An integrated circuit manufacturing patch device

Abstract

The utility model relates to circuit production and processing technical field, concretely is a kind of integrated circuit manufacturing paster, including workbench and paster, the side surface of paster is fixed with electric push rod, the output end of electric push rod is rotationally equipped with down pressure shaft, the bottom end of down pressure shaft is equipped with multiple elastic telescopic components at equal intervals, the end of multiple elastic telescopic components away from down pressure shaft is equipped with first ball uniformly, and adjusting component for controlling the synchronous opposite movement of multiple elastic telescopic components is equipped on down pressure shaft;By setting elastic telescopic component, first ball, adjusting component and guide component, the effect that multiple first balls can be contacted with electronic component in advance is achieved, first ball forms circular path pre-pressing electronic component, so that the edge and central region of electronic component can be covered, the pressure distribution in pre-pressing process is more uniform, and the diameter of circular path of first ball can be adjusted according to demand, so that first ball can be adapted to electronic component of different sizes.

Description

Technical Field

[0001] This utility model relates to the field of circuit manufacturing and processing technology, and in particular to an integrated circuit manufacturing and mounting device. Background Technology

[0002] Integrated circuit manufacturing surface mount equipment, also known as a chip mounter in surface mount technology, is one of the core pieces of equipment in the electronics manufacturing field. It is responsible for precisely mounting tiny electronic components onto printed circuit boards.

[0003] A surface mount device for integrated circuit manufacturing, disclosed in Chinese Patent Publication No. CN113207240A, adjusts the position of the working head through a moving mechanism until it is directly above the worktable. The working head can then perform subsequent surface mount operations on the integrated circuit board in the groove of the worktable. However, according to surface mount devices provided in related fields and existing technologies, traditional devices often use a single pressure head or local contact pre-pressing, with pressure concentrated at the contact point. This can easily lead to the edge of electronic components lifting, poor center connection, or uneven distribution of solder paste, affecting the reliability of electrical connections. At the same time, when switching to different specifications of components, the corresponding pre-pressing fixture needs to be replaced, resulting in long changeover times and high fixture inventory costs. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art, solve the problems mentioned in the background art, and provide an integrated circuit manufacturing chip mounting device.

[0005] The objective of this utility model is achieved through the following technical solution: an integrated circuit manufacturing placement apparatus, comprising a worktable and a placement machine, wherein the top of the worktable is provided with a drive device for controlling the movement of the placement machine, an electric push rod is fixedly installed on the side of the placement machine, a downward pressure shaft is rotatably provided at the output end of the electric push rod, a downward pressure component is fixedly installed at the center of the bottom end of the downward pressure shaft, a plurality of elastic telescopic components are provided at equal intervals at the bottom end of the downward pressure shaft, a first ball bearing is provided at the end of each of the multiple elastic telescopic components away from the downward pressure shaft, an adjustment component is provided on the downward pressure shaft for controlling the synchronous opposing movement of the multiple elastic telescopic components, and a guide component is provided on the placement machine for causing the downward pressure shaft to rotate circumferentially when it slides longitudinally.

[0006] Preferably, the elastic telescopic assembly includes a fixed cylinder, a movable cylinder is slidably disposed on the outer surface of the fixed cylinder, and an elastic element is fixedly disposed inside the fixed cylinder and the movable cylinder.

[0007] Preferably, the bottom end of the movable cylinder is provided with a rolling groove that is adapted to the first ball.

[0008] Preferably, a slider is fixedly installed at one end of the fixed cylinder near the lower pressure shaft, and a groove is provided on the lower pressure shaft corresponding to the position of the slider.

[0009] Preferably, the adjusting assembly includes an adjusting disc rotatably disposed at the bottom end of the lower pressure shaft. The adjusting disc has adjusting grooves corresponding to the positions of the plurality of fixed cylinders. The adjusting grooves are arc-shaped, and positioning bolts are threaded onto the adjusting disc.

