Electronic device

Abstract

This disclosure provides an electronic device, relating to the field of electronic device technology. The electronic device includes: a motherboard; a lens metal decorative element; and an antenna radiator disposed near the lens metal decorative element, located between the motherboard and the rear cover of the electronic device. The lens metal decorative element and the antenna radiator are spaced apart and disposed on the same side of the motherboard, forming a coupling gap between them. A first grounding spring and a second grounding spring are provided between the lens metal decorative element and the motherboard. The lens metal decorative element is electrically connected to the motherboard through the first and second grounding springs, so that under the coupling excitation of the antenna radiator, the lens metal decorative element becomes a parasitic radiator of the antenna radiator. By forming a coupling gap between the lens metal decorative element and the antenna radiator, and using the first and second grounding springs to electrically connect the lens metal decorative element to the motherboard, the lens metal decorative element becomes a parasitic radiator of the antenna radiator, enhancing the antenna radiation efficiency.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and more specifically, to an electronic device. Background Technology

[0002] In electronic devices with an all-metal structure, a window is usually made in the area of ​​the rear camera trim, and a laser-direct-structuring (LDS) antenna or a flexible printed circuit (FPC) antenna is deployed in this area. However, the antenna performance is affected by the size of the trim window, the camera trim, and other components such as the camera body. Utility Model Content

[0003] This disclosure provides an electronic device that at least partially solves the problems in the related art.

[0004] According to a first aspect of the present disclosure, an electronic device is provided, comprising: a motherboard; a lens metal decorative element; and an antenna radiator disposed near the lens metal decorative element, located between the motherboard and a rear cover of the electronic device; the lens metal decorative element and the antenna radiator are spaced apart and disposed on the same side of the motherboard, and a coupling gap is formed between the lens metal decorative element and the antenna radiator; a first grounding spring and a second grounding spring are provided between the lens metal decorative element and the motherboard, and the lens metal decorative element is electrically connected to the motherboard through the first grounding spring and the second grounding spring, so that the lens metal decorative element becomes a parasitic radiator of the antenna radiator under the coupling excitation of the antenna radiator.

[0005] In some embodiments of this disclosure, the first grounding spring and the second grounding spring are spaced apart, and the grounding positions of the first grounding spring and the second grounding spring on the lens metal decorative part satisfy that the direction of the current formed corresponds at least partially to the direction of the trace current of the antenna radiator.

[0006] In some embodiments of this disclosure, the minimum distance between the lens metal decorative element and the antenna radiator is less than 1 / 4λ, where λ is the operating frequency wavelength of the antenna radiator.

[0007] In some embodiments of this disclosure, the point on the lens metal trim closest to the antenna radiator is used as a reference point, and the maximum distance from the reference point to the antenna radiator is less than 1 / 4λ.

[0008] In some embodiments of this disclosure, the first grounding spring and the second grounding spring are welded to the motherboard.

[0009] In some embodiments of this disclosure, the distance between the first grounding spring and the second grounding spring is 1 / 4λ.

[0010] In some embodiments of this disclosure, a first matching circuit is further provided between the first grounding spring and the motherboard, and a second matching circuit is further provided between the second grounding spring and the motherboard; wherein, capacitors and / or inductors are provided on the first matching circuit and the second matching circuit.

[0011] In some embodiments of this disclosure, in response to the distance between the first grounding spring and the second grounding spring being greater than 1 / 4λ, the input impedance of the first matching circuit and the second matching circuit is set to capacitive; where λ is the operating frequency wavelength of the antenna radiator; in response to the distance between the first grounding spring and the second grounding spring being less than 1 / 4λ, the input impedance of the first matching circuit and the second matching circuit is set to inductive.

[0012] In some embodiments of this disclosure, at least two first matching circuits are provided between the first grounding spring and the motherboard, and / or at least two second matching circuits are provided between the second grounding spring and the motherboard; wherein the at least two first matching circuits and / or the at least two second matching circuits are used to suppress high-order mode resonance of the antenna radiator in the operating frequency band and eliminate static electricity.

[0013] In some embodiments of this disclosure, the antenna radiator is a laser-formed antenna or a flexible printed circuit antenna.

