Device for reducing alarm rate of grab failure of die bonder

Abstract

The utility model relates to the technical field that grabs the failure alarm rate reduction of fixed -crystal machine, concretely is fixed -crystal machine grabbing failure alarm rate reduction device. The utility model, including: frame, the upper surface one end of frame is provided with wafer conveying module, wafer fixed connection module, wafer fixed connection module sets up in the position of frame surface corresponding wafer conveying module, controller, controller sets up in the surface one side of frame, mounting mechanism, mounting mechanism sets up in the surface of wafer fixed connection module, and illumination mechanism, illumination mechanism sets up in the position corresponding wafer fixed connection module, wherein, wafer fixed connection module includes mounting bracket, and the bottom of mounting bracket is fixedly connected with the upper surface of frame. Solve the problem that fixed -crystal machine will appear the problem of grabbing failure in the process of grabbing wafer, and fixed -crystal machine equipment will report a grabbing failure alarm, at this moment, manual judgment is needed whether to re -supply, will cause the problem of time -consuming and labor -intensive.

Description

Technical Field

[0001] This application relates to the field of reducing the alarm rate of die bonder pick-up failure, and in particular to a device for reducing the alarm rate of die bonder pick-up failure. Background Technology

[0002] The die bonder gripping failure alarm rate reduction device is an optimized piece of equipment designed to address the frequent gripping failures of die bonders during production. This device effectively improves the gripping accuracy and stability of the die bonder by comprehensively utilizing advanced mechanical design, vision guidance, sensor technology, and intelligent control, reducing the alarm rate caused by gripping failures, thereby improving production efficiency and equipment reliability. It is commonly seen in daily life.

[0003] Existing technologies, such as the utility model patent with publication number CN206349400U, disclose a die bonding machine. This patent includes a worktable system for moving LED frames, a wafer positioning system for providing wafer positioning, and a die bonding system for picking up and fixing wafers onto the LED frames. The die bonding system includes a die bonding arm, a rotary drive mechanism, and a telescopic drive mechanism. The worktable system has a worktable; the rotary drive mechanism drives the die bonding arm to rotate in a plane perpendicular to or at a certain angle to the worktable; the telescopic drive mechanism drives the die bonding arm to perform linear telescopic motion. The moving mechanisms of the wafer and the LED frame are spatially staggered and do not interfere with each other, effectively solving the adaptability problem of large-size LED frames. It allows for the production of ultra-large and ultra-wide LED frames without affecting precision. It also allows previously small LED frames to be spliced ​​together, saving loading and unloading time and thus improving production efficiency.

[0004] In daily use, it has been found that existing die bonders sometimes fail to pick up wafers. The die bonder will issue a pick failure alarm, which requires manual intervention to determine whether to re-pick up the wafer, resulting in a time-consuming and labor-intensive process. Utility Model Content

[0005] One of the technical problems this application aims to solve is that the die bonder may fail to pick up the wafer during the process of picking up the wafer. The die bonder will report a pick-up failure alarm, which requires manual judgment to determine whether to re-pick up the wafer, which will cause time and labor costs.

[0006] To address the aforementioned technical problems, embodiments of this application provide a device for reducing the alarm rate of die bonder pick-up failures, comprising:

[0007] The rack has a wafer delivery module installed at one end of its upper surface.

[0008] The wafer mounting module is installed on the rack surface at the position corresponding to the wafer transport module;

[0009] The controller is mounted on one side of the rack surface;

[0010] The mounting mechanism is mounted on the surface of the wafer bonding module; and

[0011] The lighting mechanism is located at the position of the corresponding chip mounting module;

[0012] The wafer mounting module includes a mounting frame, the bottom of which is fixedly connected to the upper surface of the frame. An alarm is installed on the inner wall surface of the mounting frame. A drive module is fixedly connected to the upper end of the mounting frame. A gripping suction head is installed at the output end of the drive module. The lighting mechanism is located directly below the gripping suction head. The mounting mechanism is set on the side wall surfaces at both ends of the mounting frame. The lighting mechanism includes an adjusting ring and a light source illumination module. The adjusting ring is annularly hollow. Connecting plates are fixedly connected to both sides of the light source illumination module. Several through holes are evenly opened on the surface of the adjusting ring. The surface of the light source illumination module is connected to the inner wall of the through holes. An inlay groove is opened on the surface of the adjusting ring corresponding to the position of the through holes. The light source illumination module is engaged with the inner wall of the inlay groove by means of the connecting plates fixed on both sides. The mounting mechanism includes two slide rails and a support rod. One side of each slide rail is fixedly connected to the surface of the mounting frame. Support rods are fixedly connected to both sides of the adjusting ring. A sliding frame is slidably connected to the surface of the slide rails. The surface of the sliding frame is fixedly connected to one end of the support rod.

