Automobile liquid cooling plate

Abstract

The utility model discloses a kind of automobile liquid cooling plates, it includes shell and the heat dissipation cavity that is concave to shell lower end on shell upper end, heat dissipation cavity is divided into symmetrically arranged first cavity and second cavity, and the third cavity that communicates first cavity and second cavity;Third cavity bottom wall is equipped with concave recess, and third cavity and recess inner cavity are equipped with flow guide heat dissipation part.The setting of the recess provided on the heat dissipation cavity, when shell is installed on domain control mainboard, recess bottom surface can be attached with heat source on domain control mainboard, to increase the cooling effect of automobile liquid cooling plate to domain control mainboard, to avoid the damage of electrical components on domain control mainboard due to overheating.

Description

Technical Field

[0001] This utility model relates to the field of liquid cooling plates, and in particular to an automotive liquid cooling plate. Background Technology

[0002] Automotive liquid cooling plates are key components of the battery thermal management system in new energy vehicles (such as electric vehicles and hybrid vehicles). They are mainly used to regulate battery temperature and ensure its safe and efficient operation.

[0003] Meanwhile, the domain controller motherboard can also be cooled by the corresponding automotive liquid cooling plate. The domain controller motherboard usually refers to the heat dissipation management of vehicle controllers (such as DC / DC converters, on-board chargers, etc.) or electronic components, with the aim of preventing these electronic components from being damaged or degraded due to overheating.

[0004] The domain control motherboard installed in the cockpit is usually located near the glove box or at the bottom of the center armrest. These locations contain a large number of components and the snap-fit ​​structures of the various detachable panels that make up the glove box or center armrest. As a result, when using a traditional flat-plate automotive liquid cooling plate to cool the domain control motherboard, the horizontal contact surface between the flat-plate automotive liquid cooling plate and the heat source sometimes makes the liquid cooling plate and the car's heat source not fit properly, thus affecting the heat dissipation effect. Utility Model Content

[0005] In view of this, the present invention addresses the deficiencies of the existing technology and its main purpose is to provide an automotive liquid cooling plate. This solves the problem that when using a traditional flat-plate automotive liquid cooling plate to cool the domain control motherboard, the horizontal contact surface between the flat-plate automotive liquid cooling plate and the heat source sometimes results in an incompatible fit between the liquid cooling plate and the automotive heat source, thus affecting the heat dissipation effect.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: an automotive liquid cooling plate, comprising a shell and a heat dissipation cavity recessed from the upper end of the shell to the lower end of the shell, the heat dissipation cavity being divided into a first cavity and a second cavity arranged symmetrically, and a third cavity connecting the first cavity and the second cavity; the bottom wall of the third cavity is provided with a recessed portion, and both the third cavity and the recessed portion are provided with a heat dissipation guiding portion.

[0007] Furthermore, the bottom surface of the third cavity is provided with multiple protrusions surrounding the bottom surface of the recess, with the bottom surfaces of the protrusions and the bottom surface of the recess being parallel.

[0008] Furthermore, the heat dissipation section has multiple sections, and the multiple heat dissipation sections are arranged in an adaptive array within the third cavity and the recess.

[0009] Furthermore, the first cavity, the second cavity, and the third cavity are interconnected and form a U-shape, and the first cavity and the second cavity are respectively connected to an inlet and an outlet located on one side wall of the shell.

[0010] Furthermore, the recessed portion is located in the middle section of the U-shaped third cavity, and the recessed portion is adjacent to the first cavity.

[0011] Furthermore, the bottom ends of the first cavity and the second cavity are inclined and are divided into a first inclined surface, a second inclined surface and a third inclined surface that gradually slope downwards, with the first inclined surface connected to the third cavity.

[0012] Furthermore, the third inclined surface is divided into a first connecting surface located in the first cavity and a second connecting surface located in the second cavity. The first connecting surface extends to the bottom of the water outlet end, and the second connecting surface extends to the bottom of the water inlet end.

[0013] Furthermore, the heat dissipation section is columnar, and the upper end of the heat dissipation section inside the recess is parallel to the upper end of the heat dissipation section inside the third cavity.

