A heat sink and a computer case using the same
By introducing multiple parallel heat pipes and a pressing mechanism into the heat sink, combined with structures such as positioning blocks, positioning pillars, springs, and pressure rings, the problems of loosening and poor heat conduction caused by vibration and thermal expansion and contraction of the heat sink are solved. This achieves stable contact between the heat sink and the CPU and efficient heat dissipation, thereby improving the stability and heat dissipation efficiency of the computer system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 向钱
- Filing Date
- 2025-06-03
- Publication Date
- 2026-06-09
Smart Images

Figure CN224341850U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of electronic heat dissipation equipment technology, specifically relating to a heat sink and a computer chassis using the heat sink. Background Technology
[0002] As computer processor performance continues to improve, the heat generated during operation also increases significantly, placing higher demands on the reliability and efficiency of cooling systems. As a crucial thermal management component for core devices such as the central processing unit (CPU), the heatsink's structural design and installation method directly affect the overall system's operational stability and lifespan. Currently, most mainstream computer heatsinks employ bolt-fastened or snap-fit structures, pressing the bottom of the heatsink firmly against the CPU surface and using thermal grease for heat conduction to achieve the desired cooling effect.
[0003] However, in actual long-term operation, this type of connection has certain shortcomings due to the rigidity of the heatsink mounting structure. On the one hand, after bolt fixing or clip locking, the lack of an adaptive buffer structure means that the heatsink may loosen slightly when the system is subjected to vibration or external impact. On the other hand, under prolonged high-temperature operation, thermal expansion and contraction can cause tiny gaps to form at the thermal interface, and the thermal grease will gradually age or fail, leading to a decrease in heat transfer efficiency. These problems will prevent the heatsink base from maintaining a stable and continuous fit with the CPU, potentially causing heat dissipation failure, processor frequency degradation, or even system malfunctions.
[0004] In addition, existing radiator structures typically rely on manual tightening point by point during installation, lacking effective limit alignment mechanisms and elastic adjustment devices. This can easily lead to uneven clamping force or misalignment, increasing assembly difficulty and uncertainty, and is also not conducive to maintenance and reuse. Utility Model Content
[0005] In view of the problems existing in the prior art, the purpose of this utility model is to provide a heat sink and a computer case using the heat sink, which can achieve automatic adaptive pressing, stable positioning, and continuous contact with the CPU surface.
[0006] To achieve the above objectives, this utility model provides the following technical solution:
[0007] A heat sink includes heat pipes, wherein the number of heat pipes is set to a plurality, and the plurality of heat pipes are arranged side by side;
[0008] The bottom of the heat pipes arranged side by side is connected to a connector, and heat sinks are fitted on the heat pipes. A cooling fan is provided on one side of the heat sinks.
[0009] The connector is provided with a pressing mechanism, which is used to fix the connector to the CPU.
[0010] The pressing mechanism includes a pressing plate that engages with the connecting seat, and positioning pins are symmetrically inserted into the pressing plate. A spring and a pressure ring are sleeved on the positioning pins, and a pin is inserted into the positioning pins.
[0011] Furthermore, a positioning block is fixedly connected to the upper end face of the connecting seat;
[0012] The bottom of the lower pressure plate is provided with a locking groove;
[0013] The positioning block engages with the slot.
[0014] Furthermore, a second positioning hole is provided through the upper end face of the lower pressure plate;
[0015] The top of the positioning block is fixedly connected to a first positioning post, which passes through a second positioning hole.
[0016] Furthermore, the upper end face of the lower pressure plate is symmetrically provided with a plug hole;
[0017] The positioning post passes through the insertion hole, and the bottom of the positioning post is fixedly connected to the CPU cover.
[0018] Furthermore, the positioning post has equal-spaced adjustment holes along its height direction, the pin passes through the adjustment holes, and the pin is located above the pressure ring.
[0019] Furthermore, a retaining ring is provided at the bottom of the pressure ring, and the spring is located inside the retaining ring;
[0020] The top of the pressure ring is provided with a pin groove, and both ends of the pin are located in the pin groove.
