SMT patch high-speed dispensing device
By combining a dual-axis moving mechanism, a rotating mechanism, and a UV lamp assembly, the problems of low efficiency and poor precision in traditional dispensing equipment are solved, enabling efficient and precise dispensing and curing of electronic components, and improving the placement accuracy and safety of circuit boards.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUAGUAN TECH (HEYUAN) CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-06-16
AI Technical Summary
In the existing technology, traditional dispensing equipment has low operating efficiency and is prone to causing electronic components to shift on the circuit board, affecting the placement accuracy.
The system employs a combination of a dual-axis moving mechanism, a rotating mechanism, and a UV lamp assembly. Electronic components are adsorbed by a vacuum suction plate, and after being applied to the circuit board, they are flipped and fixed in place. Combined with photoelectric sensors to ensure accurate positioning and UV lamps to quickly cure the adhesive, it achieves efficient dispensing and precise positioning.
It improves dispensing efficiency and circuit board mounting accuracy, prevents positional deviation when the adhesive is not cured, and ensures equipment operation safety and processing efficiency.
Smart Images
Figure CN224358770U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of dispensing devices, and more particularly to a high-speed dispensing device for SMT assembly. Background Technology
[0002] In SMT (Surface Mount Technology) assembly, a dispensing device is a device that applies a quantitative amount of liquid adhesive material to a specific target to achieve bonding and fixation between electronic components and circuit boards.
[0003] In the existing technology, traditional dispensing equipment uses a sequence of first mounting the component and then dispensing the adhesive when dispensing adhesive to electronic components. This is not only inefficient, but also prone to displacement of the component position due to the adhesive not curing in time, thus affecting the placement accuracy of the circuit board.
[0004] Therefore, existing technologies have shortcomings and need to be improved. Utility Model Content
[0005] The technical problem to be solved by this utility model is to provide a high-speed dispensing device for SMT placement that has high operating efficiency and effectively improves placement accuracy.
[0006] To achieve this objective, the present invention adopts the following technical solution: a high-speed SMT component dispensing device, comprising a base, a support frame, a dual-axis moving mechanism, a dispensing assembly, a lifting mechanism, a rotating mechanism, a vacuum suction plate, and a positioning fixture;
[0007] The positioning fixture is mounted on the machine base, and the positioning fixture is provided with a receiving groove for fixing the circuit board to be glued.
[0008] The lifting mechanism is mounted on the base at the side end of the positioning fixture. The movable end of the lifting mechanism is connected to the lifting plate. The lifting mechanism is used to drive the lifting plate to move up and down in the vertical direction.
[0009] The rotating mechanism is mounted on the lifting plate, and the vacuum suction plate is mounted on the rotating mechanism. The rotating mechanism is used to flip and adjust the angle of the vacuum suction plate. The vacuum suction plate is provided with a plurality of suction holes, which are used to adsorb and fix electronic components that are attached to the circuit board.
[0010] The support frame is mounted on the base, and the dual-axis moving mechanism is mounted on the support frame. Its movable end is connected to the dispensing assembly. The dual-axis moving mechanism is used to adjust the position of the dispensing assembly, and the dispensing assembly is used to dispense adhesive onto the surface of electronic components on the vacuum suction plate.
[0011] The SMT high-speed dispensing device using the above technical solution also includes a UV lamp assembly, which is located on the side of the positioning fixture and is used to cure electronic components mounted on the circuit board.
[0012] The SMT high-speed dispensing device using the above technical solution also includes a photoelectric sensor. The positioning fixture has an inner groove, and the photoelectric sensor is located in the inner groove. The photoelectric sensor is used to sense whether the circuit board is installed in place.
[0013] Using the above technical solution, in the SMT high-speed dispensing device, the rotating mechanism includes a servo motor, a bearing housing, and a rotating carrier plate;
[0014] Two bearing seats are respectively located on both sides of the lifting plate. The two ends of the rotating carrier plate are rotatably connected to the bearing seats through rotating shafts. The vacuum suction plate is located on the rotating carrier plate. The output shaft of the servo motor is connected to the rotating carrier plate through a coupling.
[0015] Using the above technical solution, in the SMT high-speed dispensing device, the dual-axis moving mechanism includes an X-axis moving module and a Y-axis moving module.
[0016] The X-axis moving module is located on the top of the support frame. The movable end of the X-axis moving module is connected to the Y-axis moving module, and the movable end of the Y-axis moving module is connected to the dispensing assembly.
[0017] Using the above technical solution, in the SMT high-speed dispensing device, the dispensing component includes a mounting base, a dispensing head, and a glue cartridge;
[0018] The dispensing head and glue cartridge are respectively mounted on the mounting base. The glue cartridge is connected to the dispensing head through a connecting pipe and is used to provide glue to the dispensing head.
[0019] The SMT high-speed dispensing device using the above technical solution further includes a waste glue collection box, which is located on the base and is used to collect waste glue discharged from the dispensing head.
