Piezoelectric ceramic transformer package for low temperature reflow

Abstract

The utility model discloses piezoelectric ceramic transformer package body that can be used for low temperature reflow soldering, it includes piezoelectric ceramic transformer body, piezoelectric ceramic transformer body sets up in package body, and package body has first encapsulation department and sets up in the encapsulation cover of first encapsulation department, and first encapsulation department is provided with the output pole, negative pole, input pole of piezoelectric ceramic transformer body electric connection, and package body is provided with exhaust hole. Due to the emergence of package body, the whole piezoelectric ceramic transformer package body can use low temperature reflow soldering technology to install on the circuit board quickly, and the design of exhaust hole can make the air in the package body effectively exhaust under the condition of temperature rise, avoid the air heating and make the package body internal pressure rise and damage piezoelectric ceramic transformer package body.

Description

Technical Field

[0001] This utility model relates to the field of negative ion technology, and in particular to a piezoelectric ceramic transformer package that can be used for low-temperature reflow soldering. Background Technology

[0002] Piezoelectric ceramic transformers are typically used in negative ion products. Existing piezoelectric ceramic transformers usually employ open-type packaging. Because piezoelectric transformers are unstable at high temperatures, open packaging prevents the use of techniques like reflow soldering, forcing the use of inefficient methods such as manual soldering. This necessitates numerous additional processes in later manufacturing, such as adhesive application, resulting in higher processing costs and longer labor times.

[0003] To meet the requirements of low-temperature reflow soldering, the piezoelectric transformer needs to be completely repackaged to facilitate subsequent use and improve the efficiency of piezoelectric transformer installation. Utility Model Content

[0004] The present invention aims to solve the above-mentioned technical problems and provide a piezoelectric ceramic transformer package that can be used for low-temperature reflow soldering. It can be installed on the corresponding circuit board using low-temperature reflow soldering technology to avoid the inefficiency and unstable quality of manual installation.

[0005] To solve the above-mentioned technical problems, the present invention provides a piezoelectric ceramic transformer package that can be used for low-temperature reflow soldering. The package includes a piezoelectric ceramic transformer body, which is disposed in the package. The package has a first encapsulation part and an encapsulation cover disposed in the first encapsulation part. The first encapsulation part is provided with an output pole, a negative pole, and an input pole that are electrically connected to the piezoelectric ceramic transformer body. The package is provided with an exhaust hole.

[0006] It is not difficult to see from the above that the presence of the package allows the entire piezoelectric ceramic transformer package to be quickly installed onto the circuit board using low-temperature reflow soldering technology. The design of the vent hole allows the air inside the package to be effectively discharged when the temperature rises, preventing the air from being heated and causing the internal pressure of the package to rise, which could damage the piezoelectric ceramic transformer package.

[0007] Furthermore, the output and input poles are symmetrically arranged at both ends of the first package, which can effectively improve the recognition efficiency.

[0008] Furthermore, the first encapsulation portion has a bottom and a circumferential side enclosure disposed at the bottom. At both ends of the first long side of the circumferential side enclosure are a first short side and a second short side perpendicular to it. The first short side and the second short side are connected to a second irregularly shaped long side. The second irregularly shaped long side has a first U-shaped recess and a second U-shaped recess. The first short side and the second short side are provided with L-shaped recessed grooves, and the second irregularly shaped long side is also provided with L-shaped recessed grooves. This encapsulation uses a quasi-regular cube to encapsulate the piezoelectric ceramic transformer, effectively meeting the requirement of internal piezoelectric ceramic transformers without significantly increasing the overall product size.

[0009] Furthermore, a mounting platform is provided near the upper edge of the side enclosure. This platform design allows the package cover to be located here, making the package cover installation more stable. At the same time, the package cover can also allow the lead wires to be pressed at this point, improving the stability of the lead wire installation.

