Dashcam and vehicle

Abstract

This application discloses a dashcam and a vehicle. The dashcam may include a housing, a circuit board, a camera, and a first heat sink. The housing has a recessed cavity; the circuit board is disposed within the recessed cavity and has a control chip mounted on it; at least a portion of the camera is disposed within the recessed cavity and electrically connected to the control chip; the first heat sink is disposed within the recessed cavity and is at least partially positioned opposite the control chip; the first heat sink comprises a substrate and graphene, and is configured as a single, integrally formed structure. The technical solution of this application improves the heat dissipation of the dashcam, reducing the possibility of overheating affecting its operation.

Description

Technical Field

[0001] This application relates to the field of dashcam technology, and in particular to a dashcam and a vehicle. Background Technology

[0002] Dashcams can record images and sounds while a vehicle is in motion, serving as evidence in traffic accidents and for monitoring parking. As a result, more and more vehicles are being equipped with dashcams.

[0003] However, dashcams in this technology generate heat during operation, and overheating can affect their functionality. Utility Model Content

[0004] The main purpose of this application is to provide a dashcam that can improve heat dissipation and reduce the possibility of overheating affecting the operation of the dashcam.

[0005] To achieve the above objectives, the dashcam proposed in this application includes:

[0006] A housing, wherein a receiving cavity is provided inside the housing;

[0007] A circuit board, which is disposed within the accommodating cavity, and a control chip is provided on the circuit board;

[0008] A camera, at least a portion of which is disposed within the accommodating cavity and electrically connected to the control chip; and

[0009] A first heat sink is disposed within the accommodating cavity and is at least partially disposed opposite to the control chip; the first heat sink includes a substrate and graphene and is configured as an integrally formed structure.

[0010] Optionally, the substrate is made of nylon or aluminum;

[0011] And / or, the first heat sink includes a heat sink plate and a plurality of heat sink protrusions, the heat sink plate being disposed opposite to the control chip, and the plurality of heat sink protrusions being disposed on the side of the heat sink plate facing away from the control chip.

[0012] Optionally, the dashcam further includes a first heat-conducting component, which is disposed between the control chip and the first heat sink and configured to contact the control chip and the first heat sink.

[0013] Optionally, the first thermally conductive element is made of thermally conductive silicone.

[0014] Optionally, the dashcam further includes a second heat sink, which is disposed on the side of the circuit board opposite to the control chip and is at least partially disposed opposite to the control chip.

[0015] The second heat sink includes a substrate and graphene, and is configured as a single-piece structure.

[0016] Optionally, the dashcam further includes a second heat-conducting component and a third heat-conducting component, wherein the second heat-conducting component is disposed between the circuit board and the second heat sink and is configured to contact the circuit board and the second heat sink;

[0017] The third heat-conducting component is disposed between the second heat-dissipating component and the housing, and is configured to contact the second heat-dissipating component and the housing.

[0018] Optionally, the second and third thermal conductive elements are made of thermally conductive silicone.

[0019] Optionally, the second heat sink has a contoured surface on the side facing away from the circuit board, and the contoured surface has the same shape as the wall surface of the area opposite the housing.

[0020] Optionally, the dashcam further includes a battery module, the battery module and the camera are located on the same side of the circuit board and arranged along a first direction;

[0021] The control chip is located in the area between the battery module and the camera. The dashcam also includes a speaker. The control chip, the first heat sink, and the speaker are arranged along a second direction, and the speaker and the first heat sink are spaced apart. The second direction intersects the first direction.

[0022] The housing has a connecting hole at the position corresponding to the speaker, which connects to the accommodating cavity, and the speaker is electrically connected to the control chip.

[0023] This application also proposes a vehicle comprising:

[0024] The vehicle body; and

[0025] The dashcam described above is mounted on the vehicle body.

[0026] The technical solution of this application involves incorporating a first heat sink within the housing cavity of the dashcam. This first heat sink is positioned opposite the main heat source control chip on the circuit board, enabling targeted heat dissipation of the primary heat source. Furthermore, the first heat sink comprises a substrate and graphene, forming a single, integral structure. This allows the first heat sink to possess high heat dissipation performance and strength, ensuring stable and efficient heat dissipation of the control chip and radiating heat to other areas within the housing cavity and / or dissipating it from the housing. Thus, the targeted heat dissipation of the main heat source within the dashcam, combined with the excellent heat dissipation performance and strength of the first heat sink, ensures stable heat dissipation, improving the overall heat dissipation effect of the dashcam and reducing the possibility of overheating affecting its operation. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of an embodiment of the dashcam of this application;

[0029] Figure 2 for Figure 1 A schematic diagram of a partial exploded structure of a dashcam.

