Anti-backdraft high-efficiency heat dissipation air duct and energy storage converter

Abstract

The utility model discloses a kind of anti-return air efficient heat dissipation air duct and energy storage converter, wherein, anti-return air efficient heat dissipation air duct includes: air guide part, the air guide part's air inlet side is equipped with baffle, the baffle is equipped with for corresponding with fan to import the air inlet of heat dissipation wind force;And, bearing part, the inside of the bearing part is used to accommodate radiator, top is used to load circuit board;The heat dissipation wind force of fan at least one part can cross the air guide part and directly act on circuit board.The utility model in due to the setting of baffle, heat dissipation wind force will be limited in air guide part and bearing part, and form internal pressure, force heat dissipation wind force to circulate in air guide part and bearing part, to reduce turbulence, continuously heat dissipation is carried out to radiator, improve heat dissipation efficiency;While upper and lower separation main vice heat dissipation air duct can be formed, the circuit board installed on bearing part is cooled and radiated, and the utilization rate and heat dissipation efficiency of fan are improved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a high-efficiency heat dissipation duct that prevents backflow and an energy storage converter. Background Technology

[0002] In the field of power electronic products such as energy storage converters and photovoltaic inverters, power devices generate a lot of heat loss. They are often troubled by heat dissipation problems due to the distance between the fan and the heat-generating device. At this time, it is necessary to use air ducts to blow air to cool down certain parts or heat-generating devices.

[0003] like Figure 1 As shown, the commonly used air duct is directly connected to the radiator. When the fan blows air, the return air will form turbulence due to wind resistance, resulting in low ventilation and heat dissipation efficiency. The heat dissipation effect on specific parts is not ideal. At the same time, when the fan blows air onto the radiator, it will be blocked, which will further increase the wind resistance and form return air. The air duct is not smooth, which reduces the heat dissipation efficiency. Utility Model Content

[0004] In order to overcome the shortcomings of the existing technology, the purpose of this utility model is to provide a high-efficiency heat dissipation duct and energy storage converter that prevents backflow and improves heat dissipation efficiency.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] According to a first aspect of the present disclosure, a high-efficiency heat dissipation duct with anti-backflow capability is provided, comprising:

[0007] An air guide section, wherein the air inlet side of the air guide section is provided with a baffle plate, and the baffle plate is provided with an air inlet for guiding cooling airflow corresponding to the fan; and...

[0008] The support portion has an inner side for accommodating a heat sink and a top for mounting a circuit board.

[0009] At least a portion of the cooling airflow from the fan can bypass the air guide section and act directly on the circuit board.

[0010] To achieve the above technical solution, during the heat dissipation process, the fan blows out cooling air. A portion of this cooling air enters the air guide section through the air inlet and then circulates in the support section, thereby carrying away the heat from the radiator to achieve the cooling effect. When the cooling air returns due to wind resistance, the baffle plate restricts the cooling air to the air guide section and the support section, creating internal pressure that forces the cooling air to circulate within them. This reduces turbulence, continuously dissipates heat from the radiator, and improves cooling efficiency. The remaining cooling air crosses the air guide section and is blown above the support section, forming separate main and secondary cooling air channels to cool the circuit board mounted on the support section, improving the fan's utilization rate and cooling efficiency.

[0011] In some exemplary embodiments, the height of the air guide section accounts for 1 / 3 to 2 / 3 of the height of the fan.

[0012] The above technical solution allows for adjustment of the height of the air guide section as needed during practical applications, thereby adjusting the ratio of the main and auxiliary heat dissipation air ducts to meet different heat dissipation requirements.

[0013] In some exemplary embodiments, the height of the supporting portion is less than the height of the air guide portion.

[0014] The above technical solution ensures that the cooling airflow can pass over the air guide and blow onto the circuit board.

[0015] In some exemplary embodiments, the top of the support portion is provided with a plurality of heat dissipation vents, which are used to output heat dissipation air to directly dissipate heat from the bottom of the circuit board.

