A high heat dissipating photovoltaic power semiconductor module junction box and a junction box assembly

Abstract

The utility model discloses a high heat dissipation photovoltaic power semiconductor module terminal box and terminal box subassembly, including first box body, first box cover and first photovoltaic power semiconductor module, first photovoltaic power semiconductor module installs in the first containing space that box body and box cover constitute, still include pouring sealant, pouring sealant is located in the first containing space and seals and is wrapped first photovoltaic power semiconductor module, first box cover is high heat conduction material, first box cover and pouring sealant contact, and the structure in this way directly contacts high heat conduction upper cover and pouring sealant in the box body to improve the heat dissipation capacity of whole terminal box greatly.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic power semiconductor module junction boxes, and in particular to a high heat dissipation photovoltaic power semiconductor module junction box and junction box assembly. Background Technology

[0002] Photovoltaic power semiconductor modules are an important component of photovoltaic modules, primarily used to improve the reliability and efficiency of photovoltaic systems. When a cell in a photovoltaic string experiences current mismatch due to shading, damage, or performance degradation, the bypass module provides a low-resistance bypass path for that cell, allowing current to flow around the faulty cell. This reduces hot spot effects, protects other normally functioning cells from damage, and maintains the overall power generation efficiency of the photovoltaic module.

[0003] Photovoltaic power semiconductor modules are installed in photovoltaic power semiconductor module junction boxes. At present, multiple split junction boxes are used on photovoltaic modules. Each junction box is equipped with one or more bypass diodes, which are electrically connected to the module busbars to realize circuit transmission.

[0004] When using multiple split-type junction boxes, the heat dissipation of the bypass diodes in each junction box is different. For example, if a photovoltaic module has two junction boxes installed on a photovoltaic system, one junction box may have one bypass diode, while the other has two. The junction box with two bypass diodes has a lower heat dissipation capacity than the junction box with one bypass diode, thus affecting the current flowing through the entire bypass module. Even in the most commonly used three-part junction box design, the heat dissipation capacity of the middle junction box is less than that of the left and right side junction boxes.

[0005] Many companies add heat sinks, metal components, and metal blocks to the housing to improve the heat dissipation capacity of the entire photovoltaic power semiconductor module, but this also increases the cost significantly. Utility Model Content

[0006] The technical problem solved by this utility model is to provide a high-heat-dissipation photovoltaic power semiconductor module junction box that improves the heat dissipation capacity of the junction box.

[0007] The technical solution adopted by this utility model to solve its technical problem is: a high heat dissipation photovoltaic power semiconductor module junction box, including a first box body, a first box cover and a first photovoltaic power semiconductor module. The first photovoltaic power semiconductor module is installed in a first accommodating space formed by the box body and the box cover. It also includes potting compound, which is located in the first accommodating space and seals and wraps the first photovoltaic power semiconductor module. The first box cover is made of a high thermal conductivity material and is in contact with the potting compound.

[0008] Furthermore, the first lid is made of metal or high thermal conductivity ceramic material.

[0009] Furthermore, the bottom of the first box cover is provided with a protrusion facing the direction of the potting compound.

[0010] Furthermore, the surface of the first box lid is provided with several notches.

[0011] Furthermore, several notches are arranged in a honeycomb pattern on the surface of the first lid.

[0012] Furthermore, the first photovoltaic power semiconductor module includes a diode, which is an axial diode, or...

[0013] The diode includes a diode chip with PN poles, and conductors are disposed at both ends of the diode chip.

[0014] Furthermore, it also includes a connecting metal component, which is connected to the diode.

[0015] The present invention also discloses a junction box assembly, comprising N high heat dissipation photovoltaic power semiconductor module junction boxes as described above, wherein N≥1, wherein the leftmost high heat dissipation photovoltaic power semiconductor module junction box and the rightmost high heat dissipation photovoltaic power semiconductor module junction box are respectively connected to cables.

[0016] The present invention also discloses a junction box assembly, including the above-mentioned N high heat dissipation photovoltaic power semiconductor module junction boxes, and M conventional photovoltaic power semiconductor module junction boxes, wherein N≥1 and M≥1. The conventional photovoltaic power semiconductor module junction box includes a second box body, a second box cover, and a second photovoltaic power semiconductor module. The second photovoltaic power semiconductor module is installed in a second accommodating space formed by the second box body and the second box cover. The second box cover is made of a polymer material.

[0017] Furthermore, there are two conventional photovoltaic power semiconductor module junction boxes, namely a left junction box and a right junction box, and N high heat dissipation photovoltaic power semiconductor module junction boxes are located between the left junction box and the right junction box. One end of the left junction box and the right junction box is connected to a cable.

