A test device for storage chips with intelligent feeding and discharging
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HUAGAO AUTOMATION EQUIP CO LTD
- Filing Date
- 2025-06-09
- Publication Date
- 2026-06-09
AI Technical Summary
In the operation of existing memory chip testing equipment, manual handling of the material tray can easily lead to problems such as chip misalignment, chip throwing, and chip stacking when the chip is placed back in the material bin. Furthermore, the chip placement status is not monitored, which may damage the probes.
Design a testing device for memory chips with intelligent loading and unloading capabilities. The device uses components such as a test rack, X-axis module, Y-axis module, Z-axis module, and vision detector to achieve automatic tray loading and unloading and precise chip positioning. The vision detector monitors the chip placement status to avoid damaging the probes.
It achieves automated loading and unloading, reduces manual operation, improves the accuracy of chip placement and equipment intelligence, avoids the risk of chip position misalignment and probe damage, and improves production efficiency.
Smart Images
Figure CN224332804U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of testing equipment for memory chips, specifically a testing equipment for memory chips with intelligent loading and unloading capabilities. Background Technology
[0002] With the rapid development of technology, memory chips are widely used in consumer electronics, information and communication, automotive electronics, and high-tech fields. In the process of memory chip manufacturing, chip performance testing is an indispensable step. However, in practice, the chip performance testing equipment on the market is currently insufficient in terms of intelligence and handling of details.
[0003] To overcome the above-mentioned defects, the prior art (Chinese patent application with application number CN202010210457.0, application date March 23, 2020) chip appearance defect identification device and method, as well as chip testing system and method, firstly imports the product information of the chip board into a first control device, then marks the chip board according to the product information, then identifies the identification code information on the chip board, and after identifying the corresponding identification code information, acquires images of several chips on the chip board, and then identifies the appearance defective chips according to the acquired images and establishes a MAP diagram of the chip board and the correspondence between the MAP diagram and the identification code information, wherein the coordinates of the appearance defective chips are recorded in the MAP diagram. Next, when using chip testing equipment to perform electrical performance tests on the chips on the chip board, the identification code information on the chip board can be identified first. Then, the corresponding MAP diagram can be called according to the identification code information, and the chip testing equipment can be controlled to test the chips on the chip board according to the MAP diagram. This allows only chips with acceptable appearance to be tested, while chips with defective appearance are not tested, thus avoiding impact on subsequent production and improving production efficiency. Although existing technologies can complete limit detection, during the operation, manual handling of the material tray is generally used, which can easily lead to problems such as chip displacement, chip throwing, and chip stacking when the chips are returned to the material bin. In addition, there is no monitoring of the status of the chips after they are placed in the chip testing workbench. If the chip is not placed properly on the testing table and jumps out of the box position, it will damage the probe.
[0004] To address the aforementioned issues, there is an urgent need for innovative designs based on existing testing equipment for memory chips. Utility Model Content
[0005] The purpose of this invention is to provide a testing device for memory chips that can intelligently load and unload materials, in order to solve the problems mentioned in the background art, where manual loading and unloading of material trays during operation can easily lead to problems such as chip displacement, chip throwing, and chip stacking when the chips are returned to the material bin, and the lack of monitoring of the chip's position after placement on the chip testing workbench. If the chip is not placed properly on the testing workbench and jumps out of the box position, it will damage the probe.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a testing device for memory chips with intelligent loading and unloading capabilities, comprising a testing rack, wherein a first loading tray to be tested is connected to the upper surface of the testing rack; including: a first receiving tray for tested good products, located on the rear side of the outer surface of the first loading tray to be tested, wherein a first receiving tray for retesting and an empty tray are connected to the rear side of the outer surface of the first receiving tray for tested good products, and a second receiving tray for tested good products is connected to the right side of the first receiving tray for tested good products, and a second receiving tray for retesting is connected to the right side of the second receiving tray for retesting, and a second loading tray to be tested is connected to the right side of the second receiving tray for retesting; and a testing mechanism, installed on the rear side of the inner surface of the testing rack, wherein the testing mechanism is provided with a multi-position adjustment mechanism.
[0007] Preferably, the first good product receiving tray is symmetrically arranged about the middle section of the upper surface of the test frame, and the first good product receiving tray, the first good product receiving tray, the first retest receiving tray, and the empty tray are arranged from front to back.
