A free-space isolator dispensing device

Abstract

The utility model discloses a free space isolator point gum device belongs to free space isolator technical field, include: feeding device, assembly device, handling device, point gum subassembly, wherein, the feeding device is used for placing chip and magnetic ring, the assembly device is used for the assembly of chip and magnetic ring, the handling device includes the first handling subassembly for handling chip and the second handling subassembly for handling magnetic ring, the first handling subassembly can drive the horizontal rotation of chip, the first handling subassembly with the second handling subassembly can handle the chip and magnetic ring on feeding device and assemble to the assembly device, the point gum subassembly sets up at the top of the base and can carry out point gum processing to chip, when the first handling subassembly handles chip to point gum position, the point gum gun will chip, and the point gum gun carries out once point gum after every ninety degrees of rotation of chip, makes the four corners of chip all can point gum.

Description

Technical Field

[0001] This utility model relates to the field of free space isolators, and more specifically, to a free space isolator dispensing device. Background Technology

[0002] A free-space isolator is an optical device primarily used to achieve unidirectional transmission of optical signals. Its basic principle is to use the magneto-optical effect to irreversibly rotate the polarization state of light, thereby blocking the back-propagating optical signal. Free-space isolators have advantages such as high power carrying capacity, high structural adjustability, and applicability to various optical interfaces. They are widely used in high-power laser systems, optical experimental platforms, and precision measurement equipment to prevent reflected light from interfering with or damaging upstream light sources, thereby improving the stability and reliability of the system.

[0003] In the manufacturing process of free space isolators, it is usually necessary to apply adhesive to the four corners of the chip to fix the chip to the magnetic ring structure. However, traditional manufacturing equipment is usually equipped with four fixed dispensing heads, each corresponding to one of the four corners of the chip to complete the dispensing operation. Due to the large number of dispensing heads, not only is the complexity of the equipment structure increased, but the overall manufacturing cost is also significantly increased. Utility Model Content

[0004] The technical problem to be solved by this utility model is that in the manufacturing process of free space isolators, it is usually necessary to apply adhesive to the four corners of the chip to fix the chip to the magnetic ring structure. However, traditional manufacturing equipment is usually equipped with four fixed dispensing heads, which correspond to the four corners of the chip to complete the dispensing operation. Due to the large number of dispensing heads, not only does it increase the complexity of the equipment structure, but it also significantly increases the overall manufacturing cost. In view of the above-mentioned defects of the prior art, a free space isolator dispensing device is provided.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] Constructing a free-space isolator dispensing device includes:

[0007] Base;

[0008] A feeding device for placing chips and magnetic rings;

[0009] An assembly apparatus for assembling chips and magnetic rings;

[0010] A conveying device includes a first conveying component for conveying chips and a second conveying component for conveying magnetic rings. The first conveying component can drive the chips to rotate horizontally. The first conveying component and the second conveying component can convey the chips and magnetic rings on the feeding device to the assembly device for assembly.

[0011] A dispensing assembly is disposed on top of the base.

[0012] Optionally, a mounting frame is provided on the top of the base, and a sliding module is provided on one side of the mounting frame. The sliding module includes a slide rail and an electric slider that is disposed on the slide rail and can reciprocate along the slide rail. The conveying device is connected to the electric slider.

[0013] Optionally, at least two electric sliders are provided, with the first conveying assembly and the second conveying assembly respectively connected to different electric sliders.

[0014] Optionally, the dispensing assembly includes a glue tank and a glue gun, with the glue gun connected to the glue tank via a connecting tube.

[0015] Optionally, the base is provided with a mounting seat on top, the mounting seat is provided with a mounting bracket on top, the mounting bracket is provided with a positioning through hole, and the glue gun is inserted into the positioning through hole for positioning.

[0016] Optionally, a camera device is provided, comprising a first camera and a second camera. The first camera is used to detect the orientation of the chip in the horizontal direction, and the second camera detects the orientation of the chip from bottom to top, thereby determining whether the orientation and tilt angle of the chip need to be corrected.

[0017] Optionally, an ultraviolet curing device is provided, which is mounted on the second transport assembly and is used to cure the adhesive used to bond the chip to the magnetic ring.

