Heat dissipation enhanced heat dissipation fan

Abstract

A heat dissipation enhanced heat dissipation fan for dissipating heat from a portable electronic product and comprising a housing, a fan body and a heat dissipation module. The housing has a receiving space and is provided with an air inlet and an air outlet, both of which are in communication with the receiving space, and a flow channel is formed among the air inlet, the receiving space and the air outlet; the fan body is arranged in the receiving space; and the heat dissipation module is arranged on the housing and comprises a fin group and a placement platform which are connected to each other, the fin group is located on a flow path of the flow channel, and the placement platform is located outside the receiving space. Heat generated by the portable electronic product placed on the placement platform is transferred to the heat dissipation module, and airflow generated by the fan body blows along the flow channel to the fin group and is discharged from the air outlet to take away the heat. In this way, the heat dissipation efficiency of the heat dissipation fan can be effectively enhanced.

Description

Technical Field

[0001] This utility model relates to cooling fans, and in particular to a cooling fan with enhanced heat dissipation. Background Technology

[0002] Cooling fans primarily work by using the airflow generated by the rotation of their fan wheels to blow heat-generating electronic products (such as mobile phones or tablets), so that the airflow carries away the heat generated by these electronic products, thus achieving the cooling effect of the cooling fan.

[0003] However, in pursuit of high-efficiency operation, modern portable electronic products inevitably generate significantly more heat. In other words, the conventional cooling method of simply blowing airflow onto portable electronic products is no longer sufficient to achieve the required cooling and therefore needs to be improved.

[0004] Therefore, how to improve upon the shortcomings of the aforementioned prior technologies is a major issue that the creator of this application urgently needs to address. Utility Model Content

[0005] The purpose of this application is to provide a cooling fan with enhanced heat dissipation.

[0006] To achieve the above objectives, this application provides a heat dissipation-enhanced cooling fan for cooling portable electronic products, comprising: a housing having an accommodating space and an air inlet and an air outlet, the air inlet and the air outlet both communicating with the accommodating space and forming a flow channel between the three; a fan body disposed within the accommodating space; and a heat dissipation module disposed within the housing and comprising a fin assembly and a placement platform connected to each other, the fin assembly being located on the flow channel and the placement platform being located outside the accommodating space; wherein the portable electronic product is placed on the placement platform, and the airflow generated by the fan body blows along the flow channel toward the fin assembly and is discharged from the air outlet.

[0007] Furthermore, the accommodating space is divided into a first space and a second space. The air inlet is connected to the first space, the air outlet is connected to the second space, the fan body is located in the first space, the fin assembly is located in the second space, the flow channel includes an exhaust section that flows through the second space, and the fin assembly is located on the exhaust section.

[0008] Furthermore, the housing comprises a cover and a carrier plate that are combined with each other, the fan body is disposed on the carrier plate and located within the accommodating space, and the heat dissipation module is integrally formed on the cover corresponding to the exhaust port position.

[0009] Furthermore, the casing is a metal shell with an inner shell surface, and the fin assembly is integrally connected to the inner shell surface.

[0010] Furthermore, the fin group includes a plurality of heat dissipation fins spaced apart from each other, a channel is formed between any two adjacent heat dissipation fins, each channel is connected to the exhaust port, and at least one side of each heat dissipation fin is integrally connected to the inner shell surface.

[0011] Furthermore, the housing comprises a cover and a carrier plate that are combined with each other, the fan body is disposed on the carrier plate and located within the accommodating space, and the heat dissipation module is fixed to the cover corresponding to the exhaust port position.

[0012] Furthermore, the casing is a metal casing or a plastic casing and is provided with a first structure, and the heat dissipation module is provided with a second structure, and the heat dissipation module is fixed to the first structure by the second structure.

[0013] Furthermore, the fin group includes a plurality of heat dissipation fins spaced apart from each other and arranged side by side, with a channel formed between any two adjacent heat dissipation fins, each channel connecting to the exhaust port, and at least one side of each heat dissipation fin contacting the casing.

