Chip encapsulating material aid dispersing device

Abstract

The utility model discloses a kind of chip packaging material auxiliary dispersing device, it is related to chip manufacturing technical field.The utility model includes frame body, the central place of frame body top is limited rotationally connected with carousel, the central place of carousel bottom end is fixedly installed with conical cover, the bottom end fixed mounting of conical cover is with compressor, the bottom end fixed mounting of compressor is with rotating shaft, the central place of frame body bottom is fixedly installed with motor, and the motor is with rotating shaft transmission connection, the central place of carousel top is equipped with arc slot, the center of carousel and the bottom of arc slot are all equipped with through-hole, the periphery of carousel is evenly equipped with sliding slot.The utility model utilizes that limiting rod can only be simultaneously outward even expansion and the limiting of substrate edge, can make substrate more accurately adhere at the central place above carousel, to make photoresist received centrifugal force more evenly when rotating, to improve the uniformity of photoresist coating.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing technology, specifically to a chip packaging material additive dispersion device. Background Technology

[0002] Chip packaging refers to the casing used to mount semiconductor integrated circuit chips. It serves to house, fix, seal, and protect the chip, as well as enhance its electrothermal performance. It acts as a bridge between the internal world of the chip and external circuits. The chip's contacts are connected to the pins of the package casing by wires, and the pins are then connected to other devices through wires on the printed circuit board. During the manufacturing process, chip packaging materials require the use of chip packaging material additives. For example, photoresist, as a typical chip packaging material additive, needs to be coated onto a circular substrate during the manufacturing process.

[0003] Existing photoresist coating devices first apply photoresist to the center of a circular substrate, then rotate the substrate using a turntable. This causes the photoresist at the center to be evenly dispersed on the substrate surface under centrifugal force, thus achieving uniform photoresist coating. However, existing dispersion devices use negative pressure adsorption to fix the circular substrate, but this cannot guarantee that circular substrates of different diameters are precisely centered on the turntable during placement. This results in the circular substrate rotating eccentrically, experiencing uneven centrifugal force, and consequently reducing the uniformity of photoresist coating. Utility Model Content

[0004] The purpose of this invention is to solve the problem that, during the placement process, it is impossible to ensure that circular substrates of different diameters are accurately positioned in the center of the turntable, which leads to eccentric rotation of the circular substrates and uneven centrifugal force, thus reducing the uniformity of photoresist coating. This invention provides a chip packaging material additive dispersion device.

[0005] To achieve the above objectives, this utility model specifically adopts the following technical solution:

[0006] A chip packaging material additive dispersion device includes a frame, a turntable rotatably connected to the center of the top of the frame, a conical cover fixedly installed at the center of the bottom of the turntable, a compressor fixedly installed at the bottom of the conical cover, a rotating shaft fixedly installed at the bottom of the compressor, a motor fixedly installed at the center of the bottom of the frame, and the motor is drivenly connected to the rotating shaft, an arc groove is formed at the center of the top of the turntable, through holes are formed at the center of the turntable and the bottom of the arc groove, and sliding grooves are uniformly formed on the outer periphery of the turntable, with a limit component provided between the inner side of the sliding groove and the outer periphery of the rotating shaft.

[0007] Furthermore, the through holes at the bottom of the arc groove are evenly distributed within the arc groove, and all the through holes penetrate the turntable from top to bottom.

[0008] Furthermore, the fixed mounting points at the top of the conical cover and the bottom of the turntable enclose all the through holes. Therefore, when the substrate is placed above the turntable and covers the arc groove, the compressor can generate negative pressure inside the conical cover, thereby adsorbing and fixing the substrate.

[0009] Furthermore, the limiting assembly includes a limiting rod. The limiting rod is uniformly and rotatably connected to the outer periphery of the top of the rotating shaft. The limiting rod passes upward through a slide groove and is slidably connected to the inner side of the slide groove. A mounting seat is slidably connected to the inner side of the top of the limiting rod. A spring is fixedly connected between the bottom end of the mounting seat located in the inner region of the limiting rod and the inner wall of the limiting rod. A roller is rotatably connected to the inner side of the mounting seat. A sliding column is slidably connected to the center of the bottom of the rotating shaft. A spring is fixedly connected between the bottom end of the sliding column and the inner wall of the rotating shaft. A support rod is tractively connected between the outer periphery of the top of the sliding column and the outer wall of the limiting rod.

[0010] Furthermore, the inner side of the mounting base extends obliquely upward, so that the substrate contacts the inner side of the mounting base first.

[0011] Furthermore, one end of the support rod is hinged to the outer periphery of the top of the sliding column, and the other end is tilted outward and then hinged upward to the outer wall of the limiting rod. Therefore, when the limiting rod moves outward, it can push the support rod downward.