[0018] Optionally, the feeding device includes a first feeding tray and a second feeding tray. The top of the first feeding tray is provided with a plurality of first feeding grooves, and a plurality of chips are disposed in the first feeding grooves. The top of the second feeding tray is provided with a plurality of second feeding grooves, and a plurality of magnetic ring assemblies are disposed in the second feeding grooves.

[0019] Optionally, the camera device further includes a third camera assembly and a fourth camera assembly. The third camera assembly is used to capture images of the chip placed on the first feed tray, so that the first transport assembly can accurately transport the chip. The fourth camera assembly is used to capture images of the magnetic ring placed on the second feed tray, so that the second transport assembly can accurately transport the magnetic ring.

[0020] Optionally, a push pin is provided on the first transport assembly. The push pin is used to attract the chip and push it into the magnetic ring. After the chip is pushed into the magnetic ring, the push pin can also drive the chip to rotate so that the adhesive on the chip can fully contact the magnetic ring.

[0021] The beneficial effects of this utility model are as follows:

[0022] This utility model comprises: a feeding device, an assembly device, a conveying device, and a dispensing assembly. The feeding device is used to place chips and magnetic rings; the assembly device is used to assemble the chips and magnetic rings; the conveying device includes a first conveying component for conveying chips and a second conveying component for conveying magnetic rings. The first conveying component can drive the chip to rotate horizontally. The first and second conveying components can convey the chips and magnetic rings from the feeding device to the assembly device for assembly; the dispensing assembly is located on top of the base and can dispense adhesive onto the chips. When the first conveying component conveys the chip to the dispensing position, the dispensing gun dispenses adhesive onto the chip, and the dispensing gun dispenses adhesive once every 90 degrees after the chip rotates, ensuring that adhesive can be dispensed at all four corners of the chip. Through the above technical solution, this application achieves a significant simplification of the equipment structure, replacing multiple fixed dispensing heads with the space reuse of a single dispensing assembly, reducing manufacturing costs and maintenance difficulty. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the utility model will be further described below in conjunction with the accompanying drawings and embodiments. The drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is an overall isometric schematic diagram of an embodiment of this utility model.

[0025] Figure 2 This is another overall isometric schematic diagram of an embodiment of this utility model.

[0026] Figure 3 This is a top view schematic diagram of an embodiment of this utility model.

[0027] Figure 4 This is a front view of an embodiment of the present utility model.

[0028] The attached figures are labeled as follows:

[0029] 100. Base;

[0030] 210. First feeding tray; 211. First feeding groove; 220. Second feeding tray; 221. Second feeding groove;

[0031] 300. Assembly device; 310. Rotating platform; 320. Drive component; 330. Transmission belt;

[0032] 410. First transport assembly; 411. Push needle; 420. Second transport assembly; 500. Dispensing assembly; 510. Glue box; 520. Glue gun; 530. Connecting pipe; 600. Mounting base; 610. Mounting bracket; 700. Mounting frame; 710. Sliding module; 711. Slide rail; 712. Electric slider; 800. Camera device; 810. First camera; 820. Second camera; 830. Third camera assembly; 840. Fourth camera assembly; 900. Ultraviolet curing device. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0034] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0035] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0036] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0037] Examples of embodiments of this utility model Figures 1-4 The diagram illustrates a free-space isolator dispensing device, comprising: a feeding device, an assembly device 300, a conveying device, and a dispensing assembly 500. The feeding device is used to place a chip and a magnetic ring; the assembly device 300 is used to assemble the chip (not shown) and the magnetic ring (not shown); the conveying device includes a first conveying assembly 410 for conveying the chip and a second conveying assembly 420 for conveying the magnetic ring. The first conveying assembly 410 can drive the chip to rotate horizontally. The first conveying assembly 410 and the second conveying assembly 420 can move the feeding device... The chip and magnetic ring are transported to the assembly device 300 for assembly. The dispensing assembly 500 is located on the top of the base 100 and can dispense glue to the chip. When the first transport assembly 410 transports the chip to the dispensing position, the dispensing gun 520 will dispense glue to the chip, and the dispensing gun 520 will dispense glue once after the chip rotates 90 degrees, so that glue can be dispensed at all four corners of the chip. The feeding device refers to the material container that stores and supplies the chip and magnetic ring. Specifically, it can be implemented by a regional material tray, for example, by opening a groove array on the surface of the material tray to position the material. Its function is to provide the raw material basis for the assembly process. The transport device refers to the moving mechanism that realizes the transfer of material position. Specifically, it can be implemented by a combination of slide rail 711 and electric slider 712. Its function is to transport the material on the feeding device to the assembly station in sequence. The dispensing assembly 500 refers to the functional module that performs glue application. Specifically, it can be implemented by glue gun 520 and glue supply pipeline system.

