A computer case with internal case heat dissipation guide structure

Abstract

This utility model relates to the field of computer equipment and discloses a computer chassis with an internal heat dissipation and airflow guiding structure. It includes a chassis body, a baffle fixedly connected to the front of the chassis body, a protective cover slidably connected to the outer wall of the baffle, a dustproof plate slidably connected to the top of the chassis body, a partition fixedly connected to the inner wall of the chassis body, a mounting bracket slidably connected to the inner side of the partition, a second slide rail fixedly connected to the inner wall of the mounting bracket, and a mounting plate slidably connected to the outer wall of the second slide rail. During use, when the fan on the electronic components is running, the heat generated by the electronic components is exhausted into the interior of the chassis body. The heat exhausted into the chassis body enters the interior of the airflow guiding plate through a second through-hole, and then is transported to the space formed by the partition and the inner wall of the chassis body through a first connecting plate, thereby allowing the heat to be better dissipated and improving the heat dissipation efficiency inside the chassis body.

Description

Technical Field

[0001] This utility model relates to the field of computer equipment technology, specifically to a computer chassis with an internal heat dissipation and airflow guiding structure. Background Technology

[0002] As a component of a computer, the computer case primarily serves to house and secure various computer parts, providing support and protection. Furthermore, it plays a crucial role in shielding against electromagnetic radiation. Because computer cases, unlike components such as the CPU, graphics card, and motherboard, don't rapidly improve overall system performance, they have undergone continuous innovation and development. Therefore, while current computer cases generally meet basic user needs, some issues still persist.

[0003] For example, patent document CN213766150U discloses a computer chassis, including an outer shell. The outer shell has a gear and two rotating brackets rotatably fitted onto it. Two sliding square rods, each rotating and slidably fitted with the two rotating brackets, mesh with the circumference of the gear. A motor, fixedly connected to the gear, is fixedly mounted on one side of the outer shell. Two rotating bars, each rotating and slidably fitted with the outer shell, are rotatably fitted onto the middle portions of the two sliding square rods. Two filters are fixedly installed inside the outer shell. Four brushes, each corresponding to one of the four rotating bars, are fixedly mounted at one end. This invention, through the installation of the motor, can drive the two rotating brackets to rotate. When the two rotating brackets rotate, it facilitates the entry of air into the chassis, thus improving the chassis's heat dissipation capacity.

[0004] However, in actual use, the aforementioned device, through the installation of a motor, can drive two rotating frames to rotate. When the two rotating frames rotate, it facilitates the entry of air into the chassis, thus improving the chassis's heat dissipation capacity. However, in actual use, because electronic components such as graphics cards and CPUs have their own fans, the heat generated by these electronic components is exhausted into the chassis when the fans are running. Furthermore, as the chassis's own heat dissipation mechanism expels the heat, it passes through other electronic components, causing their temperatures to rise. Due to the lack of a proper airflow guiding structure inside the chassis, this heat may affect other electronic components inside the chassis, leading to prolonged exposure to high temperatures and a reduced lifespan for these components. Therefore, there is an urgent need for a computer chassis with an internal chassis heat dissipation and airflow guiding structure to solve the above problems. Utility Model Content

[0005] The purpose of this utility model is to provide a computer chassis with an internal heat dissipation and airflow guiding structure to solve the problem mentioned in the background art that when the fan on the electronic components is running, the heat generated by the electronic components will be exhausted into the interior of the chassis. Due to the lack of a certain airflow guiding structure inside the chassis, the heat may affect other electronic components inside the chassis.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a computer chassis with an internal heat dissipation and airflow guiding structure is disclosed, comprising a chassis body, a control panel fixedly connected to the front of the chassis body, a baffle fixedly connected to the front of the chassis body and located below the control panel, a protective cover slidably connected to the outer wall of the baffle, a dustproof plate slidably connected to the top of the chassis body, a partition fixedly connected to the inner wall of the chassis body, a mounting bracket slidably connected to the inner side of the partition, a second slide rail fixedly connected to the inner wall of the mounting bracket, and a mounting plate slidably connected to the outer wall of the second slide rail;

[0007] A second connecting plate is fixedly connected to one side of the outer wall of the chassis body. A flow guide is slidably connected to the outer wall of the second connecting plate. A flow guide plate is fixedly connected to the inner side of the flow guide plate. A second through hole is opened on the outer wall of the flow guide plate. A first connecting plate is fixedly connected to the outer wall of the flow guide plate, and the first connecting plate is fitted into the space formed by the partition and the inner wall of the chassis body.