[0014] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0015] By creating a coupling gap between the lens metal decorative component and the antenna radiator, and using a first and second grounding spring to electrically connect the lens metal decorative component to the motherboard, the lens metal decorative component becomes a parasitic radiator of the antenna radiator. This solves the problem of antenna performance degradation caused by the integration or floating of camera decorative components in related electronic devices, enhances the overall radiation efficiency of the antenna, effectively avoids interference resonance problems caused by floating designs, reduces electromagnetic interference, and improves electromagnetic compatibility. Furthermore, this technical solution optimizes antenna radiation characteristics without increasing additional space, making it suitable for electronic devices such as tablets, mobile phones, and e-readers.

[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0018] Figure 1 This is a structural diagram of an electronic device according to an exemplary embodiment of the present disclosure.

[0019] Figure 2 yes Figure 1 A detailed view of region A in the electronic device shown.

[0020] Figure 3 This is a schematic diagram illustrating an exemplary embodiment of the present disclosure showing a lens metal decorative element electrically connected to a motherboard via a first grounding spring and a second grounding spring.

[0021] Figure 4 This is a schematic diagram illustrating the current flow according to an exemplary embodiment of the present disclosure.

[0022] Figure 5 This is a schematic diagram illustrating the distance between a metal decorative element and an antenna radiator according to an exemplary embodiment of the present disclosure.

[0023] Figure 6 This is a schematic diagram illustrating the connection method between the first grounding spring, the second grounding spring, and the motherboard according to an exemplary embodiment of this disclosure.

[0024] Figure 7 and Figure 8 This is a comparison diagram of the antenna performance of electronic devices in related technologies and electronic devices according to embodiments of this disclosure.

[0025] Figure 9 This is a block diagram illustrating an electronic device according to an exemplary embodiment of the present disclosure. Detailed Implementation

[0026] Exemplary embodiments of this disclosure will be described in detail herein, examples of which are illustrated in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings denote the same or similar elements unless otherwise indicated. Various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to those orders set forth herein, but can be changed as will become apparent upon understanding this disclosure, except for operations that must be performed in a particular order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.

[0027] The embodiments described below, which are examples of some of the embodiments of this disclosure, do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0028] The specific implementation methods of the embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0029] Figure 1 This is a structural diagram of an electronic device according to an exemplary embodiment of the present disclosure. Figure 2 yes Figure 1 A detailed view of region A in the illustrated electronic device. For example, the electronic device may be a tablet computer, mobile phone, e-reader, MP3 player, MP4 player, laptop computer, in-vehicle infotainment system or desktop computer, portable terminal, laptop terminal, desktop terminal, action camera, drone, monitor camera, or similar product.

[0030] like Figure 1 and Figure 2 As shown, the electronic device includes: a motherboard 110, a lens metal trim 120, and an antenna radiator 130 disposed near the lens metal trim 120.

[0031] The antenna radiator 130 is responsible for transmitting and receiving signals. In an exemplary embodiment, the antenna radiator 130 is an LDS antenna or an FPC antenna. LDS antennas have the advantages of high precision and the ability to achieve complex shapes, which can adapt to different design requirements; FPC antennas have good flexibility and are easy to place in electronic devices with limited space or irregular shapes.

[0032] For example, the operating frequency range of the antenna radiator 130 covers 1G to 4G, such as the 2.4G frequency band.

[0033] The lens metal trim 120 and the antenna radiator 130 are located between the motherboard 110 and the back cover of the electronic device. The lens metal trim 120 and the antenna radiator 130 are spaced apart on the same side of the motherboard 110, forming a coupling gap between them. This coupling gap prevents direct contact between the lens metal trim 120 and the antenna radiator 130, thus avoiding short circuits and ensuring the normal operation of the antenna radiator 130.

[0034] like Figure 2As shown, a first grounding spring 140 and a second grounding spring 150 are provided between the lens metal decorative part 120 and the main board 110. The lens metal decorative part 120 is electrically connected to the main board 110 through the first grounding spring 140 and the second grounding spring 150, so that the lens metal decorative part 120 becomes a parasitic radiator of the antenna radiator 130 under the coupling excitation of the antenna radiator 130. Among them, the first grounding spring 140 and the second grounding spring 150 are elastic, which can ensure that the lens metal decorative part 120 and the main board 110 maintain good and stable electrical contact under vibration or other external forces.

