Perovskite photovoltaic module encapsulation structure

Abstract

The utility model provides a kind of perovskite photovoltaic module packaging structure, it includes the FTO glass, hole transport layer, perovskite layer, electron transport layer, back electrode, polysiloxane buffer layer, hot-pressing film layer, glass and the packaging rubber edge being arranged in component four quarters in turn, the polysiloxane buffer layer is prepared by polysiloxane, the liquid viscosity of the polysiloxane is 1000~20000mPa·s, the thickness of the polysiloxane buffer layer is 100-1000nm.The utility model is by being provided with polysiloxane buffer layer, can avoid in the process of hot-pressing hot melt adhesive film directly contact perovskite absorption layer, reduce the efficiency loss of battery, slow down mechanical damage to battery in the process of hot-pressing simultaneously, realize low-loss packaging to perovskite solar module.

Description

TECHNICAL FIELD

[0001] The utility model relates to perovskite photovoltaic module field especially relates to a perovskite photovoltaic module packaging structure. BACKGROUND

[0002] Perovskite solar cells, as a new photovoltaic technology, have attracted extensive attention due to their high photoelectric conversion efficiency, low cost, and simple preparation process. However, perovskite materials have poor stability in air and are easily eroded by moisture and oxygen, leading to a decrease in battery performance. Therefore, effective packaging of perovskite solar cells is crucial to ensure their long-term stability and service life.

[0003] In the field of printable perovskite photovoltaic module packaging technology, hot melt adhesive film (PU, POE, EVA) is widely used for laminated packaging of perovskite solar cells. However, there are many problems in the current perovskite solar photovoltaic module hot melt adhesive film packaging process. For example, after using hot melt adhesive film for packaging, the perovskite absorption layer of the battery is decomposed after contacting the adhesive film, resulting in a decrease in PCE (Power Conversion Efficiency) and FF (Fill Factor) of the battery, and a decrease in service life and efficiency stability of the battery.

[0004] Therefore, it is necessary to design a perovskite photovoltaic module packaging structure to solve the above problems. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a perovskite photovoltaic module packaging structure which prevents hot melt adhesive film from contacting perovskite layer and improves battery efficiency.

[0006] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a perovskite photovoltaic module packaging structure, which comprises FTO glass, hole transport layer, perovskite layer, electron transport layer, back electrode, polysiloxane buffer layer, hot pressing film layer, glass and packaging adhesive edge arranged around the module, the polysiloxane buffer layer is prepared from polysiloxane, the liquid viscosity of the polysiloxane is 1000-20000 mPa·s, and the thickness of the polysiloxane buffer layer is 100-1000 nm.

[0007] As a further improved technical scheme of the utility model, the polysiloxane includes one or a mixture of several of polydimethylsiloxane, polyvinylsiloxane, cyclomethicone, aminosiloxane, polymethylphenylsiloxane and polyether polysiloxane copolymer.

[0008] As a further improved technical scheme of the present application, the polysiloxane buffer layer is prepared on the back electrode by a plating process.

[0009] As a further improved technical scheme of the present application, the perovskite layer comprises a SAM layer, a perovskite absorption layer and a passivation layer prepared in sequence.

[0010] As a further improved technical scheme of the present application, the material of the SAM layer is 2-(3,6-dimethoxy-9H-carbazol-9-yl)ethyl)phosphoric acid or 4-(3,6-dimethyl-9H-carbazol-9-yl)butyl)phosphoric acid.

[0011] As a further improved technical scheme of the present application, the thickness of the perovskite absorption layer is 100-1000 nm.

[0012] As a further improved technical scheme of the present application, the thickness of the passivation layer is 0.1-20 nm, and the material of the passivation layer is phenethylammonium iodide or lithium fluoride.

[0013] As a further improved technical scheme of the present application, the thickness of the electron transport layer is 20-100 nm, and the material of the electron transport layer is fullerene, 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline or SnO2.

[0014] As a further improved technical scheme of the present application, the material of the hot melt adhesive film is one or more of polyurethane, polyolefin elastomer or ethylene-vinyl acetate copolymer.

