LED semiconductor plastic sealing mold capable of preventing heat dissipation fin from being deviated

Abstract

The utility model discloses a kind of LED semiconductor plastic encapsulation moulds capable of preventing fin deviation, its technical solution main point is, belong to LED semiconductor plastic encapsulation mould field, including body mechanism, the inner end of body mechanism is equipped with positioning mechanism, the bottom of body mechanism is equipped with auxiliary mechanism, the positioning mechanism includes fin body, the both sides of fin body are movably connected with auxiliary ring, the upper of auxiliary ring is movably connected with inserting rod;By being set with the connecting inserting rod between structure, then produce mobile insertion slot inner end, inserting rod then let moving block move drive positioning rod and chuck and be positioned in the outer end of fin body, i.

Description

Technical Field

[0001] This utility model relates to the field of LED semiconductor molding compound, and in particular to an LED semiconductor molding compound that can prevent heat sink misalignment. Background Technology

[0002] LED semiconductor molding molds are one of the commonly used pieces of equipment in LED semiconductor processing and manufacturing. The main function of LED semiconductors is to encapsulate LED chips in plastic shells to protect the chips and ensure their normal operation. Therefore, the use of LED semiconductor molding molds is very important.

[0003] Existing LED semiconductor molding compounds have certain drawbacks. First, the use of heat sinks is crucial in the use of LED semiconductor molding compounds, but heat sinks are prone to misalignment during the production process, which reduces the effectiveness of the LED semiconductor molding compound. To address this, we propose an LED semiconductor molding compound that can prevent heat sink misalignment. Utility Model Content

[0004] To overcome the shortcomings of existing technologies, the purpose of this utility model is to provide an LED semiconductor molding die that can prevent heat sink misalignment. By setting a push rod and a moving block, when the device performs molding, the mold structures are connected. As the structures connect, the push rod moves, inserting into the inner end of the slot. The front end of the push rod contacts the moving block, which moves and presses under force. The moving block then engages and positions the positioning rod and the locking head at the outer end of the heat sink body, thus achieving precise positioning of the heat sink body. This effectively prevents misalignment during use, allowing the mold to achieve precise positioning and ensuring that the heat sink body can contact the LED chip to the maximum extent, thereby effectively conducting heat, reducing the chip's operating temperature, and improving the performance of the LED semiconductor molding die.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0006] An LED semiconductor molding compound mold for preventing heat sink misalignment includes a main body mechanism, a positioning mechanism installed at the inner end of the main body mechanism, and an auxiliary mechanism installed at the bottom end of the main body mechanism.

[0007] The positioning mechanism includes a heat sink body, with auxiliary rings movably connected to both sides of the heat sink body. A plug rod is movably connected above the auxiliary rings. The plug rods are symmetrically distributed at the bottom of the body mechanism. A slot is provided at the inner end of the body mechanism. The slot has an L-shaped structure. A moving block is slidably connected to the inner end of the slot. A reset ring is sleeved on the outer end of the moving block.

[0008] The use of this LED semiconductor encapsulation mold can be improved by installing insert rods and moving blocks.

[0009] Furthermore, a positioning rod is movably connected to the front end of the movable block, and an elastic ring is sleeved on the outer end of the positioning rod.

[0010] By installing positioning rods and elastic rings, the anti-displacement structure of this mold can be easily adjusted and used.

[0011] Furthermore, a locking head is installed at the front end of the positioning rod, and the locking head is slidably connected to the inner end of the auxiliary ring.

[0012] By installing the clip, the heatsink body can be made to operate stably.

[0013] Furthermore, a guide groove is provided at the inner end of the auxiliary ring, and the guide groove is slidably connected to the positioning rod.

[0014] By installing guide grooves, the moving positioning rod and elastic ring can be restricted and guided, preventing them from shifting during positioning adjustments.

[0015] Furthermore, the main body mechanism includes a base, a mold cavity is installed at the inner end of the base, an upper mold is movably connected above the mold cavity, and a support frame is movably connected to the outer side of the upper mold.

[0016] By installing a support frame, the hydraulic cylinder can drive the upper mold to adjust its position more stably.

