An electronic component pin bending mechanism

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The automated pin bending device enables high-precision and high-speed bending of electronic component pins, solving the problems of low efficiency and poor consistency in existing technologies, and is suitable for the precision manufacturing of high-density electronic components.

CN224359289UActive Publication Date: 2026-06-16ELRAD ELECTRONICS DONGGUAN

Patent Information

Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner: ELRAD ELECTRONICS DONGGUAN
Filing Date: 2025-06-07
Publication Date: 2026-06-16

AI Technical Summary

⚠Technical Problem

In existing technologies, the bending process of electronic component pins relies on manual operation, resulting in low processing efficiency and errors, making it difficult to meet the requirements of high-precision and high-efficiency electronic manufacturing.

⚗Method used

Design an automated pin bending device that includes a base, linear guide, lateral pushing mechanism, workpiece positioning plate, upper and lower stamping mechanisms and related auxiliary mechanisms. The device achieves high-precision bending and cutting of pins through an automated process and integrates a modular structure to adapt to both manual and automated production.

🎯Benefits of technology

It significantly improves the accuracy and production efficiency of pin bending, solves the problems of low efficiency and poor consistency of traditional manual bending, adapts to diverse processing needs, and supports the precision manufacturing of high-density electronic components.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to electronic component processing technical field especially is concerned with a kind of electronic component pin bending mechanism, including base, linear guide and transverse pushing mechanism are installed on base, workpiece positioning base plate is slidably connected on linear guide, workpiece positioning base plate is dynamically connected with transverse pushing mechanism, workpiece pressing mechanism and workpiece stripping mechanism are installed on workpiece positioning base plate, workpiece positioning base plate is driven along linear guide sliding in two places of front and back by transverse pushing mechanism;Significantly improve bending accuracy and production efficiency, its modular structure can adapt to manual operation and can integrate automatic production line, effectively solve the problems, such as low efficiency and poor consistency, of traditional manual bending, while upper punch head and lower punch head can be replaced according to pin bending characteristics, meet the diversified processing needs, provide reliable solution for the precision manufacturing of high-density electronic components.

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Description

Technical Field

[0001] This utility model relates to the field of electronic component processing technology, and in particular to an electronic component pin bending mechanism. Background Technology

[0002] In the manufacturing process of electronic products, in order to meet the layout requirements of electronic components on circuit boards and ensure that they are correctly installed in specific directions and positions to achieve normal function, some electronic components need to have their pins pre-bent during the production and processing stage to form a fixed geometric structure. For example... Figure 1 As shown, bending the pins into a specific shape not only helps improve the assembly accuracy and mechanical stability of components on the circuit board, but also effectively improves the space utilization of the circuit board, which is especially suitable for electronic products with high requirements for size and structural compactness.

[0003] Furthermore, as modern electronics manufacturing becomes increasingly automated and efficient, the pin design of electronic components must also adapt to the requirements of automated assembly equipment. A well-designed pin bending configuration can improve the recognition efficiency and gripping accuracy of automated placement equipment, thereby further enhancing overall production line efficiency and product yield.

[0004] However, in existing technologies, specialized fixtures are typically used to bend and shape the leads. While this method can ensure the consistency of lead shape to some extent, it often relies on manual intervention, resulting in low processing efficiency and the risk of operational errors. This can easily lead to lead bending angles or directions that do not meet design requirements, affecting subsequent assembly quality. Therefore, there is an urgent need to propose a more efficient, precise, and automated lead bending device and method to overcome the shortcomings of existing technologies and meet the demands of high-precision and high-efficiency electronic manufacturing. Utility Model Content

[0005] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution that can solve the above problems.

[0006] An electronic component pin bending mechanism includes a base, on which a linear guide rail and a transverse pushing mechanism are mounted. A workpiece positioning plate is slidably connected to the linear guide rail. The workpiece positioning plate is poweredly connected to the transverse pushing mechanism. A workpiece clamping mechanism and a workpiece unloading mechanism are mounted on the workpiece positioning plate. The workpiece positioning plate slides along the linear guide rail at two positions, front and back, driven by the transverse pushing mechanism.

[0007] The substrate is also equipped with an upper stamping mechanism located above the workpiece positioning plate and a lower stamping mechanism located below the workpiece positioning plate. The upper stamping mechanism is provided with an upper punch head, and the lower stamping mechanism is provided with a lower punch head that mates with the upper punch head. When the workpiece positioning plate moves to the rear position, it corresponds to the upper punch head and the lower punch head.

[0008] Preferably, two linear guides are provided, and two wings extend from both sides of the workpiece positioning base plate, and the workpiece positioning base plate is slidably connected to the linear guides through the two wings.

