Power module and vehicle

Abstract

The utility model discloses a kind of power module and vehicle, it is related to semiconductor technical field, wherein, power module includes substrate and chip module, wherein, substrate has insulating groove;Chip module is located in the insulating groove, the chip module includes multiple mounting seat, the electrically conductive connecting piece for connecting adjacent two the mounting seat and multiple chips correspondingly arranged on multiple the mounting seat, the electrically conductive connecting piece is located between adjacent two the mounting seat and is connected with two the mounting seat respectively, the bottom electrode of the chip is electrically connected with the mounting seat, multiple the chip is connected in parallel through the mounting seat and the electrically conductive connecting piece;The technical scheme provided by the utility model can reduce the overall volume of power module by optimizing the layout of chip module, reduce the uneven flow degree of multiple chip parallel connection, improve the purpose of power module efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a power module and a vehicle. Background Technology

[0002] Currently, PCB-embedded power module packaging is becoming a development trend for next-generation packaging technology due to its advantages such as small size, low inductance, and high efficiency. To address the limited current carrying capacity of a single chip, existing solutions involve directly soldering a single IGBT or SiC chip onto an embedded copper block. Multiple chips are individually positioned on a substrate, with insulation and gap filling achieved using prepreg lamination, and electrical interconnection achieved through laser drilling and electroplating. Chip interconnection typically involves drilling individual upward or downward holes, then merging current on the chip surface before connecting to PN / AC terminals. However, this approach leads to inefficient use of substrate area because each chip is placed individually, resulting in increased substrate size and consequently, a larger overall power module volume. Furthermore, when multiple chips operate in parallel, the independent layout of each chip may cause uneven current distribution, leading to reduced power module efficiency. Utility Model Content

[0003] The main objective of this invention is to propose a power module and a vehicle that optimizes the chip structure layout to reduce the overall size of the power module and reduce the uneven flow rate of multiple chips connected in parallel.

[0004] To achieve the above objectives, this utility model proposes a power module, comprising:

[0005] The substrate has insulating grooves;

[0006] A chip module is disposed within the insulating groove. The chip module includes multiple mounting bases, conductive connectors for connecting two adjacent mounting bases, and multiple chips disposed on the multiple mounting bases in a one-to-one correspondence. The conductive connectors are disposed between two adjacent mounting bases and are respectively connected to the two mounting bases. The bottom electrode of the chip is electrically connected to the mounting base. The multiple chips are connected in parallel via the mounting bases and the conductive connectors.

[0007] In one embodiment, there are multiple conductive connectors located between two adjacent mounting bases, and the multiple conductive connectors are arranged at intervals along the length and / or width direction of the mounting base.

[0008] In one embodiment, the cross-sectional shape of the conductive connector along the thickness direction is rectangular or trapezoidal.

[0009] In one embodiment, the thickness of the conductive connector is less than the thickness of the mounting base.

[0010] In one embodiment, the mounting base includes at least one of a copper base, a copper-molybdenum alloy base, an aluminum base, a DBC base, an AMB base, and an AlN base.

[0011] In one embodiment, the plurality of mounting bases and the plurality of conductive connectors are an integral structure.

[0012] In one embodiment, a plurality of the mounting bases are arranged in an array along the length and / or width direction.

[0013] In one embodiment, the insulating groove is provided with at least one partition rib, which is used to divide the insulating groove into multiple sub-insulating grooves. Multiple mounting seats are provided in the multiple sub-insulating grooves in a one-to-one correspondence. The partition rib is located between two adjacent mounting seats to support the conductive connector.

[0014] In one embodiment, the partition rib has a notch, and the conductive connector is accommodated within the notch.

[0015] This utility model also proposes a vehicle, including the power module as described in the above embodiments.

[0016] The technical solution of this utility model, through this arrangement, allows multiple chips to be connected via multiple mounting bases and conductive connectors to form a highly integrated chip module. The chips within this module can also be connected in parallel via mounting bases and conductive connectors, thereby achieving the goal of reducing the overall size of the power module and lowering the uneven current distribution in parallel multi-chip connections by optimizing the chip module layout. This arrangement also allows for the creation of only one insulating groove on the substrate for mounting the chip module. The highly integrated chip module is then mounted into the insulating groove, and subsequently encapsulated within the substrate using a unified packaging method, thus achieving a rapid and unified packaging effect for multiple chips and mounting bases. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the structure of an embodiment of the power module provided by this utility model;

[0019] Figure 2 for Figure 1 A cross-sectional view of the medium-power module along its thickness.