[0008] Preferably, an X-axis module is mounted on the upper surface of the test frame, and a Y-axis module is slidably connected to the upper surface of the X-axis module. An auxiliary guide rail is slidably connected to the lower rear side of the Y-axis module, and a Z-axis module is movable on the upper surface of the Y-axis module. The test frame, the X-axis module, and the auxiliary guide rail form an integrated structure, and the X-axis module, the auxiliary guide rail, and the Y-axis module form a sliding structure. The Y-axis module and the Z-axis module form a lifting structure.
[0009] Preferably, the outer surface of the Z-axis module is equipped with a pick-and-place mechanism, and the outer surface of the pick-and-place mechanism is equipped with a pick-and-place material tray suction cup. The inner surface of the pick-and-place mechanism is nested with a pick-and-place paper separator suction cup, and the lower surface of the pick-and-place paper separator suction cup is adsorbed with the paper separator body. The Z-axis module and the pick-and-place mechanism form a lifting structure, and the pick-and-place mechanism and the pick-and-place material tray suction cup form a nested structure. The pick-and-place mechanism and the paper separator body form an adsorption structure through the pick-and-place paper separator suction cup.
[0010] Preferably, a vision detector is slidably connected to the right side of the outer surface of the Z-axis module, and a chip pick-and-place suction cup is installed behind the vision detector. A chip loading / unloading buffer area is provided on the lower surface of the chip pick-and-place suction cup, and an NG material tray is provided on the front side of the outer surface of the chip loading / unloading buffer area. The Z-axis module and the vision detector form a sliding structure, and the vision detector and the chip pick-and-place suction cup form an integrated structure. The chip pick-and-place suction cup and the chip loading / unloading buffer area are arranged vertically opposite each other.
[0011] Preferably, the multi-position adjustment mechanism includes a movable seat slidably connected to the lower surface of the test mechanism, and a crank rod rotatably connected to the outer surface of the movable seat. A lifting plate is rotatably connected to the outer surface of the crank rod and limits the sliding of the lifting plate on the outer surface of the movable seat. Meanwhile, a test worktable is installed on the upper surface of the lifting plate, and a probe is installed on the outer surface of the test mechanism.
[0012] Preferably, the testing mechanism and the movable seat form a sliding structure, and the movable seat forms a lifting structure with the lifting plate via a crank, and the lifting plate and the testing workbench form an integrated structure, while the testing workbench and the probe are set up vertically relative to each other.
[0013] Compared with the prior art, the beneficial effects of this utility model are:
[0014] 1. This intelligent loading and unloading testing equipment for memory chips is equipped with a testing rack. The automatic material handling device controls the loading of the material tray, saving manual labor by requiring only one loading per day. It also enhances the intelligence of the equipment by using a vision detector in conjunction with a chip pick-and-place suction cup to accurately place each chip back into the material tray, reducing chip throwing and stacking. The system also monitors the status of the chips after placement. If a chip is not placed correctly, the system will alarm and the workbench will not move to the work position for testing, thus avoiding damage to the probes and improving the intelligence of the equipment.
[0015] 2. This intelligent loading and unloading testing equipment for memory chips includes a nested, partitioned loading tray 1, a tested good product receiving tray 1, a retest receiving tray 1, an empty tray, and a tested good product receiving tray 2. The retest receiving tray 2 and the loading tray 2 are used for the positions to be tested, retested, good products, and empty products respectively, improving the adsorption and conveying effect. They also work in conjunction with the pick-and-place mechanism on the Z-axis module to control the conveying of the paper separator and the tray body. Furthermore, auxiliary guide rails are provided for easy support, improving the stability of the Y-axis module's movement and controlling the Z-axis module. The lifting structures on both sides of the Z-axis module control the pick-and-place mechanism and the vision detector to work with the chip pick-and-place suction cup, improving the adsorption effect. The pick-and-place mechanism facilitates automatic and intelligent loading and unloading of the tray body and the paper separator body, and works in conjunction with the vision detector to detect the chip body position, improving the stability of the chip pick-and-place suction cup, increasing adsorption accuracy, and working in conjunction with the testing mechanism for loading and unloading.