[0018] The beneficial effects of this utility model are:

[0019] 1. In this structure, the heat dissipation capacity of the entire junction box is greatly improved by directly contacting the high thermal conductivity top cover with the potting compound inside the box.

[0020] 2. The concave design on the lid surface increases the heat dissipation area and further improves heat dissipation efficiency.

[0021] 3. In the junction box assembly, by reasonably matching high heat dissipation photovoltaic power semiconductor module junction boxes and conventional photovoltaic power semiconductor module junction boxes, not only is the overall heat dissipation performance improved, but the system's flexibility and cost-effectiveness are also maintained. Attached Figure Description

[0022] Figure 1 This is an exploded view of the junction box for a high-heat-dissipation photovoltaic power semiconductor module according to an embodiment of this application.

[0023] Figure 2 This is a cross-sectional view of the junction box for a high-heat-dissipation photovoltaic power semiconductor module according to an embodiment of this application.

[0024] Figure 3 This is a schematic diagram of a high-heat-dissipation photovoltaic power semiconductor module junction box filled with potting compound according to an embodiment of this application.

[0025] Figure 4 This is a schematic diagram of the cover of the junction box for a high-heat-dissipation photovoltaic power semiconductor module according to an embodiment of this application.

[0026] Figure 5 This is a schematic diagram of the diode chip in the junction box of the high heat dissipation photovoltaic power semiconductor module according to an embodiment of this application.

[0027] Figure 6 This is a schematic diagram of the axial diode in the junction box of the high heat dissipation photovoltaic power semiconductor module according to an embodiment of this application.

[0028] Figure 7 This is a schematic diagram of a photovoltaic power semiconductor module junction box with connecting metal parts installed according to an embodiment of this application.

[0029] Figure 8 This is a schematic diagram of the structure of a conventional photovoltaic power semiconductor module junction box according to an embodiment of this application.

[0030] Figure 9 This is a schematic diagram of a first embodiment of the junction box assembly according to the present application.

[0031] Figure 10 This is a schematic diagram of a second embodiment of the junction box assembly according to the present application.

[0032] Figure 11 This is a schematic diagram of a third embodiment of the junction box assembly of this application.

[0033] Figure 12 This is a schematic diagram of a fourth embodiment of the junction box assembly according to the present application.

[0034] The components in the diagram are labeled as follows: First box 11, First box cover 12, Protrusion 121, Recess 122, First photovoltaic power semiconductor module 13, Axial diode 131, Diode chip 132, Conductor 133, Connecting metal part 134, Encapsulating glue 14, Conventional photovoltaic power semiconductor module junction box 2, Second box 21, Second box cover 22, Second photovoltaic power semiconductor module 23, Left junction box 2A, Right junction box 2B, Cable 3. Detailed Implementation

[0035] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0036] like Figures 1 to 3 As shown in the figure, an embodiment of this application discloses a high heat dissipation photovoltaic power semiconductor module junction box, including a first box body 11, a first box cover 12 and a first photovoltaic power semiconductor module 13. The first photovoltaic power semiconductor module 13 is installed in a first accommodating space formed by the box body and the box cover. It also includes potting compound 14, which is located in the first accommodating space and seals and wraps the first photovoltaic power semiconductor module 13. The first box cover 12 is made of a high thermal conductivity material and is in contact with the potting compound 14.

[0037] Specifically, in the above structure, the high thermal conductivity of the first cover 12 allows for rapid heat dissipation from inside the junction box, improving heat dissipation efficiency. Simultaneously, the direct contact between the first cover 12 and the potting compound 14 further ensures effective heat transfer, preventing heat accumulation inside the junction box.

[0038] In this embodiment, the first box cover 12 is made of metal or high thermal conductivity ceramic material.

[0039] Specifically, the first cover 12 is made of a metal material, such as aluminum alloy or copper alloy, but preferably aluminum. These metal materials not only have good thermal conductivity but also high strength and corrosion resistance, which can meet the usage requirements of photovoltaic power semiconductor module junction boxes. High thermal conductivity ceramic materials have excellent high temperature resistance and stable chemical properties, and can maintain stable heat dissipation in harsh working environments.

[0040] In this embodiment, the bottom of the first cover 12 is provided with a protrusion 121 facing the potting compound 14. This design can increase the contact area between the first cover 12 and the potting compound 14, thereby further improving the heat transfer efficiency.

