Display substrate

Abstract

A display substrate includes a substrate including a display area and a peripheral area surrounding the display area; a plurality of light emitting diodes over the substrate in the display area; a thin film encapsulation layer covering the plurality of light emitting diodes; and a plurality of protrusions arranged on the thin film encapsulation layer in the peripheral area and along at least a portion of an edge of the display area.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to and all benefits arising therefrom of Korean Patent Application No. 10-2024-0058130, filed on April 30, 2024, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] One or more embodiments relate to a display substrate and a method of manufacturing a display device. One or more embodiments relate to a method of manufacturing an electronic device. Background Technology

[0004] Electronic devices may include display devices for displaying images and / or video. Display devices may include light-emitting diodes (LEDs), such as organic light-emitting diodes (OLEDs). A protective film may be attached to a semi-finished display device undergoing a manufacturing process (hereinafter referred to as a "display substrate") to protect the surface of the display substrate during the manufacturing process. The protective film may be applied to the display substrate in a solid state or in a liquid state and then cured (or hardened). Unlike solid protective films with a fixed shape, liquid (or resin) protective films can be applied to display substrates of various shapes because liquid (or resin) protective films can flow freely on the display substrate. Utility Model Content

[0005] The process of setting a liquid (or resin) protective film may include placing resin on a display substrate, allowing the resin to flow to the area to be covered, and curing the resin into a solid state. In this process, as the resin flows, it may overflow beyond the boundaries of the area to be covered, and as the resin cures, it may shrink, creating areas that may not be covered. As mentioned above, when using a liquid (or resin) protective film, it can be difficult to control the area where the film is formed. Therefore, a structure that matches both the area to be covered and the area where the film is actually formed is needed.

[0006] According to one or more embodiments, a display substrate includes: a substrate including a display area and a peripheral area surrounding the display area; a plurality of light-emitting diodes disposed on the substrate in the display area; a thin-film encapsulation layer covering the plurality of light-emitting diodes; and a plurality of protrusions disposed on the thin-film encapsulation layer in the peripheral area, wherein the plurality of protrusions are disposed along at least a portion of the edge of the display area.

[0007] In an embodiment, the display substrate may further include a resin disposed on the thin film encapsulation layer and overlapping the display area.

[0008] In one embodiment, the resin may be in direct contact with at least one of the plurality of protrusions.

[0009] In one embodiment, the multiple protrusions may be spaced apart from each other, and a portion of the edge of the resin may be between two adjacent protrusions among the multiple protrusions.

[0010] In an embodiment, the substrate may further include an opening region within the display area and an intermediate region between the opening region and the display area, wherein the intermediate region may at least partially surround the opening region, and the display substrate may further include a plurality of additional protrusions disposed on a thin-film encapsulation layer in the intermediate region.

[0011] In an embodiment, the display substrate may further include an input sensing layer disposed on the thin film encapsulation layer and including a conductive layer and an insulating layer, wherein a plurality of protrusions may be disposed on the input sensing layer.

[0012] In one embodiment, the thin-film encapsulation layer may include a first inorganic encapsulation layer covering a plurality of light-emitting diodes, an organic encapsulation layer disposed on the first inorganic encapsulation layer, and a second inorganic encapsulation layer covering the organic encapsulation layer.

[0013] In one implementation, multiple protrusions may be arranged outside the area in which the organic encapsulation layer is disposed.

[0014] According to one or more embodiments, a method of manufacturing a display device includes: preparing a display substrate, the display substrate including a plurality of light-emitting diodes disposed in a display area and a thin-film encapsulation layer covering the plurality of light-emitting diodes; providing a plurality of protrusions on the thin-film encapsulation layer in a peripheral region surrounding the display area; and providing a resin on the display substrate to overlap with the display area.

[0015] In one implementation, multiple protrusions may be arranged along the edge of the display area.

[0016] In this implementation, the multiple protrusions can be spaced apart from each other.

[0017] In some embodiments, the method may also include causing the resin to flow toward the plurality of protrusions.