[0016] 3. This intelligent loading and unloading testing equipment for memory chips is equipped with a multi-position adjustment mechanism. The moving base of the testing mechanism can be slidably adjusted to control the position of the testing workbench for loading and visual positioning. In conjunction with the relative setting of the testing workbench and the probe, it is used for detection of pass / fail. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of the test frame of this utility model;
[0018] Figure 2 This is a schematic diagram of the internal three-dimensional structure of the test frame of this utility model;
[0019] Figure 3 This is a three-dimensional structural diagram of the feeding tray to be tested according to this utility model;
[0020] Figure 4 This is a three-dimensional structural diagram of the Y-axis module of this utility model;
[0021] Figure 5 This is a three-dimensional structural diagram of the picking and placing mechanism of this utility model;
[0022] Figure 6 This is a three-dimensional structural diagram of the chip pick-and-place suction cup of this utility model;
[0023] Figure 7 This is a three-dimensional structural diagram of the testing mechanism of this utility model.
[0024] In the diagram: 1. Test frame; 2. Test-ready loading tray 1; 3. Tested good product receiving tray 1; 4. Retest receiving tray 1; 5. Empty tray; 6. Tested good product receiving tray 2; 7. Retest receiving tray 2; 8. Test-ready loading tray 2; 9. X-axis module; 10. Y-axis module; 11. Auxiliary guide rail; 12. Z-axis module; 13. Pick-up and placement mechanism; 14. Pick-up and placement tray suction cup; 15. Pick-up and placement paper separator suction cup; 16. Paper separator body; 17. Vision detector; 18. Chip pick-up and placement suction cup; 19. Chip loading and unloading buffer area; 20. NG tray; 21. Test mechanism; 22. Moving seat; 23. Crank rod; 24. Lifting plate; 25. Test workbench; 26. Probe. Detailed Implementation
[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0026] Please see Figures 1-7 The present invention provides the following technical solution: a test device for memory chips with intelligent loading and unloading, which is provided with a test frame 1, and the upper surface of the test frame 1 is connected to a loading tray 2 to be tested.
[0027] Example 1: As Figures 1-5 The present invention provides the following technical solution: a testing device for memory chips with intelligent loading and unloading capabilities, comprising: a pre-tested good product receiving tray 3, located on the rear side of the outer surface of the untested loading tray 2, and connected to the rear side of the outer surface of the pre-tested good product receiving tray 3 are a retesting receiving tray 4 and an empty tray 5; a pre-tested good product receiving tray 6 is connected to the right side of the untested loading tray 2, and a retesting receiving tray 7 is connected to the right side of the pre-tested good product receiving tray 3, and a untested loading tray 8 is connected to the right side of the retesting receiving tray 7; the pre-tested good product receiving tray 3 is symmetrically arranged about the middle section of the upper surface of the testing frame 1, and the pre-tested good product receiving tray 3, the retesting receiving tray 4, and the empty tray 5 are arranged from front to back.
[0028] During use, the material tray 2 to be tested is placed manually in the material receiving tray placement area set up in the test rack 1, and the retest receiving tray 4 and empty tray 5 are placed there for the chip body to be initially tested. That is, the positions of the tested good product receiving tray 3 and the tested good product receiving tray 6 assembled in the test rack 1 are used. The chip body to be retested is placed in the retest receiving tray 4 and the retest receiving tray 7 for subsequent secondary testing.
[0029] Example 2: Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 6 The technical solution shown, based on Embodiment 1, further discloses intelligent control of the material handling mechanism 13, the specific details of which are as follows: An X-axis module 9 is mounted on the upper surface of the test frame 1, and a Y-axis module 10 is slidably connected to the upper surface of the X-axis module 9. An auxiliary guide rail 11 is slidably connected to the lower rear side of the Y-axis module 10, while a Z-axis module 12 moves along the upper surface of the Y-axis module 10. The test frame 1, the X-axis module 9, and the auxiliary guide rail 11 form an integrated structure, and the X-axis module 9, the auxiliary guide rail 11, and the Y-axis module 10 form a sliding structure, while the Y-axis module 10 and the Z-axis module 12 form a lifting structure. A material handling mechanism 13 is mounted on the outer surface of the Z-axis module 12, and a material handling suction cup 14 is mounted on the outer surface of the material handling mechanism 13. A material handling paper suction cup 15 is nested and connected to the inner surface of the material handling mechanism 13. The lower surface of the paper-placing suction cup 15 is adsorbed with the paper-placing body 16; the Z-axis module 12 and the paper-placing mechanism 13 form a lifting structure, and the paper-placing mechanism 13 and the paper-placing tray suction cup 14 form a nested structure, and the paper-placing mechanism 13 forms an adsorption structure with the paper-placing suction cup 15 and the paper-placing body 16; a vision detector 17 is slidably connected to the right side of the outer surface of the Z-axis module 12, and a chip paper-placing suction cup 18 is installed on the rear side of the vision detector 17, and a chip loading / unloading buffer area 19 is provided on the lower surface of the chip loading / unloading buffer area 18, while an NG tray 20 is provided on the front side of the outer surface of the chip loading / unloading buffer area 19; the Z-axis module 12 and the vision detector 17 form a sliding structure, and the vision detector 17 and the chip paper-placing suction cup 18 form an integrated structure, and the chip paper-placing suction cup 18 and the chip loading / unloading buffer area 19 are arranged vertically opposite each other.