[0020] Figure 3 for Figure 1 A schematic diagram of the substrate structure of a medium-power module;

[0021] Figure 4 A schematic diagram of the first embodiment of the mounting base and conductive connector provided by this utility model;

[0022] Figure 5 for Figure 4 A cross-sectional view of the mounting base and conductive connector along the thickness direction;

[0023] Figure 6 A schematic diagram of the second embodiment of the mounting base and conductive connector provided by this utility model;

[0024] Figure 7 A schematic diagram of the third embodiment of the mounting base and conductive connector provided by this utility model;

[0025] Figure 8 A schematic diagram of the fourth embodiment of the mounting base and conductive connector provided by this utility model;

[0026] Figure 9 A schematic diagram of the fifth embodiment of the mounting base and conductive connector provided by this utility model;

[0027] Figure 10 A schematic diagram of the sixth embodiment of the mounting base and conductive connector provided by this utility model;

[0028] Figure 11 A structural schematic diagram of the seventh embodiment of the mounting base and conductive connector provided by this utility model;

[0029] Figure 12 A schematic diagram of the eighth embodiment of the mounting base and conductive connector provided by this utility model.

[0030] Explanation of icon numbers:

[0031] 1. Power module; 10. Substrate; 101. Insulating groove; 102. Separating rib; 1021. Notch; 11. First package; 111. First conductive layer; 112. First insulating layer; 12. Second package; 121. Second conductive layer; 122. Second insulating layer; 20. Chip module; 201. Mounting base; 202. Conductive connector; 203. Chip.

[0032] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0034] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0035] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0036] Currently, PCB-embedded power module packaging is becoming a development trend for next-generation packaging technology due to its advantages such as small size, low inductance, and high efficiency. To address the limited current carrying capacity of a single chip, existing solutions involve directly soldering a single IGBT or SiC chip onto an embedded copper block, or placing multiple chips individually on a substrate for positioning. Insulation and gap filling are achieved using prepreg lamination, and electrical interconnection is achieved through laser drilling and electroplating. Chip interconnection typically involves drilling individual upward or downward holes, then merging current on the chip surface before connecting to PN / AC terminals.

[0037] However, this method results in inefficient use of the substrate area because each chip is placed individually on the substrate, leading to an increase in substrate size and consequently, an increase in the overall size of the power module. Furthermore, when multiple chips operate in parallel, the independent placement of each chip may cause uneven current distribution, leading to reduced power module efficiency. Additionally, because each chip is individually mounted on the substrate, it requires individual packaging after mounting, which, due to the multiple chips, necessitates multiple processes, making the power module manufacturing process cumbersome.

[0038] This utility model proposes a power module that is applied to vehicles.

[0039] Please see Figures 1 to 4 In one embodiment of the present invention, the power module 1 includes a substrate 10 and a chip module 20. The substrate 10 has an insulating groove 101. The chip module 20 is disposed in the insulating groove 101. The chip module 20 includes a plurality of mounting bases 201, a conductive connector 202 for connecting two adjacent mounting bases 201, and a plurality of chips 203 correspondingly disposed on the plurality of mounting bases 201. The conductive connector 202 is disposed between two adjacent mounting bases 201 and is connected to the two mounting bases 201 respectively. The bottom electrode of the chip 203 is electrically connected to the mounting base 201. The plurality of chips 203 are connected in parallel through the mounting bases 201 and the conductive connector 202.