[0020] Compared with the prior art, the present invention has the following beneficial effects:
[0021] The circuit board of this invention is placed in the receiving groove of the positioning fixture. The vacuum suction plate can adsorb electronic components and make the adhesive-receiving surface of the electronic components face upward. The lifting mechanism can drive the vacuum suction plate to the dispensing position. Under the action of the dual-axis moving mechanism and the dispensing assembly, the dispensing operation can be performed on the surface of the electronic components. Then, the rotating mechanism can flip and adjust the vacuum suction plate so that the adhesive surface faces downward. The lifting mechanism then attaches the electronic components to the circuit board to complete the mounting. Finally, the UV lamp assembly can quickly cure the adhesive to prevent the components from shifting, thereby effectively improving the mounting accuracy and processing efficiency of the circuit board. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.
[0024] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0025] Figure 2 This is a schematic diagram of the rotating mechanism and vacuum suction plate structure of this utility model;
[0026] Figure 3 This is a schematic diagram of the positioning fixture structure of this utility model. Detailed Implementation
[0027] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.
[0028] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.
[0029] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.
[0030] like Figures 1 to 3As shown, this utility model embodiment provides a high-speed SMT dispensing device, including a base 1, a support frame 2, a dual-axis moving mechanism 3, a dispensing assembly 4, a lifting mechanism 5, a rotating mechanism 6, a vacuum suction plate 7, and a positioning fixture 8. The positioning fixture 8 is disposed on the base 1 and has a receiving groove 80 for fixing the circuit board to be dispensed. The lifting mechanism 5 is disposed on the base 1 at the side end of the positioning fixture 8, and the movable end of the lifting mechanism 5 is connected to a lifting plate 51. The lifting mechanism 5 is used to drive the lifting plate 51 to move up and down vertically. A rotating mechanism 6 is mounted on the lifting plate 51, and a vacuum suction plate 7 is mounted on the rotating mechanism 6. The rotating mechanism 6 is used to flip and adjust the angle of the vacuum suction plate 7. The vacuum suction plate 7 is provided with a plurality of suction holes 70, which are used to adsorb and fix electronic components attached to the circuit board. The support frame 2 is mounted on the base 1, and the dual-axis moving mechanism 3 is mounted on the support frame 2. Its movable end is connected to the dispensing assembly 4. The dual-axis moving mechanism 3 is used to adjust the position of the dispensing assembly 4, which is used to dispense adhesive onto the surface of the electronic components on the vacuum suction plate 7. During the dispensing process, the circuit board to be dispensed can be placed in the positioning fixture 8. The receiving groove 80 on the positioning fixture 8 can prevent the circuit board from shifting position during the placement process. Then, the external robotic arm places the electronic components into the suction holes 70 on the vacuum suction plate 7. The suction holes 70 fix the electronic components with suction force, so that the glue-receiving surface faces upward. Next, the lifting mechanism 5 drives the lifting plate 51 to rise, so that the components on the vacuum suction plate 7 are raised to the predetermined dispensing height. Under the action of the dual-axis moving mechanism 3, the dispensing assembly 4 dispenses glue onto the surface of each electronic component on the vacuum suction plate 7. After the dispensing is completed, the rotating mechanism 6 drives the vacuum suction plate 7 to flip, so that the glue-received side faces downward toward the circuit board. Then, the lifting mechanism 5 drives the vacuum suction plate 7 to descend, so that the electronic components are attached to the designated position on the circuit board, thereby completing the dispensing and mounting. The entire dispensing and mounting action is carried out in tandem, which not only improves the dispensing efficiency, but also ensures the mounting accuracy and stability between the circuit board and the electronic components.
[0031] like Figure 1 As shown, it further includes a UV lamp assembly 9, which is disposed on the side of the positioning fixture 8. The UV lamp assembly 9 is used to cure the electronic components mounted on the circuit board. During the mounting process, after the electronic components are dispensed and flipped face down onto the circuit board, the mounted electronic components are still in an uncured state and are prone to positional displacement. At this time, the UV lamp assembly 9 can emit ultraviolet light to irradiate the adhesive, causing it to undergo a photocuring reaction, thereby achieving rapid fixation of the electronic components, shortening the curing cycle, effectively preventing mounting errors caused by adhesive movement, and improving the mounting effect of the circuit board.
[0032] like Figure 3 As shown, the device further includes a photoelectric sensor 81. The positioning fixture 8 has an inner groove 801, and the photoelectric sensor 81 is located within this groove. The photoelectric sensor 81 is used to sense whether the circuit board is properly installed. When the circuit board is not properly positioned, the photoelectric sensor 81 cannot detect a signal, thus prohibiting subsequent dispensing and mounting operations. Only when the circuit board is accurately positioned and confirmed by the photoelectric sensor 81 will the control system allow the lifting mechanism 5, the rotating mechanism 6, and the dispensing assembly 4 to operate sequentially, thereby improving the operational safety of the equipment.
[0033] like Figure 1 and Figure 2 As shown, the rotating mechanism 6 further includes a servo motor 61, bearing seats 62, and a rotating carrier plate 63. The two bearing seats 62 are respectively located on both sides of the lifting plate 51. The two ends of the rotating carrier plate 63 are rotatably connected to the bearing seats 62 through rotating shafts. The vacuum suction plate 7 is located on the rotating carrier plate 63. The output shaft of the servo motor 61 is connected to the rotating carrier plate 63 through a coupling. When the servo motor 61 is running, it can drive the rotating carrier plate 63 to rotate, thereby realizing the angle flipping operation of the electronic components.
