Mold for LED lampshade production

By incorporating an active cooling system with cooling pipes, cooling boxes, and refrigeration components within the mold, the problem of slow natural cooling speed is solved, enabling rapid cooling and efficient production, thereby improving the molding quality and production efficiency of LED lampshades.

CN224360634UActive Publication Date: 2026-06-16CHANGZHOU SD POLYMER PROFILES CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
CHANGZHOU SD POLYMER PROFILES CO LTD
Filing Date
2025-05-14
Publication Date
2026-06-16

AI Technical Summary

Technical Problem

The existing molds used for producing LED lampshades do not have auxiliary cooling structures and mainly rely on natural cooling, which results in slow cooling speed, prolongs production cycle time, reduces production efficiency and increases costs.

Method used

An active cooling system comprising cooling pipes, a cooling tank, a circulation mechanism, and refrigeration components was designed. The system utilizes a water pump to force coolant circulation and a semiconductor refrigeration chip to reduce temperature, thus constructing a highly efficient cooling system.

🎯Benefits of technology

It significantly shortens mold cooling time, improves production efficiency, reduces costs, decreases product defects, and enhances product quality.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224360634U_ABST
    Figure CN224360634U_ABST
Patent Text Reader

Abstract

The utility model discloses a mould for LED lampshade production, including upper mould, guide rod, lower mould and pressing device, the guide rod fixed mounting is in the four corners of lower mould top, the upper mould sliding connection is in the surface of guide rod. The utility model discloses a set of complete initiative cooling system is constructed through setting cooling pipe, cooling box, circulating mechanism and refrigeration assembly etc., compares natural cooling, and initiative cooling system can quickly take away mould heat, greatly shortened mould cooling time, makes mould can enter the next production cycle more quickly, has improved production efficiency significantly, has reduced production cost, simultaneously, the cooling liquid circulates in the spiral cooling pipe and flows, can make mould cooling more evenly, reduces the LED lampshade forming defect because of the uneven cooling, improves product quality, solves the above -mentioned equipment when practical application, has not set up auxiliary cooling structure, mainly relies on natural cooling mode, but the natural cooling speed is relatively slow.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of lampshade production technology, specifically to a mold for producing LED lampshades. Background Technology

[0002] As a key component of LED lighting fixtures, LED lampshades concentrate light, making it more focused and softer, effectively avoiding the glare caused by direct LED light. Injection molds are widely used in the production process of LED lampshades. Through injection molds, the molding and manufacturing of LED lampshades can be completed efficiently.

[0003] Patent CN218429686U discloses a mold for producing LED lampshades. The mold consists of an upper mold and a lower mold. The upper mold has a cavity at its bottom, and the lower mold has a punch at its top. Multiple guide grooves are formed on the top of the lower mold corresponding to the punch positions, and a push rod is slidably connected to each guide groove. A spring is installed between the push rod and the guide groove. Multiple push rods are fixed at the bottom of the upper mold, and guide holes are formed on the top of the lower mold corresponding to the push rod positions, allowing the push rod to be inserted into the corresponding guide hole. A push bar is fixed in the middle of the push rod, with its side extending into the guide hole. A sliding groove is formed on the inner wall of the guide groove for the push bar to slide. This mold structure can automatically realize the demolding operation of the formed lampshade, and its structure is simple and easy to manufacture.

[0004] However, research on the aforementioned patents and related equipment in the prior art revealed that, in actual application, the equipment does not have an auxiliary cooling structure and mainly relies on natural cooling. However, natural cooling is relatively slow. After the LED lampshade is injection molded, if it relies solely on natural heat dissipation for cooling, the required time is long. This will significantly extend the cooling time of the mold in a single production cycle, thereby reducing production efficiency and increasing production costs. Utility Model Content