[0040] The mounting base 201 in this utility model can be manufactured by machining or etching, and there are no further limitations on this. In this embodiment, two mounting bases 201 located at adjacent positions are connected by conductive connectors 202. There can be multiple mounting bases 201; the specific number can be set according to the number of chips 203 required by the power module 1. In other words, the number of mounting bases 201 needs to match the number of chips 203. After placing the chips 203 on the mounting bases 201, multiple chips 203 can be mounted on multiple mounting bases 201 in a one-to-one manner by sintering or welding. Since multiple mounting bases 201 are connected by conductive connectors 202, the material of the conductive connectors 202 can be the same as or different from that of the mounting bases 201. The conductive connectors 202 have conductive function. The number of conductive connectors 202 can be one or more. The conductive connectors 202 can be set in the upper, middle or lower layer of the mounting base 201 along the thickness direction, or when there are multiple conductive connectors 202, they can be any two or three of the above three positional relationships. When there are multiple conductive connectors 202 and they are located in different positions, the conductive connectors 202 can improve the connection stability between two adjacent mounting bases 201 from different positions. In this embodiment, the bottom electrode of each chip 203 is electrically connected to the mounting base 201. This arrangement allows multiple chips 203 to form a highly integrated chip module 20 through the connection of multiple mounting bases 201 and conductive connectors 202. The multiple chips 203 in this chip module 20 can also be connected in parallel through the mounting bases 201 and conductive connectors 202, thereby reducing the overall size of the power module 1 and lowering the uneven current distribution of the multiple chips 203 in parallel by optimizing the layout of the chip module 20. This arrangement also allows for the creation of only one insulating groove 101 on the substrate 10 for mounting the chip module 20. The highly integrated chip module 20 is then mounted into the insulating groove 101, and subsequently encapsulated within the substrate 10 using a unified packaging method, achieving a rapid and unified packaging effect for multiple chips 203 and mounting bases 201.

[0041] In one embodiment, there are multiple conductive connectors 202 located between two adjacent mounting bases 201, and the multiple conductive connectors 202 are arranged at intervals along the length and / or width direction of the mounting base 201. For example, Figure 10As shown, there are two conductive connectors 202. These two conductive connectors 202 can be positioned at any location along the thickness direction of the mounting base 201, either in the upper, middle, or lower layer. Of course, the two conductive connectors 202 can be positioned simultaneously in the same location or in different locations. This arrangement improves the connection stability between adjacent mounting bases 201. For example, as... Figure 11 As shown, there are three conductive connectors 202. The positions of the three conductive connectors 202 are the same as in the above embodiment, and the function achieved by having three conductive connectors 202 is the same as in the above embodiment. Therefore, further details are omitted. Alternatively, as... Figure 12 As shown, there are four conductive connectors 202. The positions of the four conductive connectors 202 are as described in the above embodiments. When there are four conductive connectors 202, they have the same function as the above embodiments with three or two, so they will not be described in detail.

[0042] In one embodiment, the conductive connector 202 has a rectangular or trapezoidal cross-sectional shape along its thickness direction. For example,... Figure 4 As shown, the conductive connector 202 has a rectangular cross-section along its own thickness or that of the mounting base 201. It can be rectangular or square; there are no strict limitations on this. For example, as... Figure 9 As shown, the conductive connector 202 has a trapezoidal cross-section along its own thickness or that of the mounting base 201. In other embodiments, the conductive connector 202 may also have a triangular or irregular cross-section along its own thickness or that of the mounting base 201; no further limitations are imposed on this.

[0043] In one embodiment, the thickness of the conductive connector 202 is less than the thickness of the mounting base 201. For example, the thickness of the mounting base 201 is 0.1–2 mm, while the thickness of the conductive connector 202 is less than the thickness of the mounting base 201. For instance, if the thickness of the mounting base 201 is 2 mm, then the thickness of the conductive connector 202 can be 1.9 mm, 1 mm, or 0.5 mm. No particular limitation is made in this regard. This arrangement reduces the amount of conductive connector 202 used, thereby reducing the manufacturing cost of the chip module 20.