[0030] Figure 3 for Figure 2 A partial structural diagram of a dashcam;

[0031] Figure 4 for Figure 3 A partial cross-sectional view of a dashcam;

[0032] Figure 5 for Figure 3 Another partial exploded structure diagram of the dashcam;

[0033] Figure 6 for Figure 5 A schematic diagram of another partial explosion of a dashcam.

[0034] Explanation of icon numbers:

[0035] 100. Dashcam; 10. Housing; 11. First housing; 111. Rotating hole; 13. Second housing; 131. Receiving cavity; 133. Connecting hole; 20. Circuit board; 21. Control chip; 30. Camera; 40. First heat sink; 41. Heat sink plate; 43. Heat dissipation protrusion; 50. First heat conduction component; 60. Second heat sink; 61. Contouring surface; 70. Second heat conduction component; 80. Third heat conduction component; 91. Battery module; 93. Speaker.

[0036] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0037] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0038] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0039] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0040] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the word "and / or" throughout the text means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of a person skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0041] Please refer to the reference. Figures 1 to 4 This application proposes a dashcam 100. In one embodiment of this application, the dashcam 100 includes a housing 10, a circuit board 20, a camera 30, and a first heat sink 40. The housing 10 has a receiving cavity 131. The circuit board 20 is disposed in the receiving cavity 131 and has a control chip 21. At least a portion of the camera 30 is disposed in the receiving cavity 131 and is electrically connected to the control chip 21. The first heat sink 40 is disposed in the receiving cavity 131 and is at least partially disposed opposite to the control chip 21. The first heat sink 40 includes a substrate and graphene and is configured as an integrally formed structure.

[0042] The housing 10 serves as a cavity 131 for accommodating the circuit board 20, camera 30, first heat sink 40, and other components of the dashcam 100, allowing the components to be assembled into a single unit and providing protection for them. In some embodiments, to allow adjustment of the shooting angle of the camera 30 mounted on the housing 10, the housing 10 may include a first housing 11 and a second housing 13. The first housing 11 is mounted on a vehicle and may have a rotating hole 111. One end of the second housing 13 is rotatably inserted into the rotating hole 111, and an interference fit or silicone ring may be used between it and the first housing 11 to limit its rotation. In this case, the second housing 13 may have a cavity 131, at least partially located outside the rotating hole 111. The camera 30 may be at least partially located within the cavity 131 of the second housing 13, outside the rotating hole 111. Of course, this application is not limited to this. In some embodiments, the housing 10 may only include the first housing 11, in which case a receiving cavity 131 may be provided within the first housing 11. In addition, the shape of the housing 10 may be cylindrical or cuboid, and this application does not limit the shape of the housing 10.

[0043] The circuit board 20 can be used to provide mounting positions for mounting the control chip 21, and then the control chip 21 can be used to control the operation of the dashcam 100, such as turning it on and off. The circuit board 20 can be rectangular, square or circular, and this application does not limit the shape of the circuit board 20.

[0044] The camera 30 can be used to perform monitoring and recording functions to complete the basic functions of the dashcam 100. At least a portion of the camera 30 is housed within the receiving cavity 131, meaning that a portion of the camera 30 can be placed inside the receiving cavity 131, while the recording end can be exposed outside the receiving cavity 131. Alternatively, the entire camera 30 can be housed within the receiving cavity 131. In this case, the housing 10 can have a light-transmitting portion corresponding to the position of the camera 30, such as a light-transmitting hole or a portion of the housing 10 made of a light-transmitting material. Furthermore, there can be one camera 30, which can be located on the same side as the control chip 21 for easy electrical connection. Alternatively, the camera 30 and the control chip 21 can be located on opposite sides of the circuit board 20. In addition, there can be at least two cameras 30, which can be arranged back-to-back, so that one can be used to monitor and record the external environment of the vehicle, and the other can be used to monitor and record the internal environment of the vehicle.