[0010] Preferably, the adjusting disc has a rotating hole corresponding to the position of the pressing member, and a bearing is embedded inside the rotating hole, and the bearing is fitted onto the outer surface of the pressing member.

[0011] Preferably, the guiding assembly includes a sleeve fixedly mounted on the placement machine, and the pressing shaft is circumferentially rotatable or axially slidable inside the sleeve. Two guide grooves are symmetrically formed on the inner wall of the sleeve, and the pressing shaft is provided with a second ball bearing that is adapted to each of the two guide grooves. The guide grooves are spiral in shape.

[0012] Beneficial effects:

[0013] This integrated circuit manufacturing surface mount device, by incorporating an elastic telescopic component, first ball bearings, an adjustment component, and a guide component, achieves the effect of multiple first ball bearings pre-contacting electronic components. This allows the first ball bearings to form a circular path to pre-press the electronic components, thereby covering the edges and center areas of the electronic components. This results in a more uniform pressure distribution during the pre-pressing process, avoiding problems such as edge lifting and loose connection of electronic components caused by traditional single-point or localized pre-pressing. At the same time, the diameter of the circular path of the first ball bearings can be adjusted according to requirements, allowing the first ball bearings to adapt to electronic components of different sizes, increasing the versatility and flexibility of the device. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a first-view structural schematic diagram of the worktable of this utility model;

[0017] Figure 3 This is a structural schematic diagram of the worktable of this utility model from a second perspective;

[0018] Figure 4 This is a diagram showing the state of the lower pressure shaft of this utility model after it extends out of the sleeve.

[0019] Figure 5 This is a schematic diagram of the structure of the guide component of this utility model;

[0020] Figure 6 This is a diagram showing the state of the lower pressure shaft of this utility model after it has retracted into the sleeve.

[0021] Figure 7 This is a structural schematic diagram of the pressure shaft of this utility model from a first-view perspective;

[0022] Figure 8 This is a structural schematic diagram of the lower pressure shaft of this utility model from a second perspective;

[0023] Figure 9 This is a diagram showing the state of multiple elastic telescopic components of this utility model after they are brought close together;

[0024] Figure 10 This is a schematic diagram showing the disassembled structure of the adjustment component and the lower pressure shaft of this utility model.

[0025] In the diagram: 1. Workbench; 2. Pick and place machine; 3. Drive unit; 4. Electric push rod; 5. Pressing shaft; 501. Slide groove; 6. Pressing component; 7. Elastic telescopic assembly; 701. Fixed cylinder; 7011. Slider; 702. Movable cylinder; 7021. Rolling groove; 703. Elastic component; 8. First ball bearing; 9. Adjustment assembly; 901. Adjustment disc; 9011. Rotating hole; 9012. Bearing; 902. Adjustment groove; 903. Positioning bolt; 10. Guide assembly; 1001. Sleeve; 1002. Guide groove; 1003. Second ball bearing. Detailed Implementation

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] Additional aspects and advantages of this invention will be further set forth in the description which follows in conjunction with the accompanying drawings, and in part will be obvious from the description or may be learned by practice of the invention.

[0028] like Figures 1 to 10As shown, an integrated circuit manufacturing chip mounting apparatus includes a worktable 1 and a chip mounter 2. The top of the worktable 1 is provided with a drive device 3 for controlling the movement of the chip mounter 2. An electric push rod 4 is fixedly mounted on the side of the chip mounter 2. A pressing shaft 5 is rotatably mounted at the output end of the electric push rod 4. A pressing component 6 is fixedly mounted at the center of the bottom end of the pressing shaft 5. Multiple elastic telescopic components 7 are provided at equal intervals at the bottom end of the pressing shaft 5. Each of the multiple elastic telescopic components 7 has a first ball bearing 8 at the end away from the pressing shaft 5. An adjustment component 9 is provided on the pressing shaft 5 for controlling the synchronous opposing movement of the multiple elastic telescopic components 7. A guide component 10 is provided on the chip mounter 2 for causing the pressing shaft 5 to rotate circumferentially when it slides longitudinally.