[0005] To address the problems mentioned in the background art, the purpose of this utility model is to provide a mold for producing LED lampshades, which has the advantage of accelerating molding and solves the problem that the above-mentioned equipment does not have an auxiliary cooling structure and mainly relies on natural cooling, but the natural cooling speed is relatively slow.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a mold for producing LED lampshades, comprising an upper mold, a guide rod, a lower mold, and a pressing device. The guide rod is fixedly installed at the four corners of the top of the lower mold. The upper mold is slidably connected to the surface of the guide rod. The pressing device is fixedly installed at the top of the guide rod, and the output end of the pressing device is fixedly connected to the top of the upper mold. A cooling groove is provided inside the lower mold, and a cooling pipe is installed inside the cooling groove. The cooling pipe is spirally arranged, and its two ends extend through through holes to the left and right sides of the lower mold, respectively. The left end of the cooling pipe is connected to a first flexible hose, and the other end of the first flexible hose is connected to a cooling box. A circulation mechanism is connected to the left side of the cooling box, and a refrigeration component is provided at the top of the cooling box.

[0007] In a preferred embodiment of this invention, the circulation mechanism includes a second hose connected to the left side of the cooling tank, a water pump at the other end of the second hose, an input end of the water pump connected to the second hose, an output end of the water pump connected to a third hose, and the other end of the third hose connected to the right side interface of the cooling pipe.

[0008] In a preferred embodiment of this invention, the refrigeration assembly includes a mounting slot located at the top of the cooling box. A semiconductor refrigeration chip is fixedly mounted inside the mounting slot, with the refrigeration surface of the semiconductor refrigeration chip located inside the cooling box.

[0009] As a preferred embodiment of this invention, a cooling fan is fixedly mounted on the heating surface of the semiconductor cooling chip, and multiple cooling fans are provided and distributed at equal intervals.

[0010] As a preferred embodiment of this invention, the cooling surface of the semiconductor refrigeration chip is fixedly equipped with cooling fins, which are located inside the cooling box.

[0011] As a preferred embodiment of this invention, a drain pipe is connected to the bottom of the front side of the cooling tank, and a valve is connected to the other end of the drain pipe.

[0012] As a preferred embodiment of this invention, an mounting plate is fixedly installed on the left side of the lower mold, and the cooling box and water pump are fixedly installed on the top of the mounting plate.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. This utility model constructs a complete active cooling system by setting up cooling pipes, cooling boxes, circulation mechanisms, and refrigeration components. Compared with natural cooling, the active cooling system can quickly remove heat from the mold, greatly shortening the mold cooling time and allowing the mold to enter the next production cycle more quickly, significantly improving production efficiency and reducing production costs. At the same time, the coolant circulates in the spiral cooling pipe, which can make the mold cool more evenly, reduce LED lampshade molding defects caused by uneven cooling, improve product quality, and solve the problem that the above-mentioned equipment does not have an auxiliary cooling structure and mainly relies on natural cooling, but the natural cooling speed is relatively slow, thus achieving the effect of accelerating molding.

[0015] 2. This utility model, by setting up a circulation mechanism, forces the coolant to circulate through a water pump, which accelerates the flow rate of the cooling medium. Compared with natural cooling, it can more efficiently remove heat from the mold, greatly shorten the mold cooling time, improve production efficiency, and reduce production costs. At the same time, the circulating flow of coolant can make the mold cool more evenly, which helps to improve the molding quality of LED lampshades and reduce product defects caused by uneven cooling.

[0016] 3. This utility model enhances the cooling effect by setting up a cooling component and using a semiconductor cooling chip to reduce the temperature of the coolant, thereby further shortening the mold cooling time. Compared with the cooling method that relies solely on the temperature of the coolant itself for heat dissipation, the semiconductor cooling chip can keep the coolant at a lower temperature, greatly improving the cooling efficiency and thus improving the production efficiency of the mold. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a schematic diagram of the exploded structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the cross-sectional structure of the lower mold of this utility model;

[0020] Figure 4 This is a cross-sectional view of the cooling box and an exploded view of some parts of this utility model.