[0045] The first heat sink 40 can be used to dissipate heat from the control chip 21, radiating the heat from the control chip 21 to other areas of the accommodating cavity 131 or the housing 10, thereby reducing the temperature of the control chip 21. The graphene included in the first heat sink 40 can improve its heat dissipation effect due to its high heat dissipation performance. The substrate included in the first heat sink 40 can strengthen the graphene, thereby increasing the overall strength of the first heat sink 40 and reducing the possibility of damage due to insufficient strength during vehicle collisions or bumps, ensuring stable heat dissipation. The substrate can be made of nylon, allowing the substrate and graphene to be directly mixed in a molten state and then directly molded as a single piece, improving the manufacturing convenience of the first heat sink 40. Furthermore, nylon is relatively inexpensive, thus reducing the manufacturing cost of the first heat sink 40. Of course, in some embodiments, the substrate can also be made of aluminum. At this point, a substrate can be manufactured first, and then the substrate can be placed in a molding die in a pre-embedded form to integrally form with graphene. Since aluminum also has high heat dissipation performance, this further improves the heat dissipation performance of the first heat sink 40. Alternatively, in some embodiments, the substrate material can also be boron nitride or copper, etc., which is not limited in this application. Furthermore, the first heat sink 40 is at least partially disposed opposite to the control chip 21, that is, on the projection plane perpendicular to the arrangement direction of the control chip 21 and the first heat sink 40, the projection of the first heat sink 40 and the projection of the control chip 21 at least partially overlap. Moreover, in some embodiments, to improve the heat dissipation effect of the first heat sink 40 on the control chip 21, on the projection plane perpendicular to the arrangement direction of the control chip 21 and the first heat sink 40, the projection of the control chip 21 can be located inside the projection of the first heat sink 40, that is, the area of ​​the first heat sink 40 is larger than the area of ​​the control chip 21. Of course, in some embodiments, it is also possible to set the area of ​​the first heat sink 40 and the area of ​​the control chip 21 to be equal. Furthermore, the shape of the first heat sink 40 can be rectangular, or it can be square, etc. This application does not limit the shape of the first heat sink 40. In addition, the first heat sink 40 and the control chip 21 can be in contact, or they can be separated by a gap. The side of the first heat sink 40 facing away from the control chip 21 can be in contact with the housing 10, or it can be separated by a gap from the housing 10.

[0046] The technical solution of this application involves providing a first heat sink 40 within the accommodating cavity 131 of the housing 10 of the dashcam 100. This first heat sink 40 is positioned opposite the main heat source control chip 21 on the circuit board 20, enabling targeted heat dissipation of the main heat source. Furthermore, the first heat sink 40 is configured to include a substrate and graphene, forming a single integrated structure. This allows the first heat sink 40 to possess high heat dissipation performance and strength requirements, ensuring stable and efficient heat dissipation of the control chip 21 and radiating heat to other areas within the accommodating cavity 131 and / or the housing 10. Thus, the targeted heat dissipation of the main heat source within the dashcam 100, combined with the excellent heat dissipation performance and strength of the first heat sink 40, ensures stable heat dissipation, improving the heat dissipation effect of the dashcam 100 and reducing the possibility of overheating affecting its operation.

[0047] Please refer to the reference. Figures 4 to 6 In one embodiment of this application, the first heat sink 40 includes a heat sink 41 and a plurality of heat sink protrusions 43. The heat sink 41 is disposed opposite to the control chip 21, and the plurality of heat sink protrusions 43 are disposed on the side of the heat sink 41 that is away from the control chip 21.

[0048] The heat dissipation protrusion 43 can be cylindrical and extend in a direction parallel to the plane of the heat sink 41. Alternatively, it can extend perpendicular to the plane of the heat sink 41, or in the direction of the arrangement of the heat sink 41 and the control chip 21. Of course, the heat dissipation protrusion 43 can also be plate-shaped. This application does not limit the structural type of the heat dissipation protrusion 43.

[0049] In this embodiment, the first heat sink 40 is configured to include a heat sink 41 and multiple heat sink protrusions 43. This allows the heat sink 41 to facilitate a larger contact area with the control chip 21, or with the first thermally conductive element 50 (described below) positioned between the control chip 21 and the first heat sink 40, thereby improving heat dissipation. The multiple heat sink protrusions 43 increase the contact area between the other side of the first heat sink 40 and the air, further enhancing heat dissipation. It should also be noted that the first heat sink 40 described above, comprising a substrate and graphene, refers to the material of the first heat sink 40. However, the first heat sink 40 defined here, comprising the heat sink 41 and heat sink protrusions 43, refers to its structure. That is, both the heat sink 41 and the heat sink protrusions 43 include a substrate and graphene.

[0050] Please refer to the reference. Figures 4 to 6In one embodiment of this application, the dashcam 100 further includes a first heat-conducting element 50, which is disposed between the control chip 21 and the first heat sink 40 and configured to contact the control chip 21 and the first heat sink 40.

