Modular circuit board heat sink structure

Abstract

This utility model discloses a modular circuit board heat dissipation structure, relating to the field of circuit board heat dissipation technology. It includes: a housing with a plurality of heat dissipation fins evenly distributed on the bottom outer surface; a detachable cover plate on the top of the housing; a thermally conductive substrate fixedly disposed inside the bottom of the housing, on which heat-generating components are disposed; and thermally conductive grease filling the space between the thermally conductive substrate and the housing. This modular circuit board heat dissipation structure conducts heat generated by the heat-generating components to the thermally conductive substrate at the bottom of the housing. The thermally conductive substrate then conducts the heat to the thermally conductive grease, which in turn conducts the heat to the plurality of heat dissipation fins on the outer surface of the housing. An external air-cooling device then rapidly removes the heat from the heat dissipation fins, thereby improving the heat dissipation effect of the modular circuit board and ensuring its operational stability and reliability. Simultaneously, it facilitates the disassembly, repair, or replacement of the modular components inside the circuit board.

Description

Technical Field

[0001] This utility model relates to the field of circuit board heat dissipation technology, specifically to a modular circuit board heat dissipation structure. Background Technology

[0002] With the rapid development of electronic technology, controllers are increasingly used in various electronic devices, such as industrial automation equipment, smart home appliances, and automotive electronic systems. These controllers need to handle complex calculation and control tasks and integrate a large number of high-performance electronic components, which leads to a continuous increase in the power consumption of the controllers and increasingly serious heat generation problems.

[0003] Chinese utility model patent CN212519807U discloses a motor controller with good heat dissipation. By incorporating a cooling box, when the controller circuit board generates heat, the heat is transferred to the cooling box through heat-conducting blocks and heat dissipation fins. The heat is then carried away by the flow of coolant, facilitating heat dissipation from the controller circuit board. However, this controller has a compact structure and limited size, making it unable to meet the requirements of efficient heat dissipation under high power density. Furthermore, the electrical connections and disassembly / removal of the multi-layered circuit boards within the controller are relatively difficult, increasing the difficulty of maintenance or replacement.

[0004] Therefore, there is an urgent need for a modular circuit board heat dissipation structure to meet the high-efficiency heat dissipation requirements of compact and size-constrained controllers under high power density, and to facilitate the electrical connection and disassembly of internal multi-layer circuit boards. Utility Model Content

[0005] The purpose of this utility model is to provide a modular circuit board heat dissipation structure to solve at least one aspect of the problems and defects mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A modular circuit board heat dissipation structure, comprising:

[0008] The housing has a plurality of heat dissipation fins evenly distributed on the bottom outer surface, and a cover plate is detachably provided on the top of the housing;

[0009] A heat-conducting substrate is fixedly disposed at the bottom of the housing, and a heat-generating component is disposed on the heat-conducting substrate;

[0010] Thermally conductive grease is filled between the thermally conductive substrate and the housing.

[0011] Based on the modular circuit board heat dissipation structure of this solution, at least the following technical effects are achieved:

[0012] This modular circuit board heat dissipation structure uses a heat-conducting substrate at the bottom of the housing to conduct heat generated by the heat-generating components to the substrate. The substrate then conducts the heat to thermal grease, which in turn conducts it to several heat dissipation fins on the outer surface of the housing. An external air-cooling device then rapidly removes the heat from the fins. This effectively improves the heat transfer efficiency of the heat-generating components inside the modular circuit board, thereby enhancing its heat dissipation performance and ensuring its operational stability and reliability. It meets the high-efficiency heat dissipation requirements of compact, size-constrained controllers under high power density. Furthermore, the circuit board's cover can be removed, facilitating the disassembly, repair, or replacement of the modular components inside, improving maintenance convenience and efficiency.

[0013] As a further improvement of this utility model, the thermally conductive substrate is selected as an aluminum substrate.