[0029] like Figure 8 As shown, the elastic telescopic assembly 7 includes a fixed cylinder 701, a movable cylinder 702 slidably disposed on the outer surface of the fixed cylinder 701, and an elastic element 703 fixedly disposed inside the fixed cylinder 701 and the movable cylinder 702. The bottom end of the movable cylinder 702 is provided with a rolling groove 7021 adapted to the first ball 8. The elastic telescopic assembly 7 provides the first ball 8 with flexible contact capability. When the first ball 8 contacts the electronic component, the elasticity can buffer the instantaneous impact force and avoid the electronic component from breaking or the solder pad from being damaged due to rigid contact.

[0030] like Figures 3 to 5 As shown, the guide assembly 10 includes a sleeve 1001 fixedly mounted on the pick-and-place machine 2. A downward pressing shaft 5 is rotatably or axially slidably disposed inside the sleeve 1001. Two guide grooves 1002 are symmetrically formed on the inner wall of the sleeve 1001. A second ball bearing 1003, corresponding to each of the two guide grooves 1002, is provided on the downward pressing shaft 5. The guide grooves 1002 are spiral-shaped. The downward pressing shaft 5 slides axially downwards controlled by an electric push rod 4. Then, by utilizing the cooperation between the second ball bearing 1003 and the guide groove 1002, the downward pressing shaft 5 can slide axially downwards while simultaneously rotating circumferentially. Figure 4 , Figure 6 and Figure 8 As shown, when the pressure shaft 5 slides downward axially and rotates circumferentially, the first ball bearings 8 at the bottom of the multiple elastic telescopic components 7 can pre-contact with the electronic components, so that the first ball bearings 8 form a circular path to pre-press the electronic components, thereby covering the edge and center area of ​​the electronic components, making the pressure distribution more uniform during the pre-pressing process, and avoiding problems such as edge lifting and center loose connection of electronic components caused by traditional single-point or local pre-pressing.

[0031] like Figures 4 to 10As shown, a slider 7011 is fixedly installed at one end of the fixed cylinder 701 near the lower pressure shaft 5. A groove 501 is provided on the lower pressure shaft 5 corresponding to the position of the slider 7011. The adjustment component 9 includes an adjustment plate 901 rotatably disposed at the bottom end of the lower pressure shaft 5. An adjustment groove 902 is provided on the adjustment plate 901 corresponding to the positions of multiple fixed cylinders 701. The adjustment groove 902 is arc-shaped. A positioning bolt 903 is threaded onto the adjustment plate 901. A rotating hole 9011 is provided on the adjustment plate 901 corresponding to the position of the lower pressure component 6. A bearing 9012 is embedded inside the rotating hole 9011 and is fitted onto the outer surface of the lower pressure component 6. By rotating the adjustment plate 901, the adjustment groove 902 can control the synchronous opposite movement of multiple elastic telescopic components 7, thereby changing the diameter of the circular path formed by the first ball 8. This allows the first ball 8 to be adapted to electronic components of different sizes, increasing the versatility and flexibility of the device. After adjustment, the adjustment plate 901 can be limited by tightening the positioning bolt 903.

[0032] The work process is as follows:

[0033] S1: As Figures 3 to 6 As shown, during the placement process, the lower pressure shaft 5 is controlled to slide downward axially by the electric push rod 4. Then, by utilizing the cooperation between the second ball 1003 and the guide groove 1002, the lower pressure shaft 5 can slide downward axially while rotating circumferentially.

[0034] S2: As Figures 3 to 8 As shown, when the pressure shaft 5 slides downward axially and rotates circumferentially, the first ball bearings 8 at the bottom of the multiple elastic telescopic components 7 can pre-contact the electronic components, so that the first ball bearings 8 form a circular path to pre-press the electronic components, thereby covering the edge and center area of ​​the electronic components, making the pressure distribution more uniform during the pre-pressing process, and avoiding problems such as edge lifting and center loose connection of electronic components caused by traditional single-point or local pre-pressing.