[0051] In this embodiment, a first heat-conducting element 50 is provided between the control chip 21 and the first heat sink 40 to facilitate the rapid conduction of heat generated by the control chip 21 to the first heat sink 40 for heat dissipation, thereby improving the heat dissipation effect at the control chip 21. The first heat-conducting element 50 can be made of thermally conductive silicone to provide good thermal conductivity while allowing for deformation, achieving close contact with both the control chip 21 and the first heat sink 40, thus improving heat dissipation. However, this application is not limited to this; in some embodiments, the first heat-conducting element 50 can also be made of aluminum or copper, etc. Furthermore, the shape and size of the first heat-conducting element 50 can be the same as those of the control chip 21 to increase the contact area and improve heat dissipation. Of course, in some embodiments, the shape and size of the first heat-conducting element 50 can also be different from those of the control chip 21.

[0052] Please refer to the reference. Figures 4 to 6 In one embodiment of this application, the dashcam 100 further includes a second heat sink 60, which is disposed on the side of the circuit board 20 opposite to the control chip 21 and is at least partially disposed opposite to the control chip 21; the second heat sink 60 includes a substrate and graphene and is configured as an integral structure.

[0053] In this embodiment, a second heat sink 60 is also provided on the side of the circuit board 20 opposite to the control chip 21, so that heat from the control chip 21 can be transferred to the second heat sink 60 via the circuit board 20 for heat dissipation, thereby improving the heat dissipation effect on the control chip 21. Furthermore, the second heat sink 60 is configured to include a substrate and graphene, just like the first heat sink 40, so that the second heat sink 60 can also meet both heat dissipation performance and strength requirements. The substrate material of the second heat sink 60 can be the same as the substrate material in the first heat sink 40, such as nylon or aluminum. In addition, it should be noted that the second heat sink 60 can also be used to dissipate heat from devices mounted on the side of the circuit board 20 opposite to the control chip 21, such as a Wi-Fi module.

[0054] Please refer to the reference. Figures 4 to 6In one embodiment of this application, the dashcam 100 further includes a second heat-conducting element 70 and a third heat-conducting element 80. The second heat-conducting element 70 is disposed between the circuit board 20 and the second heat sink 60 and is configured to contact the circuit board 20 and the second heat sink 60. The third heat-conducting element 80 is disposed between the second heat sink 60 and the housing 10 and is configured to contact the second heat sink 60 and the housing 10.

[0055] In this embodiment, a second heat-conducting element 70 is provided between the circuit board 20 and the second heat sink 60, and a third heat-conducting element 80 is provided between the second heat sink 60 and the housing 10. This facilitates the rapid conduction of heat generated by the control chip 21 to the housing 10 for heat dissipation, thereby improving the heat dissipation effect at the control chip 21. The second heat-conducting element 70 can be made of thermally conductive silicone, so that it has good thermal conductivity and can deform to achieve close contact with the circuit board 20 and the second heat sink 60, thus improving the heat dissipation effect. Of course, this application is not limited to this; in some embodiments, the material of the second heat-conducting element 70 can also be aluminum or copper, etc. This application does not limit the material of the second heat-conducting element 70.

[0056] Similarly, the third heat-conducting element 80 can be made of thermally conductive silicone to ensure good thermal conductivity while allowing for deformation, thus achieving close contact with the second heat sink 60 and the housing 10 and improving heat dissipation. However, this application is not limited to this; in some embodiments, the third heat-conducting element 80 can also be made of aluminum or copper, etc. This application does not limit the material of the third heat-conducting element 80.

[0057] Please refer to the reference. Figure 4 and Figure 6 In one embodiment of this application, the second heat sink 60 has a contoured surface 61 on the side facing away from the circuit board 20, and the contoured surface 61 has the same shape as the wall of the area opposite the housing 10.

[0058] In this embodiment, the second heat sink 60 is provided with a contoured surface 61 that matches the shape of the housing 10, so that the two can be directly fitted and abutted together, or fitted tightly together through the third heat-conducting component 80, thereby improving the compatibility and heat dissipation effect.

[0059] Please refer to the reference. Figures 4 to 6In one embodiment of this application, the dashcam 100 further includes a battery module 91, the battery module 91 and the camera 30 are located on the same side of the circuit board 20 and are arranged along a first direction; the control chip 21 is located in the area between the battery module 91 and the camera 30. The dashcam 100 also includes a speaker 93, the control chip 21, the first heat sink 40 and the speaker 93 are arranged along a second direction, and the speaker 93 and the first heat sink 40 are spaced apart, and the second direction intersects the first direction; the housing 10 has a connecting hole 133 at the position corresponding to the speaker 93 that connects to the receiving cavity 131, and the speaker 93 is electrically connected to the control chip 21.