[0021] A computer case using the heat sink includes a case body, wherein a heat dissipation hole is provided on one side edge of the case body and a heat dissipation window is provided at one end of the case body;
[0022] The bottom of the enclosure is provided with a motherboard bracket, on which the motherboard is mounted. The CPU is mounted on the motherboard, and the heat sink is mounted on the CPU. The cooling fan is oriented towards the heat dissipation holes or windows to accelerate the exhaust of hot air.
[0023] The enclosure is also equipped with an auxiliary exhaust fan that runs in the same direction as the radiator, which works in conjunction with the radiator's cooling fan to form an air duct and improve overall heat dissipation efficiency.
[0024] Compared with the prior art, the beneficial effects of this utility model are:
[0025] This utility model sets a positioning block on the connecting seat and a locking groove at the bottom of the lower pressure plate. By using the interlocking structure of the positioning block and the locking groove, precise horizontal alignment and locking are achieved during installation. This effectively prevents the lateral displacement of traditional radiators caused by vibration or structural stress during long-term use, thereby improving the structural stability and durability of the radiator installation.
[0026] This invention sets up a first positioning post and a second positioning hole, which are linked with the positioning block to form a three-dimensional limiting structure. This enables the heat sink to have good positioning constraint capability in the vertical direction, effectively avoiding longitudinal displacement problems caused by thermal expansion and contraction or installation errors. It ensures that the heat sink and the CPU always maintain a stable fit, improving the continuity of the heat conduction path and thermal efficiency.
[0027] This invention, through the setting of a positioning post, spring, pressure ring, and height-adjustable pin structure, forms a variable clamping device during the pressing process. The spring structure provides continuous elastic support force, and even after long-term operation, if the thermal grease ages or the contact surface is slightly deformed, it can automatically compensate for the clamping height and suppress the generation of contact gaps, thus solving the problem of unstable heat conduction that is prone to occur in traditional fixed structures.
[0028] This invention limits the axial movement path of the spring and pressure ring through the cooperation structure between the pin groove, the retaining ring and the pressure ring, preventing the elastic element from shifting or failing due to fatigue during long-term use, further enhancing the structural reliability and service life of the pressing mechanism, and ensuring the continuous performance output of the radiator under high temperature fluctuation conditions.
[0029] This utility model, through the coordinated design of the radiator and the internal structure of the chassis, arranges the cooling fan towards the heat dissipation holes or windows, and adds an auxiliary exhaust fan in the chassis that is consistent with the airflow direction, forming a main-auxiliary combined air duct. This solves the problems of short exhaust paths and easy heat flow retention in traditional radiators, and achieves efficient guidance and rapid exhaust of hot air, thereby effectively improving the overall heat dissipation efficiency and preventing local heat accumulation from causing system instability. Attached Figure Description
[0030] Figure 1 This is a schematic diagram of the structure of this utility model;
[0031] Figure 2 This is a schematic diagram of the structure of the connector of this utility model;
[0032] Figure 3 This is a schematic diagram of the pressing mechanism of this utility model;
[0033] Figure 4 This is a schematic diagram of the structure of the lower pressure plate of this utility model;
[0034] Figure 5This is a schematic diagram of the positioning column of this utility model;
[0035] Figure 6 This is a schematic diagram of the structure of the pressure ring of this utility model. Figure 1 ;
[0036] Figure 7 This is a schematic diagram of the structure of the pressure ring of this utility model. Figure 2 ;
[0037] Figure 8 This is a schematic diagram of the structure of the box body of this utility model.
[0038] The attached diagram lists the components represented by each number as follows:
[0039] 1. Heat pipe;
[0040] 2. Connecting seat; 21. Positioning block; 22. First positioning pin;
[0041] 3. Heat sink;
[0042] 4. Cooling fan;
[0043] 5. Pressing mechanism;
[0044] 51. Lower pressure plate; 511. Locking slot; 512. Second positioning hole; 513. Insertion hole;
[0045] 52. Positioning pin; 521. Adjustment hole;
[0046] 53. Spring;
[0047] 54. Pressure ring; 541. Pin groove; 542. Retaining ring; 55. Pin;
[0048] 6. Enclosure; 61. Ventilation holes; 62. Ventilation windows. Detailed Implementation
[0049] To make the objectives and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the following text is merely used to describe one or more specific embodiments of this utility model and does not strictly limit the scope of protection specifically claimed by this utility model.
