A high-voltage power assembly temperature sampling device

Abstract

This utility model discloses a high-voltage power component temperature sampling device, relating to the field of high-voltage thyristor output voltage control. The device includes a main body comprising a thyristor, a heat sink on top of the thyristor, and an insulating support on the side of the heat sink. A support base and a temperature sampling plate are located on one side of the top of the heat sink. A current transformer, a mounting groove, and a cylindrical copper column are also located on the top of the heat sink. A first metal plate and a second metal plate are respectively located at both ends of the insulating support, with a positioning rod in the middle of the first metal plate. A temperature sensor is located on one side of the heat sink. This utility model achieves temperature sampling through the heat sink, thyristor, current transformer, temperature sensor, and temperature sampling plate. The temperature sampling plate, temperature sensor, and heat sink are connected, and the temperature signal is transmitted wirelessly, thereby achieving rapid transmission of sampled data, improving the ease of use of the device, and the device structure is simple.

Description

Technical Field

[0001] This utility model relates to the field of high voltage thyristor output voltage control, and in particular to a high voltage power component temperature sampling device. Background Technology

[0002] Thyristor chopper technology has been widely used in equipment for closed-loop control of output voltage in high-voltage systems, such as high-voltage motor starters and high-voltage power regulators. In existing applications, temperature sampling often requires powering the temperature sampling circuit through a high-voltage isolation transformer and then transmitting the signal through optical fiber, which is a complex and costly solution.

[0003] To address the above issues, power supply and signal transmission problems need to be solved in high-voltage system applications. With continuous technological innovation, existing wireless communication solutions, such as Bluetooth, Wi-Fi, and LoRa, are relatively mature. Wireless communication can directly achieve spatial transmission and solve safety regulations in high-voltage systems.

[0004] The communication involved requires the design of a circuit board to implement the corresponding functions. In high-voltage systems, the temperature sampling points all have high voltage. The power supply design needs to meet the corresponding safety requirements, and high isolation voltage power supplies are often considered. However, their high cost and implementation difficulty are significant. Therefore, a high-voltage power component temperature sampling device is needed to solve the above problems. Utility Model Content

[0005] The main objective of this invention is to provide a high-voltage power component temperature sampling device, which can effectively solve the problems in the background art.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] A high-voltage power component temperature sampling device includes a main body, which includes a thyristor. A heat sink is provided on the top of the thyristor, and an insulating support is provided on the side of the heat sink. A support base and a temperature sampling plate are provided on one side of the top of the heat sink, and a current transformer, a mounting groove, and a cylindrical copper column are provided on the top of the heat sink. A first metal plate and a second metal plate are respectively provided at both ends of the insulating support, and a positioning rod is provided in the middle of the first metal plate. A temperature sensor is provided on one side of the heat sink.

[0008] Preferably, there are two insulating supports, which are symmetrically distributed on both sides of the radiator. A slot is provided on one side of the radiator. There are two slots, which are symmetrically distributed on both sides of the radiator. The insulating support is snapped into the inside of the slot. A threaded connection groove is provided in the middle of the slot.

[0009] Preferably, the top of the insulating bracket on the side away from the heat sink has a groove, and the threaded connection groove passes through the groove. A thyristor is installed at the bottom of the heat sink, and there are multiple thyristors, which are evenly distributed between the two insulating brackets. The thyristors are arranged correspondingly to the heat sink.

[0010] Preferably, a bracket is installed on one side of the top of the radiator, and there are two brackets, which are respectively arranged adjacent to each other on one side of the top of the radiator. A temperature sampling plate is installed on the top of the bracket, and a positioning bolt is threadedly connected to the top of the temperature sampling plate. The temperature sampling plate is connected to the bracket through the positioning bolt, and the temperature sampling plate is installed on the top side of the radiator through the bracket.

[0011] Preferably, a current transformer is installed at the top center of the radiator, and an L-shaped positioning plate is bolted to one side of the current transformer. The bottom of the L-shaped positioning plate is bolted to the top of the radiator. A temperature sensor is installed on the side of the radiator, and the temperature sensor is electrically connected to the temperature sampling plate.

[0012] Preferably, the current transformer has a mounting groove in the middle of its top, and a cylindrical copper column is installed in the middle of the mounting groove. The top of the cylindrical copper column is in contact with the bottom of the first metal sheet. The first metal sheet is connected to two insulating brackets by bolts, and a positioning rod is installed in the middle of the first metal sheet. The bottom end of the positioning rod passes through the first metal sheet and connects to the cylindrical copper column.