[0021] In the diagram: 1. Upper mold; 2. Guide rod; 3. Lower mold; 4. Pressing device; 5. Cooling tank; 6. Cooling pipe; 7. First hose; 8. Cooling box; 9. Circulation mechanism; 91. Second hose; 92. Water pump; 93. Third hose; 10. Refrigeration component; 101. Mounting slot; 102. Semiconductor cooling chip; 11. Cooling fan; 12. Cooling fins; 13. Drain pipe; 14. Valve; 15. Mounting plate. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] like Figures 1 to 4 As shown, the present invention provides a mold for producing LED lampshades, including an upper mold 1, a guide rod 2, a lower mold 3, and a pressing device 4. The guide rod 2 is fixedly installed at the four corners of the top of the lower mold 3. The upper mold 1 is slidably connected to the surface of the guide rod 2. The pressing device 4 is fixedly installed at the top of the guide rod 2. The output end of the pressing device 4 is fixedly connected to the top of the upper mold 1. A cooling groove 5 is provided inside the lower mold 3. A cooling pipe 6 is installed inside the cooling groove 5. The cooling pipe 6 is spirally arranged. The two ends of the cooling pipe 6 extend out of the left and right sides of the lower mold 3 through through holes, respectively. The left interface of the cooling pipe 6 is connected to a first flexible hose 7. The other end of the first flexible hose 7 is connected to a cooling box 8. A circulation mechanism 9 is connected to the left side of the cooling box 8. A refrigeration component 10 is provided at the top of the cooling box 8.

[0024] refer to Figure 1 , Figure 2 and Figure 4 The circulation mechanism 9 includes a second hose 91, which is connected to the left side of the cooling box 8. A water pump 92 is provided at the other end of the second hose 91. The input end of the water pump 92 is connected to the second hose 91, and the output end of the water pump 92 is connected to a third hose 93. The other end of the third hose 93 is connected to the right side interface of the cooling pipe 6.

[0025] As a technical optimization of this utility model, by setting up a circulation mechanism 9, the coolant is forced to circulate by a water pump 92, which accelerates the flow rate of the cooling medium. Compared with natural cooling, it can remove the heat from the mold more efficiently, greatly shorten the mold cooling time, improve production efficiency, and reduce production costs. At the same time, the circulating flow of coolant can make the mold cool more evenly, which helps to improve the molding quality of LED lampshades and reduce product defects caused by uneven cooling.

[0026] refer to Figure 1 , Figure 2 and Figure 4 The cooling assembly 10 includes a mounting slot 101, which is located on the top of the cooling box 8. A semiconductor cooling chip 102 is fixedly installed inside the mounting slot 101, and the cooling surface of the semiconductor cooling chip 102 is located inside the cooling box 8.

[0027] As a technical optimization of this utility model, by setting up a cooling component 10, the temperature of the coolant is reduced by the semiconductor cooling chip 102, which enhances the cooling effect and further shortens the mold cooling time. Compared with the cooling method that relies solely on the temperature of the coolant itself for heat dissipation, the semiconductor cooling chip 102 can keep the coolant at a lower temperature, greatly improving the cooling efficiency and thus improving the production efficiency of the mold.

[0028] refer to Figure 1 , Figure 2 and Figure 4 A cooling fan 11 is fixedly installed on the heating surface of the semiconductor cooling chip 102. Multiple cooling fans 11 are provided and are distributed at equal distances.

[0029] As a technical optimization of this utility model, by setting a cooling fan 11, the heat dissipation of the semiconductor refrigeration chip 102 can be effectively assisted. If the heat on the heating surface of the semiconductor refrigeration chip 102 cannot be dissipated in time during operation, the cooling efficiency will be reduced or even damaged. The cooling fan 11 accelerates the heat dissipation, ensuring that the semiconductor refrigeration chip 102 works continuously and stably, thereby ensuring the cooling effect of the cooling component 10 on the coolant.