[0050] See Figures 1-7A heat sink includes multiple heat pipes 1 arranged side-by-side. The bottom of each heat pipe 1 is connected to a connecting base 2, which integrates the lower ends of the multiple heat pipes 1 onto a unified mounting base to achieve uniform heat dissipation. Heat sink fins 3 are fitted onto the multiple heat pipes 1, spaced apart along the axial direction of the heat pipes 1 to form a high-density fin array, enhancing the contact area with air and improving heat dissipation efficiency. A cooling fan 4 is provided on one side of the cooling fan 3, fixed to a mounting frame on the edge of the cooling fan 3 with screws to generate forced airflow and quickly remove the heat absorbed by the cooling fan 3. The connecting base 2 is equipped with… A pressing mechanism 5 is provided to fix the connecting seat 2 to the CPU, ensuring a continuous and stable heat conduction path. The pressing mechanism 5 includes a pressing plate 51 that engages with the connecting seat 2. The pressing plate 51 is a planar metal structure plate on which positioning posts 52 are installed through a symmetrical plug-in structure. A spring 53 and a pressure ring 54 are sleeved on the outside of the positioning posts 52. The spring 53 is used to provide elastic pressure in the vertical direction, and the pressure ring 54 is used to limit the compression of the spring 53 and fix its position. A pin 55 is inserted into the positioning post 52. The pin 55 is used to realize height adjustment and locking control of the pressure ring 54 to ensure that the pressing mechanism 5 has good fit and reliability in long-term working conditions.
[0051] See Figures 1-4 A positioning block 21 is fixedly connected to the upper end face of the connecting seat 2. The positioning block 21 is welded or riveted to the connecting seat 2 and has a rectangular block structure. A locking groove 511 is opened at the bottom of the lower pressure plate 51. The locking groove 511 is a groove structure that matches the shape of the positioning block 21 and is used to realize a reliable mechanical fastening between the two. The positioning block 21 is fastened into the locking groove 511, which plays a role in limiting and aligning during the downward installation of the lower pressure plate 51, avoiding the problem of unstable fit caused by uneven force or offset of the connecting seat 2 during the installation process, and effectively enhancing the stability of the lower pressure mechanism 5.
[0052] See Figures 1-5 The upper end face of the lower pressure plate 51 is provided with a second positioning hole 512, which is a circular through hole structure and is symmetrically arranged on the left and right sides of the lower pressure plate 51. The top of the positioning block 21 is fixedly connected with a first positioning pin 22, which is a cylindrical pin that passes through the second positioning hole 512 to achieve mechanical limiting fit in the vertical direction. Through the insertion fit between the first positioning pin 22 and the second positioning hole 512, after the lower pressure plate 51 completes the snap-fit positioning with the connecting seat 2, the overall three-dimensional stability is further enhanced, preventing the heat sink from structural displacement due to micro-vibration during operation, thereby maintaining the continuous contact of the heat-conducting contact surface.
[0053] See Figures 2-5The upper end face of the lower pressure plate 51 is symmetrically provided with a insertion hole 513, which is used for the insertion and mating of the positioning post 52. The diameter of the insertion hole 513 is slightly larger than the outer diameter of the positioning post 52 to ensure that the positioning post 52 can be smoothly inserted and has a certain axial movement space. The positioning post 52 passes through the insertion hole 513, and the bottom of the positioning post 52 is fixedly connected to the CPU cover. The bottom end of the positioning post 52 is connected to the reserved interface on the CPU cover by threaded connection or slot locking, which plays the role of supporting and stabilizing the lower pressure plate 51. This structure ensures that the heat sink can form a reliable mechanical connection with the CPU, and at the same time, combined with the spring structure, it maintains stable vertical pressure transmission and alleviates the problem of structural loosening caused by temperature changes.