[0013] Preferably, a second metal plate is bolted to one side of the insulating bracket near the bottom, and the second metal plate connects two insulating brackets. Multiple arc-shaped pads are installed on the top of the insulating bracket, and a support column is installed on the top of the arc-shaped pads. The top of the support column contacts the bottom of the radiator located at the bottom of the insulating bracket.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] In this invention, temperature is sampled by means of a heat sink, thyristor, current transformer, temperature sensor, and temperature sampling board. The temperature sampling board, temperature sensor, and heat sink are connected together, and the temperature signal is transmitted wirelessly, thereby achieving rapid transmission of sampled data, improving the ease of use of the device, and the device has a simple structure and is easy to operate. Attached Figure Description

[0016] Figure 1 This is a first-view structural schematic diagram of the entire device of this utility model;

[0017] Figure 2 This is a second-view structural schematic diagram of the overall device of this utility model;

[0018] Figure 3 This is a schematic diagram of the top of the device of this utility model unfolded;

[0019] Figure 4 This is a schematic diagram of the unfolded structure of the device of this utility model.

[0020] In the diagram: 1. Main body of the device; 2. Thyristor; 3. Heat sink; 4. Insulating bracket; 5. Slot; 6. Groove; 7. First metal plate; 8. Second metal plate; 9. Threaded connection groove; 10. Arc-shaped pad; 11. Support column; 12. Current transformer; 13. Mounting groove; 14. Cylindrical copper column; 15. Temperature sampling plate; 16. Bracket base; 17. Positioning bolt; 18. Temperature sensor; 19. L-shaped positioning plate; 20. Positioning rod. Detailed Implementation

[0021] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0022] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, a high-voltage power component temperature sampling device includes a device body 1. The device body 1 includes a thyristor 2. A heat sink 3 is provided on the top of the thyristor 2, and an insulating support 4 is provided on the side of the heat sink 3. A support base 16 and a temperature sampling plate 15 are provided on the top side of the heat sink 3. A current transformer 12, a mounting groove 13, and a cylindrical copper column 14 are provided on the top of the heat sink 3. A first metal sheet 7 and a second metal sheet 8 are respectively provided at both ends of the insulating support 4, and a positioning rod 20 is provided in the middle of the first metal sheet 7. A temperature sensor is provided on one side of the heat sink 3. The sensor 18 has two insulating supports 4, which are symmetrically distributed on both sides of the heat sink 3. One side of the heat sink 3 is provided with a slot 5. There are two slots 5, which are symmetrically distributed on both sides of the heat sink 3. The insulating supports 4 are snapped into the inside of the slots 5. A threaded connection groove 9 is provided in the middle of the slot 5. A groove 6 is provided on the top of the side of the insulating support 4 away from the heat sink 3. The threaded connection groove 9 passes through the groove 6. A thyristor 2 is installed at the bottom of the heat sink 3. There are multiple thyristors 2, which are evenly distributed between the two insulating supports 4. The thyristors 2 are set in correspondence with the heat sink 3.

[0023] A bracket 16 is installed on one side of the top of the radiator 3. There are two brackets 16, which are respectively arranged adjacent to each other on one side of the top of the radiator 3. A temperature sampling plate 15 is installed on the top of the bracket 16, and a positioning bolt 17 is threadedly connected to the top of the temperature sampling plate 15. The temperature sampling plate 15 is connected to the bracket 16 through the positioning bolt 17, and the temperature sampling plate 15 is installed on one side of the top of the radiator 3 through the bracket 16. A current transformer 12 is installed in the middle of the top of the radiator 3, and an L-shaped positioning plate 19 is bolted to one side of the current transformer 12. The bottom of the plate 19 is bolted to the top of the radiator 3. A temperature sensor 18 is mounted on the side of the radiator 3 and is electrically connected to the temperature sampling plate 15. A mounting groove 13 is provided in the middle of the top of the current transformer 12, and a cylindrical copper column 14 is installed in the middle of the mounting groove 13. The top of the cylindrical copper column 14 is in contact with the bottom of the first metal plate 7. The first metal plate 7 is bolted to two insulating brackets 4, and a positioning rod 20 is installed in the middle of the first metal plate 7. The bottom end of the positioning rod 20 passes through the first metal plate 7 and is connected to the cylindrical copper column 14.

[0024] A second metal plate 8 is bolted to one side of the insulating bracket 4 near the bottom, and the second metal plate 8 connects two insulating brackets 4. Multiple arc-shaped pads 10 are installed on the top of the insulating bracket 4, and a support column 11 is installed on the top of the arc-shaped pads 10. The top of the support column 11 contacts the bottom of the heat sink 3 located at the bottom of the insulating bracket 4. Temperature is sampled through the heat sink 3, thyristor 2, current transformer 12, temperature sensor 18, and temperature sampling plate 15. The temperature sampling plate 15, temperature sensor 18, and heat sink 3 are connected. The temperature signal is transmitted wirelessly, thereby realizing the rapid transmission of sampled data, improving the ease of use of the device, and the device has a simple structure and prevents operation.

