Vacuum suction device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHANGSHA HUASHI SEMICON CO LTD
- Filing Date
- 2026-04-01
- Publication Date
- 2026-06-12
AI Technical Summary
In the existing technology, the wax bonding process used to fix the workpiece during the processing of silicon components has the problems of low processing efficiency and impurity contamination.
The vacuum adsorption device uses a vacuum pump to create negative pressure and uses an adsorption unit to fix the workpiece, avoiding the steps of heating to melt wax and cleaning, simplifying the processing flow, and improving the applicability and stability of the device through the adaptive switching mechanism of the adsorption unit.
It improves processing efficiency, reduces the risk of impurity contamination, enhances processing quality and the applicability and reliability of the equipment, and reduces the risk of damage to the workpiece.
Smart Images

Figure CN224347449U_ABST