An adapter plate substrate film pasting device

Abstract

The utility model discloses a kind of adapter plate substrate film pasting device, including bottom plate, sliding table, substrate fixed clamp, rear air cylinder, support plate, web, transversely placed air cylinder, vertically placed air cylinder, limit block, buffer needle and suction nozzle, support plate is provided with on bottom plate by web, the tail portion of bottom plate is provided with rear air cylinder, support plate upper portion both sides are provided with fixed frame, fixed frame is provided with limit pin and buffer needle, support plate between fixed frame is provided with slide rail, slide rail is connected with the cylinder seat of vertically placed air cylinder by sliding block, the cylinder rod of vertically placed air cylinder is connected with suction nozzle by sliding block connecting block, transversely placed air cylinder is installed on the fixed frame of one side, the cylinder rod of transversely placed air cylinder and the cylinder seat of vertically placed air cylinder push cooperation, the cylinder rod of rear air cylinder and substrate fixed clamp cooperation, substrate fixed clamp is set in sliding table, the front end of bottom plate is provided with limit fixed plate, limit fixed plate top is provided with limit block, limit block and substrate fixed clamp limit cooperation.The utility model structure design is reasonable, positioning is accurate, it is flexible to operate, greatly improve the film pasting quality, and practicality is strong.

Description

Technical Field

[0001] This utility model relates to the field of battery manufacturing technology, specifically to a device for attaching a substrate to an adapter sheet. Background Technology

[0002] Lithium-ion battery adapters are crucial components that bring out the internal electrode posts of a battery and connect them to modules such as the battery pack management system and power management board. They are typically made by laser welding a copper substrate to the electrode posts, followed by coating the copper substrate with a PI film only tens of micrometers thick to provide electrical insulation, high-temperature resistance, chemical corrosion resistance, and mechanical protection.

[0003] However, existing film application processes mainly rely on manual operation or semi-automated equipment, which has significant shortcomings in the following aspects:

[0004] 1. Small substrate size and thin PI film: The substrate size of the adapter sheet is often between tens of millimeters, and the PI film thickness is only 12–75 μm. It is easy to cause the whole to be misaligned due to film tension or bonding angle deviation.

[0005] 2. High scrap rate: If the diaphragm is misaligned or wrinkled, it will be scrapped. Manual judgment and fine-tuning are difficult to meet the high yield requirements, resulting in material waste and increased costs.

[0006] 3. Low production efficiency: The speed of manual film application is limited by the operator's skill level, making it difficult to meet the needs of mass production;

[0007] 4. Difficulty in repeated positioning: During mass production, different operators or equipment may generate cumulative errors during the picking, transfer, and application processes, affecting the accuracy of film application.

[0008] 5. Poor environmental adaptability: High humidity, high temperature and other workshop environments have a significant impact on the stability of manual film application, making it difficult to guarantee consistent application and long-term reliability.

[0009] Therefore, there is an urgent need for an automated film application device that can achieve high precision, low scrap rate, and high efficiency to solve the problems of misaligned application, high scrap rate, and low efficiency in existing technologies. Utility Model Content

[0010] To address the shortcomings of existing technologies, the purpose of this utility model is to provide a substrate bonding device for adapter sheets, which has a reasonable structural design, precise positioning, flexible operation, greatly improves bonding quality, and is highly practical.

[0011] To achieve the above objectives, this utility model provides the following technical solution: a substrate bonding device for an adapter sheet, comprising a base plate, a slide table, a substrate fixing fixture, a rear cylinder, a support plate, ribs, a horizontal cylinder, a vertical cylinder, a limiting block, a buffer pin, and a suction nozzle. A support plate is mounted on the base plate via the ribs. A rear cylinder is mounted at the rear of the base plate. Fixing frames are mounted on both sides of the upper part of the support plate. Limiting pins and buffer pins are mounted on the fixing frames. A slide rail is mounted on the support plate between the fixing frames. The slide rail is connected to the cylinder seat of the vertical cylinder via a slider. The cylinder rod of the vertical cylinder is connected to the suction nozzle via a slider connecting block. A horizontal cylinder is mounted on one side of the fixing frame. The cylinder rod of the horizontal cylinder pushes against the cylinder seat of the vertical cylinder. The cylinder rod of the rear cylinder engages with the substrate fixing fixture. The substrate fixing fixture is located in the slide table. A limiting fixing plate is mounted at the front end of the base plate. A limiting block is mounted on the top of the limiting fixing plate, and the limiting block engages with the substrate fixing fixture.

[0012] Preferably, the substrate fixing fixture is provided with a substrate limiting fixture groove.

[0013] This utility model has the following beneficial effects:

[0014] Precise positioning: The system is equipped with a rear-mounted cylinder to push the substrate fixing fixture and limit block for positioning, as well as limit pins and buffer pins on the fixing frame, which can ensure the accurate positioning of the substrate during the film application process and guarantee the precision and quality of the film application.