[0035] Figure 3 This is a schematic diagram illustrating the electrical connection between a lens metal decorative element and a motherboard via a first grounding spring and a second grounding spring, according to an exemplary embodiment of this disclosure. Figure 3 As shown, the first grounding spring 140 and the second grounding spring 150 are located between the lens metal decorative piece 120 and the main board 110, and the lens metal decorative piece 120 establishes an electrical connection with the main board 110 through the first grounding spring 140 and the second grounding spring 150.

[0036] For example, when the antenna radiator 130 transmits or receives signals in the 2.4G band, it induces current in the lens metal decoration 120 through electromagnetic coupling. These currents form a current distribution on the lens metal decoration 120, thereby generating additional radiation. This additional radiation can enhance the transmission and reception strength of the antenna signal in the 2.4G band, thereby improving the overall performance of the antenna assembly in this band.

[0037] In related technologies, integrating the camera decorative piece with the metal back cover reduces the window area and lowers the overall antenna performance; or, suspending the camera decorative piece in the window will cause interference resonance, reduce antenna radiation efficiency, and also affect electromagnetic compatibility.

[0038] The electronic device of this disclosure forms a coupling gap between the lens metal decorative piece 120 and the antenna radiator 130, and electrically connects the lens metal decorative piece 120 to the motherboard 110 using a first grounding spring 140 and a second grounding spring 150. This makes the lens metal decorative piece 120 a parasitic radiator of the antenna radiator 130, solving the problem of antenna performance degradation caused by the integration or floating of camera decorative pieces in related technologies. It enhances the overall radiation efficiency of the antenna, effectively avoids interference resonance problems caused by floating designs, reduces electromagnetic interference, and improves electromagnetic compatibility. Furthermore, this technical solution optimizes antenna radiation characteristics without increasing additional space, making it suitable for electronic devices such as tablets, mobile phones, and e-readers.

[0039] In an exemplary embodiment, the first grounding spring 140 and the second grounding spring 150 are spaced apart, and the grounding positions of the first grounding spring 140 and the second grounding spring 150 on the lens metal decorative member 120 satisfy that the direction of the current formed corresponds at least partially to the direction of the trace current of the antenna radiator 130.

[0040] In this embodiment, the first grounding spring 140 and the second grounding spring 150 are spaced apart, and the grounding positions of the first grounding spring 140 and the second grounding spring 150 on the lens metal decoration 120 are carefully designed to guide the current flow path on the lens metal decoration 120, so that the current flow path on the lens metal decoration 120 corresponds at least partially to the routing current direction of the antenna radiator 130.

[0041] Figure 4 This is a schematic diagram illustrating the current flow according to an exemplary embodiment of the present disclosure. Figure 4 In the diagram, arrow 1 points to the direction of the current flow in the antenna radiator 130, i.e., the current flow direction when the antenna transmits or receives signals. Arrow 2 points to the direction of the current flow near the grounding positions of the first grounding spring 140 and the second grounding spring 150 on the lens metal decorative piece 120. Figure 2 It can be seen that in the vicinity of the grounding positions of the first grounding spring 140 and the second grounding spring 150 on the lens metal decorative piece 120, the current is guided, so that the direction of the current in these areas (i.e., the current direction indicated by arrow 2) tends to be parallel to the direction of the current in the antenna radiator 130 (i.e., the current direction indicated by arrow 1). This makes the distribution of the electromagnetic fields generated by the lens metal decorative piece 120 and the antenna radiator 130 in space more coordinated, and they can be better superimposed on each other, thereby enhancing the overall radiation effect and improving the radiation efficiency of the antenna.

[0042] The electronic device of this disclosure adjusts the positions of the first grounding spring 140 and the second grounding spring 150 to guide the current path on the lens metal decoration 120 to at least partially correspond to the current direction of the antenna radiator 130, so that the electromagnetic fields between the lens metal decoration 120 and the antenna radiator 130 are more coordinated and mutually enhanced. In this way, the performance of the antenna system can be effectively improved without adding additional antenna elements.

[0043] In an exemplary embodiment, the minimum distance between the lens metal decorative piece 120 and the antenna radiator 130 is less than 1 / 4λ, where λ is the operating frequency wavelength of the antenna radiator 130.

