A SIP circuit board heat dissipation structure

Abstract

The utility model discloses a SIP circuit board heat dissipation structure belongs to SIP circuit heat dissipation technical field, including heat dissipation subassembly, for the heat of SIP circuit generates transmission to the outside, shell, the shell is connected with heat dissipation subassembly and forms a sealed component, and SIP circuit board is encapsulated in the sealed component inside, heat dissipation subassembly includes: base plate, heat exchange seat and cooling assembly, the top of base plate is used for installing the various elements of SIP circuit, and the bottom of base plate is connected with the top of heat exchange group, cooling assembly is connected with the bottom of heat exchange seat, the shell is encapsulated in the top of heat exchange seat, and SIP circuit board is encapsulated in the inside, through the base plate, heat exchange seat and the cooling assembly of liquid cooling mode of setting, three cooperation can quickly pass SIP circuit board electrical element's temperature to the outside, and the installation space of electrical element is not affected, thereby under the prerequisite of guaranteeing installation space, can quickly cool down.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for SIP circuits, specifically a heat dissipation structure for SIP circuit boards. Background Technology

[0002] System-in-Package (SIP) integrates multiple different chips into a single package, forming an independent packaged device with certain system-level or subsystem-level functions. Assembling SIPs with other electronic components on PCBs (Printed Circuit Boards) creates a more complex board-level system. However, when these board-level systems are applied to high-power SIPs, especially when high-power SIPs are integrated in high-density arrays, the total heat dissipation power of the board-level system can reach kilowatts. Without adequate heat dissipation, high-power chips will experience decreased reliability or even burn out due to excessively high junction temperatures. Therefore, the heat dissipation technology employed in board-level systems is crucial.

[0003] For example, the PCB heat dissipation component or structure disclosed in Chinese utility model patent application number CN202111064147.3 uses a heat-conducting structure that penetrates the thickness of the PCB to conduct heat generated by the device to the back side, thereby enhancing heat dissipation capacity. However, the through-type heat-conducting structure used in this type of structure severely affects the effective wiring area of ​​the PCB. Especially in the case of dense array mounting of high-power SiPs, most of the PCB motherboard area is occupied by the through-type heat-conducting structure, leaving insufficient usable area to meet the wiring requirements for power signal transmission, power networks, and control signal routing. Therefore, this type of heat dissipation structure cannot meet the needs of high-density array integration of high-power SiPs.

[0004] In view of this, this application designs a circuit board heat dissipation structure that meets the requirements of high-power SIP high-density array integration. Summary of the Invention

[0005] To address the problems of the prior art, this utility model provides a SIP circuit packaging structure, including: a heat dissipation component for transferring the heat generated by the SIP circuit to the outside;

[0006] The housing is connected to the heat dissipation assembly to form a sealed assembly, which encapsulates the SIP circuit board inside the sealed assembly.

[0007] The heat dissipation assembly includes: a substrate, a heat exchange base, and a cooling component;

[0008] The top of the substrate is used to mount various components of the SIP circuit, and the bottom of the substrate is connected to the top of the heat exchange assembly.

[0009] The cooling component is connected to the bottom of the heat exchange base for heat transfer with the substrate;

[0010] The housing is encapsulated on the heat exchange base, and the SIP circuit board is encapsulated inside.

[0011] Furthermore, the substrate is made of a material with high thermal conductivity, and the substrate is selected from any one of aluminum nitride substrate, silicon carbide aluminum substrate, copper substrate or aluminum substrate.

[0012] Furthermore, a heat-conducting mesh with an interlaced structure is provided on the substrate. The heat-conducting mesh is made of a silver sintered layer and is adapted to the thickness of the substrate.

[0013] Furthermore, the heat exchange base has a through mounting port, and the edge of the mounting port is connected to the bottom edge of the substrate.

[0014] The heat exchange base is made of a material with high thermal conductivity.

[0015] Furthermore, the cooling assembly includes: a conduit and a cooling chamber;

[0016] The conduit is installed and connected to the bottom of the base plate in a wave shape. One end of the conduit is connected to the liquid supply tank, and the other end of the conduit passes through the cooling cavity and is connected to the liquid supply tank.

[0017] The cooling chamber is connected to one side of the heat exchange base.

[0018] Furthermore, a micro pump is installed inside the liquid supply tank, and the output end of the micro pump is connected to one end of the pipeline;

[0019] The cooling chamber is filled with cold water or a mixture of alcohol and water, and the pipes entering the cooler have a spiral structure.

[0020] Furthermore, a metal mesh is provided at the bottom of the heat exchange base to protect the pipe.

[0021] Furthermore, a heat-conducting sheet is provided at the bottom of the substrate, the heat-conducting sheet is connected to the heat-conducting mesh, and the metal sheet is concentrated below the electrical components with high heat generation and is offset from the pipe.