[0010] Furthermore, the mounting base has multiple triangular mounting portions on the second irregular long side. The triangular mounting portions can indicate the layout position of the lead wire and increase the fixed area of ​​the lead wire at this location, preventing problems such as lead wire detachment.

[0011] Furthermore, the package includes a stabilizer that suspends the piezoelectric ceramic transformer within the package's internal space. This stabilizer allows the piezoelectric ceramic transformer plates to be stably mounted within the package without direct contact with the package itself, preventing external heat from being conducted to the transformer plates and thus affecting its performance.

[0012] Furthermore, the vent is located at the bottom of the package. This vent allows the air inside the piezoelectric ceramic transformer to be discharged in time after being heated, avoiding damage to the device due to thermal expansion of the air inside the package, and effectively meeting the requirements of low-temperature reflow soldering.

[0013] The present invention has the following beneficial effects: After the piezoelectric ceramic transformer is encapsulated by the encapsulation body, it is convenient to use mechanized operation and low temperature reflow soldering technology to install it on the circuit board. This not only greatly improves the production efficiency during mass production, but also greatly improves the quality stability and reliability of the product when installed on the circuit board. Attached Figure Description

[0014] Figure 1 This is a front view of a piezoelectric ceramic transformer package that can be used for low-temperature reflow soldering.

[0015] Figure 2 This is a top view of a piezoelectric ceramic transformer package that can be used for low-temperature reflow soldering.

[0016] Figure 3 This is a bottom view of a piezoelectric ceramic transformer package that can be used for low-temperature reflow soldering.

[0017] Figure 4 This is an exploded view of the package of a piezoelectric ceramic transformer that can be used for low-temperature reflow soldering.

[0018] Figure 5 This is a schematic diagram of the internal structure of the first package.

[0019] Figure 6 This is a schematic diagram of the bottom structure of the first package. Detailed Implementation

[0020] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0021] The first embodiment of this utility model provides a piezoelectric ceramic transformer package that can be used for low-temperature reflow soldering. See [link to relevant documentation]. Figure 1-3 As shown, it includes a piezoelectric ceramic transformer body, which is housed within a package 1. This piezoelectric ceramic transformer package, consisting of the transformer body and the package, is suitable for low-temperature reflow soldering and can well meet the automation requirements of PCB assembly plants. Since this package has only three exposed electrodes, during low-temperature reflow soldering, only the three exposed electrodes need to be electrically connected to the corresponding points on the PCB. The package has a first package portion 1-1 and a package cover 1-2 located on the first package portion. The piezoelectric ceramic transformer is housed within the internal space formed by the first package portion and the package cover. The first package portion has an output electrode 2, an input electrode 3, and a negative electrode 4 electrically connected to the transformer body. The output and input electrodes are symmetrical at both ends of the first package portion. The package has an exhaust port 5, which allows the air inside the package to release pressure due to thermal expansion.

[0022] See Figure 4As shown, the package is molded using a mold, and the material includes, but is not limited to, black PPS. In this embodiment, the package has a first packaging part 1-1 and a packaging cover 1-2 installed on the first packaging part. The overall shape of the package can be selected as needed. This embodiment takes a rectangular cross-section as an example. The first packaging part 1-1 has a rectangular bottom 1-1a. Circumferential side protection parts are vertically distributed along the circumferential edge of the bottom. Since the bottom is rectangular, the number of circumferential side protection parts is four, which are respectively defined as the first long side 1-1b, the second irregular long side 1-1c, the first short side 1-1d, and the second short side 1-1e. The two ends of the first long side of the circumferential side protection part are provided with first short sides perpendicular to it. The first short side and the second short side constitute the two closed ends of the package in the direction of the short side. The first short side and the second short side are connected to the second irregular long side. The first long side and the second irregular long side constitute the two closed ends of the package in the direction of the long side. The second irregular long side has a first U-shaped concave portion 1-1f and a second U-shaped concave portion 1-1g. The length of the first U-shaped concave portion is greater than that of the second U-shaped concave portion. The first U-shaped concave portion is distributed close to the second short side, and the second U-shaped concave portion is distributed close to the first short side. The first short side and the second short side are provided with L-shaped embedded grooves 1-1h. The second irregular long side is provided with L-shaped embedded grooves 1-1h. The embedded grooves are used to configure electrode plates. The electrode plates are electrically connected to the corresponding electrodes of the piezoelectric ceramic transformer.