[0018] In one embodiment, the edge of the area where the resin is disposed may be defined by a plurality of protrusions.

[0019] In some embodiments, the method may also include curing a resin.

[0020] In one embodiment, during resin curing, the edges of the areas in which the resin is disposed can be secured and held by a plurality of protrusions.

[0021] In an embodiment, the method may further include separating the cured resin together with at least one of the plurality of protrusions from the display substrate.

[0022] In an embodiment, the display substrate may further include an opening region within the display area and an intermediate region between the opening region and the display area, the intermediate region at least partially surrounding the opening region, wherein the method may further include forming a plurality of additional protrusions on a thin-film encapsulation layer in the intermediate region.

[0023] In an embodiment, the method may further include setting an input sensing layer on the thin-film encapsulation layer, wherein setting a plurality of protrusions may include setting a plurality of protrusions on the input sensing layer on the thin-film encapsulation layer.

[0024] In one embodiment, the thin-film encapsulation layer may include a first inorganic encapsulation layer covering a plurality of light-emitting diodes, an organic encapsulation layer disposed on the first inorganic encapsulation layer, and a second inorganic encapsulation layer covering the organic encapsulation layer.

[0025] In one implementation, multiple protrusions may be arranged outside the area in which the organic encapsulation layer is disposed.

[0026] According to one or more embodiments, a method of manufacturing an electronic device includes manufacturing a display device and disposing the display device in a housing, wherein manufacturing the display device includes: preparing a display substrate, the display substrate including a plurality of light-emitting diodes disposed in a display area and a thin-film encapsulation layer covering the plurality of light-emitting diodes; providing a plurality of protrusions on the thin-film encapsulation layer in a peripheral region surrounding the display area; and providing a resin on the display substrate to overlap with the display area.

[0027] In some implementations, the method may also include placing electronic components within the housing. Attached Figure Description

[0028] The above and other features of specific embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0029] Figure 1 It is a schematic plan view of an electronic device according to an embodiment;

[0030] Figure 2 It is according to the implementation method along Figure 1 A schematic cross-sectional view of the electronic device taken from line II-II';

[0031] Figure 3 This is a schematic plan view of the display substrate according to an embodiment;

[0032] Figure 4 It is according to the implementation method along Figure 3 A schematic cross-sectional view of the display substrate taken along line IV-IV';

[0033] Figure 5This is an enlarged plan view showing a portion of the display substrate according to an embodiment and is Figure 3 A magnified planar view of region V;

[0034] Figure 6 This is an enlarged plan view showing a portion of the display substrate according to an embodiment and is Figure 3 Enlarged plan view of area VI;

[0035] Figure 7 This is a cross-sectional view showing a portion of the display substrate according to an embodiment, and is along... Figure 6 A cross-sectional view of the display substrate taken by line VII-VII';

[0036] Figure 8 This is an enlarged plan view showing a portion of the display substrate according to an embodiment and is Figure 3 Enlarged plan view of region VIII;

[0037] Figure 9 This is a cross-sectional view showing a portion of the display substrate according to an embodiment, and is along... Figure 8 A cross-sectional view of the display substrate taken by line IX-IX';

[0038] Figure 10A , Figure 10B , Figure 10C , Figure 10D , Figure 10E and Figure 10F It is a perspective view of the protrusion according to various implementation methods;

[0039] Figure 11A , Figure 11B , Figure 11C and Figure 11D It is a plan view showing various examples of how protrusions can be arranged in corner areas;

[0040] Figure 12 This is an enlarged plan view of a portion of the display substrate according to an embodiment, and shows the direction... Figure 5 The embodiments shown provide embodiments of the resin;

[0041] Figure 13 This is an enlarged plan view of a portion of the display substrate according to an embodiment, and shows the direction... Figure 6 The embodiments shown provide embodiments of the resin;

[0042] Figure 14 This is an enlarged plan view of a portion of the display substrate according to an embodiment, and shows the direction... Figure 8 The embodiments shown provide embodiments of the resin; and

[0043] Figure 15A, Figure 15B , Figure 15C , Figure 15D , Figure 15E , Figure 15F and Figure 15G This is a schematic perspective view illustrating the operation of a manufacturing process for a display device according to an embodiment. Detailed Implementation

[0044] This disclosure will now be described more fully below with reference to the accompanying drawings, in which various embodiments are illustrated. However, this disclosure may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of this disclosure to those skilled in the art. The same reference numerals throughout denote the same elements.