[0054] See Figures 3-7 The positioning post 52 has adjustment holes 521 evenly spaced along its height direction. The adjustment holes 521 are multiple axially evenly distributed circular holes used to allow the pin 55 to be inserted at different heights. The pin 55 passes through the adjustment holes 521 and limits the height of the pressure ring 54 through positioning. The pin 55 is located above the pressure ring 54 and adjusts the compression of the spring 53 by contacting the top of the pressure ring 54, thereby controlling the overall downward pressure. This structure can be flexibly adjusted according to the height of different CPUs or installation conditions, avoiding the problem of improper fit caused by height deviation, and solving the problem of reduced heat dissipation efficiency caused by micro gaps due to structural solidification or aging of the heat sink after long-term operation in the background technology.
[0055] See Figures 3-7 The bottom of the pressure ring 54 is provided with a retaining ring 542, which is a concave limiting structure. It surrounds the outside of the spring 53 and supports the bottom of the spring 53, preventing the spring 53 from axially slipping or deviating from the center line of the positioning post 52 during long-term use. The spring 53 is located inside the retaining ring 542. After being subjected to force, it can be compressed and deformed between the pressure ring 54 and the lower pressure plate 51, continuously providing elastic support downward. The top of the pressure ring 54 is provided with a pin groove 541, which is an arc-shaped guide groove that runs through both ends. The two ends of the pin 55 are located in the pin groove 541, realizing the axial limiting and rotation prevention function of the pressure ring 54. This structure, together with the adjustment function of the pin 55 and the adjustment hole 521, makes the lower pressure structure flexible and adjustable, structurally stable and with strong shock resistance, further ensuring that the bottom surface of the heat sink is in long-term contact with the CPU without loosening.
[0056] See Figure 8A computer chassis using this heat sink includes a chassis 6, which is made of metal or high-strength engineering plastic and houses a motherboard, fan, power supply, and multiple functional modules. Ventilation holes 61 are provided on one side edge of the chassis 6, arranged in a honeycomb pattern to allow for natural convection or passive exhaust of internal hot air. A ventilation window 62, a rectangular opening with a metal protective mesh, is provided at one end of the heat sink's airflow duct to enhance active ventilation. A motherboard bracket is located at the bottom of the chassis 6, employing a stepped bracket structure to ensure compatibility with different motherboard specifications. The motherboard is mounted on the motherboard bracket. The motherboard houses the CPU, and the heatsink is mounted on the CPU, secured by a pressing mechanism 5. The cooling fan 4 faces the ventilation holes 61 or ventilation windows 62, forming a connection with the airflow structure to accelerate the exhaust of hot air. An auxiliary exhaust fan, aligned with the heatsink's airflow direction, is also installed inside the enclosure 6. This auxiliary exhaust fan is installed at the end of the heatsink channel or on the rear wall of the enclosure, rotating synchronously to remove air from around the heatsink, thus guiding smooth airflow. These structures together form an internal airflow closed loop, effectively improving heat dissipation efficiency and ensuring that core components such as the CPU maintain a safe temperature under high load, preventing system instability or shortened hardware lifespan due to localized overheating.
[0057] The working principle of this utility model is as follows:
[0058] The heat sink structure provided by this utility model addresses the problem that traditional heat sinks, which are generally installed using bolts or clips, are prone to developing tiny gaps between the bottom surface of the heat sink and the CPU during long-term operation due to vibration, thermal expansion and contraction, or material aging, resulting in poor heat conduction. The structure has been specifically improved.
[0059] Specifically, by setting a snap-fit lower pressure plate 51 on the connecting seat 2, and combining the three-dimensional limiting structure of the positioning block 21, the first positioning post 22 and the second positioning hole 512, the radiator can achieve stable initial alignment and locking during installation, avoiding installation deviations caused by external forces or micro-displacements.