[0012] Furthermore, a feed tube is provided above the turntable, and the opening at the bottom of the feed tube is aligned with the center of the turntable, so that after the substrate is placed, photoresist can be coated on the center of the substrate.

[0013] The beneficial effects of this utility model are as follows:

[0014] This invention, through the design of a limiting component between the inner side of the slide groove on the turntable and the outer periphery of the rotating shaft, allows the substrate to be more precisely attached to the center of the turntable during the placement and adsorption fixation process by using the limiting rod to simultaneously and evenly expand outward and limit the edge of the substrate. This results in a more uniform centrifugal force on the photoresist during rotation, thereby improving the uniformity of photoresist coating. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the three-dimensional structure of this utility model. Figure 1 ;

[0016] Figure 2 This is a schematic diagram of the three-dimensional structure of this utility model. Figure 2 ;

[0017] Figure 3 This is a cross-sectional three-dimensional structural schematic diagram of the present invention;

[0018] Figure 4 This is a schematic diagram of the internal three-dimensional structure of the frame of this utility model. Figure 1 ;

[0019] Figure 5 This is a schematic diagram of the internal three-dimensional structure of the frame of this utility model. Figure 2 ;

[0020] Figure 6 This is a three-dimensional structural diagram of the peripheral limiting component of the rotating shaft of this utility model;

[0021] Figure 7 This is a partial cross-sectional three-dimensional structural diagram of the peripheral limiting component of the rotating shaft of this utility model.

[0022] Reference numerals in the attached drawings: 1. Frame; 2. Turntable; 3. Conical cover; 4. Compressor; 5. Rotating shaft; 6. Motor; 7. Arc groove; 8. Through hole; 9. Slide groove; 10. Limiting component; 101. Limiting rod; 102. Mounting base; 103. Spring 1; 104. Roller; 105. Sliding column; 106. Spring 2; 107. Support rod; 11. Conveying pipe. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0024] A preferred embodiment of the present invention, a chip packaging material additive dispersion device, will be described in detail below, such as... Figures 1-7 As shown, a chip packaging material additive dispersion device includes a frame 1. A turntable 2 is rotatably connected to the center of the top of the frame 1. A conical cover 3 is fixedly installed at the center of the bottom of the turntable 2. A compressor 4 is fixedly installed at the bottom of the conical cover 3. The fixed installation points of the top of the conical cover 3 and the bottom of the turntable 2 enclose all the through holes 8. Therefore, when the substrate is placed above the turntable 2 and covers the arc groove 7, the compressor 4 can generate a negative pressure inside the conical cover 3, thereby adsorbing and fixing the substrate.

[0025] A rotating shaft 5 is fixedly installed at the bottom of the compressor 4. A motor 6 is fixedly installed at the center of the bottom of the frame 1, and the motor 6 is connected to the rotating shaft 5 for transmission. An arc groove 7 is opened at the center of the top of the turntable 2. Through holes 8 are opened at the center of the turntable 2 and the bottom of the arc groove 7. The through holes 8 at the bottom of the arc groove 7 are evenly distributed in the arc groove 7, and the through holes 8 all penetrate the turntable 2 from top to bottom.

[0026] The turntable 2 has uniformly spaced grooves 9 on its outer periphery. A limiting component 10 is provided between the inner side of the grooves 9 and the outer periphery of the rotating shaft 5. The limiting component 10 includes a limiting rod 101. The limiting rod 101 is uniformly and rotatably connected to the outer periphery of the top of the rotating shaft 5. The limiting rod 101 passes upward through the grooves 9 and is slidably connected to the inner side of the grooves 9. A mounting seat 102 is slidably connected to the inner side of the top of the limiting rod 101. A spring 103 is fixedly connected between the bottom end of the mounting seat 102 located in the inner region of the limiting rod 101 and the inner wall of the limiting rod 101. A roller 104 is rotatably connected to the inner side of the mounting seat 102. The inner side of the mounting seat 102 extends obliquely upward, so that the substrate contacts the inner side of the mounting seat 102 first.

[0027] A sliding column 105 is slidably connected to the center of the bottom of the rotating shaft 5. A spring 106 is fixedly connected between the bottom end of the sliding column 105 and the inner wall of the rotating shaft 5. A support rod 107 is connected to the outer periphery of the top of the sliding column 105 and the outer wall of the limiting rod 101. One end of the support rod 107 is hinged to the outer periphery of the top of the sliding column 105, and the other end is tilted outward and then hinged upward to the outer wall of the limiting rod 101. Therefore, when the limiting rod 101 moves outward, it can push the support rod 107 to move downward.

