A silicon wafer processing even glue machine

Abstract

The utility model discloses a kind of even glue machines for silicon wafer processing, including installation shell, collection shell is fixedly arranged on installation shell top, installation shell surface is provided with fixed component, installation shell inside is fixedly provided with mounting bracket, mounting bracket surface is provided with driving component, rotating shaft is rotatably arranged in mounting bracket inside, rotating shaft top is provided with connecting component. Through driving component driving rotating shaft rotates through connecting component and connecting shaft, and through transmission component and drive rotating tube, so that centrifugal disc drives silicon wafer rotation, wherein, when centrifugal disc of one side rotates, centrifugal disc of the other side does not rotate, i. e. it can be placed silicon wafer to centrifugal disc of not rotating, to carry out continuous coating glue to silicon wafer, avoid the need silicon wafer, after completing feeding, even glue and whole process of discharging, next piece production can be carried out, so that the processing speed of even glue machine to silicon wafer is improved, so that more silicon wafers can be processed in the same time.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing technology, and in particular to a homogenizing machine for silicon wafer processing. Background Technology

[0002] In the silicon wafer manufacturing process, a homogenizer is used to uniformly coat the silicon wafer with photoresist. Photoresist is a photosensitive polymer material. Through steps such as coating, exposure, and development, the circuit pattern on the photomask is copied to the photoresist layer on the silicon wafer surface. Then, the pattern is transferred to the silicon wafer body through etching or ion implantation. Generally, the working principle of a homogenizer is to drop the adhesive onto the center of the silicon wafer and then rotate the silicon wafer at high speed so that the adhesive can be uniformly coated on the surface of the silicon wafer under the action of centrifugal force.

[0003] However, existing homogenizing machines have certain shortcomings. Generally, a homogenizing machine processes only one silicon wafer at a time, completing the entire process of loading, homogenizing, and unloading before proceeding to the next wafer. This results in a reduced processing speed for silicon wafers. Based on these issues, this application proposes a homogenizing machine for silicon wafer processing. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a homogenizing machine for silicon wafer processing, which solves the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A silicon wafer homogenizer includes a mounting housing, a collecting housing fixedly disposed on the top of the mounting housing, a fixing component disposed on the surface of the mounting housing, a mounting frame fixedly disposed inside the mounting housing, a driving component disposed on the surface of the mounting frame, a rotating shaft rotatably disposed inside the mounting frame, a connecting component disposed at the top end of the rotating shaft, a connecting shaft disposed at the top end of the rotating shaft via the connecting component, and a transmission component disposed on the surface of the connecting shaft.

[0007] Preferably, the fixing assembly includes a vacuum pump fixedly installed on the lower side wall of the mounting housing. A three-way connector is fixedly provided at the air inlet end of the vacuum pump. A connecting pipe is fixedly provided inside the three-way connector. A solenoid valve is fixedly installed on the connecting pipe. A rotary joint is installed at the air inlet end of the connecting pipe. A rotating pipe is installed at the air inlet end of the rotary joint. A centrifugal disc is fixedly provided at the top of the rotating pipe. The centrifugal disc is located inside the collecting housing. The rotating pipe is rotatably connected to both the mounting housing and the collecting housing.

[0008] Preferably, the drive assembly includes a servo motor fixedly mounted at the bottom of the mounting bracket, a double-groove synchronous pulley fixedly mounted at the output end of the servo motor, a synchronous belt meshing inside the double-groove synchronous pulley, a single-groove synchronous pulley meshing inside the synchronous belt, and the single-groove synchronous pulley fixedly mounted on the surface of the rotating shaft.

[0009] Preferably, the connecting assembly includes a rotating disk fixedly installed on the top of the rotating shaft, the rotating disk having a mounting groove on its surface, a mounting shaft fixedly installed inside the mounting groove, a flip plate rotatably installed on the surface of the mounting shaft, a spring fixedly installed on one side of the flip plate, the spring being fixedly connected to the mounting groove, a rotating disk overlapping the surface of the rotating disk, and a connecting groove having a connecting groove overlapping the flip plate.

[0010] Preferably, the transmission assembly includes a drive gear fixedly mounted on the surface of the connecting shaft, a driven gear meshing with the surface of the drive gear, and the driven gear fixedly mounted on the surface of the rotating tube.

[0011] Preferably, a return pipe is fixedly provided on the rear side of the collecting shell, a discharge port is provided through the surface of the collecting shell, the discharge port is funnel-shaped, and heat dissipation grooves are provided through the front and rear sides of the mounting shell.