[0023] It is worth mentioning that a mounting platform 1-1i is provided near the upper edge of the side enclosure. This mounting platform allows the encapsulation cover to be installed here, and the surface of the encapsulation cover is flush with the upper surface of the side enclosure. The mounting platform has multiple triangular mounting portions on the second irregular long side, see [reference]. Figure 5 In this embodiment, three triangular embedded parts 1-1j are provided. The output lead, input lead, and negative lead of the piezoelectric ceramic transformer are fixed here by soldering through conductive materials such as copper wire. The pressure fitting method with the encapsulation cover can ensure the stability and reliability of the electrical connection structure.

[0024] Combination Figure 5 The package contains a stabilizer that suspends the piezoelectric ceramic transformer within its internal space. This stabilizer can be made of insulating resin or adhesive, and two stabilizers are distributed along the width of the first package, each 2-3 mm wide and 1-2 mm high. The stabilizers can be arranged in a U-shape within the first package, ensuring the piezoelectric ceramic transformer does not contact the package and effectively preventing heat conduction. Figure 6 As can be seen, the vent 5 is located at the bottom of the package, for example, in pairs distributed at the bottom and close to the second irregular long side. In this embodiment, there are three triangular inserts, and the vents are distributed close to these three front sections. The form of the vents includes, but is not limited to, round holes.

[0025] Those skilled in the art will understand that the above embodiments are specific examples of implementing the present invention, and in practical applications, various changes can be made to them in form and detail without departing from the spirit and scope of the present invention.

Claims

1. A piezoelectric ceramic transformer package for low-temperature reflow soldering, comprising a piezoelectric ceramic transformer body, characterized in that, The piezoelectric ceramic transformer body is disposed in an encapsulation body, the encapsulation body has a first encapsulation part and an encapsulation cover disposed in the first encapsulation part, the first encapsulation part is provided with an output pole, a negative pole and an input pole electrically connected to the piezoelectric ceramic transformer body, and the encapsulation body is provided with an exhaust hole.

2. The piezoelectric ceramic transformer package for low-temperature reflow soldering according to claim 1, characterized in that, The output and input terminals are symmetrically arranged at both ends of the first package.

3. The piezoelectric ceramic transformer package for low-temperature reflow soldering according to claim 1, characterized in that, The first encapsulation part has a bottom and a circumferential side enclosure provided on the bottom. The two ends of the first long side of the circumferential side enclosure are provided with a first short side and a second short side perpendicular to it. The first short side and the second short side are connected to the second irregular long side. The second irregular long side has a first U-shaped concave part and a second U-shaped concave part. The first short side and the second short side are provided with L-shaped inset grooves. The second irregular long side is provided with L-shaped inset grooves.

4. The piezoelectric ceramic transformer package for low-temperature reflow soldering according to claim 3, characterized in that, The side enclosure is provided with a mounting plate near the upper edge.

5. The piezoelectric ceramic transformer package for low-temperature reflow soldering according to claim 4, characterized in that, The mounting base has multiple triangular mounting base sections on the long side of the second irregular shape.

6. The piezoelectric ceramic transformer package for low-temperature reflow soldering according to claim 1, characterized in that, The package contains a stabilizer that suspends the piezoelectric ceramic transformer within the internal space of the package.

7. The piezoelectric ceramic transformer package for low-temperature reflow soldering according to claim 1, characterized in that, The vent is located at the bottom of the package.

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