An integrated optical communication module housing
By employing a combination of large and small slots and an interlaced baffle structure in the optical communication module base, the problems of low heat dissipation efficiency and insufficient structural strength are solved, achieving a balance between efficient heat dissipation and structural strength, and meeting the requirements of high-density integration.
CN224341706UActive Publication Date: 2026-06-09DONGGUAN ZHENGKUN PRECISION PROD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN ZHENGKUN PRECISION PROD
- Filing Date
- 2025-06-06
- Publication Date
- 2026-06-09
Smart Images

Figure CN224341706U_ABST
Abstract
This utility model discloses an integrated optical communication module base, comprising a base body with a through hole in the center, and several evenly distributed larger adapter slots on the base body near the through hole. At least one smaller adapter slot is provided between adjacent larger adapter slots, and each adapter slot is provided with a baffle rigidly connected to the base body. The sides of the base body are joined end-to-end to close each adapter slot. This utility model achieves high-density integration and performance improvement: the adapter slots (combining large and small slots) are evenly distributed around the through hole, making the layout more compact; the baffles adopt an interlaced design and are rigidly connected to the base, enhancing structural strength and improving deformation resistance; the thin baffles combine support and heat dissipation functions, forming an efficient heat dissipation channel with a slot-to-baffle area ratio of ≤1:3; the overall layout optimization reduces redundant materials, achieving lightweight design, and ultimately balancing strength, heat dissipation, and weight requirements in a compact structure.
Need to check novelty before this filing date? Find Prior Art