[0012] Preferably, both the rotating shaft and the connecting shaft are circular structures, both are made of metal, the rotating shaft is rotatably disposed inside the mounting bracket, and the connecting shaft is rotatably disposed inside the mounting housing.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This silicon wafer processing homogenizer drives the rotating shaft through the drive assembly, which in turn drives the connecting shaft to rotate through the connecting assembly. The transmission assembly then drives the rotating tube, causing the centrifugal disc to rotate the silicon wafer. When one side of the centrifugal disc rotates, the other side does not rotate, allowing the silicon wafer to be placed on the non-rotating centrifugal disc. This enables continuous coating of adhesive on the silicon wafer, avoiding the need to complete the entire process of loading, homogenizing, and unloading before the next wafer can be produced. This increases the processing speed of the homogenizer, allowing more silicon wafers to be processed in the same amount of time. Attached Figure Description

[0014] Figure 1 This is an isometric drawing of the structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the internal structure of the outer casing of this utility model;

[0016] Figure 3 This is a partial structural diagram of the present invention;

[0017] Figure 4 This is a schematic diagram of the fixing structure of this utility model;

[0018] Figure 5 This is a schematic diagram of another partial structure of the present invention;

[0019] Figure 6 This is a schematic diagram of the connecting component structure of this utility model.

[0020] In the diagram: 1. Mounting housing; 2. Collection housing; 3. Vacuum pump; 4. T-joint; 5. Connecting pipe; 6. Rotary joint; 7. Rotating pipe; 8. Centrifugal disc; 9. Mounting bracket; 10. Servo motor; 11. Double-groove synchronous pulley; 12. Synchronous belt; 13. Single-groove synchronous pulley; 14. Rotating shaft; 15. Rotating disc; 16. Mounting groove; 17. Mounting shaft; 18. Flip plate; 19. Spring; 20. Rotating disc; 21. Connecting groove; 22. Connecting shaft; 23. Drive gear; 24. Driven gear; 25. Return pipe; 26. Heat dissipation groove. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Reference Figure 1-6A silicon wafer homogenizer includes a mounting housing 1, a collecting housing 2 fixedly mounted on the top of the mounting housing 1, a fixing component mounted on the surface of the mounting housing 1, a mounting frame 9 fixedly mounted inside the mounting housing 1, a driving component mounted on the surface of the mounting frame 9, a rotating shaft 14 rotatably mounted inside the mounting frame 9, a connecting component mounted at the top of the rotating shaft 14, and a connecting shaft 22 connected to the top of the rotating shaft 14 via the connecting component. Both the rotating shaft 14 and the connecting shaft 22 are circular structures and are made of metal. The rotating shaft 14 is rotatably mounted inside the mounting frame 9, and the connecting shaft 22 is rotatably mounted inside the mounting housing 1. A transmission component is mounted on the surface of the connecting shaft 22. The driving component includes... The assembly includes a servo motor 10 fixedly mounted at the bottom of the mounting bracket 9. A double-groove synchronous pulley 11 is fixedly mounted at the output end of the servo motor 10. A synchronous belt 12 is meshed inside the double-groove synchronous pulley 11, and a single-groove synchronous pulley 13 is meshed inside the synchronous belt 12. The single-groove synchronous pulley 13 is fixedly mounted on the surface of the rotating shaft 14. The connecting assembly includes a rotating disk 15 fixedly mounted on the top of the rotating shaft 14. A mounting groove 16 is formed on the surface of the rotating disk 15. A mounting shaft 17 is fixedly mounted inside the mounting groove 16. A flip plate 18 is rotatably mounted on the surface of the mounting shaft 17. A spring 19 is fixedly mounted on one side of the flip plate 18 and is fixedly connected to the mounting groove 16. A rotating disk 20 overlaps on the surface of the rotating disk 15. The turntable 20 has a connecting groove 21 inside, which overlaps with the flipping plate 18. The transmission assembly includes a drive gear 23 fixedly mounted on the surface of the connecting shaft 22, and a driven gear 24 meshing on the surface of the drive gear 23. The driven gear 24 is fixedly mounted on the surface of the rotating tube 7. The servo motor 10 drives the rotating shaft 14 to rotate via a double-groove synchronous pulley 11, a synchronous belt 12, and a single-groove synchronous pulley 13. This causes the rotating shaft 14 to drive the mounting shaft 17 to rotate via the rotating disk 15. One side of the rotating disk 15 drives the flipping plate 18 to rotate via the mounting shaft 17, while the other side of the rotating disk 15 drives the flipping plate 18 to move along the inclined surface of the connecting groove 21, thus connecting the rotating shaft 20 to rotate via the mounting shaft 17. The inclined surface of the receiving groove 21 pushes the flip plate 18 to compress the spring 19, so that the flip plate 18 will not drive the rotating disk 20 to rotate. Then, the connecting shaft 22 on one side drives the rotating tube 7 on one side to rotate through the driving gear 23 and the driven gear 24, so that the centrifugal disk 8 on one side drives the silicon wafer to rotate. Meanwhile, the connecting shaft 22 on the other side does not rotate, so that the rotating tube 7 on the other side will not drive the centrifugal disk 8 to rotate. Silicon wafers can then be placed on the centrifugal disk 8 on the other side. This allows for the continuous placement of silicon wafers on both sides of the centrifugal disk 8. The rotation of the centrifugal disk 8 on both sides is controlled by the forward and reverse rotation of the motor, which avoids waiting for one silicon wafer to complete the entire process before the next silicon wafer can be processed, thus increasing the silicon wafer processing speed.