[0025] It should be noted that this utility model is a high-voltage power component temperature sampling device. In use, the heat sink 3 and thyristor 2 are sequentially installed between two insulating supports 4, with multiple thyristors 2 connected in series. The heat sink 3 is connected to the insulating supports 4 by bolts, and the insulating supports 4 are snapped into the slots 5 on the side of the heat sink 3, thereby improving the stability of the connection. A temperature sampling plate 15 is installed on one side of the top of the heat sink 3 via a support base 16 and positioning bolts 17. The temperature sampling plate 15 is electrically connected to the heat sink 3, and a temperature sensor 18 is installed on the side of the heat sink 3. Temperature sampling plate 15 is connected to heat sink 3. A current transformer 12 and a cylindrical copper column 14 are installed on the top of heat sink 3. A first metal plate 7 is installed on the top of the cylindrical copper column 14. The first metal plate 7 and the second metal plate 8 are respectively snapped onto the two ends of the insulating bracket 4, thereby realizing the positioning and support of multiple heat sinks 3 and thyristors 2. An arc-shaped pad 10 and a support column 11 are installed on the top of the second metal plate 8, thereby preventing the second metal plate 8 from directly contacting the heat sink 3 and affecting the use of the heat sink 3. Multiple temperature sampling plates 15 can be installed on multiple heat sinks 3 according to different requirements.

[0026] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A high-voltage power component temperature sampling device, comprising a device body (1), characterized in that: The main body (1) of the device includes a thyristor (2), a heat sink (3) is provided on the top of the thyristor (2), and an insulating bracket (4) is provided on the side of the heat sink (3). A bracket seat (16) and a temperature sampling plate (15) are provided on one side of the top of the heat sink (3), and a current transformer (12), a mounting groove (13) and a cylindrical copper column (14) are provided on the top of the heat sink (3). A first metal plate (7) and a second metal plate (8) are provided at both ends of the insulating bracket (4), and a positioning rod (20) is provided in the middle of the first metal plate (7). A temperature sensor (18) is provided on one side of the heat sink (3).

2. The high-voltage power component temperature sampling device according to claim 1, characterized in that: There are two insulating brackets (4), which are symmetrically distributed on both sides of the radiator (3). A slot (5) is provided on one side of the radiator (3). There are two slots (5), which are symmetrically distributed on both sides of the radiator (3). The insulating bracket (4) is snapped into the inside of the slot (5). A threaded connection groove (9) is provided in the middle of the slot (5).

3. The high-voltage power component temperature sampling device according to claim 2, characterized in that: The insulating bracket (4) has a groove (6) on the top of the side away from the radiator (3), and the threaded connection groove (9) passes through the groove (6). A thyristor (2) is installed at the bottom of the radiator (3), and there are multiple thyristors (2) evenly distributed between the two insulating brackets (4). The thyristors (2) are correspondingly arranged with the radiator (3).

4. The high-voltage power component temperature sampling device according to claim 3, characterized in that: A bracket (16) is installed on one side of the top of the radiator (3), and there are two brackets (16), which are respectively arranged adjacent to each other on one side of the top of the radiator (3). A temperature sampling plate (15) is installed on the top of the bracket (16), and a positioning bolt (17) is threadedly connected to the top of the temperature sampling plate (15). The temperature sampling plate (15) is connected to the bracket (16) through the positioning bolt (17), and the temperature sampling plate (15) is installed on one side of the top of the radiator (3) through the bracket (16).

5. The high-voltage power component temperature sampling device according to claim 4, characterized in that: A current transformer (12) is installed in the middle of the top of the radiator (3), and an L-shaped positioning plate (19) is installed on one side of the current transformer (12) by bolts. The bottom of the L-shaped positioning plate (19) is installed on the top of the radiator (3) by bolts. A temperature sensor (18) is installed on the side of the radiator (3), and the temperature sensor (18) is electrically connected to the temperature sampling plate (15).

6. The high-voltage power component temperature sampling device according to claim 5, characterized in that: The current transformer (12) has a mounting groove (13) in the middle of its top, and a cylindrical copper column (14) is installed in the middle of the mounting groove (13). The top of the cylindrical copper column (14) is in contact with the bottom of the first metal plate (7). The first metal plate (7) is connected to two insulating brackets (4) by bolts. A positioning rod (20) is installed in the middle of the first metal plate (7). The bottom end of the positioning rod (20) passes through the first metal plate (7) and is connected to the cylindrical copper column (14).

7. The high-voltage power component temperature sampling device according to claim 2, characterized in that: The insulating bracket (4) has a second metal plate (8) bolted to one side near the bottom, and the second metal plate (8) connects two insulating brackets (4). Multiple arc-shaped pads (10) are installed on the top of the insulating bracket (4), and a support column (11) is installed on the top of the arc-shaped pads (10). The top of the support column (11) is in contact with the bottom of the radiator (3) located at the bottom of the insulating bracket (4).

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