[0008] As a preferred embodiment of this utility model, the inner side wall of the chassis body is provided with a first through hole, the inner side wall of the baffle is fixedly connected with a cable tray, and the outer side wall of the cable tray is provided with a cable tray hole.

[0009] As a preferred technical solution of this utility model, a first dust filter is fixedly connected to the top of the main body of the chassis. A fitting groove is opened on the top of the main body of the chassis, and the fitting groove is located outside the first dust filter. Magnets are installed on the bottom wall of the fitting groove and the bottom of the dustproof plate, and the magnetic poles of the two magnets are opposite at the contact surfaces. A second dust filter is fixedly connected inside the dustproof plate, and the second dust filter is located above the first dust filter.

[0010] As a preferred technical solution of this utility model, the partition and the inner top and bottom walls of the chassis body form a heat dissipation chamber. A first ventilation hole is provided on the top of the partition, and a conical air guide is fixedly connected to the outer wall of the partition, and the conical air guide corresponds to the first ventilation hole.

[0011] As a preferred embodiment of this utility model, a support sleeve is fixedly connected to the bottom of the chassis body, a base plate is slidably connected to the bottom of the support sleeve, and a damping shock absorber is fixedly connected to the inner top wall of the support sleeve, with the bottom end of the damping shock absorber connected to the top end of the base plate.

[0012] As a preferred embodiment of this utility model, the outer wall of the partition is fixedly connected to a first slide rail, the top and bottom of the mounting bracket are both fixedly connected to a first slider, and the first slider is slidably connected to the inner side of the first slide rail. The inner side wall of the mounting bracket is fixedly connected to a mounting base, and the outer wall of the mounting base is provided with a wire hole.

[0013] As a preferred embodiment of this utility model, a second slider is fixedly connected to the outer wall of the mounting plate, and the second slider is slidably connected to the inner side of the second slide rail. A second ventilation hole is provided on the top of the mounting plate.

[0014] As a preferred technical solution of this utility model, the outer wall of the baffle is provided with a limiting groove, the inner side wall of the protective cover is fixedly connected to a limiting block, and the limiting block is slidably connected to the inner side of the limiting groove. The outer wall of the protective cover is threaded through with a first fastening bolt, and the bottom end of the first fastening bolt abuts against the outer wall of the baffle. The outer wall of the guide shield is threaded through with a second fastening bolt, and the bottom end of the second fastening bolt abuts against the outer wall of the second connecting plate.

[0015] As a preferred embodiment of this utility model, the computer chassis is used as follows:

[0016] S1. Before using the computer chassis, remove the mounting bracket from the inside of the chassis body. The mounting bracket provides a mounting position for computer electronic components. Install the electronic components on top of the mounting base. Guide the wires of the electronic components through the wire holes so that the wires of the electronic components can be handled in an orderly manner. Then slide the mounting plate out from the inside of the mounting bracket. The mounting plate provides a mounting position for the cooling fan. After the electronic components are installed, slide the first slider to connect to the inside of the first slide rail to facilitate the installation and removal of the mounting bracket by the staff. This facilitates the subsequent disassembly and maintenance by the staff and avoids the electronic components being inside the chassis body, which would reduce the efficiency of the staff in inspecting the electronic components.

[0017] S2. After the electronic components are installed, the wires of the electronic components are taken out by passing through the first through hole, and then the top of the wires is passed through the wire bundling hole through the wire bundling plate, so that the wire bundling plate can bundle the wires. After bundling the wires, the protective cover is slidably connected to the outer wall of the baffle, and the limiting block is slidably connected to the inner side of the limiting groove. Then, by rotating the second fastening bolt, the bottom end of the second fastening bolt is pressed against the outer wall of the second connecting plate, which facilitates the subsequent inspection and maintenance of the wire ports by the staff.