[0013] In some embodiments, the lighting mechanism further includes a plurality of adjusting columns, with each pair of adjusting columns forming a group. The bottom end of each group of adjusting columns is fixedly connected to the surface of the adjusting ring. A limiting plate is fixedly connected to the arc surface of the adjusting column. A retaining plate slides through the arc surface of the adjusting column. The surface of the retaining plate is slidably connected to the surface of the limiting plate. A spring is fitted onto the arc surface of the adjusting column. The two ends of the spring are fixedly connected to the retaining plate and the adjusting column, respectively. An auxiliary rod is fixedly connected to one side surface of the retaining plate.

[0014] In some embodiments, the lower surface of the card plate and the upper surface of the connecting plate are both tapered, and the lower surface of the card plate is engaged with the upper surface of the connecting plate.

[0015] In some embodiments, guide rods are fixedly connected to the four corners of the light source illumination module, and guide holes are opened on the surface of the inlay groove corresponding to the positions of the guide rods. The inner wall of the guide hole is inserted into the arc surface of the guide rod.

[0016] In some embodiments, a groove is provided on the lower surface of the adjusting ring, a magnetic ring is fixedly connected to the inner wall of the groove, a magnetic block is adsorbed on the surface of the magnetic ring, and a cleaning brush is fixedly connected to the surface of the magnetic block. The length of the cleaning brush is adapted to the cross-sectional dimensions of the light source irradiation module.

[0017] In some embodiments, the surface of the magnetic block is covered with an auxiliary sleeve, which is a nylon sleeve.

[0018] In some embodiments, the mounting mechanism further includes a connecting plate with an "L"-shaped cross section. One end of the connecting plate is fixedly connected to the surface of the sliding frame, and a pressing shaft is threaded through the surface of the connecting plate. One end of the pressing shaft is fixedly connected to the pressing plate.

[0019] In some embodiments, two baffles are fixedly connected to the surface of the mounting bracket at the position corresponding to the slide rail, and the two baffles are located on both sides of the slide rail respectively.

[0020] In some embodiments, an extrusion pad is fixedly connected to the lower surface of the extrusion plate. The extrusion pad is a rubber pad, and the surface of the extrusion pad abuts against the surface of the slide rail.

[0021] In some embodiments, a limiting rod is fixedly connected to the surface of the extrusion plate, and the arc surface of the limiting rod slides through the surface of the connecting plate.

[0022] Through the above technical solution, the light source illumination module in the lighting mechanism of this application is directly located below the gripping and adsorption head, forming a vertical illumination area, completely eliminating shadow interference, and providing a uniform and high-brightness wafer gripping field of view for the visual positioning system or operator. At the same time, it helps to significantly improve the wafer edge recognition accuracy and position feedback accuracy, and fundamentally reduce adsorption offset or failure caused by visual misjudgment. In this process, the combination design of through holes and inlay slots helps to support the light source illumination module to be horizontally inserted into the adjustment ring through the connecting plate, realizing tool-free installation and replacement, and adapting to the light source requirements of different wavelengths or intensities.

[0023] The combination of slide rails and sliding frames in the mounting mechanism of this application allows the support rod to drive the entire lighting mechanism to move freely horizontally along the mounting frame, accurately covering wafers or process positions of different sizes. The protection of the baffles helps to prevent dust / debris from entering the slide rails, ensuring smooth sliding over a long period of time, thereby allowing the entire mounting mechanism to work in conjunction with the lighting mechanism. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a three-dimensional structural schematic diagram of the device for reducing the alarm rate of die bonder grasping failure disclosed in the embodiments of this application;

[0026] Figure 2This is a schematic diagram of the wafer bonding module of the die bonding module of the die bonding machine grabbing failure alarm rate reduction device disclosed in the embodiments of this application;

[0027] Figure 3 This is a schematic diagram of the lighting mechanism of the die bonder grabbing failure alarm rate reduction device disclosed in the embodiments of this application;

[0028] Figure 4 This application discloses a device for reducing the alarm rate of die bonder pick-up failure. Figure 3 An enlarged structural diagram at point B;

[0029] Figure 5 This is a partial structural schematic diagram of the lighting mechanism of the die bonder grabbing failure alarm rate reduction device disclosed in the embodiments of this application;

[0030] Figure 6 This application discloses a device for reducing the alarm rate of die bonder pick-up failure. Figure 2 An enlarged structural diagram of point A.