[0035] S3: As Figure 4 and Figure 6 As shown, once the pressing component 6 comes into contact with the electronic component, the installation of the electronic component is completed;

[0036] S4: As Figures 4 to 10 As shown, by rotating the adjustment disc 901, the adjustment groove 902 can control multiple elastic telescopic components 7 to move synchronously in opposite directions, which indirectly changes the diameter of the circular path formed by the first ball 8, allowing the first ball 8 to adapt to electronic components of different sizes, increasing the versatility and flexibility of the device.

[0037] The workbench 1, pick-and-place machine 2, drive device 3, and electric push rod 4 described in this application are all well-known technologies in the field, and therefore their specific structures and working principles are not described in detail.

[0038] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. An integrated circuit manufacturing surface mount device, characterized in that: The device includes a worktable (1) and a pick-and-place machine (2). The top of the worktable (1) is provided with a drive device (3) for controlling the movement of the pick-and-place machine (2). An electric push rod (4) is fixedly installed on the side of the pick-and-place machine (2). The output end of the electric push rod (4) is provided with a downward pressure shaft (5). A downward pressure component (6) is fixedly installed at the center of the bottom end of the downward pressure shaft (5). Multiple elastic telescopic components (7) are provided at equal intervals at the bottom end of the downward pressure shaft (5). A first ball bearing (8) is provided at the end of each of the multiple elastic telescopic components (7) away from the downward pressure shaft (5). An adjustment component (9) is provided on the downward pressure shaft (5) for controlling the multiple elastic telescopic components (7) to move synchronously in opposite directions. A guide component (10) is provided on the pick-and-place machine (2) for making the downward pressure shaft (5) rotate circumferentially when it slides longitudinally.

2. The integrated circuit manufacturing surface mount device according to claim 1, characterized in that: The elastic telescopic assembly (7) includes a fixed cylinder (701), a movable cylinder (702) is slidably provided on the outer surface of the fixed cylinder (701), and an elastic element (703) is fixedly provided inside the fixed cylinder (701) and the movable cylinder (702).

3. The integrated circuit manufacturing chip mounting apparatus according to claim 2, characterized in that: The bottom end of the movable cylinder (702) is provided with a rolling groove (7021) that is adapted to the first ball (8).

4. The integrated circuit manufacturing chip mounting apparatus according to claim 2, characterized in that: A slider (7011) is fixedly installed at one end of the fixed cylinder (701) near the lower pressure shaft (5), and a groove (501) is provided on the lower pressure shaft (5) corresponding to the position of the slider (7011).

5. The integrated circuit manufacturing chip mounting apparatus according to claim 4, characterized in that: The adjustment assembly (9) includes an adjustment disc (901) rotatably disposed at the bottom end of the lower pressure shaft (5). The adjustment disc (901) has adjustment grooves (902) at the positions corresponding to the positions of the plurality of fixed cylinders (701). The adjustment grooves (902) are arc-shaped. The adjustment disc (901) is threaded with positioning bolts (903).

6. The integrated circuit manufacturing surface mount apparatus according to claim 5, characterized in that: The adjusting disc (901) has a rotating hole (9011) corresponding to the position of the pressing member (6). A bearing (9012) is embedded inside the rotating hole (9011), and the bearing (9012) is fitted onto the outer surface of the pressing member (6).

7. The integrated circuit manufacturing chip mounting apparatus according to claim 1, characterized in that: The guide assembly (10) includes a sleeve (1001) fixedly installed on the pick-and-place machine (2). The pressing shaft (5) is circumferentially rotatable or axially slidable inside the sleeve (1001). The inner wall of the sleeve (1001) is symmetrically provided with two guide grooves (1002). The pressing shaft (5) is provided with a second ball (1003) that is adapted to the two guide grooves (1002) at the corresponding positions. The guide grooves (1002) are spiral in shape.

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