[0030] In use, the X-axis module 9 assembled on the test frame 1 controls the position of the Y-axis module 10. The Y-axis module 10, in conjunction with the auxiliary guide rail 11 on the other side, improves the stability of movement, thereby controlling the position of the Z-axis module 12 assembled on the upper side of the Y-axis module 10. The pick-and-place mechanism 13, in conjunction with the pick-and-place chuck 14, picks up the first loading tray 2 to be tested and moves it to the position of the second loading tray 8. The vision detector 17 assembled on the pick-and-place mechanism 13 then performs visual recognition of the chip at the position of the second loading tray 8 and controls the chip pick-and-place chuck 18 assembled on the pick-and-place mechanism 13 to pick up the chip, placing a set of chips in the chip loading / unloading buffer area 19. Then, in conjunction with the movement of the test mechanism 21, the chip pick-and-place chuck 18 grabs the chip a second time. The chip pick-and-place suction cup 18 is used for testing. After testing, the chip pick-and-place suction cup 18 picks up the chip and places it in the position of the good product receiving tray 26, the retest receiving tray 27, or the NG tray 20 according to the test results. The chip pick-and-place suction cup 18 can be placed back individually and is positioned by the vision detector 17 to ensure accurate positioning, without throwing or stacking the chip. After the good product receiving tray 26 is full of chip bodies, the paper separator 16 is picked up by the paper separator suction cup 15 and placed on top of it. The paper separator suction cup 14 is used to pick up the empty tray 5 for the next intelligent feeding. After the chips on the waiting-to-be-tested feeding tray 28 are picked up, the paper separator suction cup 14 is controlled to pick up the empty tray 5 for subsequent feeding.
[0031] Example 3: Figure 1 , Figure 2 , Figure 3 and Figure 7 The technical solution shown, based on Embodiment 2, further discloses a multi-position adjustment detection of the testing mechanism 21, the specific contents of which are as follows: The testing mechanism 21 is installed on the rear side of the inner surface of the testing frame 1, and the testing mechanism 21 is provided with a multi-position adjustment mechanism; the multi-position adjustment mechanism includes a movable seat 22 slidably connected to the lower surface of the testing mechanism 21, and a crank 23 is rotatably connected to the outer surface of the movable seat 22, and a lifting plate 24 is rotatably connected to the upper side of the outer surface of the crank 23, limiting the sliding of the lifting plate 24 on the outer surface of the movable seat 22. At the same time, a testing workbench 25 is installed on the upper surface of the lifting plate 24, and a probe 26 is installed on the outer surface of the testing mechanism 21; the testing mechanism 21 and the movable seat 22 form a sliding structure, and the movable seat 22 forms a lifting structure with the lifting plate 24 through the crank 23, and the lifting plate 24 and the testing workbench 25 form an integrated structure, while the testing workbench 25 and the probe 26 are arranged vertically relative to each other.
[0032] In use, the chip pick-and-place suction cup 18 is used to pick up and transport the chip to the test workbench 25. The test workbench 25 is then moved to the underside of the vision detector 17 via the movable seat 22 to check whether the chip is properly placed. After the chip is correctly placed, the test workbench 25 is moved to the underside of the probe 26 assembled on the test mechanism 21, and the crank 23 assembled on the movable seat 22 is controlled to adjust the lifting plate 24 to move upward, so that the chip body on the test workbench 25 mounted on the lifting plate 24 contacts the probe 26 for detection. After the detection is completed, the chip pick-and-place suction cup 18 picks up the chip and, according to the detection result, places it in the good product receiving tray 26, the retest receiving tray 27, or the NG tray 20 for detection work in different positions.
[0033] The contents not described in detail in this specification are existing technologies known to those skilled in the art.