[0044] In one embodiment, the mounting base 201 includes at least one of a copper base, a copper-molybdenum alloy base, an aluminum base, a DBC base, an AMB base, and an AlN base. For example, the mounting base 201 can be a conductor, such as a copper base, a copper-molybdenum alloy base, or an aluminum base. This configuration allows for electrical connection between the external lead and the bottom electrode of the chip 203 by connecting an external lead to the end of the mounting base 201 away from the chip 203. Alternatively, the mounting base 201 can also be a DBC base, an AMB base, or an AlN base. Each of these bases consists of a first conductive structure, an insulating structure, and a second conductive structure stacked sequentially. To ensure that multiple chips 203 can be electrically connected through the first conductive structure and the conductive connector 202, connecting ribs can be formed on the upper surface of the first conductive structure by copper etching. In another embodiment, the DBC, AMB, and AIN sockets can be used as an integrated structure of at least two mounting bases 201 and one conductive connector 202 as described in the above embodiments, using a first conductive structure. In other words, the first conductive structure is a single integrated structure of two mounting bases 201 and one conductive connector 202. Multiple chips 203 can be connected in parallel by connecting ribs on the first conductive structure. Specifically, grooves can be formed in the second conductive structure to facilitate the mounting of the DBC, AMB, and AIN sockets within the substrate 10.

[0045] In one embodiment, the plurality of mounting bases 201 and the plurality of conductive connectors 202 are an integral structure. In this embodiment, the plurality of mounting bases 201 and the plurality of conductive connectors 202 can be integrally formed by machining or etching. In this way, the connection between the mounting bases 201 and the conductive connectors 202 is more stable, and there is no need to connect and install the mounting bases 201 and the conductive connectors 202 separately, thus making it more convenient to use.

[0046] In one embodiment, a plurality of the mounting bases 201 are arranged in an array along the length and / or width direction. For example, Figure 4 As shown, there are two mounting bases 201, which are spaced apart along the length of the power module 1, and a conductive connector 202 is provided between the two mounting bases 201. For example, as... Figure 6 The number of mounting bases 201 is four, and the four mounting bases 201 are arranged at intervals along the length and width directions, that is, arranged in a 2x2 grid pattern. This arrangement can reduce the span of the chip module 20 along the length direction, thereby reducing the increase in the length of the power module 1. Or, as... Figure 7 or Figure 8As shown, when there are six or eight mounting bases 201, they can also be arranged in a spaced-out manner along the length and width directions, such as a 2x3 grid or a 2x4 grid. This achieves the same function as described above, and will not be elaborated further here. In other embodiments, for example, when there are nine mounting bases 201, they can also be arranged along the length and width directions, such as a 3x3 grid. The arrangement of multiple mounting bases 201 is not particularly limited.

[0047] In one embodiment, the insulating groove 101 is provided with at least one partition rib 102, which divides the insulating groove 101 into multiple sub-insulating grooves 101. Multiple mounting seats 201 are correspondingly disposed within the multiple sub-insulating grooves 101. The partition rib 102 is located between two adjacent mounting seats 201 to receive the conductive connector 202. For example,... Figure 2 and Figure 3 As shown, in this embodiment, a partition rib 102 is also provided in the insulating groove 101. There can be multiple partition ribs 102. For example, when there are two mounting bases 201, there can be one partition rib 102, located in the middle of the insulating groove 101, dividing the groove into two sub-insulating grooves 101. The two sub-insulating grooves 101 can accommodate the two mounting bases 201 for insertion and installation. The partition rib 102 can support the conductive connector 202 between the two mounting bases 201, thereby improving the connection strength between the chip module 20 and the substrate 10, ensuring a good and stable connection. Alternatively, in other embodiments, the number of mounting bases 201 is greater than two, and the number of partition ribs 102 can be set according to the actual situation, ensuring that the partition rib 102 can divide the insulating groove 101 into sub-insulating grooves 101 that can accommodate the mounting bases 201, and that the number of sub-insulating grooves 101 is not less than the number of mounting bases 201.

[0048] In one embodiment, the partition rib 102 has a notch 1021, and the conductive connector 202 is accommodated within the notch 1021. Figure 3As shown, in order to prevent the upper and lower surfaces of the chip module 20 from protruding from the upper and lower surfaces of the substrate 10, in this embodiment, a notch 1021 is provided on the partition rib 102. The notch 1021 is correspondingly provided with the conductive connector 202 of the mounting base 201. That is, after the mounting base 201 is installed in the sub-insulating groove 101, the conductive connector 202 is inserted into the notch 1021 of the partition rib 102. In this way, not only can the above-mentioned purpose be achieved, but the receiving and supporting effect of the partition rib 102 on the conductive connector 202 in the chip module 20 can also be strengthened. It can also be used to position the conductive connector 202, thereby achieving a pre-positioning function, so that the chip module 20 is less likely to be misaligned when packaged with the base, thereby indirectly improving the manufacturing yield of the power module 1.