[0038] Specifically, the feeding device stores the chip and the magnetic ring in separate trays. The conveying device moves to the feeding station along the slide rail 711 via the electric slider 712, picks up the material, and then applies glue to the four corners of the chip through the dispensing assembly 500. Subsequently, the chip and the magnetic ring are positioned and assembled on the assembly device 300.

[0039] Compared to existing technologies, traditional devices rely on four fixed dispensing heads to dispense adhesive to chips, resulting in complex equipment structures and high costs. This solution, however, uses a first transport component 410 to transport the chip to the dispensing position. The first transport component 410 then rotates the chip, allowing the dispensing gun 520 to dispense adhesive to all four corners of the chip, effectively reducing the number of dispensing heads. For example, a traditional solution requires four dispensing heads and four sets of adhesive supply lines, while this solution only requires one dispensing component 500, simplifying the piping layout and reducing hardware costs.

[0040] Through the above technical solution, this application achieves a significant simplification of the equipment structure. By reusing the space of a single dispensing assembly 500 to replace multiple fixed dispensing heads, manufacturing costs and maintenance difficulty are reduced. For example, in the same production scenario, the number of dispensing heads is reduced by 75%, and the hardware costs of the supporting glue supply system and drive module are reduced accordingly. In this embodiment, the handling component includes a vacuum nozzle and / or a vacuum clamp. The dispensing assembly 500 includes a glue tank 510 and a glue gun 520, and the glue gun 520 is connected to the glue tank 510 through a connecting pipe 530.

[0041] This application further proposes a base 100 and a mounting frame 700 disposed on the top of the base 100. A sliding module 710 is provided on one side of the mounting frame 700. The sliding module 710 includes a slide rail 711 and an electric slider 712 disposed on the slide rail 711 and capable of reciprocating along the slide rail 711. A conveying device is connected to the electric slider 712.

[0042] At least two electric sliders 712 are provided, and the first conveying component 410 and the second conveying component 420 are respectively connected to different electric sliders 712.

[0043] The base 100 refers to the base of the overall structure of the supporting device, which can be implemented using metal castings or a welded frame structure. Its function is to provide a stable mounting reference for the upper components. The mounting frame 700 refers to the mounting structure set on top of the base 100, which can be implemented using a profile frame or a bent steel plate structure. Its function is to provide assembly for the sliding module 710. The slide rail 711 refers to the structure that provides linear motion guidance for the electric slider 712, which can be implemented using a linear guide rail. Its function is to ensure displacement accuracy through a high-precision guiding path. The electric slider 712 refers to the drive module that moves along the slide rail 711. Its function is to convert rotational motion into linear motion and precisely control the displacement.

[0044] In this embodiment, a mounting base 600 is provided on the top of the base 100, and a mounting bracket 610 is provided on the top of the mounting base 600. The mounting bracket 610 is provided with a positioning through hole (not shown in the figure). The glue gun 520 is inserted into the positioning through hole for positioning. Furthermore, by sequentially providing the mounting base 600 and the mounting bracket 610 on the top of the base 100, and providing a positioning through hole on the mounting bracket 610, the glue gun 520 can be stably inserted into the through hole for positioning, thereby effectively improving the positioning accuracy during the glue dispensing process, avoiding glue gun 520 deviation or vibration causing poor glue dispensing, and improving the consistency and reliability of glue dispensing. At the same time, this structure simplifies the installation and debugging process of the glue gun 520, reduces the difficulty of operation, enhances the assembly efficiency and maintenance convenience of the equipment, and further improves the stability and adaptability of the overall structure.