[0014] Because the thermally conductive substrate is made of aluminum, which has high thermal conductivity, it can quickly conduct the heat generated by the heat-generating components away. During the operation of the circuit board, the heat generated by the heat-generating components can be quickly transferred to the aluminum substrate, and then conducted to the housing and heat sink fins through thermal grease, effectively reducing the temperature of the heat-generating components and ensuring the stable operation of the controller. At the same time, the aluminum substrate can make the heat evenly distributed on the substrate, reducing the occurrence of local overheating, protecting other components on the circuit board from high temperatures, and extending the service life of the entire circuit board.

[0015] As a further embodiment of this utility model: the housing is further provided with a plurality of conductive posts and a copper busbar, one end of the copper busbar being connected to the conductive posts.

[0016] As a further embodiment of this utility model: an aviation plug is provided through one end of the housing, and the other end of the copper busbar is connected to the aviation plug.

[0017] The housing also contains several conductive posts and copper busbars, with one end of the copper busbar connected to the conductive posts. An aviation connector is installed through one end of the housing, and the other end of the copper busbar is connected to the aviation connector. The conductive posts provide stable connection points for the electrical components inside the circuit board, and the copper busbar has good conductivity, connecting the conductive posts to the aviation connector to form a stable electrical conduction path. This ensures reliable transmission of power and signals between the circuit board and external devices, reduces electrical faults caused by unstable connections, and improves the performance reliability of the circuit board.

[0018] As a further embodiment of this utility model, fastening screws are provided through both ends of the conductive pillars, the heat-conducting substrate, and the housing.

[0019] Because fastening screws are installed at both ends of several conductive pillars, the heat-conducting substrate, and the shell, the conductive pillars, heat-conducting substrate, and shell are firmly connected together to form an integral structure. This enhances the mechanical stability of the entire modular circuit board heat dissipation structure, enabling it to withstand certain external impacts, vibrations, and shaking, ensuring that the components will not easily shift or loosen, thereby guaranteeing the heat dissipation stability and efficiency of the circuit board.

[0020] As a further improvement of this utility model, an insulating sleeve is provided between the fastening screw and the two ends of the conductive post.

[0021] By installing an insulating sleeve between the fastening screw and the two ends of the conductive post, direct contact between the fastening screw and the conductive post can be effectively avoided, preventing current from leaking through the fastening screw to other parts or the human body. The insulating sleeve provides good insulation protection and improves the safety of the equipment during use.

[0022] As a further improvement of this utility model, a butterfly-shaped washer is provided between the fastening screw and the insulating sleeve.

[0023] By placing a butterfly washer between the fastening screw and the insulating sleeve, the butterfly washer, which has good elasticity, is compressed when the fastening screw is tightened, producing elastic deformation. This provides a continuous elastic preload between the fastening screw and the insulating sleeve, ensuring that the conductive post, the heat-conducting substrate and the housing are always tightly connected. This prevents the components from loosening due to factors such as vibration, impact or temperature changes, and ensures the stability and reliability of the entire structure.

[0024] As a further improvement of this utility model, a sealing ring is provided around the connection between the shell and the cover plate.

[0025] Because a sealing ring is provided around the connection between the housing and the cover, the sealing performance between the housing and the cover is greatly enhanced. This can effectively prevent dust, sand and other fine particles from entering the housing, reducing the impact of dust, sand and other fine particles on the internal components of the housing. It can also prevent moisture from entering the housing, reducing the risk of corrosion or short circuits to the circuit board due to moisture intrusion, and extending the service life of the circuit board. Attached Figure Description

[0026] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.

[0027] Figure 1 This is a cross-sectional schematic diagram of a modular circuit board heat dissipation structure.