[0017] Furthermore, a buffer frame is movably connected to the lower part of the support frame, a hydraulic cylinder is installed at the top of the buffer frame, and multiple buffer rods are slidably connected to the inner end of the buffer frame.

[0018] By installing a buffer frame and buffer rod, the stability of the LED semiconductor molding compound can be improved during operation.

[0019] Furthermore, the bottom end of the upper mold is equipped with multiple calibration rods, the inner end of the base is provided with multiple connecting grooves, the inner end of the connecting grooves is equipped with multiple auxiliary rods, and the inner end of the auxiliary rods is slidably connected with a snap-fit ​​connector.

[0020] The effectiveness of the mold can be further improved by installing auxiliary rods and clamping connectors.

[0021] Furthermore, a connecting component is installed at the outer end of the card connector, and the connecting component is slidably connected to the inner end of the auxiliary rod.

[0022] Installing the connecting components makes snap-fit ​​operations on the connectors more convenient.

[0023] In summary, this utility model has the following beneficial effects:

[0024] 1. By setting up insert rods and moving blocks, when the device performs plastic encapsulation, the mold structures are connected. As the structures are connected, the insert rods move and insert into the inner end of the slot. The front end of the insert rod contacts the moving block, which moves and presses under force. The moving block causes the positioning rod and the locking head to engage and position on the outer end of the heat sink body, thus achieving the positioning of the heat sink body. This effectively prevents the heat sink body from deviating during use, allowing the mold to achieve precise positioning and ensuring that the heat sink body can contact the LED chip to the maximum extent, thereby effectively conducting heat, reducing the chip's operating temperature, and improving the performance of the LED semiconductor plastic encapsulation mold.

[0025] 2. By setting a positioning rod and an elastic ring, the positioning rod can move simultaneously under the pressure of the moving block, and the elastic ring moves simultaneously with the positioning rod. When the mold structure separates, the insert rod moves away from the moving block, and the positioning rod can be reset, making the anti-displacement structure of the mold easy to adjust and use.

[0026] 3. By setting an auxiliary rod and a snap-fit ​​connector, when the mold is being connected and sealed, the calibration rod snaps into the auxiliary rod, and the snap-fit ​​connector snaps into the inner end of the calibration rod. This makes the mold connection and sealing process more stable and prevents displacement of mold components, thus improving molding accuracy and further enhancing the mold's performance. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure in this embodiment;

[0028] Figure 2 This is a structural schematic diagram of the base cross-section in this embodiment;

[0029] Figure 3 This is in this embodiment Figure 2 A magnified structural diagram of the plane at point A in the middle;

[0030] Figure 4 This is in this embodiment Figure 2 A magnified structural diagram of the plane at point B in the middle;

[0031] Figure 5 This is in this embodiment Figure 2 A magnified structural diagram of the plane at point C.

[0032] In the diagram, 1. Main body mechanism; 101. Base; 102. Mold cavity; 103. Upper mold; 104. Support frame; 105. Buffer frame; 106. Hydraulic cylinder; 107. Buffer rod; 2. Positioning mechanism; 201. Heat sink body; 202. Auxiliary ring; 203. Insert rod; 204. Slot; 205. Moving block; 206. Reset ring; 207. Positioning rod; 208. Elastic ring; 209. Clamp head; 210. Guide groove; 3. Auxiliary mechanism; 301. Calibration rod; 302. Connecting groove; 303. Auxiliary rod; 304. Clamp head; 305. Connecting assembly. Detailed Implementation

[0033] The present invention will be further described in detail below with reference to the accompanying drawings.

[0034] Identical parts are indicated by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, while the terms "bottom surface," "top surface," "inner," and "outer" refer to directions toward or away from the geometric center of a specific part, respectively.

[0035] Reference Figure 1-5 As shown, this is a preferred embodiment of the present invention of an LED semiconductor molding die that can prevent heat sink misalignment, including a main body mechanism 1, a positioning mechanism 2 installed at the inner end of the main body mechanism 1, and an auxiliary mechanism 3 installed at the bottom end of the main body mechanism 1.