[0016] To achieve the above technical solution, a heat dissipation airflow channel facing the bottom of the circuit board can be formed through the heat dissipation vents, ensuring that a portion of the heat dissipation airflow can dissipate heat to the bottom of the circuit board, and preventing the rear components on the circuit board from being blocked by the front components and thus unable to be dissipated by the secondary heat dissipation airflow channel.

[0017] In some exemplary embodiments, the number of openings of the heat dissipation vents on the side away from the air guide is greater than the number of openings of the heat dissipation vents on the side closer to the air guide.

[0018] By implementing the above technical solution, the impact of varying airflow on the front and rear components of the circuit board can be balanced.

[0019] In some exemplary embodiments, the air guide portion is inserted and fixed to the support portion or integrally formed.

[0020] The above technical solution facilitates processing and installation.

[0021] In some exemplary embodiments, the air guide portion has a plurality of first locking holes on both sides, and the bearing portion has a plurality of second locking holes on its top.

[0022] Implementing the above technical solution facilitates the installation of air ducts and the assembly of circuit boards.

[0023] In some exemplary embodiments, an inclined transition plate is provided between the air guide and the support portion.

[0024] The above technical solution enables the cooling airflow to be smoothly blown from the air guide to the load-bearing part.

[0025] According to a second aspect of the present disclosure, an energy storage converter is provided, comprising:

[0026] As described in the first aspect, a high-efficiency heat dissipation duct that prevents backflow;

[0027] A fan is installed close to the air inlet side of the air guide and corresponding to the air inlet, and the height of the fan is higher than that of the air guide.

[0028] A heat sink disposed within the support portion for conducting heat from the power device, wherein the fins of the heat sink extend in the same direction as the arrangement direction of the support portion; and...

[0029] The circuit board is supported on top of the support portion.

[0030] To achieve the above technical solution, part of the cooling air generated by the fan is blown into the air duct to cool the radiator, while the other part of the cooling air is blown directly onto the circuit board to cool it down. The anti-backflow design of the air duct can effectively improve the cooling efficiency and enhance the utilization rate and cooling performance of the fan.

[0031] In some exemplary embodiments, multiple sets of radiators are arranged side by side, two or more sets of fans are arranged side by side, and two or more sets of air inlets are arranged accordingly.

[0032] Implementing the above technical solutions can make heat dissipation more uniform and efficient.

[0033] In summary, compared with the prior art, this utility model has the following beneficial effects:

[0034] This utility model embodiment provides a high-efficiency heat dissipation duct and energy storage converter with backflow prevention. The high-efficiency heat dissipation duct with backflow prevention includes: an air guide section, on which an air baffle is provided on the air inlet side, and an air inlet corresponding to a fan to introduce heat dissipation airflow; and a support section, on which the inner side is used to accommodate a heat sink and the top is used to mount a circuit board; at least a portion of the heat dissipation airflow from the fan can pass through the air guide section and act directly on the circuit board. During the heat dissipation process, the fan blows out cooling air. A portion of this airflow enters the air guide section through the air inlet and then circulates within the support section, carrying away heat from the radiator to achieve a cooling effect. When the cooling airflow experiences backflow due to air resistance, the baffle plate restricts the airflow within the air guide section and support section, creating internal pressure that forces the airflow to circulate within these sections. This reduces turbulence, continuously dissipates heat from the radiator, and improves cooling efficiency. The remaining cooling airflow crosses the air guide section and is blown above the support section, forming separate main and secondary cooling air ducts that cool the circuit boards mounted on the support section, improving the fan's utilization and cooling performance. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the structure of the air duct and radiator in the prior art.

[0036] Figure 2 This is a schematic diagram of the structure of the anti-backflow high-efficiency heat dissipation air duct in Embodiment 1 of this utility model.

[0037] Figure 3 This is a schematic diagram of the structure of the anti-backflow high-efficiency heat dissipation air duct in Embodiment 2 of this utility model.

[0038] Figure 4 This is a schematic diagram of the energy storage converter in Embodiment 3 of this utility model.