[0045] In this embodiment, a camera device 800 is included, comprising a first camera 810 and a second camera 820. The first camera 810 is used to detect the chip's posture in the horizontal direction, while the second camera 820 detects the chip's posture from bottom to top to determine whether the chip's orientation and tilt angle need correction. Furthermore, the first camera 810 detects the chip's posture from the horizontal direction to identify rotation, offset, or positional deviation in the horizontal direction, while the second camera 820 detects the chip from bottom to top to obtain the chip's height, angle, and tilt state in the vertical direction. This achieves comprehensive monitoring of the chip's overall posture and determines whether there are deviations in the chip's orientation and tilt angle, and whether correction is needed. After confirming that the chip's state is correct, a glue gun 520 applies glue to the chip to avoid assembly deviations and glue application errors caused by chip tilting or offset, thereby improving assembly quality and the operational stability of automated equipment, reducing rework and defect rates due to poor posture, and further optimizing the overall manufacturing process.

[0046] In this embodiment, an ultraviolet curing device 900 is included. The ultraviolet curing device 900 is mounted on the second transport assembly 420 and is used to cure the adhesive used to bond the chip and the magnetic ring. Furthermore, the ultraviolet curing device 900 is disposed on the second transport assembly 420 and is used to perform ultraviolet curing treatment on the adhesive used to bond the chip and the magnetic ring. The ultraviolet curing device 900 can move with the movement of the second transport assembly 420, realizing the immediate curing of the chip after dispensing and assembly, effectively shortening the curing waiting time and improving the production cycle.

[0047] In this embodiment, the feeding device includes a first feeding tray 210 and a second feeding tray 220. The top of the first feeding tray 210 is provided with a plurality of first feeding grooves 211, each containing a plurality of chips. The top of the second feeding tray 220 is provided with a plurality of second feeding grooves 221, each containing a plurality of magnetic ring assemblies. Further, the feeding device includes a first feeding tray 210 and a second feeding tray 220. The top of the first feeding tray 210 is provided with a plurality of first feeding grooves 211 for positioning and supporting chips. Multiple chips are arranged in an orderly manner in slot 211 for sequential picking by the conveying component; the top of the second feeding tray 220 is provided with multiple second feeding grooves 221 for placing magnetic ring assemblies. Each second feeding groove 221 also holds multiple magnetic ring assemblies, ensuring the continuity and stability of the feeding. By orderly placing the chips and magnetic ring assemblies in different feeding grooves, the standardized storage and efficient picking of materials are achieved, which helps to improve the accuracy of the conveying positioning and the picking and placing efficiency, and reduces the failure of conveying or assembly abnormalities caused by material disorder, misalignment or interference. After the chips and magnetic rings are assembled, they can be put back into the second feeding tray 220.

[0048] In this embodiment, the camera device 800 further includes a third camera assembly 830 and a fourth camera assembly 840. The third camera assembly 830 is used to capture images of the chip placed on the first feed tray 210, enabling the first transport assembly 410 to accurately transport the chip. The fourth camera assembly 840 is used to capture images of the magnetic ring placed on the second feed tray 220, enabling the second transport assembly 420 to properly transport the magnetic ring. The camera device 800 further includes a third camera assembly 830 and a fourth camera assembly 840. The third camera assembly 830 is used to capture images of the chip placed on the first feed tray 210. The chip is image acquired, and by identifying the chip's specific position and posture information, the first handling component 410 is assisted in performing precise positioning and gripping operations. The fourth camera component 840 is used to photograph the magnetic ring located on the second feeding tray 220 to obtain its spatial position and posture information, so as to guide the second handling component 420 to accurately perform handling actions, thereby ensuring that both the chip and the magnetic ring can complete the feeding process with high precision. By introducing visual recognition methods in the feeding stage, the real-time positioning and dynamic calibration of the chip and the magnetic ring can be realized, which can effectively reduce the impact of material offset and rotation error on handling accuracy and improve the stability and automation of the overall handling process.