[0028] Figure label:

[0029] 1. Housing; 2. Heat dissipation fins; 3. Cover plate; 4. Thermally conductive substrate; 5. Conductive post; 6. Copper busbar; 7. Aviation connector; 8. Fastening screw; 9. Insulating sleeve; 10. Butterfly gasket; 11. Sealing ring. Detailed Implementation

[0030] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0031] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0032] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0033] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0034] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and are not intended to limit the present utility model; that is, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The components of the embodiments of the present utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0036] like Figure 1 The present invention provides a modular circuit board heat dissipation structure, comprising: a housing 1, wherein a plurality of heat dissipation fins 2 are uniformly disposed on the bottom outer surface of the housing 1, and a cover plate 3 is detachably disposed on the top of the housing 1; a heat-conducting substrate 4 is fixedly disposed at the bottom of the housing 1, and heat-generating components are disposed on the heat-conducting substrate 4; and thermally conductive silicone grease is filled between the heat-conducting substrate 4 and the housing 1.

[0037] Specifically, the modular circuit board heat dissipation structure uses a heat-conducting substrate 4 at the bottom of the inner shell 1 to conduct heat generated by the heat-generating components to the heat-conducting substrate 4. The heat-conducting substrate 4 then conducts the heat to the thermal grease, which in turn conducts the heat to several heat dissipation fins 2 on the outer surface of the shell 1. The heat is then quickly carried away by an external air-cooling device. This effectively improves the heat conduction efficiency of the heat-generating components inside the modular circuit board, thereby improving the heat dissipation effect of the modular circuit board, ensuring the operational stability and reliability of the modular circuit board, and meeting the high-efficiency heat dissipation requirements of compact and size-constrained controllers under high power density. At the same time, the cover plate 3 of the circuit board can be removed, making it easy to repair or replace the modular components inside the circuit board, improving maintenance convenience and efficiency.

[0038] Furthermore, the thermally conductive substrate 4 is selected as an aluminum substrate.

[0039] Specifically, since the thermally conductive substrate 4 is made of aluminum, which has a high thermal conductivity, it can quickly conduct the heat generated by the heat-generating components away. During the operation of the circuit board, the heat generated by the heat-generating components can be quickly transferred to the aluminum substrate, and then conducted to the housing 1 and heat sink fins 2 through thermal grease, effectively reducing the temperature of the heat-generating components and ensuring the stable operation of the controller. At the same time, the aluminum substrate can make the heat evenly distributed on the substrate, reducing the occurrence of local overheating, protecting other components on the circuit board from high temperature, and extending the service life of the entire circuit board.

[0040] According to embodiments of the present invention, such as Figure 1 As shown, the housing 1 is also provided with several conductive posts 5 and copper busbars 6, one end of the copper busbars 6 is connected to the conductive posts 5; an aviation plug 7 is provided through one end of the housing 1, and the other end of the copper busbars 6 is connected to the aviation plug 7.

[0041] Specifically, the housing 1 also contains several conductive posts 5 and copper busbars 6, with one end of the copper busbar 6 connected to the conductive posts 5; an aviation connector 7 is installed through one end of the housing 1, and the other end of the copper busbar 6 is connected to the aviation connector 7; the conductive posts 5 provide stable connection points for the electrical components inside the circuit board, and the copper busbar 6 has good conductivity, connecting the conductive posts 5 and the aviation connector 7 to form a stable electrical conduction path, ensuring reliable transmission of power and signals between the circuit board and external devices, reducing electrical faults caused by unstable connections, and improving the performance reliability of the circuit board.

[0042] Furthermore, fastening screws 8 are provided through both ends of several conductive pillars 5, the heat-conducting substrate 4, and the housing 1.

[0043] Specifically, since fastening screws 8 are provided at both ends of several conductive pillars 5, the heat-conducting substrate 4 and the housing 1, the conductive pillars, the heat-conducting substrate 4 and the housing 1 are firmly connected together by the fastening screws 8 to form an integral structure; this enhances the mechanical stability of the entire modular circuit board heat dissipation structure, enabling it to withstand certain external impacts, vibrations and shaking, ensuring that the components will not easily shift or loosen, thereby ensuring the heat dissipation stability and efficiency of the circuit board.

