Wafer ring replacement apparatus
The automatic cutting of the blue film by the disk and base drive mechanism solves the problems of inconsistent positioning and adhesion caused by manual replacement of wafer rings, realizes efficient and accurate wafer ring replacement, and improves product consistency and work efficiency.
CN224356601UActive Publication Date: 2026-06-12SUZHOU GOODARK ELECTRONICS CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU GOODARK ELECTRONICS CO LTD
- Filing Date
- 2025-05-22
- Publication Date
- 2026-06-12
Smart Images
Figure CN224356601U_ABST
Abstract
The application relates to a wafer ring replacement device, which comprises a rack, an upper end pressing unit, a lower end pressing unit and a cutting unit, a table top is fixedly arranged on the rack, a carrier is fixedly arranged on the table top, the upper end pressing unit and the lower end pressing unit are installed on the table top, the upper end pressing unit comprises a disc driving mechanism and a disc connected to the disc driving mechanism, the lower end pressing unit comprises a base driving mechanism and a base connected to the base driving mechanism, the base is located on the inner side of the carrier, the carrier is used for placing a wafer, the wafer comprises a wafer, a blue film and a metal ring, the blue film connects the wafer and the metal ring, the cutting unit is installed on the upper end pressing unit, and the cutting unit is synchronously lifted and descended with the disc. The device realizes automatic cutting of the blue film and reduces the risk of material damage in the operation process.
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