[0039] Figure 5 This is a cross-sectional view of the energy storage converter in Embodiment 3 of this utility model.

[0040] The numbers and letters in the diagram represent the names of the corresponding components:

[0041] 10. Air guide section; 11. Baffle plate; 12. Air inlet; 13. First locking hole; 14. Transition plate; 20. Supporting part; 21. Heat dissipation vent; 22. Second locking hole; 30. Fan; 40. Radiator; 50. Circuit board. Detailed Implementation

[0042] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0043] Example 1

[0044] like Figure 2 As shown, the first aspect of this utility model provides a high-efficiency heat dissipation duct with anti-backflow capability, including: an air guide section 10, a baffle plate 11 on the air inlet side of the air guide section 10, an air inlet 12 on the baffle plate 11 for corresponding to the fan 30 to introduce heat dissipation airflow; and a support section 20, the inner side of the support section 20 for accommodating the heat sink 40 and the top for mounting the circuit board 50; at least a portion of the heat dissipation airflow of the fan 30 can pass through the air guide section 10 and act directly on the circuit board 50.

[0045] Specifically, the height of the air guide section 10 is 1 / 3 to 2 / 3 of the height of the fan 30. Preferably, the height of the air guide section 10 is 1 / 2 of the height of the fan 30. In practical applications, the height of the air guide section 10 can be adjusted as needed, thereby adjusting the ratio of the main and auxiliary heat dissipation air ducts to meet different heat dissipation requirements. Furthermore, the height of the supporting section 20 is less than the height of the air guide section 10, ensuring that the cooling airflow can pass over the air guide section 10 and be blown onto the circuit board 50, achieving effective heat dissipation for the circuit board 50.

[0046] The air guide section 10 and the support section 20 are either inserted and fixed together or integrally formed. In this embodiment, preferably, the air guide section 10 and the support section 20 can be integrally stamped to facilitate processing and installation. Furthermore, an inclined transition plate 14 is provided between the air guide section 10 and the support section 20, so that the heat dissipation air can be smoothly blown from the air guide section 10 to the support section 20.

[0047] Furthermore, the air guide section 10 has several first locking holes 13 on both sides, and the top of the support section 20 has several second locking holes 22 to facilitate the installation of the air duct and the assembly of the circuit board 50.

[0048] During the heat dissipation process, the fan 30 blows out cooling air. Part of this cooling air enters the air guide section 10 through the air inlet 12 and then flows through the support section 20, thereby carrying away the heat from the radiator 40 to achieve the cooling effect. When the cooling air returns due to wind resistance, the baffle 11 restricts the cooling air to the air guide section 10 and the support section 20, creating internal pressure that forces the cooling air to flow through the air guide section 10 and the support section 20, thereby reducing turbulence and continuously cooling the radiator 40, improving the cooling efficiency. The remaining cooling air crosses the air guide section 10 and is blown above the support section 20, forming a main and secondary cooling air duct that is separated into upper and lower sections, cooling the circuit board 50 mounted on the support section 20, improving the utilization rate and cooling efficiency of the fan 30.

[0049] Example 2

[0050] The difference between this embodiment and Embodiment 1 is that: Figure 3 As shown, in this embodiment, the top of the support part 20 is provided with a plurality of heat dissipation vents 21. The heat dissipation vents 21 are used to output heat dissipation air to directly dissipate heat from the bottom of the circuit board 50. The heat dissipation vents 21 can form a heat dissipation air channel facing the bottom of the circuit board 50, ensuring that a portion of the heat dissipation air can dissipate heat from the bottom of the circuit board 50, and preventing the rear components on the circuit board 50 from being blocked by the front components and thus not being able to be dissipated by the secondary heat dissipation air channel.

[0051] The number of openings of the heat dissipation vents 21 on the side away from the air guide 10 is greater than the number of openings of the heat dissipation vents 21 on the side closer to the air guide 10. For example, multiple sets of heat dissipation vents 21 can be arranged from front to back. Each set of heat dissipation vents 21 includes a different number of through holes arranged in an array. This arrangement can balance the effect of varying air volume on the front and rear components of the circuit board 50.