[0044] When the antenna radiator 130 is operating, it radiates electromagnetic waves and generates an alternating electromagnetic field in the surrounding space. If the distance between the lens metal trim 120 and the antenna radiator 130 is too large, the electromagnetic coupling between them will be significantly weakened. In this case, the lens metal trim 120 will have difficulty effectively sensing the electromagnetic field of the antenna radiator 130, thus failing to fully utilize its function as a parasitic radiator.

[0045] In this embodiment, the minimum distance between the lens metal decorative element 120 and the antenna radiator 130 is less than 1 / 4λ, which enables the lens metal decorative element 120 to generate induced current. These induced currents further radiate electromagnetic waves and cooperate with the radiation of the antenna radiator 130 to jointly improve the overall performance of the antenna.

[0046] In an exemplary embodiment, a reference point is taken as the point on the lens metal trim 120 that is closest to the antenna radiator 130, and the maximum distance from the reference point to the antenna radiator 130 is less than 1 / 4λ.

[0047] Find the point on the lens metal trim 120 that is closest to the antenna radiator 130. This point is the location on the lens metal trim 120 that is most easily affected by the electromagnetic field of the antenna radiator 130. Its electromagnetic coupling state plays a key role in the performance of the entire lens metal trim 120 as a parasitic radiator.

[0048] In this embodiment of the present disclosure, the point on the lens metal decorative piece 120 that is closest to the antenna radiator 130 is used as a reference point. The maximum distance from the reference point to the antenna radiator 130 is less than 1 / 4λ. That is, the maximum distance from the reference point to the end or edge of the antenna radiator 130 is constrained to be less than 1 / 4λ. This ensures that the lens metal decorative piece 120 and the antenna radiator 130 can maintain a good electromagnetic coupling state at the position closest to the antenna radiator 130.

[0049] Figure 5 This is a schematic diagram illustrating the distance between a metal decorative element and an antenna radiator according to an exemplary embodiment of this disclosure. Figure 5 As shown, the minimum distance between the lens metal decorative piece 120 and the antenna radiator 130 is L1, which satisfies that L1 is less than 1 / 4λ. Taking the point on the lens metal decorative piece 120 that is closest to the antenna radiator 130 as the reference point, the maximum distance between this reference point and the antenna radiator 130 is L2, which satisfies that L2 is less than 1 / 4λ.

[0050] In the antenna assembly of this embodiment, the minimum distance between the lens metal trim 120 and the antenna radiator 130 is less than 1 / 4 of the operating frequency wavelength λ. This effectively utilizes the near-field coupling effect, thereby enhancing the antenna's radiation efficiency and performance. Furthermore, taking the point on the lens metal trim 120 closest to the antenna radiator 130 as a reference point, the maximum distance between this reference point and the antenna radiator 130 is less than 1 / 4 of the operating frequency wavelength λ, which further enhances the antenna's radiation efficiency and performance.

[0051] In an exemplary embodiment, the first grounding spring 140 and the second grounding spring 150 are soldered to the motherboard 110.

[0052] Figure 6 This is a schematic diagram illustrating the connection method between the first grounding spring, the second grounding spring, and the motherboard according to an exemplary embodiment of this disclosure. Figure 6 As shown, the first grounding spring 140 and the second grounding spring 150 can be disposed on the lens metal decorative part 120. The first spring pad 111 and the second spring pad 112 can be disposed on the motherboard 110. The first grounding spring 140 is soldered to the first spring pad 111, and the second grounding spring 150 is soldered to the second spring pad 112, so that the lens metal decorative part 120 is electrically connected to the motherboard 110 through the first grounding spring 140 and the second grounding spring 150. In this way, the lens metal decorative part 120 can constitute the parasitic radiator of the antenna radiator 130.

[0053] In an exemplary embodiment, the distance between the first grounding spring 140 and the second grounding spring 150 is 1 / 4λ.

[0054] In this embodiment, the distance between the first and second grounding springs is 1 / 4λ. The 1 / 4λ resonance principle can be utilized to make the lens metal decorative element 120 a highly efficient parasitic radiator. This spacing causes a 90° phase difference in the induced currents on the two grounding springs, thereby exciting a traveling wave current distribution on the lens metal decorative element 120, making it equivalent to a 1 / 4λ monopole antenna structure and enhancing radiation efficiency.