[0018] S3. When the computer case is in use, the fan installed above the mounting plate dissipates heat from the inside of the case. While dissipating heat, the first and second dust filters filter dust from the air. During ventilation, the first ventilation hole and the conical air guide allow normal ventilation inside the case. When the case is ventilated, the conical air guide reduces the amount of water entering the case through the first and second dust filters, preventing water from entering the case and damaging electronic components if water is spilled on it.

[0019] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0020] 1. When the chassis body is in use, the heat generated by the electronic components is discharged into the interior of the chassis body. Then, through the operation of the guide fan, the heat discharged into the chassis body is drawn into the interior of the guide plate through the second through hole. Then, through the first connecting plate, the heat is transported to the space formed by the partition and the inner wall of the chassis body. This allows the heat to be discharged from the top and bottom of the chassis body to the outside of the chassis body through air circulation, thereby reducing the impact of heat circulation on other electronic components inside the chassis body and improving the heat dissipation efficiency inside the chassis body.

[0021] 2. During ventilation inside the chassis, this utility model uses a conical air guide shroud to reduce water entering the chassis through the first and second dust filters, preventing water from entering and damaging electronic components when water is spilled on the chassis. During ventilation and heat dissipation, the first and second dust filters filter dust from the air. They are connected by two magnets, and the dust filter plate is fitted into the inner side of the fitting groove by a magnet at the bottom of the plate. This allows for easy installation and removal of the dust filter plate, facilitating subsequent cleaning and maintenance of the second and first dust filters.

[0022] 3. This utility model removes the wires of the electronic component through the first through hole, and then passes the top of the wire through the wire bundling hole into the wire bundling plate, so that the wire bundling plate can bundle the wires. After bundling the wires, the protective cover is slidably connected to the outer wall of the baffle, and the limiting block is slidably connected to the inner side of the limiting groove, so that the interface end of the electronic component and the electronic component are in two different spaces, avoiding the heat generated by the electronic component during operation from affecting the interface end, thereby causing damage to the interface end and making the electronic component unable to be used normally. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0024] Figure 2This is a schematic diagram of the main structure of the chassis of this utility model;

[0025] Figure 3 This is a schematic diagram of the mounting bracket structure of this utility model;

[0026] Figure 4 This is a schematic diagram of the protective cover structure of this utility model;

[0027] Figure 5 This is a schematic diagram of the mounting plate structure of this utility model;

[0028] Figure 6 This is a schematic diagram of the flow guide structure of this utility model;

[0029] Figure 7 This is a schematic cross-sectional view of the main body of the chassis of this utility model;

[0030] Figure 8 This is a cross-sectional view of the mounting bracket of this utility model.

[0031] In the diagram: 1. Chassis body; 2. First through hole; 3. Control panel; 4. Baffle; 5. Limiting groove; 6. Cable management plate; 7. Cable management hole; 8. First dust filter; 9. Fitting groove; 10. Dustproof plate; 11. Magnet; 12. Second dust filter; 13. Partition; 14. Conical air guide shroud; 15. First ventilation hole; 16. Support sleeve; 17. Damping shock absorber; 18. Base plate; 19. First slide rail; 20. Mounting bracket; 21. First slider; 22. Mounting base; 23. Wire hole; 24. Second slide rail; 25. Mounting plate; 26. Second slider; 27. Second ventilation hole; 28. Protective cover; 29. ​​Limiting block; 30. First fastening bolt; 31. Flow guide; 32. Second fastening bolt; 33. Flow guide plate; 34. Second through hole; 35. First connecting plate; 36. Second connecting plate; 37. Guide fan. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Please see Figures 1 to 8 A computer chassis with an internal heat dissipation and airflow guiding structure:

[0034] The chassis body 1 includes a control panel 3 fixedly connected to the front of the chassis body 1, a baffle 4 fixedly connected to the front of the chassis body 1 and located below the control panel 3, a protective cover 28 slidably connected to the outer wall of the baffle 4, a dustproof plate 10 slidably connected to the top of the chassis body 1, a partition 13 fixedly connected to the inner wall of the chassis body 1, a mounting bracket 20 slidably connected to the inner side of the partition 13, a second slide rail 24 fixedly connected to the inner wall of the mounting bracket 20, and a mounting plate 25 slidably connected to the outer wall of the second slide rail 24.