[0034] like Figure 1 and Figure 2 As shown, the dual-axis moving mechanism 3 further includes an X-axis moving module 31 and a Y-axis moving module 32. The X-axis moving module 31 is located on the top of the support frame 2. The movable end of the X-axis moving module 31 is connected to the Y-axis moving module 32. The movable end of the Y-axis moving module 32 is connected to the dispensing assembly 4. With this configuration, the dispensing assembly 4 can move in the X-axis and Y-axis directions to dispense adhesive onto the various electronic components on the vacuum suction plate 7.
[0035] like Figure 1 and Figure 2 As shown, the dispensing assembly 4 further includes a mounting base 41, a dispensing head 42, and an adhesive cartridge 43. The dispensing head 42 and the adhesive cartridge 43 are respectively disposed on the mounting base 41. The adhesive cartridge 43 is connected to the dispensing head 42 via a connecting pipe (not shown). The adhesive cartridge 43 is used to supply adhesive to the dispensing head 42. The adhesive cartridge 43, as an adhesive storage device, is connected to the dispensing head 42 via the connecting pipe, continuously supplying adhesive to the dispensing head 42 and preventing dispensing interruption due to insufficient adhesive quantity. The dispensing head 42 can then apply the adhesive to the surface of electronic components.
[0036] like Figure 1 and Figure 3As shown, the system further includes a waste adhesive collection box 10, which is mounted on the base 1. The waste adhesive collection box 10 is used to collect waste adhesive discharged from the dispensing head 42. During the dispensing operation, a small amount of residual adhesive often drips when the dispensing head 42 starts and stops. If not handled promptly, this can not only contaminate the workpiece or affect the dispensing accuracy of the next operation, but also cause adhesive buildup and blockage inside the equipment. The waste adhesive collection box 10 can receive this waste adhesive, facilitating subsequent maintenance and cleaning.
[0037] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. An SMT patch high-speed dispensing device, characterized in that, It includes a base, support frame, dual-axis moving mechanism, dispensing assembly, lifting mechanism, rotating mechanism, vacuum suction plate, and positioning fixture; The positioning fixture is mounted on the machine base, and the positioning fixture is provided with a receiving groove for fixing the circuit board to be glued. The lifting mechanism is mounted on the base at the side end of the positioning fixture. The movable end of the lifting mechanism is connected to the lifting plate. The lifting mechanism is used to drive the lifting plate to move up and down in the vertical direction. The rotating mechanism is mounted on the lifting plate, and the vacuum suction plate is mounted on the rotating mechanism. The rotating mechanism is used to flip and adjust the angle of the vacuum suction plate. The vacuum suction plate is provided with a plurality of suction holes, which are used to adsorb and fix electronic components that are attached to the circuit board. The support frame is mounted on the base, and the dual-axis moving mechanism is mounted on the support frame. Its movable end is connected to the dispensing assembly. The dual-axis moving mechanism is used to adjust the position of the dispensing assembly, and the dispensing assembly is used to dispense adhesive onto the surface of electronic components on the vacuum suction plate.
2. The SMT paster high-speed dispensing device according to claim 1, characterized in that, It also includes a UV lamp assembly, which is located on the side of the positioning fixture and is used to cure electronic components mounted on the circuit board.
3. The SMT paster high-speed dispensing device according to claim 1, characterized in that, It also includes a photoelectric sensor. The positioning fixture has an inner groove, and the photoelectric sensor is located in the inner groove. The photoelectric sensor is used to sense whether the circuit board is installed in place.
4. The SMT paster high-speed dispensing device according to claim 1, characterized in that, The rotating mechanism includes a servo motor, a bearing housing, and a rotating carrier plate; Two bearing seats are respectively located on both sides of the lifting plate. The two ends of the rotating carrier plate are rotatably connected to the bearing seats through rotating shafts. The vacuum suction plate is located on the rotating carrier plate. The output shaft of the servo motor is connected to the rotating carrier plate through a coupling.
5. The SMT high-speed dispensing device according to claim 1, characterized in that, The dual-axis moving mechanism includes an X-axis moving module and a Y-axis moving module; The X-axis moving module is located on the top of the support frame. The movable end of the X-axis moving module is connected to the Y-axis moving module, and the movable end of the Y-axis moving module is connected to the dispensing assembly.
6. The SMT high-speed dispensing device according to claim 5, characterized in that, The dispensing assembly includes a mounting base, a dispensing head, and a glue cartridge; The dispensing head and glue cartridge are respectively mounted on the mounting base. The glue cartridge is connected to the dispensing head through a connecting pipe and is used to provide glue to the dispensing head.
7. The SMT high-speed dispensing device according to claim 6, characterized in that, It also includes a waste glue collection box, which is disposed on the base and is used to collect waste glue discharged from the dispensing head.