[0015] High degree of automation: The substrate is placed by a robotic arm, and the rear cylinder, horizontal cylinder and vertical cylinder work together to complete the substrate positioning, film picking and film application operations, realizing the automated process of substrate film application for adapter sheets, reducing manual intervention and improving work efficiency.

[0016] Stable structure: The base plate is supported by stiffeners, and the cylinders, slide rails, sliders and other components are installed in a reasonable manner, resulting in a stable overall structure that ensures the reliability of the device during operation.

[0017] Flexible operation: The horizontal and vertical cylinders allow the nozzle to move flexibly in different directions, facilitating the picking up of film and film application, and adapting to the film application needs of substrates of different specifications. Attached Figure Description

[0018] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments;

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is a schematic diagram of another orientation of the present invention. Detailed Implementation

[0021] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0022] Reference Figure 1 The specific embodiment adopts the following technical solution: A substrate bonding device for an adapter sheet includes a base plate 1, a slide table 2, a substrate fixing clamp 3, a rear cylinder 4, a support plate 5, a rib 6, a horizontal cylinder 7, a vertical cylinder 8, a limiting block 9, a buffer pin 10, and a suction nozzle 11. The support plate 5 is provided on the base plate 1 through the rib 6. The rear cylinder 4 is provided at the tail of the base plate 1. Fixing frames 12 are provided on both sides of the upper part of the support plate 5. The fixing frames 12 are provided with limiting pins 13 and buffer pins 10. The support plate 5 between the fixing frames 12 is provided with a slide table 2. The slide rail 14 is connected to the cylinder seat of the longitudinal cylinder 8 via a slider. The cylinder rod of the longitudinal cylinder 8 is connected to the suction nozzle 11 via a slider connecting block 15. A horizontal cylinder 7 is installed on a fixed frame on one side. The cylinder rod of the horizontal cylinder 7 pushes and cooperates with the cylinder seat of the longitudinal cylinder 8. The cylinder rod of the rear cylinder 4 cooperates with the substrate fixing clamp 3. The substrate fixing clamp 3 is set in the slide table 2. A limit fixing plate 16 is set at the front end of the base plate 1. A limit block 9 is set at the top of the limit fixing plate 16. The limit block 9 cooperates with the substrate fixing clamp 3.

[0023] It is worth noting that the substrate fixing fixture 3 is provided with a substrate limiting fixture groove.

[0024] The working principle of this specific implementation is as follows: Substrate placement: The robotic arm places the substrate to be coated into the substrate limiting clamp slot of the substrate fixing fixture. Substrate positioning: The cylinder rod of the rear cylinder pushes the substrate fixing fixture forward in the slide table, so that the substrate fixing fixture cooperates with the limiting block to complete the positioning. Film material suction: The cylinder rod of the horizontal cylinder pushes the cylinder seat of the vertical cylinder. The vertical cylinder moves on the slide rail through the slider, driving the suction nozzle to move to the designated position to suck up the PI film. Then, the horizontal cylinder drives the suction nozzle to return to its position. Film application operation: The cylinder rod of the vertical cylinder moves, driving the suction nozzle downward through the slider connecting block, and applying the sucked PI film onto the positioned substrate.

[0025] This specific implementation method can achieve precise positioning to ensure film application quality, highly automated process to improve work efficiency, stable structural design to ensure reliable operation, and flexible operation mode to adapt to the film application needs of different sized substrates.

[0026] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A substrate bonding device for an adapter sheet, characterized in that, The system includes a base plate (1), a slide table (2), a base plate fixing fixture (3), a rear cylinder (4), a support plate (5), a stiffener (6), a horizontal cylinder (7), a vertical cylinder (8), a limiting block (9), a buffer pin (10), and a suction nozzle (11). The support plate (5) is mounted on the base plate (1) via the stiffener (6). The rear cylinder (4) is mounted at the tail of the base plate (1). Fixing frames (12) are mounted on both sides of the upper part of the support plate (5). The fixing frames (12) are equipped with limiting pins (13) and buffer pins (10). A slide rail (14) is mounted on the support plate (5) between the fixing frames (12). 4) The cylinder rod of the vertical cylinder (8) is connected to the cylinder seat of the vertical cylinder (8) through the slider. The cylinder rod of the vertical cylinder (8) is connected to the suction nozzle (11) through the slider connecting block (15). A horizontal cylinder (7) is installed on the fixed frame on one side. The cylinder rod of the horizontal cylinder (7) is pushed and cooperated with the cylinder seat of the vertical cylinder (8). The cylinder rod of the rear cylinder (4) cooperates with the substrate fixing fixture (3). The substrate fixing fixture (3) is set in the slide table (2). A limiting fixing plate (16) is set at the front end of the base plate (1). A limiting block (9) is set at the top of the limiting fixing plate (16). The limiting block (9) is limited and cooperates with the substrate fixing fixture (3).

2. The adapter plate substrate bonding device according to claim 1, characterized in that, The substrate fixing fixture (3) is provided with a substrate limiting fixture groove.

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