[0055] In an exemplary embodiment, a first matching circuit is further provided between the first grounding spring 140 and the main board 110, and a second matching circuit is further provided between the second grounding spring 150 and the main board 110; wherein, capacitors and / or inductors are provided on the first matching circuit and the second matching circuit.

[0056] In this embodiment of the disclosure, the first matching circuit is located between the first grounding spring 140 and the motherboard 110, and the first grounding spring 140 is electrically connected to the motherboard 110 through the first matching circuit; the second matching circuit is located between the second grounding spring 150 and the motherboard 110, and the second grounding spring 150 is electrically connected to the motherboard 110 through the second matching circuit.

[0057] like Figure 6 As shown, a first matching circuit 160 is provided between the motherboard 110 and the first grounding spring 140. The first matching circuit 160 is located at the first spring pad 111, so that the first grounding spring 130 is grounded through the first matching circuit 230. A second matching circuit 170 is provided between the motherboard 110 and the second grounding spring 150. The second matching circuit 170 is located at the second spring pad 112, so that the second grounding spring 140 is grounded through the second matching circuit 240.

[0058] The first matching circuit 160 and the second matching circuit 170 can be LC matching circuits, equipped with capacitors and / or inductors. The characteristics of the capacitors and / or inductors are used to adjust the impedance characteristics of the circuit, so that the electrical connection between the lens metal decorative part 120 and the main board 110 reaches the optimal matching state within the operating frequency band of the antenna radiator 130, thereby improving the antenna radiation efficiency and performance.

[0059] In an exemplary embodiment, in response to the distance between the first grounding spring 140 and the second grounding spring 150 being greater than 1 / 4λ, the input impedance of the first matching circuit and the second matching circuit is set to capacitive; where λ is the operating frequency wavelength of the antenna radiator; in response to the distance between the first grounding spring 140 and the second grounding spring 150 being less than 1 / 4λ, the input impedance of the first matching circuit and the second matching circuit is set to inductive.

[0060] When the distance between the first grounding spring 140 and the second grounding spring 150 is greater than 1 / 4λ, the current path on the lens metal decorative piece 120 becomes longer, causing its equivalent impedance to exhibit inductive impedance characteristics. To achieve impedance matching for the entire antenna system, the first and second matching circuits are configured to exhibit capacitive input impedance. That is, when viewed from the feed port of the antenna radiator 130 towards the matching circuit, its equivalent impedance has a negative reactance component at the target frequency, similar to the behavior of a capacitor, i.e., it presents a low impedance to high-frequency signals. This capacitive characteristic can effectively counteract the inductive effect caused by the structural change in the lens metal decorative piece 120 (i.e., the distance between the first grounding spring 140 and the second grounding spring 150 is greater than 1 / 4λ), thereby improving the overall matching performance and radiation efficiency of the antenna.

[0061] It should be noted that setting the input impedance of the first and second matching circuits to capacitive is not limited to the case where the matching circuit contains purely capacitive components, but also includes scenarios where the matching circuit contains both capacitive and inductive components but behaves capacitively overall, as well as designs that achieve grounding connection through capacitors.

[0062] When the distance between the first grounding spring 140 and the second grounding spring 150 is less than 1 / 4λ, the current path on the lens metal decorative piece 120 becomes shorter, causing the lens metal decorative piece 120 to exhibit capacitive impedance characteristics. To achieve impedance matching for the entire antenna system, the first matching circuit and the second matching circuit are configured to exhibit inductive input impedance. That is, when viewed from the feed port of the antenna radiator 130 towards the matching circuit, its equivalent impedance has a positive reactance component at the target frequency, similar to the behavior of an inductor, i.e., exhibiting an impedance that increases with increasing frequency for AC signals. This inductive characteristic can effectively counteract the capacitive effect caused by the structural change in the lens metal decorative piece 120 (i.e., the distance between the first grounding spring 140 and the second grounding spring 150 is less than 1 / 4λ), thereby improving the overall matching performance and radiation efficiency of the antenna.

[0063] It should be noted that setting the input impedance of the first and second matching circuits to inductive is not limited to the case where the matching circuit contains purely inductive components, but also includes scenarios where the matching circuit contains both capacitors and inductors but behaves inductively as a whole, as well as designs that achieve grounding connection through inductance.