[0015] According to the above technical scheme, the perovskite photovoltaic module packaging structure of the present application utilizes the good chemical inertness and hydrophobicity of polysiloxane, as well as the high transparency and electrical insulation properties. First, a polysiloxane buffer layer is plated on the back electrode of the prepared perovskite solar cell, and then a hot melt adhesive film is realized by a laminating machine to realize the composite hybrid packaging of the perovskite battery. The following effects are achieved: the polysiloxane buffer layer can avoid the direct contact of the hot melt adhesive film with the perovskite absorption layer during hot pressing, reducing the efficiency loss of the battery and slowing down the mechanical damage to the battery during hot pressing, realizing low-loss packaging of the perovskite solar module; the polysiloxane buffer layer has a low water vapor transmission rate, which can effectively prevent water and oxygen from entering the battery interior and protect the perovskite material from erosion; through reasonable packaging structure design, light reflection loss is reduced, and the photoelectric conversion efficiency of the battery is improved; through reasonable packaging structure design, light reflection loss is reduced, and the photoelectric conversion efficiency of the battery is improved; the packaging structure design of the present application is reasonable, the production process is simple, and it is easy to mass produce and apply. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 FIG. 1 is a schematic view of a perovskite photovoltaic module packaging structure according to an embodiment of the present application. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be described in detail below with reference to the drawings and specific embodiments.

[0018] Please refer to Figure 1 The present application provides a kind of perovskite photovoltaic module packaging structure, it includes: FTO glass 1, hole transport layer 2, perovskite layer 3, electron transport layer 4, back electrode 5, polysiloxane buffer layer 6, hot-pressing film layer 7, glass 8 and the packaging glue edge 9 of being arranged in component four around, which are sequentially stacked.

[0019] Perovskite layer 3 includes sequentially prepared SAM layer, perovskite absorption layer and passivation layer.The material of SAM layer is 2-(3,6-dimethoxy-9H-carbazole-9-yl) ethyl) phosphoric acid (MeO-2PACz) or 4-(3,6-dimethyl-9H-carbazole-9-yl) butyl) phosphoric acid (Me-4PACz).The thickness of perovskite absorption layer is 100-1000nm.The thickness of passivation layer is 0.1-20nm, and the material of passivation layer is phenethyl ammonium iodide or lithium fluoride.

[0020] The thickness of electron transport layer 4 is 20-100nm, and the material of electron transport layer 4 is fullerene, 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline or SnO2.

[0021] Polysiloxane buffer layer 6 is prepared by polysiloxane, and the liquid viscosity of polysiloxane is 1000-20000 mPa·s.The thickness of polysiloxane buffer layer is 100-1000nm.Polysiloxane includes one or several mixtures of polydimethylsiloxane, polyvinylsiloxane, cyclo-methylsiloxane, aminosiloxane, polymethylphenylsiloxane and polyether polysiloxane copolymer.

[0022] The material of hot melt adhesive film 7 is one or more of polyurethane, polyolefin elastomer or ethylene-vinyl acetate copolymer.

[0023] The above-mentioned perovskite photovoltaic module packaging structure can be prepared by the following method:

[0024] (1) ultrasonic and plasma cleaning and scribing are carried out on FTO glass.

[0025] (2) hole transport layer (HTL) is prepared: using magnetron sputtering PVD equipment to coat film NiOX on FTO glass, and the thickness of hole transport layer is 20-100nm.

[0026] (3) Preparation of perovskite layer: first, a SAM layer with a thickness of 0.1-20 nm is prepared on the NiOX hole transport layer; then, a perovskite absorption layer with a thickness of 100-1000 nm is prepared on the SAM layer using a slot coating process; further, a passivation layer with a thickness of 0.1-20 nm is prepared on the perovskite absorption layer.

[0027] (4) Preparation of electron transport layer (ETL): an electron transport layer with a thickness of 20-100 nm is prepared on the perovskite layer using a high-low temperature evaporation device, and scribing is performed after the preparation of the ETL layer.