[0035] A second connecting plate 36 is fixedly connected to one side of the outer wall of the chassis body 1. A flow guide shroud 31 is slidably connected to the outer wall of the second connecting plate 36. A flow guide plate 33 is fixedly connected to the inner side of the flow guide shroud 31. A second through hole 34 is opened on the outer wall of the flow guide plate 33. A first connecting plate 35 is fixedly connected to the outer wall of the flow guide plate 33. The first connecting plate 35 is fitted into the space formed by the partition 13 and the inner wall of the chassis body 1. The outer wall of the flow guide shroud 31 is threaded through the second fastening bolt 32. The bottom end of the second fastening bolt 32 abuts against the outer wall of the second connecting plate 36. A guide fan 37 is fixedly connected inside the first connecting plate 35.

[0036] The control panel 3 controls the operation of the chassis body 1. The mounting bracket 20 provides mounting positions for computer electronic components. The mounting plate 25 is slidably removed from the inside of the mounting bracket 20, providing a mounting position for the cooling fan. After the electronic components are installed, the first slider 21 is slidably connected to the inside of the first slide rail 19, facilitating the installation and removal of the mounting bracket 20 by the operator, thus enabling subsequent disassembly and maintenance. The first connecting plate 35 is fitted into the space formed by the partition 13 and the inner wall of the chassis body 1, and then slidably connected to the outer wall of the second connecting plate 36 by the air guide shroud 31. By rotating the second fastening bolt 32, the bottom end of the second fastening bolt 32 abuts against the outer wall of the second connecting plate 36, thereby ensuring the stability of the air guide shroud 31 during use and facilitating the installation and removal of the air guide shroud 31 by the staff. When the chassis body 1 is in use, when the fan on the electronic component is running, the air guide fan 37 will run. When the air guide fan 37 is running, the heat discharged into the chassis body can be drawn into the interior of the air guide plate through the second through hole 34, and then the heat can be transported to the space formed by the partition 13 and the inner wall of the chassis body 1 through the first connecting plate 35, so that the heat can be better discharged and the heat dissipation efficiency inside the chassis body 1 can be improved.

[0037] In a preferred embodiment, a support sleeve 16 is fixedly connected to the bottom of the chassis body 1, a base plate 18 is slidably connected to the bottom of the support sleeve 16, a damping shock absorber 17 is fixedly connected to the inner top wall of the support sleeve 16, and the bottom end of the damping shock absorber 17 is connected to the top end of the base plate 18.

[0038] When the chassis body 1 is in use, the bottom of the chassis body 1 can be supported by the base plate 18 and the support sleeve 16, so that the bottom of the chassis body 1 can be properly ventilated and dissipated. The top of the base plate 18 slides inside the support sleeve 16 and is connected to the top of the base plate 18 by the bottom end of the damping shock absorber 17, so that the base plate 18 and the support sleeve 16 have a shock absorption effect.

[0039] Please see Figure 1 , Figure 2 and Figure 5 A computer chassis with an internal heat dissipation and airflow guiding structure:

[0040] A first dust filter 8 is fixedly connected to the top of the chassis body 1. A fitting groove 9 is provided on the top of the chassis body 1, and the fitting groove 9 is located outside the first dust filter 8. Magnets 11 are installed on the bottom wall of the fitting groove 9 and the bottom of the dustproof plate 10, and the magnetic poles of the two magnets 11 are opposite at the contact surface. A second dust filter 12 is fixedly connected inside the dustproof plate 10, and the second dust filter 12 is located above the first dust filter 8.

[0041] The dustproof plate 10 is connected by two magnets 11, which ensures the stability of the dustproof plate 10 on the top of the chassis body 1. The dustproof plate 10 is further stabilized by the magnet 11 at the bottom of the dustproof plate 10 fitting into the inner side of the fitting groove 9. This also makes it convenient for staff to install and remove the dustproof plate 10, and facilitates the subsequent cleaning and maintenance of the second dustproof filter 12 and the first dustproof filter 8.