[0064] The electronic device of this disclosure sets the input impedance characteristics of the first and second matching circuits according to the relationship between the distance between the first grounding spring 140 and the second grounding spring 150 and the wavelength of the operating frequency band of the antenna radiator 130. When the distance between the first grounding spring 140 and the second grounding spring 150 is greater than 1 / 4λ, the input impedance of the first and second matching circuits is set to capacitive to counteract the inductive effect caused by the increased current path of the lens metal decorative part 120; when the distance between the first grounding spring 140 and the second grounding spring 150 is less than 1 / 4λ, the input impedance of the first and second matching circuits is set to inductive to counteract the capacitive effect caused by the decreased current path of the lens metal decorative part 120. Both settings can effectively improve the overall matching performance and radiation efficiency of the antenna, and the matching circuit can be set in various ways, not limited to pure capacitors or pure inductors, but also including various component combinations and different grounding connection designs, so as to achieve good antenna performance optimization under different conditions.

[0065] In an exemplary embodiment, at least two first matching circuits are provided between the first grounding spring 140 and the main board 110, or at least two second matching circuits are provided between the second grounding spring 150 and the main board 110, or at least two first matching circuits are provided between the first grounding spring 140 and the main board 110, and at least two second matching circuits are also provided between the second grounding spring 150 and the main board 110; wherein, these at least two first matching circuits and / or at least two second matching circuits are used to suppress high-order mode resonance of the antenna radiator 130 in the operating frequency band and eliminate static electricity. Figure 6 As shown, there are two first matching circuits 160 and two second matching circuits 170.

[0066] In this embodiment of the disclosure, the first grounding spring 140 can be grounded through at least two first matching circuits, or the second grounding spring 150 can be grounded through at least two second matching circuits, or both grounding springs can be grounded through at least two matching circuits respectively. If the distance between the first grounding spring 140 and the second grounding spring 150 is less than 1 / 4λ, when the first grounding spring 140 is grounded through at least two first matching circuits, the input impedance of these matching circuits is set to capacitive, and they can cooperate with each other to more accurately enhance the electromagnetic coupling strength, thereby more effectively improving the antenna radiation efficiency; when the second grounding spring 150 is grounded through at least two second matching circuits, the input impedance of these matching circuits is set to capacitive, and they can cooperate with each other to more accurately enhance the electromagnetic coupling strength, thereby more effectively improving the antenna radiation efficiency; when both are grounded through at least two matching circuits respectively, the input impedance of these matching circuits is set to capacitive, and they can cooperate with each other to further more accurately enhance the electromagnetic coupling strength, thereby more significantly improving the antenna radiation efficiency.

[0067] If the distance between the first grounding spring 140 and the second grounding spring 150 is less than 1 / 4λ, when the first grounding spring 140 is grounded through at least two first matching circuits, the input impedance of these matching circuits is set to inductive. They can dynamically adjust the inductance parameters according to the specific coupling strength and signal characteristics, more flexibly reducing signal reflection and energy loss, allowing the antenna to convert electrical energy into electromagnetic energy and radiate it with higher efficiency, significantly improving radiation efficiency. When the second grounding spring 150 is grounded through at least two second matching circuits, the input impedance of these matching circuits is set to inductive. They can dynamically adjust the inductance parameters according to the specific coupling strength and signal characteristics, more flexibly reducing signal reflection and energy loss, thereby significantly improving radiation efficiency. When both are grounded through at least two matching circuits, the input impedance of these matching circuits is set to inductive. They can better dynamically adjust the inductance parameters according to the specific coupling strength and signal characteristics, more flexibly reducing signal reflection and energy loss, and greatly improving radiation efficiency.

[0068] In this embodiment, at least two first matching circuits can be provided between the first grounding spring 140 and the main board 110, and at least two second matching circuits can be provided between the second grounding spring 150 and the main board 110, depending on different design requirements; alternatively, at least two matching circuits can be provided in one location, and one matching circuit in another. Regardless of the combination of the number of matching circuits used, the specifically provided first and second matching circuits can construct a multi-level, multi-layered filtering network to intercept and attenuate high-order mode resonance signals from multiple angles, thus more effectively filtering out high-order mode resonances, ensuring high signal stability of the antenna within the operating frequency band, and significantly improving overall operating efficiency. Furthermore, these matching circuits provide multiple discharge channels for static electricity, functioning simultaneously when static electricity is generated to quickly discharge the static charge, thus more effectively protecting the antenna components from electrostatic damage.