[0014] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution, by setting the recessed part on the heat dissipation cavity, when the shell is installed on the domain control motherboard, the bottom surface of the recessed part can be in contact with the heat source on the domain control motherboard, thereby increasing the cooling effect of the automotive liquid cooling plate on the domain control motherboard and preventing the electrical components on the domain control motherboard from being damaged due to overheating.

[0015] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0016] Figure 1 This is a perspective view of Embodiment 1 of this utility model.

[0017] Figure 2 This is a back view of Embodiment 1 of this utility model.

[0018] Figure 3 This is a plan view of Embodiment 1 of this utility model.

[0019] Figure 4 This is a side top view of Embodiment 1 of this utility model.

[0020] Explanation of reference numerals in the attached diagram:

[0021] Casing 10;

[0022] Heat dissipation cavity 20, first cavity 21, second cavity 22, third cavity 23, protrusion 231, recess 24, heat dissipation guiding part 25, water inlet 26, water outlet 27;

[0023] First inclined surface A1, second inclined surface A2, third inclined surface A3, first connecting surface A31, second connecting surface A32. Detailed Implementation

[0024] Please refer to Figure 1-4 As shown, this illustrates the specific structure of a preferred first embodiment of the present invention, which is an automotive liquid cooling plate. It includes a housing 10 and a heat dissipation cavity 20 recessed from the upper end of the housing 10 to its lower end. The heat dissipation cavity 20 is divided into a first cavity 21 and a second cavity 22 symmetrically arranged, and a third cavity 23 connecting the first cavity 21 and the second cavity 22. The bottom wall of the third cavity 23 has a recessed portion 24, and both the third cavity 23 and the recessed portion 24 have heat dissipation guiding portions 25. By providing the recessed portion 24 on the heat dissipation cavity 20, when the housing 10 is mounted on the domain control motherboard, the bottom surface of the recessed portion 24 can fit against the heat source on the domain control motherboard, thereby increasing the cooling effect of the automotive liquid cooling plate on the domain control motherboard and preventing damage to electrical components on the domain control motherboard due to overheating.

[0025] Specifically, when cooling the domain controller motherboard, the liquid can flow in the heat dissipation cavity 20, carrying away the heat conducted to the housing 10. If the liquid enters from the first cavity 21 and exits through the third cavity 23 into the second cavity 22, the concave portion 24 in the third cavity 23 contacts the main heat source of the domain controller motherboard. The flow rate of the liquid in the third cavity 23 is adjusted by the heat dissipation guide portion 25 in the third cavity 23 to keep it as constant as possible, and the flow direction of the liquid is adjusted to increase the contact area between the liquid and the inner wall of the third cavity 23, thereby enhancing the heat dissipation effect on the domain controller motherboard.

[0026] For example, the bottom surface of the third cavity 23 is provided with a plurality of protrusions 231 arranged around the bottom surface of the recess 24, and the bottom surface of the protrusions 231 is parallel to the bottom surface of the recess 24. The plurality of protrusions 231 can be integrally formed with the third cavity 23, and through the cooperation of the protrusions 231 and the recess 24, the protrusions 231 and the recess 24 can come into contact with heat sources that generate different amounts of heat, so as to perform targeted heat dissipation. In addition, since the electrical components on the domain control motherboard are of different sizes, the protrusions 231 and the recess 24 can contact shorter electrical components, while the gap 1 between the protrusions 231 and the recess 24 can accommodate some taller electrical components, thereby further enhancing the heat dissipation effect of the automotive liquid cooling plate on the domain control motherboard.

[0027] For example, the heat dissipation section 25 has multiple portions, and the multiple heat dissipation sections 25 are adaptively arranged in an array within the third cavity 23 and the recess 24. Figure 3 As shown, the horizontal, left-side, right-side, and vertical arrangements of the multiple heat dissipation sections 25 are symmetrical, which controls the flow direction and flow rate of the liquid entering the third cavity 23, thereby enhancing the heat dissipation effect on the domain control motherboard.

[0028] For example, the first cavity 21, the second cavity 22, and the third cavity 23 are interconnected and form a U-shape. The first cavity 21 and the second cavity 22 are respectively connected to a water inlet 26 and a water outlet 27 located on one side wall of the housing 10. The U-shaped heat dissipation cavity 20 can reduce the space occupied by the heat dissipation cavity 20 and control the flow direction of the liquid entering the heat dissipation cavity, so that the liquid contacts the inner wall of the heat dissipation cavity as much as possible, thereby improving the heat dissipation effect.