[0014] Furthermore, the flow channel includes an air inlet section flowing from the air inlet to the fan body and an air outlet section flowing from the fan body to the air outlet, with the fin assembly located on the air outlet section.

[0015] The beneficial effects of this utility model are as follows: Compared with the prior art, this application has the following effects: it can effectively enhance the heat dissipation efficiency (heat dissipation capacity) of the cooling fan.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0018] Figure 1 This is an exploded perspective view of the first embodiment of the cooling fan of this application.

[0019] Figure 2 This is a perspective view of the cooling fan in the first embodiment of this application.

[0020] Figure 3 This application is based on Figure 2 A three-dimensional image viewed from below.

[0021] Figure 4 This is a cross-sectional schematic diagram of the first embodiment of the cooling fan of this application.

[0022] Figure 5This is a longitudinal cross-sectional view of the first embodiment of the cooling fan of this application.

[0023] Figure 6 This is an exploded perspective view of the second embodiment of the cooling fan of this application.

[0024] Figure 7 This is a perspective view of the second embodiment of the cooling fan of this application.

[0025] Figure 8 This is a longitudinal cross-sectional view of the second embodiment of the cooling fan of this application.

[0026] In the picture: 1: Outer shell

[0027] 11: Cover

[0028] 111: Inner shell surface

[0029] 12: Carrier board

[0030] 13: Turning Point Guiding Section

[0031] 15 storage spaces

[0032] 151: First Space

[0033] 152: Second Space

[0034] 3: Fan body

[0035] 4a, 4b: Heat dissipation modules

[0036] 41a, 41b: Fin group

[0037] 411: Heat dissipation fins

[0038] 412: Channel

[0039] 42: Placement platform

[0040] 421: Placement surface

[0041] I: Air Inlet

[0042] E: Exhaust vent

[0043] R: Flow channel

[0044] R1: Air intake section

[0045] R2: Exhaust section

[0046] S1: First Structure

[0047] S2: Second structure. Detailed Implementation

[0048] To make the objectives, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model are described in detail below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of this utility model more thorough and complete.

[0049] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," "upper," "lower," and similar expressions used herein are for illustrative purposes only and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

[0050] In this utility model, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances. The term "and / or" as used herein includes any and all combinations of one or more of the related listed items.

[0051] The detailed description and technical content of this application are illustrated below with reference to the accompanying drawings. However, the accompanying drawings are provided for reference and illustration only and are not intended to limit this application.

[0052] This application provides a heat dissipation-enhanced cooling fan, which can effectively improve the heat dissipation efficiency of the cooling fan. For example... Figures 1 to 5 The first embodiment is shown below. Figures 6 to 8 The following is a second embodiment.

[0053] like Figures 1 to 5 As shown, the heat dissipation enhanced cooling fan (hereinafter referred to as "cooling fan") of this application is used to dissipate heat from portable electronic products (not shown in the figure), and includes: a housing 1, a fan body 3, and a heat dissipation module 4a. Portable electronic products may be, for example, mobile phones or tablet computers, etc., and this application does not limit this; any portable electronic product that has heat dissipation requirements is included.

[0054] The outer casing 1 can be a single-piece structure (not shown in the figure), or it can be as follows: Figure 1 and Figure 2 The two-piece structure (or more than two-piece structure) shown is not limited in this application, but in this embodiment, a two-piece structure is used as an example for explanation.

[0055] The outer casing 1 comprises a cover 11 and a carrier plate 12 assembled together. The cover 11 may be an inverted type as shown in the figure and has a cover opening (component symbol not shown). The cover 11 also has an air inlet I. The carrier plate 12 covers the cover 11 at the position corresponding to the cover opening, and the carrier plate 12 and the cover 11 are not completely covered, forming a gap as if... Figure 5 The diagram shows a row of air vents E. Furthermore, the outer casing 1 also forms an accommodating space 15 between the cover 11 and the carrier plate 12. This accommodating space 15 is divided into a first space 151 and a second space 152 that are interconnected and communicate with each other. The air inlet I corresponds to the first space 151 and is interconnected with it, while the air outlet E corresponds to the second space 152 and is interconnected with it. In other words, the accommodating space 15 connects the air inlet I and the air outlet E.