[0069] In an exemplary embodiment, the electronic device further includes a camera assembly mounted within a cavity enclosed by a lens metal trim 120 and a metal frame. This provides physical protection for the camera assembly through the lens metal trim 120, preventing damage from external impacts.

[0070] Figure 7 and Figure 8 This is a comparison diagram of the antenna performance of electronic devices in related technologies and electronic devices according to embodiments of this disclosure. Figure 7 The curve of S11 parameter changing with frequency is shown. It can be seen from the figure that the electronic device provided in the present disclosure generates an additional resonance in front of the main resonant wave because the lens metal decorative part is grounded through the grounding spring, and this resonance position is outside the antenna operating frequency band of 2.4GHz-2.5GHz. Figure 8 The graph shows the radiation efficiency as a function of frequency. As can be seen from the graph, compared with the related technologies of integrating the camera decorative part with the metal back shell and suspending the camera decorative part in the window, the solution of grounding the lens metal decorative part through the grounding spring adopted in the present disclosure improves the efficiency of the antenna in the operating frequency band of 2.4GHz-2.5GHz. The peak efficiency is improved by 5.5dB compared with the solution of integrating the camera decorative part with the metal back shell and by 2dB compared with the solution of suspending the camera decorative part in the window.

[0071] The electronic device of this disclosure forms a coupling gap between a lens metal decorative element and an antenna radiator, wherein the distance between the lens metal decorative element and the antenna radiator is within 1 / 4λ. Exemplarily, the minimum distance between the lens metal decorative element and the antenna radiator is within 1 / 4λ, and the maximum distance between a reference point on the lens metal decorative element (i.e., the point closest to the antenna radiator) and the antenna radiator is within 1 / 4λ. The lens metal decorative element is electrically connected to the motherboard via a first grounding spring and a second grounding spring. Specifically, the first grounding spring is electrically connected to the motherboard via a first matching circuit, and the second grounding spring is electrically connected to the motherboard via a second matching circuit. When the distance between the first and second grounding springs is less than 1 / 4λ, the input impedance of the two matching circuits is set to inductive, such as by using inductive grounding, to offset the capacitive effect caused by the shortened current path of the lens metal decorative piece 120. When the distance between the first and second grounding springs is greater than 1 / 4λ, the input impedance of the two matching circuits is set to capacitive, such as by using capacitive grounding, to offset the inductive effect caused by the lengthened current path of the lens metal decorative piece. Through the above design, the lens metal decorative piece can act as a parasitic radiator of the antenna radiator, thereby effectively improving the overall radiation efficiency of the antenna within the operating frequency band of the antenna radiator.

[0072] It should be noted that the electronic device in this embodiment can be a foldable electronic device or a flat-screen electronic device (non-foldable electronic device). The antenna assembly can be located on the back cover of the electronic device or on the side of the electronic device closer to the screen.

[0073] Of course, in practical applications, the position of the antenna assembly can be flexibly adjusted according to factors such as the specific shape, size, internal structure and antenna performance requirements of the electronic device, and this disclosure does not limit this.

[0074] Figure 9 This is a block diagram illustrating an electronic device according to an exemplary embodiment of the present disclosure. (Refer to...) Figure 9 The electronic device 900 may also include one or more of the following components: a processing component 902, a memory 904, a power supply component 906, a multimedia component 908, an audio component 910, an input / output (I / O) interface 912, a sensor component 914, and a communication component 916.

[0075] Processing component 902 typically controls the overall operation of electronic device 900, such as operations associated with display, telephone calls, data communication, camera operation, and recording operations. Processing component 902 may include one or more processors 920 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 902 may include one or more modules to facilitate interaction between processing component 902 and other components. For example, processing component 902 may include a multimedia module to facilitate interaction between multimedia component 908 and processing component 902.

[0076] Memory 904 is configured to store various types of data to support the operation of device 900. Examples of this data include instructions for any application or method operating on electronic device 900, contact data, phonebook data, messages, pictures, videos, etc. Memory 904 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0077] Power supply component 906 provides power to various components of electronic device 900. Power supply component 906 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic device 900.