[0022] The beneficial effects of this utility model are:

[0023] By using a substrate, heat exchange base, and liquid cooling components, the three work together to quickly transfer the temperature of electrical components on the SIP circuit board to the outside environment without affecting the installation space of electrical components. This allows for rapid cooling while ensuring sufficient installation space. By utilizing the synergistic design of the substrate material and the silver sintered layer, a complete heat dissipation path can be constructed, which is "chip heat source - silver sintered connection layer - high thermal conductivity substrate - external heat dissipation device", significantly reducing thermal resistance and improving the reliability of SIP packaging. Attached Figure Description

[0024] Figure 1 A three-dimensional structural diagram of the packaging structure provided by this utility model;

[0025] Figure 2 This is a top view of the packaging structure provided by this utility model.

[0026] Figure label:

[0027] In the diagram: 1 is the substrate, 2 is the heat exchange base, 3 is the shell, 4 is the heat-conducting mesh, 5 is the conduit, 6 is the metal mesh, and 7 is the cooling chamber. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Please see Figure 1-2 This utility model provides a heat dissipation structure for a SIP circuit board, including: a heat dissipation component for transferring the heat generated by the SIP circuit to the outside.

[0030] Housing 3, which is connected to the heat dissipation assembly to form a sealed assembly, encapsulating the SIP circuit board inside the sealed assembly;

[0031] The heat dissipation assembly includes: a base plate 1, a heat exchange seat 2, and a cooling component;

[0032] The top of the substrate 1 is used to mount various components of the SIP circuit, and the bottom of the substrate 1 is detachably connected to the top of the heat exchange assembly, for example, by screws; the housing 3 is encapsulated on the heat exchange base 2, encapsulating the SIP circuit board inside.

[0033] The shell and heat exchange base are fitted by a flange face and are sealed with a double seal of "metal sealing ring (silver-plated copper) + high-temperature resistant sealant". The top of the shell is equipped with a fin structure (fin height 5mm, spacing mm) and is connected to the external heat sink through thermally conductive silicone grease.

[0034] A temperature sensor is installed inside the housing to monitor the internal temperature in real time. The temperature sensor is connected to a computer, and the data from the temperature sensor is used to control the activation of the cooling components.

[0035] The substrate adopts a composite structure of "ceramic layer (0.8mm) + embedded copper foil layer (50μm) + ceramic layer (0.2mm)". A through hole with a diameter of 0.3mm is processed in the substrate and the hole is filled with silver-copper alloy.

[0036] Alternatively, the substrate may be made of a material with high thermal conductivity, and the substrate 1 may be selected from any one of aluminum nitride substrate, silicon carbide aluminum substrate, copper substrate or aluminum substrate.

[0037] A heat-conducting mesh 4 with an interlaced mesh structure is provided on the substrate 1. The heat-conducting mesh 4 is made of silver sintered layer and the thickness of the heat-conducting mesh 4 is adapted to the thickness of the substrate 1.

[0038] A heat-conducting sheet is fixedly connected to the bottom of the substrate 1. The heat-conducting sheet is connected to the heat-conducting mesh 4. The metal sheet is concentrated below the electrical components with high heat generation and is offset from the pipe.

[0039] The cooling component is connected to the bottom of the heat exchange base 2 for heat transfer with the substrate 1; the heat exchange base 2 has a through mounting port, the edge of which is connected to the bottom edge of the substrate 1; the heat exchange base 2 is made of a material with high thermal conductivity.

[0040] The cooling assembly includes: a conduit 5 and a cooling chamber 7;

[0041] The conduit 5 is wavy and detachably connected to the bottom of the base plate 1. One end of the conduit 5 is connected to the liquid supply tank through a flange, and the other end of the conduit 5 passes through the cooling chamber and is connected to the liquid supply tank through a flange.

[0042] The cooling chamber is fixedly connected to one side of the heat exchange base 2, for example, by screw connection.

[0043] The liquid supply tank contains a miniature pump, and the output end of the miniature pump is connected to one end of the pipeline via a flange.

[0044] The cooling chamber is filled with cold water or a mixture of alcohol and water, and the pipes entering the cooler have a spiral structure.

[0045] A metal mesh 6 is fixedly connected to the bottom of the heat exchange base 2 to protect the pipe.

[0046] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A SIP circuit board heat dissipation structure, characterized in that, The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit.

2. The SIP circuit board heat dissipation structure according to claim 1, wherein The application relates to a heat dissipation assembly for SIP circuit.

3. The SIP circuit board heat dissipation structure of claim 1, wherein, The application relates to a heat dissipation assembly for SIP circuit.

4. The SIP circuit board heat dissipation structure of claim 1, wherein, The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit.

5. The SIP circuit board heat dissipation structure of claim 3, wherein, The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit.

6. The SIP circuit board heat dissipation structure of claim 5, wherein, The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit.

7. The SIP circuit board heat dissipation structure of claim 6, wherein, The application relates to a heat dissipation assembly for SIP circuit.

8. The SIP circuit board heat dissipation structure of claim 5, wherein, The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for SIP circuit. The application relates to a heat dissipation assembly for

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