[0044] Furthermore, an insulating sleeve 9 is provided between the fastening screw 8 and the two ends of the conductive post 5.

[0045] Specifically, by setting an insulating sleeve 9 between the fastening screw 8 and the two ends of the conductive post 5, direct contact between the fastening screw 8 and the conductive post 5 can be effectively avoided, preventing current from leaking through the fastening screw 8 to other parts or the human body. The insulating sleeve 9 plays a good role in insulation and protection, improving the safety of the equipment during use.

[0046] Furthermore, a butterfly washer 10 is provided between the fastening screw 8 and the insulating sleeve 9.

[0047] Specifically, by setting a butterfly washer 10 between the fastening screw 8 and the insulating sleeve 9, the butterfly washer 10 has good elasticity. When the fastening screw 8 is tightened, the butterfly washer 10 is compressed and produces elastic deformation, thereby providing a continuous elastic preload between the fastening screw 8 and the insulating sleeve 9. This ensures that the conductive post 5, the heat-conducting substrate 4 and the housing 1 are always tightly connected, preventing the components from loosening due to factors such as vibration, impact or temperature changes, and ensuring the stability and reliability of the entire structure.

[0048] like Figure 1 As shown, a sealing ring 11 is provided around the connection between the housing 1 and the cover plate 3.

[0049] Specifically, since a sealing ring 11 is provided around the connection between the housing 1 and the cover plate 3, the sealing performance between the housing 1 and the cover plate 3 is greatly enhanced. This can effectively prevent dust, sand and other small particles from entering the housing, reducing the impact of dust, sand and other small particles on the internal components of the housing. It can also prevent moisture from entering the housing 1, reducing the risk of corrosion or short circuit of the circuit board due to moisture intrusion, and extending the service life of the circuit board.

[0050] The above description is merely an example and illustration of the structure of this utility model. Those skilled in the art can make various modifications or additions to the specific embodiments described or use similar methods to replace them, as long as they do not deviate from the structure of the utility model or exceed the scope defined in the claims, they should all fall within the protection scope of this utility model.

Claims

1. A modular circuit board heat dissipation structure, characterized in that, include: The housing (1) has a plurality of heat dissipation fins (2) evenly arranged on the bottom outer surface of the housing (1), and a cover plate (3) is detachably provided on the top of the housing (1). A heat-conducting substrate (4) is fixedly disposed at the bottom of the housing (1), and a heat-generating component is disposed on the heat-conducting substrate (4); Thermal grease is filled between the thermally conductive substrate (4) and the housing (1).

2. The modular circuit board heat dissipation structure according to claim 1, characterized in that, The thermally conductive substrate (4) is selected as an aluminum substrate.

3. The modular circuit board heat dissipation structure according to claim 1, characterized in that, The housing (1) is also provided with a number of conductive posts (5) and copper busbars (6), one end of the copper busbars (6) being connected to the conductive posts (5).

4. The modular circuit board heat dissipation structure according to claim 3, characterized in that, An aviation plug (7) is provided through one end of the housing (1), and the other end of the copper busbar (6) is connected to the aviation plug (7).

5. The modular circuit board heat dissipation structure according to claim 4, characterized in that, Fastening screws (8) are provided through both ends of the conductive pillars (5), the heat-conducting substrate (4), and the housing (1).

6. The modular circuit board heat dissipation structure according to claim 5, characterized in that, An insulating sleeve (9) is provided between the fastening screw (8) and the two ends of the conductive post (5).

7. The modular circuit board heat dissipation structure according to claim 6, characterized in that, A butterfly washer (10) is provided between the fastening screw (8) and the insulating sleeve (9).

8. The modular circuit board heat dissipation structure according to any one of claims 1 to 7, characterized in that, A sealing ring (11) is provided around the connection between the housing (1) and the cover plate (3).

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