[0031] Explanation of reference numerals in the attached figures:

[0032] 1. Frame; 2. Controller; 3. Wafer conveying module; 4. Illumination mechanism; 401. Adjusting ring; 402. Through hole; 403. Light source illumination module; 404. Connecting plate; 405. Guide rod; 406. Guide hole; 407. Adjusting column; 408. Spring; 409. Clamping plate; 410. Auxiliary rod; 411. Limiting plate; 412. Slide groove; 413. Magnetic ring; 414. Magnetic block; 415. Cleaning brush; 416. Embedding slot; 5. Mounting mechanism; 51. Baffle; 52. Slide rail; 53. Sliding frame; 54. Support rod; 55. Connecting plate; 56. Extrusion shaft; 57. Extrusion plate; 58. Extrusion pad; 59. Limiting rod; 6. Wafer fixing module; 61. Mounting frame; 62. Drive module; 63. Alarm; 64. Gripping and adsorption head. Detailed Implementation

[0033] The embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of this application by way of example, but should not be used to limit the scope of this application. This application can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0034] These embodiments are provided to make the application thorough and complete, and to fully express the scope of the application to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​illustrated in these embodiments should be interpreted as merely exemplary and not as limiting.

[0035] It should be noted that, in the description of this application, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0036] Furthermore, the terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after it, and do not exclude the possibility of encompassing other elements as well.

[0037] It should also be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application depending on the specific circumstances. When a specific device is described as being located between a first device and a second device, an intermediary device may or may not be present between the specific device and the first or second device.

[0038] All terms used in this application have the same meaning as understood by one of ordinary skill in the art to which this application pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0039] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0040] Reference Figure 1 and Figure 2 As shown, this utility model provides a technical solution: a device for reducing the alarm rate of die bonder grabbing failure, including a frame 1, and a wafer conveying module 3 is provided at one end of the upper surface of the frame 1;

[0041] The wafer mounting module 6 is disposed on the surface of the rack 1 at the position corresponding to the wafer transport module 3.

[0042] Controller 2 is disposed on one side of the surface of rack 1;

[0043] Mounting mechanism 5 is disposed on the surface of wafer bonding module 6; and

[0044] Lighting mechanism 4 is located at the position of the corresponding chip fixing module 6;

[0045] The chip mounting module 6 includes a mounting frame 61, the bottom end of which is fixedly connected to the upper surface of the frame 1. An alarm 63 is installed on the inner wall surface of the mounting frame 61. A drive module 62 is fixedly connected to the upper end of the mounting frame 61. A gripping and adsorption head 64 is installed at the output end of the drive module 62. An illumination mechanism 4 is located directly below the gripping and adsorption head 64. A mounting mechanism 5 is installed on the side wall surfaces at both ends of the mounting frame 61.

[0046] The specific setup and function of the lighting mechanism 4 and the installation mechanism 5 will be explained below.