[0042] In a preferred embodiment, the partition 13 forms a heat dissipation chamber with the inner top and inner bottom walls of the chassis body 1. A first ventilation hole 15 is provided on the top of the partition 13, and a conical air guide shroud 14 is fixedly connected to the outer wall of the partition 13, and the conical air guide shroud 14 corresponds to the first ventilation hole 15.

[0043] The first ventilation hole 15 and the conical air guide shroud 14 allow for normal ventilation inside the chassis body 1. When the chassis body 1 is ventilated, the conical air guide shroud 14 reduces the amount of water entering the chassis body 1 through the first dust filter 8 and the second dust filter 12, thus preventing water from entering the chassis body 1 and damaging electronic components when water is poured on it.

[0044] Please see Figure 1 , Figure 2 and Figure 3 A computer chassis with an internal heat dissipation and airflow guiding structure:

[0045] The outer wall of the partition 13 is fixedly connected to the first slide rail 19. The top and bottom of the mounting bracket 20 are both fixedly connected to the first slider 21, and the first slider 21 is slidably connected to the inner side of the first slide rail 19. The inner wall of the mounting bracket 20 is fixedly connected to the mounting base 22, and the outer wall of the mounting base 22 is provided with a wire hole 23.

[0046] By mounting the electronic components above the mounting base 22, the wires of the electronic components are guided through the wire holes 23, allowing the wires of the electronic components to be processed in an orderly manner. By sliding the first slider 21 to the inside of the first slide rail 19, it is convenient for the staff to install and disassemble the mounting bracket 20, and facilitate subsequent disassembly and maintenance.

[0047] In a preferred embodiment, a second slider 26 is fixedly connected to the outer wall of the mounting plate 25, and the second slider 26 is slidably connected to the inner side of the second slide rail 24. A second ventilation hole 27 is provided on the top of the mounting plate 25.

[0048] The mounting plate 25 provides a mounting position for the cooling fan, and the second ventilation hole 27 allows the cooling fan to properly ventilate and dissipate heat from the chassis body 1. The second slider 26 is slidably connected to the inner side of the second slide rail 24, thereby ensuring the stability of the mounting plate 25 and making it convenient for staff to disassemble and install the mounting plate 25, and to facilitate the maintenance and repair of the cooling fan above the mounting plate 25.

[0049] Please see Figure 1 , Figure 2 and Figure 4 A computer chassis with an internal heat dissipation and airflow guiding structure:

[0050] The inner wall of the chassis body 1 has a first through hole 2. The inner wall of the baffle 4 is fixedly connected to a cable tray 6. The outer wall of the cable tray 6 has a cable tray hole 7. The outer wall of the baffle 4 has a limit groove 5. The inner wall of the protective cover 28 is fixedly connected to a limit block 29, and the limit block 29 is slidably connected to the inner side of the limit groove 5. The outer wall of the protective cover 28 is threaded with a first fastening bolt 30, and the bottom end of the first fastening bolt 30 abuts against the outer wall of the baffle 4.

[0051] By passing the wires of electronic components through the first through hole 2 and then passing the top of the wires through the wire bundling hole 7 through the wire bundling plate 6, the wire bundling plate 6 can bundle the wires. After bundling the wires, the protective cover 28 is slidably connected to the outer wall of the baffle 4, and the limiting block 29 is slidably connected to the inner side of the limiting groove 5. Then, by rotating the second fastening bolt 32, the bottom end of the second fastening bolt 32 abuts against the outer wall of the second connecting plate 36, which facilitates the subsequent inspection and maintenance of the wire ports by the staff.