[0060] In this embodiment, by providing a battery module 91, the dashcam 100 can supply power to electrical components such as the control chip 21, camera 30, and speaker 93 when not connected to an external power source. The speaker 93 facilitates voice prompts and other functions of the dashcam 100. Furthermore, arranging the battery module 91, control chip 21, and camera 30 along a first direction, and arranging the control chip 21, first heat sink 40, and speaker 93 along a second direction, allows for compact stacking of the components in the dashcam 100, reducing space occupation. Simultaneously, the speaker 93 and the first heat sink 40 are spaced apart, effectively balancing heat dissipation for the control chip 21 with structural compactness. Additionally, the connecting hole 133 corresponding to the speaker 93, besides being used for sound generation, also facilitates airflow exchange within and outside the accommodating cavity 131, thereby improving heat exchange between the first heat sink 40 and the air, and ultimately enhancing heat dissipation for the control chip 21. In addition, the first direction can be the rotation axis direction of the second housing 13 as described above, and the speaker 93 can be set in the accommodating cavity 131 of the second housing 13 located outside the rotation hole 111. The battery module 91 can be set in the accommodating cavity 131 of the second housing 13 located inside the rotation hole 111, thereby improving the utilization rate of the inner space of the second housing 13.

[0061] This application also proposes a vehicle including a vehicle body and a dashcam 100. The specific structure of the dashcam 100 is as described in the above embodiments. Since this vehicle adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here. The dashcam 100 is located on the vehicle body.

[0062] The above description is merely a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the inventive concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A dashcam, characterized in that, include: A housing, wherein a receiving cavity is provided inside the housing; A circuit board, which is disposed within the accommodating cavity, and a control chip is provided on the circuit board; A camera, at least a portion of which is disposed within the accommodating cavity and electrically connected to the control chip; and A first heat sink is disposed within the accommodating cavity and is at least partially disposed opposite to the control chip; the first heat sink includes a substrate and graphene and is configured as an integrally formed structure.

2. The dashcam as described in claim 1, characterized in that, The substrate is made of nylon or aluminum; And / or, the first heat sink includes a heat sink plate and a plurality of heat sink protrusions, the heat sink plate being disposed opposite to the control chip, and the plurality of heat sink protrusions being disposed on the side of the heat sink plate facing away from the control chip.

3. The dashcam as described in claim 1, characterized in that, The dashcam also includes a first heat-conducting component, which is disposed between the control chip and the first heat sink and configured to contact the control chip and the first heat sink.

4. The dashcam as described in claim 3, characterized in that, The first thermally conductive component is made of thermally conductive silicone.

5. The dashcam as described in any one of claims 1 to 4, characterized in that, The dashcam also includes a second heat sink, which is located on the side of the circuit board facing away from the control chip and is at least partially opposite to the control chip. The second heat sink includes a substrate and graphene, and is configured as a single-piece structure.

6. The dashcam as described in claim 5, characterized in that, The dashcam also includes a second heat-conducting component and a third heat-conducting component. The second heat-conducting component is disposed between the circuit board and the second heat sink and is configured to contact the circuit board and the second heat sink. The third heat-conducting component is disposed between the second heat-dissipating component and the housing, and is configured to contact the second heat-dissipating component and the housing.

7. The dashcam as described in claim 6, characterized in that, The second and third thermal conductive components are made of thermally conductive silicone.

8. The dashcam as described in claim 5, characterized in that, The second heat sink has a contoured surface on the side facing away from the circuit board, and the contoured surface has the same shape as the wall surface of the area opposite the housing.

9. The dashcam as described in any one of claims 1 to 4, characterized in that, The dashcam also includes a battery module, and the battery module and the camera are located on the same side of the circuit board and arranged along a first direction; The control chip is located in the area between the battery module and the camera. The dashcam also includes a speaker. The control chip, the first heat sink, and the speaker are arranged along a second direction, and the speaker and the first heat sink are spaced apart. The second direction intersects the first direction. The housing has a connecting hole at the position corresponding to the speaker, which connects to the accommodating cavity, and the speaker is electrically connected to the control chip.

10. A vehicle, characterized in that, include: Vehicle body; and The dashcam as described in any one of claims 1 to 9, wherein the dashcam is mounted on the vehicle body.

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