[0047] Reference Figure 2 , Figure 3 , Figure 4 and Figure 5As shown in this embodiment: the lighting mechanism 4 includes an adjusting ring 401 and a light source illumination module 403. The light source illumination module 403 is located directly below the gripping and adsorption head 64, directly illuminating the gripping area of ​​the wafer. This provides the machine vision system or operator with a clearer, shadow-free field of view, significantly improving the wafer position recognition accuracy and reducing gripping failures caused by visual misjudgment. The adjusting ring 401 is annularly hollowed out. Connecting plates 404 are fixedly connected to both sides of the light source illumination module 403. Several through holes 402 are evenly opened on the surface of the adjusting ring 401. The annular hollowed-out design of the adjusting ring 401 and the evenly distributed through holes 402 and inlay grooves 416 allow the light source illumination module 403 to be easily inserted, replaced, or its angle adjusted through the connecting plates 404. The illumination mechanism 4 includes several adjusting columns 407, arranged in pairs. The bottom end of each adjusting column 407 is fixedly connected to the surface of the adjusting ring 401. A limiting plate 411 is fixedly connected to the arc surface of the adjusting column 407. A locking plate 409 slides through the arc surface of the adjusting column 407. The surface of the adjusting plate 409 is slidably connected to the surface of the limiting plate 411. The adjusting column 407 is easy to maintain, upgrade, or adjust according to the chip type. The surface of the light source irradiation module 403 is connected to the inner wall of the locking plate 402. The adjusting ring 401 has an inlay groove 416 corresponding to the position of the through hole 402. The light source irradiation module 403 is engaged with the inner wall of the inlay groove 416 by connecting plates 404 fixed on both sides. The illumination mechanism 4 also includes several adjusting columns 407, arranged in pairs. The bottom end of each adjusting column 407 is fixedly connected to the surface of the adjusting ring 401. A limiting plate 411 is fixedly connected to the arc surface of the adjusting column 407. A locking plate 409 slides through the arc surface of the adjusting column 407. The surface of the locking plate 409 is slidably connected to the surface of the limiting plate 411. A spring 408 is fitted onto an arc-shaped surface. Both ends of the spring 408 are fixedly connected to a locking plate 409 and an adjusting column 407, respectively. An auxiliary rod 410 is fixedly connected to one side of the locking plate 409. The lower surface of the locking plate 409 and the upper surface of the connecting plate 404 both have a tapered tooth shape. The lower surface of the locking plate 409 engages with the upper surface of the connecting plate 404. The adjusting column 407, locking plate 409, spring 408, and auxiliary rod 410 constitute a quick-locking and releasing mechanism. Stretching the auxiliary rod 410 causes the locking plate 409 to move upward against the elastic force of the spring 408, thus releasing the light source irradiation module 403. After release, the spring 408 pushes the locking plate 409 downward, and its tapered lower surface tightly engages and fixes with the tapered upper surface of the connecting plate 404 of the light source irradiation module 403, providing a secure connection. The system features a secure locking mechanism and easy operation. Guide rods 405 are fixedly connected to all four corners of the light source illumination module 403. Guide holes 406 are provided on the surface of the mounting groove 416 corresponding to the positions of the guide rods 405. The inner wall of the guide hole 406 is inserted into the arc surface of the guide rod 405. The guide rods 405 and guide holes 406 ensure precise alignment of the light source illumination module 403 during installation. A sliding groove 412 is provided on the lower surface of the adjusting ring 401. A magnetic ring 413 is fixedly connected to the inner wall of the sliding groove 412. A magnetic block 414 is adsorbed onto the surface of the magnetic ring 413. A cleaning brush 415 is fixedly connected to the surface of the magnetic block 414. The length of the cleaning brush 415 is adapted to the cross-sectional dimensions of the light source illumination module 403. An auxiliary sleeve, made of nylon, is fitted onto the surface of the magnetic block 414.By moving the magnetic block 414, the cleaning brush 415 can clean dust or stains from the surface of the light source module 403. The nylon auxiliary sleeve protects the magnetic block 414 and reduces friction, ensuring that the light source output is always bright and clear, and avoiding visual recognition errors caused by light source contamination.

[0048] Reference Figure 2 and Figure 6 As shown in this embodiment: the mounting mechanism 5 includes two slide rails 52 and a support rod 54. One side of each slide rail 52 is fixedly connected to the surface of the mounting frame 61. The support rod 54 is fixedly connected to both sides of the adjusting ring 401. A sliding frame 53 is slidably connected to the surface of the slide rails 52. The surface of the sliding frame 53 is fixedly connected to one end of the support rod 54. Through the design of the slide rails 52 and the sliding frame 53, the support rod 54 can drive the entire lighting mechanism 4 to slide along the surface of the mounting frame 61, so that the lighting source can be precisely moved to the optimal illumination position to adapt to different workstations or process requirements. The mounting mechanism 5 also includes a connecting plate 55. The connecting plate 55 has an "L" shaped cross section. One end of the connecting plate 55 is fixedly connected to the surface of the sliding frame 53. A pressing shaft 56 is threaded through the surface of the connecting plate 55. One end of the shaft 56 is fixedly connected to a pressing plate 57. With the help of the combination between the pressing plate 57 and the pressing shaft 56, the sliding frame 53 and the lighting mechanism 4 it carries can be firmly locked in any position of the slide rail 52, preventing the light source from shifting due to vibration during operation and ensuring the stability of the lighting position. Two baffles 51 are fixedly connected to the surface of the mounting bracket 61 at the position corresponding to the slide rail 52. The two baffles 51 are located on both sides of the slide rail 52. A pressing pad 58 is fixedly connected to the lower surface of the pressing plate 57. The pressing pad 58 is a rubber pad. The pressing pad 58 can effectively increase friction and facilitate better fixing and limiting. The surface of the pressing pad 58 abuts against the surface of the slide rail 52. A limiting rod 59 is fixedly connected to the surface of the pressing plate 57. The arc surface of the limiting rod 59 slides through the surface of the connecting plate 55.