[0009] Preferably, the workpiece positioning base plate is provided with at least one workpiece positioning groove, the workpiece clamping mechanism is connected to the workpiece positioning groove, the workpiece unloading mechanism is connected to the rear end of the workpiece positioning groove, and the workpiece positioning base plate is provided with a pin processing notch at the front position corresponding to the workpiece positioning groove, and the upper stamping mechanism and the lower stamping mechanism are connected to the pin processing notch.

[0010] Preferably, a pin cutting plate is fixedly installed on the workpiece positioning substrate in front of the pin processing notch, and a pin cutting blade that docks with the pin cutting plate is integrated in front of the upper punch head, and the pin cutting blade is set lower than the upper punch head.

[0011] Preferably, the workpiece clamping mechanism includes a lifting frame mounted on the workpiece positioning base plate, a pressing cylinder fixedly mounted on the lifting frame, and a workpiece pressing block powered by the pressing cylinder. The workpiece pressing block is provided with a positioning pin, and the workpiece positioning base plate is provided with a positioning hole that mates with the positioning pin.

[0012] Preferably, the workpiece unloading mechanism includes a pusher cylinder fixedly mounted on the workpiece positioning base plate and a pusher block powered by the pusher cylinder. A pusher groove is provided on the workpiece positioning base plate at the rear end of the workpiece positioning groove, and pusher fingers that engage with the pusher groove are formed on the pusher block.

[0013] Preferably, the front part of the substrate is also provided with a waste drawer and a receiving drawer. When the workpiece positioning plate moves to the rear position, the waste drawer is aligned with the bottom of the lead cutting plate. When the workpiece positioning plate moves to the front position, the receiving drawer is aligned with the bottom of the lead processing notch.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This electronic component pin bending mechanism automatically switches between loading and processing positions by moving the workpiece positioning substrate back and forth via a lateral pushing mechanism. After loading by a manual or robotic arm, the component is fixed by a clamping mechanism, suspending the pins in mid-air. Subsequently, the substrate moves to the rear position, where the upper and lower punching mechanisms work together to complete a high-precision bending operation through precisely matched upper and lower punches. Finally, the substrate is reset and automatically unloaded by a stripping mechanism, forming a complete automated processing cycle. This design significantly improves bending accuracy and production efficiency. Its modular structure can be adapted to both manual operation and integration into automated production lines, effectively solving the problems of low efficiency and poor consistency in traditional manual bending. At the same time, the upper and lower punches can be replaced according to the pin bending characteristics to meet diverse processing needs, providing a reliable solution for the precision manufacturing of high-density electronic components.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is a partial structural diagram of the present invention before punching;

[0020] Figure 3 This is a partial structural diagram of the present invention after stamping;

[0021] Figure 4 This is a utility model Figure 2 A schematic diagram of the cross-sectional structure;

[0022] Figure 5 This is a utility model Figure 4 Schematic diagram of the structure at point A;

[0023] Figure 6 This is a utility model Figure 3 A schematic diagram of the cross-sectional structure;

[0024] Figure 7 This is a utility model Figure 6 A schematic diagram of the structure at point B.

[0025] The reference numerals and names in the figure are as follows:

[0026] 10. Base plate, 11. Linear guide rail, 12. Lateral pushing mechanism, 13. Scrap drawer, 14. Receiving drawer, 20. Workpiece positioning base plate, 21. Workpiece positioning groove, 22. Pin processing notch, 23. Pin cutting plate, 24. Positioning hole, 25. Pushing groove, 30. Workpiece clamping mechanism, 31. Lifting frame, 32. Downward pressing cylinder, 33. Workpiece pressing block, 34. Positioning pin, 40. Workpiece unloading mechanism, 41. Pushing cylinder, 42. Pushing block, 43. Pushing finger, 50. Upper punching mechanism, 51. Upper punch head, 52. Pin cutting knife, 60. Lower punching mechanism, 61. Detailed Implementation

[0027] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0028] Please see Figure 1-7 In this embodiment of the present invention, an electronic component pin bending mechanism includes a base 10, on which a linear guide rail 11 and a transverse pushing mechanism 12 are mounted. A workpiece positioning substrate 20 is slidably connected to the linear guide rail 11. The workpiece positioning substrate 20 is poweredly connected to the transverse pushing mechanism 12. A workpiece pressing mechanism 30 and a workpiece unloading mechanism 40 are mounted on the workpiece positioning substrate 20. The workpiece positioning substrate 20 slides along the linear guide rail 11 at two positions, front and back, driven by the transverse pushing mechanism 12.

[0029] The base 10 is also equipped with an upper stamping mechanism 50 located above the workpiece positioning base plate 20 and a lower stamping mechanism 60 located below the workpiece positioning base plate 20. The upper stamping mechanism 50 is provided with an upper punch head 51, and the lower stamping mechanism 60 is provided with a lower punch head 61 that is mated and cooperates with the upper punch head 51. When the workpiece positioning base plate 20 moves to the rear position, it corresponds to the upper punch head 51 and the lower punch head 61.