[0030] refer to Figure 1 , Figure 2 and Figure 4 The cooling surface of the semiconductor refrigeration chip 102 is fixedly equipped with a cooling fin 12, which is located inside the cooling box 8.

[0031] As a technical optimization of this utility model, by setting the cooling fins 12, the heat exchange efficiency between the semiconductor cooling chip 102 and the coolant is significantly enhanced. It increases the contact area between the cooling surface of the semiconductor cooling chip 102 and the coolant, enabling the coolant to absorb cold energy more quickly and reduce the temperature, thereby improving the overall cooling effect of the coolant in the cooling box 8.

[0032] refer to Figure 1 , Figure 2 and Figure 4 The bottom of the front of the cooling box 8 is connected to a drain pipe 13, and the other end of the drain pipe 13 is connected to a valve 14.

[0033] As a technical optimization of this utility model, by setting up a drain pipe 13 and a valve 14, when it is necessary to replace the coolant in the cooling tank 8 or to maintain the cooling system, the valve 14 is opened, and the coolant in the cooling tank 8 is discharged through the drain pipe 13 under its own gravity. The drain pipe 13 is set at the bottom front of the cooling tank 8, which facilitates the complete discharge of the coolant and makes it easy for the operator to operate the valve 14 to drain the coolant.

[0034] refer to Figure 1 , Figure 2 and Figure 4 A mounting plate 15 is fixedly installed on the left side of the lower mold 3, and the cooling box 8 and water pump 92 are fixedly installed on the top of the mounting plate 15.

[0035] As a technical optimization of this utility model, by setting up an installation plate 15, which is fixed on the left side of the lower mold 3, and placing and fixing the cooling box 8 and water pump 92 on the top of the installation plate 15, this installation method integrates the cooling box 8 and water pump 92 with the lower mold 3, making the entire mold cooling system structure compact.

[0036] The working principle and usage process of this utility model are as follows: During use, the operator issues a command to activate the pressing device 4. The power output end of the pressing device 4 pushes the upper mold 1 to slide vertically downwards along the guide rod 2 until the upper mold 1 and the lower mold 3 are tightly fitted together, completing the mold closing action. At this time, the mold cavity at the bottom of the upper mold 1 and the punch at the top of the lower mold 3 cooperate to jointly construct a closed space, which is the area for LED lampshade injection molding. After the mold is closed, the LED lampshade injection material is injected into the molding space inside the mold through the lampshade material inlet pipe at the top of the upper mold 1. As the material continues to be injected, the molding space is gradually filled, and the material begins to be shaped according to the shape of the mold cavity and the punch inside the mold, initially forming the prototype of the LED lampshade. Simultaneously with the start of the injection molding process, the water pump 92 is started first. 92 draws low-temperature coolant from the cooling tank 8 through the second hose 91. Under the strong pressure of the water pump 92, the coolant flows rapidly into the right-side interface of the cooling pipe 6 along the third hose 93. The cooling pipe 6 is cleverly arranged in a spiral shape in the cooling groove 5 inside the lower mold 3. This unique design greatly increases the contact area between the coolant and the lower mold 3. When the coolant flows in the cooling pipe 6, it can fully absorb the large amount of heat emitted by the lower mold 3 and the LED lampshade being formed, achieving efficient cooling of the mold. At the same time, after the semiconductor cooling chip 102 is powered on, its cooling surface quickly plays its role, absorbing the heat of the coolant in the cooling tank 8, further reducing the temperature of the coolant. In order to ensure that the semiconductor cooling chip 102 can work continuously and stably, its heating surface is equipped with multiple cooling fans 11 that are evenly distributed. The cooling fan 11 operates at high speed, quickly dissipating the heat generated by the heating surface of the thermoelectric cooler 102 into the surrounding environment, preventing the thermoelectric cooler 102 from degrading due to excessive temperature. In addition, a cooling fin 12 is fixedly installed on the cooling surface of the thermoelectric cooler 102. The cooling fin 12 is located inside the cooling box 8. Its large surface area can quickly absorb the cold energy from the cooling surface of the thermoelectric cooler 102 and quickly transfer the cold energy to the surrounding coolant, greatly accelerating the cooling speed of the coolant. After absorbing heat through the cooling pipe 6, the coolant flows out from the left port of the cooling pipe 6 and flows back to the cooling box 8 through the first hose 7. Inside the cooling box 8, the coolant is cooled again by the cooling component 10. After returning to a lower temperature, it is pumped back to the cooling pipe 6 by the water pump 92. This cycle repeats, forming a highly efficient coolant circulation cooling system that continuously cools the mold and accelerates the molding process of the LED lampshade.