[0049] Working Principle: During the wafer processing operation, the wafer is first sent to the gripping station by the wafer conveying module 3. At the same time, the lighting mechanism 4 is activated, allowing the light source irradiation module 403 to illuminate vertically from directly below the gripping suction head 64, eliminating shadows and highlighting the wafer edge outline. The vision system in the rack 1 accurately locates the wafer coordinates based on the clear image, and the coordinate data is fed back to the controller 2. During the gripping execution stage, the controller 2 drives the module 62 to move the gripping suction head 64 downward. The suction head accurately picks up the wafer according to the visual positioning coordinates. When the pick-up is successful, the wafer is transferred to the fixing station. When the pick-up fails due to insufficient vacuum or positional deviation, the alarm 63 is triggered. During this process, the annular adjustment ring 401 causes the light source module to surround the gripping point, and the light penetrates the wafer edge from multiple angles, completely eliminating blind spots. After the light source irradiation module 403 has been used for a long time, in order to facilitate the replacement of the limit position of the light source irradiation module 403, the auxiliary rod 410 is first stretched, allowing the auxiliary rod 410 to drive the clamping plate 409 along the adjustment column 407. The movement proceeds, then the clamping plate 409 moves upward, stretching the spring 408, causing the bevel teeth of the clamping plate 409 to disengage from the connecting plate 404. This allows the light source module to be pulled out laterally. The new module is then inserted along the guide hole 406. Simultaneously, the auxiliary rod 410 is released, and the spring 408 pushes the clamping plate 409 downward, engaging and locking the bevel teeth on both sides of the connecting plates 404 of the new light source irradiation module 403. This effectively fixes and limits the entire light source irradiation module 403, and simultaneously pulls the cleaning brush 415 on the lower surface of the adjusting ring 401, allowing the cleaning brush 415 to move with the aid of magnets. Block 414 is attracted and fixed to magnetic ring 413, and slides along slide groove 412. At the same time, it cleans the surface of light source irradiation module 403. When operating the installation mechanism 5, push support rod 54 to move sliding frame 53 along slide rail 52 and drive the entire lighting mechanism 4 to horizontal displacement. After reaching the designated position, rotate the extrusion shaft 56 on the surface of connecting plate 55 to extrude and limit the extrusion plate 57 and the surface of slide rail 52.

[0050] The embodiments of this application have now been described in detail. To avoid obscuring the concept of this application, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0051] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any manner.

Claims

1. A device for reducing the alarm rate of die bonder pick-up failure, characterized in that, include: A rack (1), wherein a wafer transport module (3) is provided at one end of the upper surface of the rack (1); A wafer bonding module (6) is disposed on the surface of the rack (1) at a position corresponding to the wafer transport module (3); Controller (2), the controller (2) is disposed on one side of the surface of the frame (1); Mounting mechanism (5), said mounting mechanism (5) is disposed on the surface of wafer bonding module (6); and Lighting mechanism (4), which is located at the position of the corresponding wafer mounting module (6); The wafer mounting module (6) includes a mounting bracket (61), the bottom end of which is fixedly connected to the upper surface of the frame (1). An alarm (63) is installed on the inner wall surface of the mounting bracket (61). A drive module (62) is fixedly connected to the upper end of the mounting bracket (61). A gripping suction head (64) is installed at the output end of the drive module (62). The lighting mechanism (4) is located directly below the gripping suction head (64). The mounting mechanism (5) is set on the side wall surfaces at both ends of the mounting bracket (61). The lighting mechanism (4) includes an adjusting ring (401) and a light source illumination module (403). The adjusting ring (401) is annularly hollow. Connecting plates (404) are fixedly connected to both sides of the light source illumination module (403). The surface of the light source irradiation module (403) is uniformly provided with several through holes (402). The surface of the light source irradiation module (403) is connected to the inner wall of the through holes (402). The surface of the adjustment ring (401) is provided with an inlay groove (416) corresponding to the position of the through holes (402). The light source irradiation module (403) is engaged with the inner wall of the inlay groove (416) by means of the connecting plates (404) fixed on both sides. The installation mechanism (5) includes two slide rails (52) and a support rod (54). One side of each of the two slide rails (52) is fixedly connected to the surface of the mounting frame (61). The two sides of the adjustment ring (401) are fixedly connected with the support rod (54). The surface of the slide rail (52) is slidably connected with a sliding frame (53). The surface of the sliding frame (53) is fixedly connected to one end of the support rod (54).