[0049] In one embodiment, the power module 1 further includes a first package 11 and a second package 12. After the chip module 20 is installed in the insulating groove 101 of the substrate 10, prepreg is used to press and encapsulate the substrate 10 along both sides of its thickness. After encapsulation, the first package 11 and the second package 12 are formed. The first package 11 includes a first conductive layer 111 and a first insulating layer 112. The first conductive layer 111 of the first package 11 is located above the first insulating layer 112, that is, the first insulating layer 112 covers the top of the substrate 10 and the chip 203, which can achieve a good encapsulation effect. The second package 12 includes a second conductive layer 121 and a second insulating layer 122. The second conductive layer 121 is located below the second insulating layer 122, that is, the second insulating layer 122 covers the bottom of the substrate 10 and the mounting base 201. In this embodiment, the first conductive layer 111 of the first package 11 can be electrically connected to the top electrode of the chip 203 by laser drilling, and the second conductive layer 121 of the second package 12 can also be electrically connected to the side of the mounting base 201 away from the chip 203 by laser drilling. In this way, the chip 203 is placed between the power supply and the load through the first package 11 and the second package 12. The connection relationship between the first package 11 and the second package 12 and the chip 203, as well as the connection method between the power module 1 and the power supply and the load, can be referred to the existing technology. In this regard, no further details will be provided.

[0050] This utility model also proposes a vehicle that includes the power module 1 in the above embodiments. The specific structure of the power module 1 is as described in the above embodiments. Since this vehicle adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here. The vehicle can be a new energy vehicle, and the power module 1 can be used in the vehicle's inverter, battery management system, motor controller, or on-board charger; no further limitations are imposed.

[0051] The above description is merely an exemplary embodiment of the present utility model and does not limit the scope of protection of the present utility model. Any equivalent structural transformations made under the technical concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.

Claims

1. A power module, characterized in that, include: The substrate has insulating grooves; A chip module is disposed within the insulating groove. The chip module includes multiple mounting bases, conductive connectors for connecting two adjacent mounting bases, and multiple chips disposed on the multiple mounting bases in a one-to-one correspondence. The conductive connectors are disposed between two adjacent mounting bases and are respectively connected to the two mounting bases. The bottom electrode of the chip is electrically connected to the mounting base. The multiple chips are connected in parallel via the mounting bases and the conductive connectors.

2. The power module as described in claim 1, characterized in that, The number of conductive connectors located between two adjacent mounting bases is multiple, and the multiple conductive connectors are arranged at intervals along the length and / or width direction of the mounting base.

3. The power module as described in claim 1, characterized in that, The conductive connector has a rectangular or trapezoidal cross-sectional shape along its thickness direction.

4. The power module as described in claim 2, characterized in that, The thickness of the conductive connector is less than the thickness of the mounting base.

5. The power module as described in claim 1, characterized in that, The mounting base includes at least one of the following: copper base, copper-molybdenum alloy base, aluminum base, DBC base, AMB base, and AlN base.

6. The power module as described in claim 1, characterized in that, The multiple mounting bases and the multiple conductive connectors are integrated into one structure.

7. The power module as described in claim 1, characterized in that, The plurality of said mounting bases are arranged in an array along the length and / or width direction.

8. The power module as described in any one of claims 1 to 7, characterized in that, The insulating groove is provided with at least one partition rib, which is used to divide the insulating groove into multiple sub-insulating grooves. Multiple mounting seats are provided in the multiple sub-insulating grooves in a one-to-one correspondence. The partition rib is located between two adjacent mounting seats to support the conductive connector.

9. The power module as described in claim 8, characterized in that, The separator has a notch, and the conductive connector is housed within the notch.

10. A vehicle, characterized in that, Includes the power module as described in any one of claims 1 to 9.

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