[0037] In summary, this LED lampshade production mold, by incorporating cooling pipes 6, cooling boxes 8, circulation mechanisms 9, and refrigeration components 10, constructs a complete active cooling system. Compared to natural cooling, the active cooling system can quickly remove heat from the mold, greatly shortening the mold cooling time and allowing the mold to enter the next production cycle more quickly, significantly improving production efficiency and reducing production costs. Simultaneously, the circulating coolant within the spiral cooling pipes 6 ensures more uniform mold cooling, reducing LED lampshade molding defects caused by uneven cooling, improving product quality, and solving the problem of the aforementioned equipment, which in practical applications lacked auxiliary cooling structures and relied primarily on natural cooling, resulting in a relatively slow natural cooling rate.

[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A mold for producing LED lampshades, comprising an upper mold (1), a guide rod (2), a lower mold (3), and a pressing device (4), characterized in that: The guide rod (2) is fixedly installed at the four corners of the top of the lower mold (3). The upper mold (1) is slidably connected to the surface of the guide rod (2). The pressing device (4) is fixedly installed at the top of the guide rod (2). The output end of the pressing device (4) is fixedly connected to the top of the upper mold (1). The lower mold (3) has a cooling groove (5) inside. The cooling groove (5) has a cooling pipe (6) installed inside. The cooling pipe (6) is spirally arranged. The two ends of the cooling pipe (6) extend out of the left and right sides of the lower mold (3) through through holes, respectively. The left interface of the cooling pipe (6) is connected to a first flexible hose (7). The other end of the first flexible hose (7) is connected to a cooling box (8). The left side of the cooling box (8) is connected to a circulation mechanism (9). The top of the cooling box (8) has a refrigeration component (10).

2. The mold for producing LED lampshades according to claim 1, characterized in that: The circulation mechanism (9) includes a second hose (91) connected to the left side of the cooling tank (8). A water pump (92) is provided at the other end of the second hose (91). The input end of the water pump (92) is connected to the second hose (91). The output end of the water pump (92) is connected to a third hose (93). The other end of the third hose (93) is connected to the right side interface of the cooling pipe (6).

3. The mold for producing LED lampshades according to claim 1, characterized in that: The cooling assembly (10) includes a mounting slot (101) which is located on the top of the cooling box (8). A semiconductor cooling chip (102) is fixedly installed inside the mounting slot (101), and the cooling surface of the semiconductor cooling chip (102) is located inside the cooling box (8).

4. The mold for producing LED lampshades according to claim 3, characterized in that: The heating surface of the semiconductor cooling chip (102) is fixedly equipped with a cooling fan (11), and multiple cooling fans (11) are provided and distributed at equal distances.

5. The mold for producing LED lampshades according to claim 3, characterized in that: The cooling surface of the semiconductor cooling chip (102) is fixedly equipped with a cooling fin (12), which is located inside the cooling box (8).

6. The mold for producing LED lampshades according to claim 1, characterized in that: The bottom of the front of the cooling tank (8) is connected to a drain pipe (13), and the other end of the drain pipe (13) is connected to a valve (14).

7. The mold for producing LED lampshades according to claim 2, characterized in that: An mounting plate (15) is fixedly installed on the left side of the lower mold (3), and the cooling box (8) and water pump (92) are fixedly installed on the top of the mounting plate (15).