[0056] The fan body 3 is disposed on the inner surface of the carrier plate 12 and located within the first space 151, so that the air inlet I, the fan body 3, and the air outlet E can form a similar arrangement within the accommodating space 15. Figure 5 The flow channel R is shown. In detail, the flow channel R includes an air inlet section R1 and an air outlet section R2 that are connected to each other. The air inlet section R1 flows from the air inlet I to the fan body 3, and the air outlet section R2 flows from the fan body 3 to the air outlet E.

[0057] The heat dissipation module 4a is made of metal and is disposed on the outer shell 1. However, this application does not limit its disposal method. It can be integrally formed on the outer shell 1 or can be fixed to the outer shell 1 in any feasible fixing method. In this embodiment, the example is that it is integrally formed on the cover 11 at the position corresponding to the exhaust port E.

[0058] In detail, the casing 11 may be a metal shell made of metal, and the metal casing 11 has an inner shell surface 111. The heat dissipation module 4a includes a fin assembly 41a and a placement platform 42 integrally connected to each other. The fin assembly 41a is integrally connected to the inner shell surface 111 within the second space 152. When heat is transferred to the cover 11 via the heat dissipation module 4a, the metal cover 11 can bear some of the heat dissipation. Moreover, the fin assembly 41a can also be located on the flow path of the exhaust section R2. The fin assembly 41a includes a plurality of heat dissipation fins 411 arranged side by side at intervals, so as to form a channel 412 between any two adjacent heat dissipation fins 411. Each channel 412 connects the air inlet I and the air outlet E. At least one side of each heat dissipation fin 411 is integrally connected to the inner shell surface 111. The placement platform 42 is integrally connected to the cover 11 outside the accommodating space 15. The placement platform 42 has a placement surface 421. The placement surface 421 is used to place portable electronic devices and its facing direction is the same as the facing direction of the outer surface of the carrier plate 12 (opposite to the aforementioned inner surface).

[0059] In this way, such as Figure 5 and pair Figure 4 As shown, when a portable electronic device is placed on the placement platform 42, the heat from the portable electronic device will be transferred to the fin assembly 41a via the placement platform 42. This allows the airflow generated by the fan body 3 after rotation to pass through all channels 412 of the fin assembly 41a along the exhaust section R2 and be discharged from the exhaust port E, thereby carrying away the heat transferred to the fin assembly 41a (hereinafter referred to as fin heat dissipation). The cooling fan of this application has the effect of effectively enhancing heat dissipation through fin heat dissipation, that is, effectively enhancing heat dissipation efficiency (heat dissipation capacity).

[0060] Ideally, such as Figure 1 , Figure 3 and Figure 5 As shown, the cover 11 may also have a turning guide 13. The turning guide 13 is connected between the first space 151 and the placement platform 42 at the position corresponding to the second space 152. The aforementioned inner shell surface 111 is located at the arc-shaped turning guide 13, so as to smoothly guide the airflow from the original horizontal direction to the vertical direction and discharge it from the exhaust port E.

[0061] like Figures 6 to 8 As shown, this is the second embodiment of the cooling fan of this application. The second embodiment is largely the same as the first embodiment described above, except that the cooling module 4b is fixed to the outer casing 1 in a certain fixed direction.

[0062] The casing 11 can be a metal casing as described above, or it can be a plastic casing. In order to allow the casing 11 to also bear some of the heat dissipation, the casing 11 in this embodiment will be described as a metal casing.