[0041] In this embodiment, as Figure 4As shown, the surface of the first cover 12 is provided with a plurality of recesses 122. These recesses 122 can increase the surface area of ​​the first cover 12, thereby increasing the heat dissipation area and improving the heat dissipation efficiency.

[0042] In this embodiment, a number of notches 122 are arranged in a honeycomb pattern on the surface of the first lid 12.

[0043] Specifically, the above-mentioned structural design is not only aesthetically pleasing, but also effectively enhances the heat dissipation performance of the box cover. The honeycomb-shaped notches 122 can form multiple tiny heat dissipation channels, which facilitates the rapid dissipation of heat and further improves the heat dissipation effect of the entire photovoltaic power semiconductor module junction box.

[0044] In this embodiment, as Figure 5 and Figure 6 As shown, the first photovoltaic power semiconductor module 13 includes a diode, which is an axial diode 131, or...

[0045] The diode includes a diode chip 132 with PN poles, and conductors 133 are disposed at both ends of the diode chip 132.

[0046] Specifically, the axial diode 131 has a compact structure, making it easy to install and connect, while the diode chip 132 has higher integration and flexibility, allowing for the selection of a suitable diode type based on actual needs. When installing the axial diode 131, it can be connected to a cable independently, or its pins can be electrically connected to a conductor 133, which in turn is connected to a cable. When selecting the diode chip 132, it can be connected to external circuitry via conductors 133 on both sides, thus ensuring normal current transmission.

[0047] In this embodiment, as Figure 7 As shown, it also includes a connecting metal part 134, which is connected to the diode.

[0048] Specifically, the aforementioned metal component can be a metal sheet or metal block, etc., and is used as a heat sink. Since the connecting metal component 134 has a large heat dissipation area, it can effectively conduct away the heat generated by the diode, thereby further improving the heat dissipation efficiency.

[0049] Similarly, the conductors 133 at both ends of the diode chip 132 and the axial diode 131 can also serve as heat dissipation devices.

[0050] This application also discloses a junction box assembly, such as Figure 9As shown, the system includes N high-heat-dissipation photovoltaic power semiconductor module junction boxes as described above, where N ≥ 1. The leftmost and rightmost high-heat-dissipation photovoltaic power semiconductor module junction boxes are respectively connected to cables 3.

[0051] Specifically, when N equals 1, meaning only one high-heat-dissipation photovoltaic power semiconductor module junction box is used in the entire photovoltaic module, cables are connected to both sides of the junction box for connection to external circuits. When N is greater than 1, meaning multiple high-heat-dissipation photovoltaic power semiconductor module junction boxes are used, these junction boxes can be arranged in a certain order. The leftmost and rightmost junction boxes are connected to external circuits via cable 3, while the middle junction box can transmit current through internal circuit connections.

[0052] Meanwhile, the above structures all use high heat dissipation photovoltaic power semiconductor module junction boxes. Each junction box has a high heat dissipation capacity, which can effectively dissipate the heat generated inside the junction box, avoid the temperature rise caused by heat accumulation, and thus improve the stability and reliability of the photovoltaic system.

[0053] This application also discloses another junction box assembly, such as Figure 8 , Figures 10 to 12 As shown, the device includes N high-heat-dissipation photovoltaic power semiconductor module junction boxes as described above, and also includes M conventional photovoltaic power semiconductor module junction boxes 2, where N≥1 and M≥1. Each conventional photovoltaic power semiconductor module junction box 2 includes a second box body 21, a second box cover 22, and a second photovoltaic power semiconductor module 23. The second photovoltaic power semiconductor module 23 is installed in a second accommodating space formed by the second box body 21 and the second box cover 22. The second box cover 22 is made of a high-molecular polymer material.

[0054] In one example, such as Figure 8 or Figure 9 As shown, there are two conventional photovoltaic power semiconductor module junction boxes 2, namely left junction box 2A and right junction box 2B. N high heat dissipation photovoltaic power semiconductor module junction boxes are located between left junction box 2A and right junction box 2B. One end of left junction box 2A and right junction box 2B are respectively connected to cables.

[0055] Specifically, in this embodiment, conventional photovoltaic power semiconductor module junction boxes 2 are used on both sides, while a high-heat-dissipation photovoltaic power semiconductor module junction box is used in the middle. Since the conventional photovoltaic power semiconductor module junction boxes 2 on both sides are connected to cables, and the ports of the conventional photovoltaic power semiconductor module junction boxes 2 connected to the cables have a certain heat dissipation capacity, while the junction box located in the middle is only connected to the busbar and its heat dissipation capacity is poor, the high-heat-dissipation photovoltaic power semiconductor module junction box is used in the middle and conventional photovoltaic power semiconductor module junction boxes 2 are used at both ends. This reduces the use of high-heat-dissipation photovoltaic power semiconductor module junction boxes, lowers the overall cost of the junction box assembly, and also makes the heat dissipation capacity of each junction box uniform, thus improving the overall heat dissipation effect of the photovoltaic system.