[0028] (5) Preparation of top electrode: a Cu or Ag electrode with a thickness of 50-200 nm is evaporated on the scribed battery using a high-temperature evaporation device, and laser scribing and edge cleaning are performed after the preparation of the back electrode.

[0029] (6) Preparation of polysiloxane buffer layer: Ag bus bars are attached to both sides of the device after step (5), and a polysiloxane buffer layer with a thickness of 100-1000 nm is covered on the back electrode by a plating process.

[0030] (7) Hot melt adhesive film lamination packaging: a hot melt adhesive film with appropriate size is cut and covered on the surface of the polysiloxane buffer layer, and butyl hot melt sealant is attached to the edge of the cleaned glass, and white glass is covered on the surface for lamination packaging, the lamination time is 10-30 min, and the lamination temperature is 80-150°C.

[0031] The perovskite photovoltaic module packaging structures of Examples 1-4 and Comparative Examples prepared according to the above preparation method are as follows, the materials, thicknesses of each layer of the modules, and the obtained battery efficiencies are shown in Table 1 and Table 2. Comparative Example 1 omits the process of "preparing a polysiloxane buffer layer on the back electrode" in step (6).

[0032] Table 1: Materials and thicknesses of perovskite layer, electron transport layer, and hot melt adhesive film in each example and comparative example

[0033]

[0034]

[0035] Table 2: Polysiloxane buffer layer parameters and battery efficiency measurement results in each example and comparative example

[0036]

[0037] As can be seen from Table 1 and Table 2, compared with the comparative examples, the battery efficiency is effectively improved by setting a polysiloxane buffer layer between the back electrode and the hot melt adhesive film in the examples.

[0038] The terms such as "upper", "lower", "front", "back", "left", "right" and the like used herein to indicate spatial relative positions are for the purpose of facilitating illustration to describe the relationship of one feature relative to another feature as shown in the drawings. It can be understood that the terms of spatial relative positions can be intended to include different orientations other than the orientation shown in the drawings, and should not be construed as limiting the claims.

[0039] In addition, the above embodiments are only used to illustrate the technical solutions described in the utility model and not to limit the utility model. The understanding of the specification should be based on the technical personnel in the art. Although the utility model has been described in detail in the specification with reference to the above embodiments, the ordinary skilled person in the art should understand that the technical personnel in the art can still modify or equivalently replace the utility model. All technical solutions and improvements that do not deviate from the spirit and scope of the utility model should be covered in the scope of the claims of the utility model.

Claims

1. A perovskite photovoltaic module encapsulation structure, characterized in that, The assembly includes FTO glass, a hole transport layer, a perovskite layer, an electron transport layer, a back electrode, a polysiloxane buffer layer, a hot-pressed film layer, glass, and encapsulation adhesive edges disposed around the assembly, arranged in sequence. The polysiloxane buffer layer is made of polysiloxane, the liquid viscosity of which is 1000~20000 mPa·s, and the thickness of which is 100-1000 nm.

2. The perovskite photovoltaic module encapsulation structure as described in claim 1, characterized in that: The polysiloxane buffer layer is prepared on the back electrode by a polysiloxane coating process.

3. The perovskite photovoltaic module encapsulation structure as described in claim 1, characterized in that: The perovskite layer comprises a SAM layer, a perovskite absorber layer, and a passivation layer, which are prepared sequentially.

4. The perovskite photovoltaic module encapsulation structure as described in claim 3, characterized in that: The material of the SAM layer is 2-(3,6-dimethoxy-9H-carbazole-9-yl)ethyl phosphate or 4-(3,6-dimethyl-9H-carbazole-9-yl)butyl phosphate.

5. The perovskite photovoltaic module encapsulation structure as described in claim 3, characterized in that: The thickness of the perovskite absorber layer is 100-1000 nm.

6. The perovskite photovoltaic module encapsulation structure as described in claim 3, characterized in that: The passivation layer has a thickness of 0.1-20 nm and is made of phenylethyl ammonium iodide or lithium fluoride.

7. The perovskite photovoltaic module encapsulation structure as described in claim 1, characterized in that: The electron transport layer has a thickness of 20-100 nm and is made of fullerene, 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline, or SnO2.

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