[0029] For example, the recess 24 is located in the middle of the U-shaped third cavity 23, and the recess 24 is adjacent to the first cavity 21. Since the first cavity 21 is connected to the water inlet 26, setting the recess 24 close to the first cavity 21 can improve the heat dissipation effect of the recess 24 on specific locations of the domain controller motherboard.

[0030] For example, the bottom ends of the first cavity 21 and the second cavity 22 are inclined and divided into a first inclined surface A1, a second inclined surface A2, and a third inclined surface A3 that gradually slope downwards. The first inclined surface A1 is connected to the third cavity 23. The inclination of the bottom wall of the first cavity 21 reduces the flow velocity of the water entering the third cavity 23 when the liquid enters the first cavity 21 through the inlet 26, so that the liquid and the inner wall of the third cavity 23 can make more sufficient contact and remove heat. The second cavity 22 corresponds to the outlet 27, which allows the liquid entering the second cavity 22 through the third cavity 23 to be discharged more quickly, thereby further improving the heat dissipation effect.

[0031] The third inclined surface A3 is divided into a first connecting surface A31 located in the first cavity 21 and a second connecting surface A32 located in the second cavity 22. The first connecting surface A31 extends to the bottom of the water outlet 26, and the second connecting surface A32 extends to the bottom of the water inlet 27.

[0032] The heat dissipation section 25 is columnar, and the upper end of the heat dissipation section 25 in the recessed portion 24 is parallel to the upper end of the heat dissipation section 25 in the third cavity 23.

[0033] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. An automotive liquid cooling plate, comprising a housing (10) and a heat dissipation cavity (20) recessed from the upper end of the housing (10) to the lower end of the housing (10), characterized in that: The heat dissipation cavity (20) is divided into a first cavity (21) and a second cavity (22) arranged symmetrically, and a third cavity (23) connecting the first cavity (21) and the second cavity (22); the bottom wall of the third cavity (23) is provided with a recessed part (24), and the inner cavity of the third cavity (23) and the recessed part (24) are both provided with a heat dissipation part (25).

2. The automotive liquid cooling plate according to claim 1, characterized in that: The bottom surface of the third cavity (23) is provided with a plurality of protrusions (231) arranged around the bottom surface of the recess (24), and the bottom surface of the protrusions (231) is parallel to the bottom surface of the recess (24).

3. The automotive liquid cooling plate according to claim 1, characterized in that: The heat dissipation section (25) has multiple sections, and the multiple heat dissipation sections (25) are arranged in an adaptive array within the third cavity (23) and the recess (24).

4. The automotive liquid cooling plate according to claim 1, characterized in that: The first cavity (21), the second cavity (22) and the third cavity (23) are interconnected and form a U-shape. The first cavity (21) and the second cavity (22) are respectively connected to an inlet (26) and an outlet (27) located on one side wall of the shell (10).

5. The automotive liquid cooling plate according to claim 4, characterized in that: The recess (24) is located in the middle of the U-shaped third cavity (23), and the recess (24) is adjacent to the first cavity (21).

6. The automotive liquid cooling plate according to claim 4, characterized in that: The bottom ends of the first cavity (21) and the second cavity (22) are inclined and are divided into a first inclined surface (A1), a second inclined surface (A2) and a third inclined surface (A3) that gradually slope downward. The first inclined surface (A1) is connected to the third cavity (23).

7. The automotive liquid cooling plate according to claim 6, characterized in that: The third inclined surface (A3) is divided into a first connecting surface (A31) located in the first cavity (21) and a second connecting surface (A32) located in the second cavity (22). The first connecting surface (A31) extends to the bottom of the water outlet (26), and the second connecting surface (A32) extends to the bottom of the water inlet (27).

8. The automotive liquid cooling plate according to claim 1, characterized in that: The heat dissipation section (25) is columnar, and the upper end of the heat dissipation section (25) in the recessed part (24) is parallel to the upper end of the heat dissipation section (25) in the third cavity (23).

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