[0078] Multimedia component 908 includes a screen that provides an output interface between the electronic device 900 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 908 includes a front-facing camera and / or a rear-facing camera. When the device 900 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0079] Audio component 910 is configured to output and / or input audio signals. For example, audio component 910 includes a microphone (MIC) configured to receive external audio signals when electronic device 900 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 904 or transmitted via communication component 916. In some embodiments, audio component 910 also includes a speaker for outputting audio signals.

[0080] I / O interface 912 provides an interface between processing component 902 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0081] Sensor assembly 914 includes one or more sensors for providing state assessments of various aspects of electronic device 900. For example, sensor assembly 914 can detect the on / off state of device 900, the relative positioning of components such as the display and keypad of electronic device 900, changes in position of electronic device 900 or a component of electronic device 900, the presence or absence of user contact with electronic device 900, orientation or acceleration / deceleration of electronic device 900, and temperature changes of electronic device 900. Sensor assembly 914 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 914 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 914 may also include an accelerometer, gyroscope, magnetometer, pressure sensor, or temperature sensor.

[0082] Communication component 916 is configured to facilitate wired or wireless communication between electronic device 900 and other devices. Electronic device 900 can access wireless networks based on communication standards, such as WiFi, 3G, 4G, 5G, other communication standards, or combinations thereof. In some embodiments of this disclosure, communication component 916 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In some embodiments of this disclosure, communication component 916 further includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0083] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

[0084] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. An electronic device, characterized in that, The electronic device includes: Motherboard; Lens metal decorative parts; An antenna radiator, positioned near the metal decorative element of the lens, is located between the motherboard and the rear cover of the electronic device. The lens metal decorative piece and the antenna radiator are spaced apart and disposed on the same side of the main board, and a coupling gap is formed between the lens metal decorative piece and the antenna radiator; A first grounding spring and a second grounding spring are provided between the lens metal decorative component and the main board. The lens metal decorative component is electrically connected to the main board through the first grounding spring and the second grounding spring, so that the lens metal decorative component becomes a parasitic radiator of the antenna radiator under the coupling excitation of the antenna radiator.

2. The electronic device according to claim 1, characterized in that, The first grounding spring and the second grounding spring are spaced apart, and the grounding positions of the first grounding spring and the second grounding spring on the lens metal decorative part satisfy that the direction of the current formed is at least partially corresponding to the direction of the trace current of the antenna radiator.

3. The electronic device according to claim 1, characterized in that, The minimum distance between the lens metal decorative part and the antenna radiator is less than 1 / 4λ, where λ is the operating frequency wavelength of the antenna radiator.

4. The electronic device according to claim 1, characterized in that, The point on the metal decorative part of the lens that is closest to the antenna radiator is used as a reference point, and the maximum distance from the reference point to the antenna radiator is less than 1 / 4λ.

5. The electronic device according to claim 1, characterized in that, The first grounding spring and the second grounding spring are welded to the motherboard.

6. The electronic device according to claim 5, characterized in that, The distance between the first grounding spring and the second grounding spring is 1 / 4λ.

7. The electronic device according to claim 5, characterized in that, A first matching circuit is provided between the first grounding spring and the motherboard, and a second matching circuit is provided between the second grounding spring and the motherboard; wherein, capacitors and / or inductors are provided on the first matching circuit and the second matching circuit.

8. The electronic device according to claim 7, characterized in that, In response to the distance between the first grounding spring and the second grounding spring being greater than 1 / 4λ, the input impedance of the first matching circuit and the second matching circuit is set to capacitive; where λ is the operating frequency wavelength of the antenna radiator. In response to the distance between the first grounding spring and the second grounding spring being less than 1 / 4λ, the input impedance of the first matching circuit and the second matching circuit is set to inductive.

9. The electronic device according to claim 7, characterized in that, At least two first matching circuits are provided between the first grounding spring and the motherboard, and / or at least two second matching circuits are provided between the second grounding spring and the motherboard; The at least two first matching circuits and / or the at least two second matching circuits are used to suppress high-order mode resonances of the antenna radiator in the operating frequency band and to eliminate static electricity.

10. The electronic device according to any one of claims 1 to 9, characterized in that, The antenna radiator is a laser-formed antenna or a flexible printed circuit antenna.

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