[0023] Specifically, the fixing components include a vacuum pump 3 fixedly installed on the lower side wall of the mounting housing 1. A three-way connector 4 is fixedly installed at the air inlet end of the vacuum pump 3. A connecting pipe 5 is fixedly installed inside the three-way connector 4. A solenoid valve is fixedly installed on the connecting pipe 5. A rotary joint 6 is installed at the air inlet end of the connecting pipe 5. A rotating pipe 7 is installed at the air inlet end of the rotary joint 6. A centrifugal disc 8 is fixedly installed on the top of the rotating pipe 7. The centrifugal disc 8 is located inside the collecting housing 2. The rotating pipe 7 is rotatably connected to both the mounting housing 1 and the collecting housing 2. When the vacuum pump 3 is started and the solenoid valve on the connecting pipe 5 is opened, the vacuum pump 3 draws air from the inside of the centrifugal disc 8 through the connecting pipe 5, the rotary joint 6, and the rotating pipe 7, making the inside of the centrifugal disc 8 a vacuum state. The silicon wafer is fixed to the top of the centrifugal disc 8 by the pressure difference between the inside and outside. By controlling the opening and closing of the solenoid valve, a vacuum can be drawn on the rotating centrifugal disc 8, while no vacuum is drawn on the non-rotating centrifugal disc 8.

[0024] Specifically, a return pipe 25 is fixedly installed on the rear side of the collection housing 2, and a discharge port is provided through the surface of the collection housing 2. The discharge port is funnel-shaped. Heat dissipation grooves 26 are provided through the front and rear sides of the mounting housing 1. Due to centrifugal force, excess adhesive on the silicon wafer falls into the inside of the collection housing 2, causing the adhesive to slide down inside the collection housing 2 and enter the inside of the return pipe 25 through the discharge port on the surface of the collection housing 2. Then, it is discharged into the external collection device through the return pipe 25, which avoids the adhesive accumulating inside the collection housing 2. Moreover, the heat dissipation grooves 26 can dissipate heat from the vacuum pump 3 and servo motor 10 inside the mounting housing 1, preventing the vacuum pump 3 and servo motor 10 from overheating and being damaged.

[0025] The silicon wafer processing homogenizer is connected to a 220V mains power supply, and the main controller can be a conventional known device such as a computer for control.

[0026] In use: The silicon wafer to be coated is placed on top of the centrifuge tray 8. The vacuum pump 3 is started. The vacuum pump 3 extracts air from the inside of the centrifuge tray 8 through the connecting pipe 5, rotary joint 6, and rotating pipe 7, creating a vacuum inside the centrifuge tray 8. The pressure difference between the inside and outside of the centrifuge tray 8 fixes the silicon wafer to the top of the centrifuge tray 8. The adhesive to be coated is dripped onto the silicon wafer through an external dripping device. The servo motor 10 drives the double-groove synchronous wheel 11 to rotate, which in turn drives the single-groove synchronous wheel 13 to rotate through the synchronous belt 12. The single-groove synchronous wheel 13 drives the rotating shaft 14 to rotate inside the mounting bracket 9, which in turn drives the mounting shaft 17 to rotate through the rotating disk 15. The mounting shaft 17 then drives the tilting plate 18 to rotate the rotating disk 20, which in turn drives the connecting shaft 22 to rotate. The connecting shaft 22 drives the driven gear 24, which meshes with it, through the driving gear 23. The driven gear 24 drives the rotating pipe 7 to rotate through the rotary joint 6, and then drives the centrifuge tray 8 to rotate, thus rotating the centrifuge tray 8. The rotating shaft 14 drives the rotating disk 15 to rotate. During rotation, one side of the rotating disk 15, via the mounting shaft 17, moves the flip plate 18 towards the vertical surface of the connecting groove 21. This causes the flip plate 18 to push the rotating disk 20 to rotate along the vertical surface of the connecting groove 21. The other side of the rotating disk 15, via the mounting shaft 17, moves the flip plate 18 along the inclined surface of the connecting groove 21. This causes the inclined surface of the connecting groove 21 to push the flip plate 18 against the surface of the mounting shaft 17. The rotation causes the flip plate 18 to compress the spring 19, preventing the flip plate 18 from rotating the rotating disk 20. This allows one side of the connecting shaft 22 to rotate while the other side remains stationary. This enables the rotating tube 7 on one side to rotate the silicon wafer via the centrifugal disk 8 for adhesive application, while the rotating tube 7 on the other side does not rotate the centrifugal disk 8. This allows silicon wafers to be placed on the centrifugal disk 8 on the other side. Furthermore, by controlling the opening and closing of the solenoid valve, a vacuum can be drawn on the rotating centrifugal disk 8, while no vacuum is drawn on the stationary centrifugal disk 8.