2. The device for reducing the alarm rate of die bonder grasping failure according to claim 1, characterized in that, The lighting mechanism (4) also includes several adjusting columns (407), with each pair of adjusting columns (407) forming a group. The bottom end of each group of adjusting columns (407) is fixedly connected to the surface of the adjusting ring (401). A limiting plate (411) is fixedly connected to the arc surface of the adjusting column (407). A retaining plate (409) slides through the arc surface of the adjusting column (407). The surface of the retaining plate (409) is slidably connected to the surface of the limiting plate (411). A spring (408) is sleeved on the arc surface of the adjusting column (407). The two ends of the spring (408) are fixedly connected to the retaining plate (409) and the adjusting column (407) respectively. An auxiliary rod (410) is fixedly connected to one side surface of the retaining plate (409).

3. The device for reducing the alarm rate of die bonder grasping failure according to claim 2, characterized in that, The lower surface of the clamping plate (409) and the upper surface of the connecting plate (404) are both tapered. The lower surface of the clamping plate (409) and the upper surface of the connecting plate (404) are engaged.

4. The device for reducing the alarm rate of die bonder grasping failure according to claim 3, characterized in that, Guide rods (405) are fixedly connected to the four corners of the light source illumination module (403). A guide hole (406) is opened on the surface of the inlay groove (416) corresponding to the position of the guide rod (405). The inner wall of the guide hole (406) is inserted into the arc surface of the guide rod (405).

5. The device for reducing the alarm rate of die bonder grasping failure according to claim 4, characterized in that, The lower surface of the adjusting ring (401) is provided with a sliding groove (412), and a magnetic ring (413) is fixedly connected to the inner wall of the sliding groove (412). A magnetic block (414) is adsorbed on the surface of the magnetic ring (413), and a cleaning brush (415) is fixedly connected to the surface of the magnetic block (414). The length of the cleaning brush (415) is adapted to the cross-sectional dimensions of the light source irradiation module (403).

6. The device for reducing the alarm rate of die bonder grasping failure according to claim 5, characterized in that, The surface of the magnetic block (414) is covered with an auxiliary sleeve, which is a nylon sleeve.

7. The device for reducing the alarm rate of die bonder grasping failure according to claim 6, characterized in that, The installation mechanism (5) also includes a connecting plate (55), the connecting plate (55) has an "L" shaped cross section, one end of the connecting plate (55) is fixedly connected to the surface of the sliding frame (53), and the surface of the connecting plate (55) is threaded through an extrusion shaft (56), one end of the extrusion shaft (56) is fixedly connected to an extrusion plate (57).

8. The device for reducing the alarm rate of die bonder grasping failure according to claim 7, characterized in that, The mounting bracket (61) has two baffles (51) fixedly connected to the surface of the slide rail (52) at the position corresponding to the slide rail (52). The two baffles (51) are located on both sides of the slide rail (52).

9. The device for reducing the alarm rate of die bonder grasping failure according to claim 8, characterized in that, An extrusion pad (58) is fixedly connected to the lower surface of the extrusion plate (57). The extrusion pad (58) is a rubber pad, and the surface of the extrusion pad (58) abuts against the surface of the slide rail (52).

10. The device for reducing the alarm rate of die bonder grasping failure according to claim 9, characterized in that, A limiting rod (59) is fixedly connected to the surface of the extrusion plate (57), and the arc surface of the limiting rod (59) slides through the surface of the connecting plate (55).

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