[0030] In the operation of bending the pins of electronic components, the lateral pushing mechanism 12 drives the workpiece positioning plate 20 to move forward. Then, the main part of the electronic component is positioned on the workpiece positioning plate 20 by manual or robotic arm. The main part of the electronic component is then pressed by the workpiece clamping mechanism 30, so that its pins are suspended. After positioning, the workpiece positioning plate 20 is moved to the rear by the lateral pushing mechanism 12. Then, the upper punching mechanism 50 and the lower punching mechanism 60 operate, and the upper punch head 51 and the lower punch head 61 bend the pins from the upper and lower positions. After bending is completed, the lateral pushing mechanism 12 operates, driving the workpiece positioning plate 20 to move forward again. Then, the workpiece unloading mechanism 40 pushes the electronic component out of the workpiece positioning plate 20, completing the pin bending operation of the electronic component. This design significantly improves bending accuracy and production efficiency. Its modular structure can be adapted to both manual operation and integration into automated production lines, effectively solving the problems of low efficiency and poor consistency in traditional manual bending. At the same time, the upper punch head 51 and the lower punch head 61 can be replaced according to the bending characteristics of the pins to meet diverse processing needs, providing a reliable solution for the precision manufacturing of high-density electronic components.

[0031] Please see Figure 1-3 Based on the above technical solution, it is further proposed that the linear guide rail 11 is provided with two lines, and the workpiece positioning base plate 20 has two wings extending from both sides. The workpiece positioning base plate 20 is slidably connected to the linear guide rail 11 through the two wings, so that there is space at the upper and lower positions of the workpiece positioning base plate 20 to connect with the upper stamping mechanism 50 and the lower stamping mechanism 60, making the overall structure design reasonable and compact.

[0032] Please see Figure 4-7 The workpiece positioning base plate 20 is provided with at least one workpiece positioning groove 21 for positioning electronic components. The workpiece clamping mechanism 30 is connected to the workpiece positioning groove 21. After the electronic component is placed in the workpiece positioning groove 21, the workpiece clamping mechanism 30 is driven to clamp the electronic component in the workpiece positioning groove 21. The workpiece unloading mechanism 40 is connected to the rear end of the workpiece positioning groove 21. The workpiece positioning base plate 20 is provided with a pin processing notch 22 at the front position corresponding to the workpiece positioning groove 21. The upper stamping mechanism 50 and the lower stamping mechanism 60 are connected to the pin processing notch 22. After the electronic component is fixed, its pin is suspended on the pin processing notch 22, so that it can be bent and stamped by the upper stamping mechanism 50 and the lower stamping mechanism 60.

[0033] Please see Figure 4-7Based on the above technical solution, it is further proposed that a pin cutting plate 23 is fixedly installed on the workpiece positioning substrate 20 in front of the pin processing notch 22, and a pin cutting blade 52 connected to the pin cutting plate 23 is integrated in front of the upper punch head 51. The pin cutting plate 23 and the pin cutting blade 52 are used to cut the excess part of the pin, and the pin cutting blade 52 is set lower than the upper punch head 51, so that the pin cutting blade 52 first punches the excess part of the pin during the stamping process, and then the pin is bent and formed by the docking of the upper punch head 51 and the lower punch head 61.

[0034] Please see Figure 4 and Figure 6 Based on the above technical solution, a workpiece clamping mechanism 30 is further proposed, including a lifting frame 31 mounted on the workpiece positioning base plate 20, a pressing cylinder 32 fixedly mounted on the lifting frame 31, and a workpiece pressing block 33 poweredly connected to the pressing cylinder 32. The lifting frame 31 is used to lift the pressing cylinder 32 so that the piston end of the pressing cylinder 32 can face downward to correspond to the workpiece positioning groove 21. The workpiece pressing block 33 is connected to the piston end of the pressing cylinder 32. When the electronic component is positioned in the workpiece positioning groove 21, the piston end of the pressing cylinder 32 is driven to drive the workpiece pressing block 33 to press the electronic component. In order to improve the pressing accuracy, a positioning pin 34 is provided on the workpiece pressing block 33, and a positioning hole 24 is provided on the workpiece positioning base plate 20 to engage with the positioning pin 34, so that the workpiece pressing block 33 and the workpiece positioning base plate 20 can cooperate more precisely.

