A novel heat-conductive flexible wiring board

Abstract

This utility model discloses a novel thermally conductive flexible circuit board, comprising a flexible substrate, conductive copper foil, an insulating protective film, an anti-over-bending bracket, and a porous heat-conducting plate. The flexible substrate, conductive copper foil, and insulating protective film are formed by pressing with a thermosetting adhesive. An anti-over-bending bracket is clamped at the bending position of the insulating protective film. The porous heat-conducting plate is fixedly installed on the surface of the insulating protective film with thermally conductive silicone grease. In this novel thermally conductive flexible circuit board, an arc-shaped matching bracket is positioned and aligned with the bending position of the flexible circuit board. An arc-shaped pressure roller positions and presses the curved bending position. A pressure plate, in conjunction with anti-slip pads, stably positions and clamps the flexible circuit board. Bottom thermally conductive alloy strips work with the alloy plate body for heat conduction, and through-holes allow for rapid heat dissipation, improving overall heat dissipation efficiency. The bottom of the alloy plate is uniformly spaced with bottom thermally conductive alloy strips, forming an overhead channel that provides some airflow and heat dissipation.

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