[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A testing device for memory chips with intelligent loading and unloading capability, comprising a testing rack (1) and a loading tray (2) to be tested connected to the upper surface of the testing rack (1); Its features are, include: The good product receiving tray 1 (3) is located on the rear side of the outer surface of the loading tray 1 (2) to be tested, and the rear side of the outer surface of the good product receiving tray 1 (3) is connected to the retest receiving tray 1 (4) and the empty tray (5). The right side of the loading tray 1 (2) to be tested is connected to the good product receiving tray 2 (6), and the right side of the good product receiving tray 1 (3) is connected to the retest receiving tray 2 (7). The right side of the retest receiving tray 2 (7) is connected to the loading tray 2 (8) to be tested. The testing mechanism (21) is installed on the rear side of the inner surface of the testing frame (1), and the testing mechanism (21) is provided with a multi-position adjustment mechanism.
2. The intelligent loading and unloading testing equipment for memory chips according to claim 1, characterized in that: The tested good product receiving tray (3) is symmetrically arranged about the middle section of the upper surface of the test frame (1), and the tested good product receiving tray (3), the tested good product receiving tray (3), the retest receiving tray (4) and the empty tray (5) are arranged from front to back.
3. The intelligent loading and unloading testing equipment for memory chips according to claim 1, characterized in that: The test frame (1) is equipped with an X-axis module (9) on its upper surface, and a Y-axis module (10) is slidably connected to the upper surface of the X-axis module (9). An auxiliary guide rail (11) is slidably connected to the lower rear side of the Y-axis module (10). Meanwhile, a Z-axis module (12) moves on the upper surface of the Y-axis module (10). The test frame (1), the X-axis module (9), and the auxiliary guide rail (11) form an integrated structure. The X-axis module (9), the auxiliary guide rail (11), and the Y-axis module (10) form a sliding structure. The Y-axis module (10) and the Z-axis module (12) form a lifting structure.
4. The intelligent loading and unloading testing equipment for memory chips according to claim 3, characterized in that: The outer surface of the Z-axis module (12) is equipped with a pick-and-place mechanism (13), and the outer surface of the pick-and-place mechanism (13) is equipped with a pick-and-place material tray suction cup (14). The inner surface of the pick-and-place mechanism (13) is nested with a pick-and-place paper separator suction cup (15), and the lower surface of the pick-and-place paper separator suction cup (15) is adsorbed with a paper separator body (16). The Z-axis module (12) and the pick-and-place mechanism (13) form a lifting structure, and the pick-and-place mechanism (13) and the pick-and-place material tray suction cup (14) form a nested structure. The pick-and-place mechanism (13) and the paper separator body (16) form an adsorption structure through the pick-and-place paper separator suction cup (15).
5. The intelligent loading and unloading testing equipment for memory chips according to claim 4, characterized in that: A vision detector (17) is slidably connected to the right side of the outer surface of the Z-axis module (12), and a chip pick-and-place suction cup (18) is installed on the rear side of the vision detector (17). A chip loading and unloading buffer area (19) is provided on the lower surface of the chip pick-and-place suction cup (18), and an NG material tray (20) is provided on the front side of the outer surface of the chip loading and unloading buffer area (19). The Z-axis module (12) and the vision detector (17) form a sliding structure, and the vision detector (17) and the chip pick-and-place suction cup (18) form an integrated structure. The chip pick-and-place suction cup (18) and the chip loading and unloading buffer area (19) are arranged vertically opposite each other.
6. The intelligent loading and unloading testing equipment for memory chips according to claim 1, characterized in that: The multi-position adjustment mechanism includes a movable seat (22) slidably connected to the lower surface of the test mechanism (21), and a crank (23) is rotatably connected to the outer surface of the movable seat (22) off-axis. A lifting plate (24) is rotatably connected to the outer surface of the crank (23) on the upper side axis, and the lifting plate (24) is limited to slide on the outer surface of the movable seat (22). At the same time, a test workbench (25) is installed on the upper surface of the lifting plate (24), and a probe (26) is installed on the outer surface of the test mechanism (21).
7. The intelligent loading and unloading testing equipment for memory chips according to claim 6, characterized in that: The test mechanism (21) and the movable seat (22) form a sliding structure, and the movable seat (22) forms a lifting structure with the lifting plate (24) through the crank (23). The lifting plate (24) and the test workbench (25) form an integrated structure, and the test workbench (25) and the probe (26) are set up vertically relative to each other.