[0056] In one example, such as Figure 10 As shown, the system includes a conventional photovoltaic power semiconductor module junction box 2 and a high-heat-dissipation photovoltaic power semiconductor module junction box. In this embodiment, the conventional photovoltaic power semiconductor module junction box 2 is used on the side with relatively low heat dissipation requirements, while the high-heat-dissipation photovoltaic power semiconductor module junction box is used on the side with high heat dissipation requirements. This satisfies the heat dissipation needs of different locations and reduces the overall cost.

[0057] In practical applications, the number and location of high-heat-dissipation photovoltaic power semiconductor module junction boxes and conventional photovoltaic power semiconductor module junction boxes can be flexibly selected according to the specific layout and heat dissipation requirements of photovoltaic modules to achieve the best heat dissipation effect and cost-effectiveness. Furthermore, because the high-heat-dissipation photovoltaic power semiconductor module junction box in this application has advantages such as simple structure, good heat dissipation effect, and low cost, it can be widely used in various photovoltaic systems to improve the stability and reliability of photovoltaic systems.

[0058] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above descriptions are merely specific embodiments of this utility model and are not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A high-heat-dissipation photovoltaic power semiconductor module junction box, characterized in that: The device includes a first housing (11), a first cover (12), and a first photovoltaic power semiconductor module (13). The first photovoltaic power semiconductor module (13) is installed in a first accommodating space formed by the housing and the cover. The device also includes potting compound (14), which is located in the first accommodating space and seals the first photovoltaic power semiconductor module (13). The first cover (12) is made of a high thermal conductivity material and is in contact with the potting compound (14).

2. The high heat dissipation photovoltaic power semiconductor module junction box as described in claim 1, characterized in that: The first box cover (12) is made of metal or high thermal conductivity ceramic material.

3. The high heat dissipation photovoltaic power semiconductor module junction box as described in claim 1 or 2, characterized in that: The bottom of the first box cover (12) is provided with a protrusion (121) facing the potting compound (14).

4. The high heat dissipation photovoltaic power semiconductor module junction box as described in claim 3, characterized in that: The surface of the first box cover (12) is provided with several notches (122).

5. The high heat dissipation photovoltaic power semiconductor module junction box as described in claim 4, characterized in that: Several notches (122) are arranged in a honeycomb pattern on the surface of the first box cover (12).

6. The high heat dissipation photovoltaic power semiconductor module junction box as described in claim 1, characterized in that: The first photovoltaic power semiconductor module (13) includes a diode, wherein the diode is an axial diode (131), or The diode includes a diode chip (132) with PN poles, and conductors (133) are disposed at both ends of the diode chip (132).

7. The high heat dissipation photovoltaic power semiconductor module junction box as described in claim 6, characterized in that: It also includes a connecting metal element (134) that is connected to the diode.

8. A junction box assembly, characterized in that: The high heat dissipation photovoltaic power semiconductor module junction box includes any one of claims 1 to 7, and there are N high heat dissipation photovoltaic power semiconductor module junction boxes, where N ≥ 1, wherein the leftmost high heat dissipation photovoltaic power semiconductor module junction box and the rightmost high heat dissipation photovoltaic power semiconductor module junction box are respectively connected to cables (3).

9. A junction box assembly, characterized in that: The high heat dissipation photovoltaic power semiconductor module junction box according to any one of claims 1 to 7 is provided. There are N high heat dissipation photovoltaic power semiconductor module junction boxes and M conventional photovoltaic power semiconductor module junction boxes (2). N ≥ 1 and M ≥ 1. The conventional photovoltaic power semiconductor module junction box (2) includes a second box body (21), a second box cover (22) and a second photovoltaic power semiconductor module (23). The second photovoltaic power semiconductor module (23) is installed in a second accommodating space composed of the second box body (21) and the second box cover (22). The second box cover (22) is made of a polymer material.

10. The junction box assembly as claimed in claim 9, characterized in that: There are two conventional photovoltaic power semiconductor module junction boxes (2), namely a left junction box (2A) and a right junction box (2B). N high heat dissipation photovoltaic power semiconductor module junction boxes are located between the left junction box (2A) and the right junction box (2B). One end of the left junction box (2A) and the right junction box (2B) are respectively connected to a cable.

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