[0049] In this embodiment, a push pin 411 is provided on the first transport assembly 410. The push pin 411 is used to attract the chip and push it into the magnetic ring. After the chip is pushed into the magnetic ring, the push pin 411 can also drive the chip to rotate so that the adhesive on the chip can fully contact the magnetic ring. Furthermore, the push pin 411 is used to grasp the chip by attraction during the transport process and accurately push it into the magnetic ring at a preset position after the chip is positioned. During the pushing process, the chip is ensured to be embedded into the magnetic ring with the correct direction and force to prevent positional deviation or damage. In addition, the push pin 411 completes the chip pushing... After insertion, it also has a rotation drive function, which can drive the chip to rotate moderately, so that the adhesive on the chip is evenly distributed under the action of rotation and fully contacts the inner wall of the magnetic ring, improving the adhesion and coverage effect and accelerating the initial bonding and forming. In another embodiment, the assembly device 300 includes a rotating platform 310 and a drive component 320. The rotating platform 310 and the drive component 320 are connected by a transmission belt 330. After the chip is dispensed and pushed into the magnetic ring by the pusher pin 411, the drive can drive the rotating platform 310 to drive the magnetic ring to rotate, so that the adhesive and magnetic ring are evenly coated on the chip. The drive component 320 can be a motor.

[0050] Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A free-space isolator dispensing device, characterized in that, include: Base (100); A feeding device for placing chips and magnetic rings; An assembly apparatus (300) for assembling a chip and a magnetic ring; The transport device includes a first transport component (410) for transporting chips and a second transport component (420) for transporting magnetic rings. The first transport component (410) can drive the chip to rotate horizontally. The first transport component (410) and the second transport component (420) can transport the chip and magnetic ring on the feeding device to the assembly device (300) for assembly. A dispensing assembly (500) is disposed on top of the base (100).

2. The free-space isolator dispensing device according to claim 1, characterized in that, The device includes a mounting frame (700) disposed on the top of the base (100), and a sliding module (710) is provided on one side of the mounting frame (700). The sliding module (710) includes a slide rail (711) and an electric slider (712) disposed on the slide rail (711) and capable of reciprocating along the slide rail (711). The conveying device is connected to the electric slider (712).

3. The free-space isolator dispensing device according to claim 2, characterized in that, At least two electric sliders (712) are provided, and the first conveying assembly (410) and the second conveying assembly (420) are respectively connected to different electric sliders (712).

4. The free-space isolator dispensing device according to claim 1, characterized in that, The dispensing assembly (500) includes a glue tank (510) and a glue gun (520), wherein the glue gun (520) is connected to the glue tank (510) via a connecting pipe (530).

5. The free-space isolator dispensing device according to claim 4, characterized in that, The base (100) has a mounting seat (600) on its top, and a mounting bracket (610) is provided on the top of the mounting seat (600). The mounting bracket (610) has a positioning through hole, and the glue gun (520) is inserted into the positioning through hole for positioning.

6. The free-space isolator dispensing device according to claim 1, characterized in that, The camera device (800) includes a first camera (810) and a second camera (820). The first camera (810) is used to detect the orientation of the chip in the horizontal direction, and the second camera (820) detects the orientation of the chip from bottom to top, thereby determining whether the orientation and tilt angle of the chip need to be corrected.

7. The free-space isolator dispensing device according to claim 1, characterized in that, Includes a UV curing device (900), which is mounted on a second transport assembly (420) and is used to cure the adhesive that bonds the chip to the magnetic ring.

8. The free-space isolator dispensing device according to claim 1, characterized in that, The feeding device includes a first feeding tray (210) and a second feeding tray (220). The top of the first feeding tray (210) is provided with a plurality of first feeding grooves (211), and a plurality of chips are provided in the first feeding grooves (211). The top of the second feeding tray (220) is provided with a plurality of second feeding grooves (221), and a plurality of magnetic ring assemblies are provided in the second feeding grooves (221).

9. The free-space isolator dispensing device according to claim 6, characterized in that, The camera device (800) further includes a third camera assembly (830) and a fourth camera assembly (840). The third camera assembly (830) is used to photograph the chip placed on the first feed tray (210) so that the first transport assembly (410) can accurately transport the chip. The fourth camera assembly (840) is used to photograph the magnetic ring placed on the second feed tray (220) so that the second transport assembly (420) can properly transport the magnetic ring.

10. The free-space isolator dispensing device according to claim 6, characterized in that, The device includes a push pin (411) disposed on the first transport assembly (410). The push pin (411) is used to adsorb the chip and push it into the magnetic ring. After the chip is pushed into the magnetic ring, the push pin (411) can also drive the chip to rotate so that the adhesive on the chip can fully contact the magnetic ring.

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