[0028] A feed tube 11 is provided above the turntable 2, and the opening at the bottom of the feed tube 11 is aligned with the center of the turntable 2, so that after the substrate is placed, photoresist can be applied to the center of the substrate.

[0029] The working principle of this utility model is as follows:

[0030] During coating, a circular substrate is placed above the turntable 2. During placement, the substrate will first contact the roller 104 on the inner side of the mounting base 102, and then the substrate will be pressed down. During the pressing down of the substrate, the mounting base 102 can compress the spring 103 and move downward.

[0031] At the same time, when the substrate is pressed down, it will also push the limiting rod 101 to move outward. During the process of the limiting rod 101 moving outward, the supporting rod 107 can push the sliding column 105 to compress the spring 106 downward until the substrate is attached to the top end face of the turntable 2. Then the compressor 4 is started to generate negative pressure inside the conical cover 3, and then the substrate is adsorbed and fixed by the cooperation of the arc groove 7 and the through hole 8.

[0032] After the substrate is adsorbed and fixed, photoresist is applied to the center of the substrate through the feed tube 11. Then, the rotating shaft 5 is driven to rotate by the start motor 6, which in turn drives the turntable 2 and the substrate to rotate. During the rotation, the photoresist at the center of the substrate will be evenly dispersed outward under the action of centrifugal force, thereby achieving uniform coating of photoresist on the substrate.

[0033] By utilizing the limiting sliding connection of the slide column 105 inside the rotating shaft 5, the slide column 105 can only move up and down, thereby allowing the limiting rod 101 to unfold evenly to the outside at the same time. Therefore, during the process of placing and pressing the substrate, the limiting rod 101 will make the substrate more accurately attached to the center above the turntable 2, thereby making the centrifugal force on the photoresist more uniform during rotation, thus improving the uniformity of photoresist coating.

[0034] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A chip packaging material additive dispersion device, comprising a frame (1), characterized in that, A turntable (2) is rotatably connected to the center of the top of the frame (1). A conical cover (3) is fixedly installed at the center of the bottom of the turntable (2). A compressor (4) is fixedly installed at the bottom of the conical cover (3). A rotating shaft (5) is fixedly installed at the bottom of the compressor (4). A motor (6) is fixedly installed at the center of the bottom of the frame (1), and the motor (6) is connected to the rotating shaft (5) in a transmission manner. An arc groove (7) is opened at the center of the top of the turntable (2). Through holes (8) are opened at the center of the turntable (2) and the bottom of the arc groove (7). Sliding grooves (9) are evenly opened on the outer periphery of the turntable (2). A limiting component (10) is provided between the inner side of the sliding groove (9) and the outer periphery of the rotating shaft (5).

2. The chip packaging material additive dispersion device according to claim 1, characterized in that, The through holes (8) at the bottom of the arc groove (7) are evenly distributed within the arc groove (7), and the through holes (8) all penetrate the turntable (2) from top to bottom.

3. The chip packaging material additive dispersion device according to claim 1, characterized in that, The top of the conical cover (3) and the bottom of the turntable (2) are fixedly installed to enclose all the through holes (8).

4. The chip packaging material additive dispersion device according to claim 1, characterized in that, The limiting component (10) includes: Limiting rod (101): The outer periphery of the top of the rotating shaft (5) is uniformly limited to the rotational connection of the limiting rod (101). The limiting rod (101) passes upward through the slide groove (9) and is limited to the sliding connection inside the slide groove (9). Mounting base (102), the inner side of the top of the limiting rod (101) is slidably connected to the mounting base (102); Spring 1 (103) is fixedly connected between the bottom end of the mounting base (102) located in the inner region of the limiting rod (101) and the inner wall of the limiting rod (101); Roller (104), the inner side of the mounting base (102) is rotatably connected to the roller (104); A sliding column (105) is slidably connected to the center of the bottom of the rotating shaft (5); Spring 2 (106) is fixedly connected between the bottom end of the sliding column (105) and the inner wall of the rotating shaft (5); The support rod (107) is connected to both the top periphery of the sliding column (105) and the outer side wall of the limiting rod (101).

5. The chip packaging material additive dispersion device according to claim 4, characterized in that, The mounting base (102) extends obliquely upward on the inner side.

6. The chip packaging material additive dispersion device according to claim 4, characterized in that, One end of the support rod (107) is hinged to the outer periphery of the top of the sliding column (105), and the other end is tilted outward and then hinged upward to the outer wall of the limiting rod (101).

7. The chip packaging material additive dispersion apparatus according to any one of claims 1-6, characterized in that, A material conveying pipe (11) is provided above the turntable (2), and the opening at the bottom of the material conveying pipe (11) is aligned with the center of the turntable (2).

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