[0052] Working principle: Before using the computer chassis, the mounting bracket 20 is removed from the inside of the chassis body 1. The mounting bracket 20 provides a mounting position for computer electronic components. The electronic components are installed above the mounting base 22, and the wires of the electronic components are guided through the wire holes 23, allowing the wires of the electronic components to be handled in an orderly manner. Then, the mounting plate 25 is slid out from the inside of the mounting bracket 20. The mounting plate 25 provides a mounting position for the cooling fan. After the electronic components are installed, the first slider 21 is slidably connected to the inside of the first slide rail 19, which facilitates the installation and removal of the mounting bracket 20 by the staff, making subsequent disassembly and maintenance easier. This avoids the electronic components being located inside the chassis body 1, which would reduce the efficiency of the staff in inspecting the electronic components. After the electronic components are installed, the wires of the electronic components are taken out by passing through the first through hole 2, and then the top end of the wire is passed through the cable tie hole 7 through the cable tie plate 6, so that the cable tie plate 6 can guide the wires. The wires are bundled. After the wires are bundled, the protective cover 28 is slidably connected to the outer wall of the baffle 4, and the limiting block 29 is slidably connected to the inner side of the limiting groove 5. Then, by rotating the second fastening bolt 32, the bottom end of the second fastening bolt 32 abuts against the outer wall of the second connecting plate 36, which facilitates the subsequent inspection and maintenance of the wire ports by the staff. When the computer case is in use, the fan installed above the mounting plate 25 dissipates heat from the inside of the case body 1. At the same time, the first dust filter 8 and the second dust filter 12 filter the dust in the air. During ventilation and heat dissipation, the first ventilation hole 15 and the conical air guide shroud 14 allow the inside of the case body 1 to be properly ventilated. When the inside of the case body 1 is ventilated, the conical air guide shroud 14 reduces the amount of water entering the inside of the case body 1 through the first dust filter 8 and the second dust filter 12, and prevents water from entering the inside of the case body 1 and damaging the electronic components when water is poured on it.

[0053] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A computer chassis with an internal heat dissipation and airflow guiding structure, comprising a chassis body (1), characterized in that: A control panel (3) is fixedly connected to the front of the chassis body (1). A baffle (4) is fixedly connected to the front of the chassis body (1), and the baffle (4) is located below the control panel (3). A protective cover (28) is slidably connected to the outer wall of the baffle (4). A dustproof plate (10) is slidably connected to the top of the chassis body (1). A partition (13) is fixedly connected to the inner wall of the chassis body (1). A mounting bracket (20) is slidably connected to the inner side of the partition (13). A second slide rail (24) is fixedly connected to the inner wall of the mounting bracket (20). A mounting plate (25) is slidably connected to the outer wall of the second slide rail (24). A second connecting plate (36) is fixedly connected to one side of the outer wall of the chassis body (1). A flow guide (31) is slidably connected to the outer wall of the second connecting plate (36). A flow guide plate (33) is fixedly connected to the inner side of the flow guide (31). A second through hole (34) is opened on the outer wall of the flow guide plate (33). A first connecting plate (35) is fixedly connected to the outer wall of the flow guide plate (33). The first connecting plate (35) is fitted into the space formed by the partition (13) and the inner wall of the chassis body (1). A guide fan (37) is fixedly connected inside the first connecting plate (35).

2. A computer chassis with an internal heat dissipation and airflow guiding structure according to claim 1, characterized in that: The inner wall of the chassis body (1) is provided with a first through hole (2), the inner wall of the baffle (4) is fixedly connected with a cable tray (6), and the outer wall of the cable tray (6) is provided with a cable tray hole (7).

3. A computer chassis with an internal heat dissipation and airflow guiding structure according to claim 1, characterized in that: The top of the chassis body (1) is fixedly connected to a first dust filter (8). The top of the chassis body (1) is provided with a fitting groove (9), and the fitting groove (9) is located outside the first dust filter (8). Magnets (11) are installed on the bottom wall of the fitting groove (9) and the bottom of the dustproof plate (10), and the magnetic poles of the two magnets (11) are opposite. The interior of the dustproof plate (10) is fixedly connected to a second dust filter (12), and the second dust filter (12) is located above the first dust filter (8).

4. A computer chassis with an internal heat dissipation and airflow guiding structure according to claim 1, characterized in that: The partition (13) forms a heat dissipation chamber with the inner top and bottom walls of the chassis body (1). A first ventilation hole (15) is provided on the top of the partition (13). A conical air guide shroud (14) is fixedly connected to the outer wall of the partition (13), and the conical air guide shroud (14) corresponds to the first ventilation hole (15).