[0063] The heat dissipation module 4b also includes interconnected fin groups 41b and a placement platform 42. The housing 11 has a first structure S1 corresponding to the exhaust port E, and the heat dissipation module 4b has a second structure S2 that can be fixed to the first structure S1. Therefore, by fixing the second structure S2 to the first structure S1, the heat dissipation module 4b can be fixed to the housing 11 corresponding to the exhaust port E. The fin groups 41b also include a plurality of heat dissipation fins 411 spaced apart and arranged side-by-side. At least one side of each heat dissipation fin 411 can contact the inner shell surface 111 (e.g., ...). Figure 8 As shown in the figure, it is also possible to avoid contact (not shown in the figure). In this embodiment, contact is used as an example to illustrate the process, so that the cover 11 can also bear some of the heat dissipation.

[0064] In conclusion, the heat dissipation enhanced cooling fan of this application can indeed achieve the expected purpose and effect, and can solve the shortcomings of the prior art. Therefore, this patent application is filed.

[0065] The above description is merely a preferred embodiment of this application and does not limit the scope of this application. All equivalent structural changes made using the description and drawings of this application are also included within the scope of this application and are hereby stated.

[0066] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0067] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A heat dissipation enhanced cooling fan for cooling portable electronic products, characterized in that, include: An outer casing having a receiving space and an air inlet and an air outlet, the air inlet and the air outlet being connected to the receiving space and forming a flow channel between the three; A fan body is disposed within the accommodating space; and A heat dissipation module is disposed on the housing and includes a fin assembly and a placement platform connected to each other. The fin assembly is located on the flow channel, and the placement platform is located outside the accommodating space. The portable electronic product is placed on the platform, and the airflow generated by the fan body blows along the flow channel toward the fin assembly and is discharged from the exhaust port.

2. The heat dissipation enhanced cooling fan according to claim 1, characterized in that, The accommodating space is divided into a first space and a second space. The air inlet is connected to the first space, and the air outlet is connected to the second space. The fan body is located in the first space, and the fin assembly is located in the second space. The flow channel includes an exhaust section that flows through the second space, and the fin assembly is located on the exhaust section.

3. The heat dissipation enhanced cooling fan according to claim 1, characterized in that, The housing comprises a cover and a carrier plate that are assembled together. The fan body is disposed on the carrier plate and located within the accommodating space. The heat dissipation module is integrally formed on the cover corresponding to the exhaust port position.

4. The heat dissipation enhanced cooling fan according to claim 3, characterized in that, The casing is a metal shell with an inner shell surface, and the fin assembly is integrally connected to the inner shell surface.

5. The heat dissipation enhanced cooling fan according to claim 4, characterized in that, The fin group includes a plurality of heat dissipation fins spaced apart from each other, and a channel is formed between any two adjacent heat dissipation fins. Each channel is connected to the exhaust port, and at least one side of each heat dissipation fin is integrally connected to the inner shell surface.

6. The heat dissipation enhanced cooling fan according to claim 1, characterized in that, The housing comprises a cover and a carrier plate that are assembled together. The fan body is disposed on the carrier plate and located within the accommodating space. The heat dissipation module is fixed to the cover corresponding to the exhaust port position.

7. The heat dissipation enhanced cooling fan according to claim 6, characterized in that, The casing is a metal shell or a plastic shell and is provided with a first structure. The heat dissipation module is provided with a second structure and is fixed to the first structure by the second structure.

8. The heat dissipation enhanced cooling fan according to claim 6, characterized in that, The fin group comprises a plurality of heat dissipation fins spaced apart from each other, with a channel formed between any two adjacent heat dissipation fins, each channel connecting to the exhaust port, and at least one side of each heat dissipation fin contacting the casing.

9. The heat dissipation enhanced cooling fan according to claim 1, characterized in that, The flow channel includes an air inlet section from the air inlet to the fan body and an air outlet section from the fan body to the air outlet, with the fin assembly located on the air outlet section.

Images