[0052] Example 3

[0053] like Figure 4 and Figure 5 As shown, a second aspect of the present invention provides an energy storage converter, comprising: a high-efficiency heat dissipation duct for preventing backflow as described in Embodiment 1 or Embodiment 2; a fan 30 disposed close to the air inlet side of the air guide 10 and corresponding to the air inlet 12, the height of the fan 30 being higher than that of the air guide 10; a heat sink 40 disposed within the support portion 20 for conducting heat from power devices, the fins of the heat sink 40 extending in the same direction as the arrangement direction of the support portion 20; and a circuit board 50 supported on the top of the support portion 20.

[0054] The radiators 40 are arranged in multiple groups side by side, the fans 30 are arranged in two or more groups side by side, and the air inlets 12 are arranged in two or more groups accordingly, which can make the heat dissipation more uniform and efficient. The number of radiators 40 and fans 30 can be set according to actual needs.

[0055] The cooling air generated by the fan 30 is partly blown into the air duct to cool the radiator 40, and partly blown directly onto the circuit board 50 to cool it down. The anti-backflow design of the air duct can effectively improve the cooling efficiency and enhance the utilization rate and cooling performance of the fan 30.

[0056] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that for those skilled in the art, several modifications and improvements can be made without departing from the concept of this utility model. These are all equivalent modifications and improvements made to the above embodiments based on the essential technology of this utility model, and all of these fall within the protection scope of this utility model.

Claims

1. A high-efficiency heat dissipation duct that prevents backflow, characterized in that, include: The air guide section has a baffle plate on its air inlet side, and the baffle plate has an air inlet for introducing heat dissipation airflow in accordance with the fan. as well as, The support portion has an inner side for accommodating a heat sink and a top for mounting a circuit board. At least a portion of the cooling airflow from the fan can bypass the air guide section and act directly on the circuit board.

2. The high-efficiency heat dissipation duct with anti-return airflow according to claim 1, characterized in that, The height of the air guide section accounts for 1 / 3 to 2 / 3 of the height of the fan.

3. The anti-return air high-efficiency heat dissipation duct according to claim 1 or 2, characterized in that, The height of the supporting part is less than the height of the air guide part.

4. The high-efficiency heat dissipation duct with anti-return airflow as described in claim 1, characterized in that, The top of the support portion is provided with several heat dissipation vents, which are used to output heat dissipation air to directly dissipate heat from the bottom of the circuit board.

5. The high-efficiency heat dissipation duct with anti-backflow protection according to claim 4, characterized in that, The number of heat dissipation vents on the side furthest from the air guide is greater than the number of heat dissipation vents on the side closest to the air guide.

6. The high-efficiency heat dissipation duct with anti-backflow protection according to claim 1, characterized in that, The air guide section is fixed to the bearing section by insertion or integral molding.

7. The high-efficiency heat dissipation duct with anti-backflow feature according to claim 1, characterized in that, The air guide section has several first locking holes on both sides, and the bearing section has several second locking holes on its top.

8. The high-efficiency heat dissipation duct with anti-return airflow according to claim 1, characterized in that, An inclined transition plate is provided between the air guide section and the load-bearing section.

9. An energy storage converter, characterized in that, include: The anti-backflow high-efficiency heat dissipation air duct as described in any one of claims 1-8; A fan is installed close to the air inlet side of the air guide and corresponding to the air inlet, and the height of the fan is higher than that of the air guide. A heat sink disposed within the support portion for conducting heat from the power device, wherein the fins of the heat sink extend in the same direction as the arrangement direction of the support portion; and... The circuit board is supported on top of the support portion.

10. The energy storage converter according to claim 9, characterized in that, The radiators are arranged in multiple groups side by side; the fans are arranged in two or more groups side by side, and the air inlets are arranged in two or more groups accordingly.

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