[0027] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A homogenizing machine for silicon wafer processing, comprising a mounting housing (1), characterized in that, The mounting housing (1) is fixedly provided with a collection housing (2) on its top. The mounting housing (1) is provided with a fixing component on its surface. The mounting housing (1) is fixedly provided with a mounting bracket (9) inside its interior. The mounting bracket (9) is provided with a driving component on its surface. The mounting bracket (9) is rotatably provided with a rotating shaft (14) inside its interior. The rotating shaft (14) is provided with a connecting component at its top end. The rotating shaft (14) is provided with a connecting shaft (22) at its top end via the connecting component. The connecting shaft (22) is provided with a transmission component on its surface.

2. The silicon wafer processing homogenizer according to claim 1, characterized in that, The fixed assembly includes a vacuum pump (3) fixedly installed on the lower side wall of the mounting housing (1). A three-way connector (4) is fixedly provided at the air inlet end of the vacuum pump (3). A connecting pipe (5) is fixedly provided inside the three-way connector (4). A solenoid valve is fixedly installed on the connecting pipe (5). A rotary joint (6) is installed at the air inlet end of the connecting pipe (5). A rotating pipe (7) is installed at the air inlet end of the rotary joint (6). A centrifugal disc (8) is fixedly provided at the top of the rotating pipe (7). The centrifugal disc (8) is located inside the collecting housing (2). The rotating pipe (7) is rotatably connected to both the mounting housing (1) and the collecting housing (2).

3. The silicon wafer processing homogenizer according to claim 1, characterized in that, The drive assembly includes a servo motor (10) fixedly mounted on the bottom of the mounting bracket (9). A double-groove synchronous pulley (11) is fixedly provided at the output end of the servo motor (10). A synchronous belt (12) is meshed inside the double-groove synchronous pulley (11). A single-groove synchronous pulley (13) is meshed inside the synchronous belt (12). The single-groove synchronous pulley (13) is fixedly mounted on the surface of the rotating shaft (14).

4. A homogenizing machine for silicon wafer processing according to claim 1, characterized in that, The connecting assembly includes a rotating disk (15) fixedly installed on the top of the rotating shaft (14). The rotating disk (15) has an installation groove (16) on its surface. An installation shaft (17) is fixedly installed inside the installation groove (16). A flip plate (18) is rotatably installed on the surface of the installation shaft (17). A spring (19) is fixedly installed on one side of the flip plate (18). The spring (19) is fixedly connected to the installation groove (16). A rotating disk (20) overlaps on the surface of the rotating disk (15). A connecting groove (21) is opened inside the rotating disk (20). The connecting groove (21) overlaps with the flip plate (18).

5. A homogenizing machine for silicon wafer processing according to claim 2, characterized in that, The transmission assembly includes a drive gear (23) fixedly mounted on the surface of the connecting shaft (22), and a driven gear (24) meshing on the surface of the drive gear (23). The driven gear (24) is fixedly mounted on the surface of the rotating tube (7).

6. A homogenizing machine for silicon wafer processing according to claim 1, characterized in that, A return pipe (25) is fixedly installed on the rear side of the collection shell (2), and a discharge port is provided through the surface of the collection shell (2). The discharge port is funnel-shaped, and heat dissipation grooves (26) are provided through the front and rear sides of the mounting shell (1).

7. A homogenizing machine for silicon wafer processing according to claim 1, characterized in that, Both the rotating shaft (14) and the connecting shaft (22) are circular structures. Both the rotating shaft (14) and the connecting shaft (22) are made of metal. The rotating shaft (14) is rotatably disposed inside the mounting bracket (9), and the connecting shaft (22) is rotatably disposed inside the mounting housing (1).

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