[0036] The positioning mechanism 2 includes a heat sink body 201. Auxiliary rings 202 are movably connected to both sides of the heat sink body 201. A plug rod 203 is movably connected above the auxiliary rings 202. The plug rods 203 are symmetrically distributed at the bottom of the main body mechanism 1. A slot 204 is opened at the inner end of the main body mechanism 1. The slot 204 has an L-shaped structure. A moving block 205 is slidably connected to the inner end of the slot 204. A reset ring 206 is sleeved on the outer end of the moving block 205.

[0037] Reference Figure 2-4 As shown, the front end of the movable block 205 is further movably connected to a positioning rod 207, and an elastic ring 208 is sleeved on the outer end of the positioning rod 207.

[0038] Reference Figure 4 As shown, further, a locking head 209 is installed at the front end of the positioning rod 207, and the locking head 209 is slidably connected to the inner end of the auxiliary ring 202.

[0039] Reference Figure 2 and Figure 4 As shown, the inner end of the auxiliary ring 202 is provided with a guide groove 210, and the guide groove 210 is slidably connected to the positioning rod 207.

[0040] By having the front end of the mounting rod 203 contact the moving block 205, the moving block 205 moves and presses under the force, causing the positioning rod 207 and the clamping head 209 to engage and position on the outer end of the heat sink body 201, thus achieving the positioning of the heat sink body 201. The positioning rod 207 can move simultaneously under the pressure of the moving block 205, and the elastic ring 208 moves simultaneously with the positioning rod 207. When the mold structure separates, the mounting rod 203 moves away from the moving block 205, and the positioning rod 207 can be reset. The clamping head 209 can form a positioning structure at both ends of the heat sink body 201, effectively preventing the heat sink body 201 from deviating during use. This allows the mold to achieve precise positioning, ensuring that the heat sink body 201 can contact the LED chip to the maximum extent, thereby effectively conducting heat and reducing the chip's operating temperature.

[0041] Reference Figure 1 As shown, the main body mechanism 1 further includes a base 101, a mold cavity 102 is installed at the inner end of the base 101, an upper mold 103 is movably connected above the mold cavity 102, and a support frame 104 is movably connected to the outer side of the upper mold 103.

[0042] Reference Figure 1 As shown, a buffer frame 105 is movably connected to the lower part of the support frame 104, a hydraulic cylinder 106 is installed at the top of the buffer frame 105, and a plurality of buffer rods 107 are slidably connected to the inner end of the buffer frame 105.

[0043] By installing the support frame 104, a support structure can be formed at the outer end of the hydraulic cylinder 106, making the position adjustment of the upper mold 103 more stable. The buffer frame 105 can form a support structure at the outer end of the upper mold 103. When the upper mold 103 moves, the buffer frame 105 slides at the outer end of the buffer rod 107. The buffer rod 107 buffers and protects the moving buffer frame 105, reducing the impact force of the buffer frame 105.

[0044] Reference Figure 2 and Figure 5 As shown, further, a plurality of calibration rods 301 are installed at the bottom end of the upper mold 103, and a plurality of connecting grooves 302 are opened at the inner end of the base 101. A plurality of auxiliary rods 303 are installed at the inner end of the connecting grooves 302, and a snap-fit ​​connector 304 is slidably connected to the inner end of the auxiliary rods 303.

[0045] Reference Figure 5 As shown, the outer end of the snap connector 304 is further equipped with a connecting component 305, which is slidably connected to the inner end of the auxiliary rod 303.

[0046] When the mold is being connected and sealed, the calibration rod 301 engages with the auxiliary rod 303, and the locking connector 304 engages with the inner end of the calibration rod 301. This makes the mold connection and sealing process more stable and prevents displacement of mold components, thus improving molding accuracy. The connecting component 305 forms a support structure on the outside of the locking connector 304, and the connecting component 305 is an adjustable structure, which facilitates position adjustment of the locking connector 304, making the locking operation of the locking connector 304 more convenient.