[0035] Please see Figure 4-7 Based on the above technical solution, a workpiece unloading mechanism 40 is further proposed, comprising a pusher cylinder 41 fixedly mounted on the workpiece positioning base plate 20 and a pusher block 42 poweredly connected to the pusher cylinder 41. A pusher groove 25 is provided on the workpiece positioning base plate 20 at the rear end of the workpiece positioning groove 21. Pusher fingers 43, which abut against the pusher groove 25, are formed on the pusher block 42. After the pins of the electronic component are punched, the workpiece positioning base plate 20 is pushed forward by the lateral pushing mechanism 12 to the loading position. Then, the pusher cylinder 41 drives the pusher block 42 forward, and the pusher fingers 43 on the pusher block 42 push the electronic component forward, finally causing it to fall from the pin processing notch 22, completing the unloading operation. In the above solution, to achieve automatic recovery of the cut pins and automatic collection of the processed electronic components, please refer to [link to relevant documentation]. Figure 1 Furthermore, the front of the substrate 10 is provided with a waste drawer 13 and a receiving drawer 14. When the workpiece positioning substrate 20 moves to the rear position, the waste drawer 13 is aligned with the bottom of the pin cutting plate 23. When the workpiece positioning substrate 20 moves to the front position, the receiving drawer 14 is aligned with the bottom of the pin processing notch 22.

[0036] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention.

Claims

1. A pin bending mechanism for electronic components, characterized in that, Includes a base (10), on which a linear guide rail (11) and a transverse pushing mechanism (12) are mounted. A workpiece positioning plate (20) is slidably connected to the linear guide rail (11). The workpiece positioning plate (20) is poweredly connected to the transverse pushing mechanism (12). A workpiece pressing mechanism (30) and a workpiece unloading mechanism (40) are mounted on the workpiece positioning plate (20). The workpiece positioning plate (20) slides along the linear guide rail (11) at two positions, front and back, driven by the transverse pushing mechanism (12). The substrate (10) is also equipped with an upper stamping mechanism (50) located above the workpiece positioning plate (20) and a lower stamping mechanism (60) located below the workpiece positioning plate (20). The upper stamping mechanism (50) is provided with an upper punch head (51), and the lower stamping mechanism (60) is provided with a lower punch head (61) that is mated and cooperates with the upper punch head (51). When the workpiece positioning plate (20) moves to the rear position, it corresponds to the upper punch head (51) and the lower punch head (61).

2. The electronic component pin bending mechanism according to claim 1, characterized in that, Two linear guides (11) are provided, and two wings extend from both sides of the workpiece positioning base plate (20). The workpiece positioning base plate (20) is slidably connected to the linear guides (11) through the two wings.

3. The electronic component pin bending mechanism according to claim 1, characterized in that, At least one workpiece positioning groove (21) is provided on the workpiece positioning base plate (20). The workpiece clamping mechanism (30) is connected to the workpiece positioning groove (21). The workpiece unloading mechanism (40) is connected to the rear end of the workpiece positioning groove (21). The workpiece positioning base plate (20) is provided with a pin processing notch (22) at the front position corresponding to the workpiece positioning groove (21). The upper stamping mechanism (50) and the lower stamping mechanism (60) are connected to the pin processing notch (22).

4. The electronic component pin bending mechanism according to claim 3, characterized in that, A pin cutting plate (23) is fixedly installed on the workpiece positioning base plate (20) in front of the pin processing notch (22). A pin cutting blade (52) that is connected to the pin cutting plate (23) is integrated in front of the upper punch head (51), and the pin cutting blade (52) is set lower than the upper punch head (51).

5. The electronic component pin bending mechanism according to claim 1, characterized in that, The workpiece clamping mechanism (30) includes a lifting frame (31) mounted on the workpiece positioning base plate (20), a pressing cylinder (32) fixedly mounted on the lifting frame (31), and a workpiece pressing block (33) powered by the pressing cylinder (32). The workpiece pressing block (33) is provided with a positioning pin (34), and the workpiece positioning base plate (20) is provided with a positioning hole (24) that mates with the positioning pin (34).

6. The electronic component pin bending mechanism according to claim 3, characterized in that, The workpiece unloading mechanism (40) includes a pusher cylinder (41) fixedly installed on the workpiece positioning base plate (20) and a pusher block (42) powered by the pusher cylinder (41). A pusher groove (25) is provided on the workpiece positioning base plate (20) at the rear end of the workpiece positioning groove (21). A pusher finger (43) is formed on the pusher block (42) and engages with the pusher groove (25).

7. The electronic component pin bending mechanism according to claim 6, characterized in that, The front of the substrate (10) is also provided with a scrap drawer (13) and a receiving drawer (14). When the workpiece positioning substrate (20) moves to the rear position, the scrap drawer (13) is aligned with the bottom of the pin cutting plate (23). When the workpiece positioning substrate (20) moves to the front position, the receiving drawer (14) is aligned with the bottom of the pin processing notch (22).