[0060] Furthermore, the pressure plate 51 is connected to the positioning post 52 via the insertion hole 513. The positioning post 52 is equipped with a spring 53 and a pressure ring 54, and cooperates with the pin 55 through the height-adjustable adjustment hole 521 to form an adaptive pressure structure. This structure can continuously provide a certain elastic pressure between the CPU and the heatsink contact surface. Even when thermal expansion and contraction, thermal grease aging, or slight structural loosening occur during long-term operation, the spring structure can still compensate for the offset through rebound, keeping the heat-conducting surface in close contact and effectively suppressing the formation of micro-gaps.
[0061] The bottom of the pressure ring 54 is provided with a retaining ring 542 to limit the displacement of the spring. The pin groove 541 at the top of the ring is matched with the pin 55 for limiting, which can achieve reliable positioning and quick adjustment, simplify the installation operation, and improve the assembly consistency and long-term stability of the heat dissipation system.
[0062] In the overall application, the cooling fan 4 is installed facing the heat dissipation holes 61 or heat dissipation windows 62 of the enclosure 6, and together with the auxiliary exhaust fan set inside the enclosure 6, it forms a directional airflow. Through structural cooperation, it effectively guides the heat flow out, improves the overall heat dissipation efficiency, and thus ensures the stability and safety of the computer system under high load operation.
[0063] The above description is merely a preferred embodiment of this utility model. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model. Structures, devices, and operating methods not specifically described or explained in this utility model, unless otherwise specified or limited, shall be implemented using conventional methods in the field.
Claims
1. A radiator, characterized in that: It includes heat pipes (1), the number of heat pipes (1) is set to multiple, and the multiple heat pipes (1) are arranged side by side; The bottom of the heat pipes (1) arranged side by side is connected to a connector (2), and heat sinks (3) are fitted on the heat pipes (1). A heat sink fan (4) is provided on one side of the heat sink (3). The connector (2) is provided with a pressing mechanism (5), which is used to fix the connector (2) to the CPU; The pressing mechanism (5) includes a pressing plate (51) engaged with the connecting seat (2), and positioning pins (52) are symmetrically inserted on the pressing plate (51). A spring (53) and a pressure ring (54) are sleeved on the positioning pins (52), and a pin (55) is inserted on the positioning pins (52).
2. A radiator according to claim 1, characterized in that: A positioning block (21) is fixedly connected to the upper end face of the connecting seat (2); The bottom of the lower pressure plate (51) is provided with a slot (511). The positioning block (21) is engaged in the slot (511).
3. A radiator according to claim 2, characterized in that: The upper end face of the lower pressure plate (51) is provided with a second positioning hole (512). The top of the positioning block (21) is fixedly connected to a first positioning post (22), which passes through the second positioning hole (512).
4. A radiator according to claim 1, characterized in that: The upper end face of the lower pressure plate (51) is symmetrically provided with a plug hole (513). The positioning post (52) passes through the insertion hole (513), and the bottom of the positioning post (52) is fixedly connected to the CPU cover.
5. A radiator according to claim 4, characterized in that: The positioning post (52) has an adjustment hole (521) that is evenly spaced along its height direction. The pin (55) passes through the adjustment hole (521) and is located above the pressure ring (54).
6. A radiator according to claim 5, characterized in that: A retaining ring (542) is provided at the bottom of the pressure ring (54), and the spring (53) is located inside the retaining ring (542); The top of the pressure ring (54) is provided with a pin groove (541), and both ends of the pin (55) are located in the pin groove (541).
7. A computer chassis employing the heat sink according to any one of claims 1 to 6, characterized in that: Includes a housing (6), with a heat dissipation hole (61) at one edge of the housing (6) and a heat dissipation window (62) at one end of the housing (6). The bottom of the housing (6) is provided with a motherboard bracket, a motherboard is installed on the motherboard bracket, a CPU is installed on the motherboard, and the heat sink is installed on the CPU. The heat sink fan (4) is set towards the heat dissipation hole (61) or heat dissipation window (62) to accelerate the exhaust of hot air. The housing (6) is also equipped with an auxiliary exhaust fan that is aligned with the airflow direction of the radiator's cooling fan (4), which works in conjunction with the radiator's cooling fan (4) to form an air duct and improve the overall heat dissipation efficiency.