[0047] Specific implementation process: When the device is in use, the insertion rod 203 adjusts its position as the upper mold 103 moves, causing the insertion rod 203 to move and insert into the inner end of the slot 204. The front end of the insertion rod 203 contacts the moving block 205, which moves and presses under force. The moving block 205 then engages and positions the positioning rod 207 and the locking head 209 at the outer end of the heat sink body 201. Furthermore, during movement, the positioning rod 207 can simultaneously move under the pressure of the moving block 205, springing... The ring 208 moves in conjunction with the positioning rod 207. When the mold structure separates, the insertion rod 203 moves away from the moving block 205, and the positioning rod 207 can be reset. This allows the anti-displacement structure of the mold to be easily adjusted and used, thereby achieving the positioning of the heat sink body 201. This effectively prevents the heat sink body 201 from being displaced during use, and enables the mold to achieve precise positioning. This ensures that the heat sink body 201 can contact the LED chip to the maximum extent, thereby effectively conducting heat and reducing the operating temperature of the chip.

[0048] Furthermore, when adjusting the connection between the molds, the calibration rod 301 engages with the auxiliary rod 303, and the clamping head 304 engages again with the inner end of the calibration rod 301. This makes the mold connection and sealing process more stable and prevents displacement of mold components, thus improving molding accuracy and further enhancing the mold's performance.

[0049] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An LED semiconductor molding compound mold that prevents heat sink misalignment, characterized in that: It includes a main body mechanism (1), a positioning mechanism (2) is installed at the inner end of the main body mechanism (1), and an auxiliary mechanism (3) is installed at the bottom end of the main body mechanism (1); The positioning mechanism (2) includes a heat sink body (201), with auxiliary rings (202) movably connected to both sides of the heat sink body (201). A plug rod (203) is movably connected above the auxiliary rings (202). The plug rods (203) are symmetrically distributed at the bottom of the body mechanism (1). A slot (204) is provided at the inner end of the body mechanism (1). The slot (204) has an L-shaped structure. A moving block (205) is slidably connected to the inner end of the slot (204). A reset ring (206) is sleeved on the outer end of the moving block (205).

2. The LED semiconductor molding compound mold for preventing heat sink misalignment according to claim 1, characterized in that: The front end of the movable block (205) is movably connected to a positioning rod (207), and an elastic ring (208) is sleeved on the outer end of the positioning rod (207).

3. The LED semiconductor molding compound mold for preventing heat sink misalignment according to claim 2, characterized in that: The positioning rod (207) has a locking head (209) installed at its front end, and the locking head (209) is slidably connected to the inner end of the auxiliary ring (202).

4. The LED semiconductor molding compound mold for preventing heat sink misalignment according to claim 3, characterized in that: The inner end of the auxiliary ring (202) is provided with a guide groove (210), and the guide groove (210) is slidably connected to the positioning rod (207).

5. An LED semiconductor molding compound mold for preventing heat sink misalignment according to claim 1, characterized in that: The main body mechanism (1) includes a base (101), a mold cavity (102) is installed at the inner end of the base (101), an upper mold (103) is movably connected above the mold cavity (102), and a support frame (104) is movably connected to the outer side of the upper mold (103).

6. An LED semiconductor molding compound mold for preventing heat sink misalignment according to claim 5, characterized in that: A buffer frame (105) is movably connected to the lower part of the support frame (104). A hydraulic cylinder (106) is installed at the top of the buffer frame (105). Multiple buffer rods (107) are slidably connected to the inner end of the buffer frame (105).

7. An LED semiconductor molding compound mold for preventing heat sink misalignment according to claim 5, characterized in that: The bottom end of the upper mold (103) is equipped with multiple calibration rods (301), the inner end of the base (101) is provided with multiple connecting grooves (302), the inner end of the connecting grooves (302) is equipped with multiple auxiliary rods (303), and the inner end of the auxiliary rods (303) is slidably connected with a snap-fit ​​connector (304).

8. An LED semiconductor molding compound mold for preventing heat sink misalignment according to claim 7, characterized in that: The outer end of the snap-fit ​​connector (304) is equipped with a connecting component (305), which is slidably connected to the inner end of the auxiliary rod (303).

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