5. A computer chassis with an internal heat dissipation and airflow guiding structure according to claim 1, characterized in that: The bottom of the chassis body (1) is fixedly connected to a support sleeve (16), the bottom of the support sleeve (16) is slidably connected to a base plate (18), the inner top wall of the support sleeve (16) is fixedly connected to a damping shock absorber (17), and the bottom end of the damping shock absorber (17) is connected to the top end of the base plate (18).

6. A computer chassis with an internal heat dissipation and airflow guiding structure according to claim 1, characterized in that: The outer wall of the partition (13) is fixedly connected to a first slide rail (19), the top and bottom of the mounting bracket (20) are fixedly connected to a first slider (21), and the first slider (21) is slidably connected to the inner side of the first slide rail (19). The inner wall of the mounting bracket (20) is fixedly connected to a mounting base (22), and the outer wall of the mounting base (22) is provided with a wire hole (23).

7. A computer chassis with an internal heat dissipation and airflow guiding structure according to claim 1, characterized in that: The outer wall of the mounting plate (25) is fixedly connected to a second slider (26), and the second slider (26) is slidably connected to the inner side of the second slide rail (24). A second ventilation hole (27) is provided on the top of the mounting plate (25).

8. A computer chassis with an internal heat dissipation and airflow guiding structure according to claim 1, characterized in that: The outer wall of the baffle (4) has a limiting groove (5), the inner wall of the protective cover (28) is fixedly connected to a limiting block (29), and the limiting block (29) is slidably connected to the inner side of the limiting groove (5). The outer wall of the protective cover (28) is threaded through and fitted with a first fastening bolt (30), and the bottom end of the first fastening bolt (30) abuts against the outer wall of the baffle (4). The outer wall of the guide cover (31) is threaded through a second fastening bolt (32), and the bottom end of the second fastening bolt (32) abuts against the outer wall of the second connecting plate (36).

9. A computer chassis with an internal heat dissipation and airflow guiding structure according to any one of claims 1 to 8, characterized in that, The computer case is used as follows: S1. Before using the computer chassis, remove the mounting bracket (20) from the inside of the chassis body (1). The mounting bracket (20) provides a mounting position for the computer electronic components. Install the electronic components above the mounting base (22). Guide the wires of the electronic components through the wire hole (23) so that the wires of the electronic components can be processed in an orderly manner. Then slide the mounting plate (25) out from the inside of the mounting bracket (20). The mounting plate (25) provides a mounting position for the cooling fan. After the electronic components are installed, slide the first slider (21) to the inside of the first slide rail (19) so that the staff can easily install and remove the mounting bracket (20) and facilitate the staff to carry out subsequent disassembly and maintenance. Avoid the electronic components being inside the chassis body (1), which would reduce the efficiency of the staff in inspecting the electronic components. S2. After the electronic components are installed, the wires of the electronic components are taken out by passing through the first through hole (2), and the top end of the wires is passed through the wire bundling hole (7) through the wire bundling plate (6), so that the wire bundling plate (6) can bundle the wires. After bundling the wires, the protective cover (28) is slidably connected to the outer wall of the baffle (4), and the limiting block (29) is slidably connected to the inner side of the limiting groove (5). Then, by rotating the second fastening bolt (32), the bottom end of the second fastening bolt (32) abuts against the outer wall of the second connecting plate (36), so that the staff can easily inspect and maintain the wire ports later. S3. When the computer case is in use, the fan installed above the mounting plate (25) dissipates heat inside the case body (1). At the same time, the first dust filter (8) and the second dust filter (12) filter dust in the air. During ventilation and heat dissipation, the first ventilation hole (15) and the conical air guide (14) allow the inside of the case body (1) to be ventilated normally. When the inside of the case body (1) is ventilated, the conical air guide (14) reduces the amount of water entering the inside of the case body (1) through the first dust filter (8) and the second dust filter (12), thus preventing water from entering the inside of the case body (1) and damaging electronic components when water is poured on the case body (1).

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