[0045] Because this disclosure allows for various modifications and multiple implementations, specific implementations will be shown in the accompanying drawings and described in the written description. The effects and features of this disclosure, as well as the methods for implementing them, will be elucidated with reference to the embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the following embodiments and can be implemented in various forms.

[0046] It will be understood that when an element is referred to as being "on" another element, it can be directly on the other element, or there can be an intermediate element between them. Conversely, when an element is referred to as being "directly" on another element, there is no intermediate element.

[0047] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or part from another. Therefore, without departing from the teachings herein, “first element,” “first component,” “first region,” “first layer,” or “first part” discussed below may be referred to as a second element, second component, second region, second layer, or second part.

[0048] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, “a,” “an,” “the,” and “at least one” do not indicate a limitation of quantity and are intended to include both the singular and the plural unless the context clearly indicates otherwise. Thus, reference to “a” element following “the” element in a claim includes one element and multiple elements. For example, “a single element” has the same meaning as “at least one element” unless the context clearly indicates otherwise. “At least one” should not be construed as limiting “a” or “an.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, the expressions “at least one of a, b, and c” or “selected from at least one of a, b, and c” mean only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0049] It will also be understood that, when used in this specification, the terms “comprises” and / or “comprising” or “includes” and / or “including” specify the presence of the stated features, areas, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, areas, integrals, steps, operations, elements, components and / or groups thereof.

[0050] Furthermore, relative terms such as “down” or “bottom” and “up” or “top” may be used herein to describe the relationship between one element and another as shown in the accompanying drawings. It will be understood that, in addition to the orientations depicted in the drawings, the relative terms are intended to encompass different orientations of the devices. For example, if a device in one of the drawings is flipped, an element described as being “down” to the other element will consequently be oriented “up” to the other element. Thus, the term “down” can encompass both “down” and “up” orientations, depending on the specific orientation of the drawing. Similarly, if a device in one of the drawings is flipped, an element described as being “below” or “under” the other element will consequently be oriented “above” the other element. Thus, the term “below” or “under” can encompass both “up” and “down” orientations.

[0051] For ease of explanation, the dimensions of the elements in the accompanying drawings may be enlarged or reduced. By way of example, for ease of description, the dimensions and thicknesses of each element shown in the drawings are arbitrarily represented, and therefore, this disclosure is not necessarily limited thereto.

[0052] Where specific implementation methods can be carried out differently, a particular process sequence may be performed in an order different from that described. As an example, two consecutively described processes may be performed substantially simultaneously or in reverse order.

[0053] In this specification, "A and / or B" means A or B, or A and B. In this specification, "at least one of A and B" means A or B, or A and B.

[0054] It will be understood that when a layer, area, or element is referred to as being "connected to" another layer, area, or element, it may be "directly connected to" the other layer, area, or element, or it may be "indirectly connected to" the other layer, area, or element, with the other layer, area, or element located therebetween. For example, it will be understood that when a layer, area, or element is referred to as being "electrically connected to" another layer, area, or element, it may be "directly electrically connected to" the other layer, area, or element, or it may be "indirectly electrically connected to" the other layer, area, or element, with the other layer, area, or element inserted therebetween.

[0055] The x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different orientations that are not perpendicular to each other.

[0056] Given the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), the terms "about" or "approximately" as used herein include the stated value and mean within an acceptable deviation range of the particular value as determined by one of ordinary skill in the art. For example, "about" may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0057] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms, such as those defined in common dictionaries, shall be interpreted as having the same meaning as they have in the relevant field and in the context of this disclosure, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0058] Embodiments are described herein with reference to schematic cross-sectional views as preferred embodiments. Therefore, variations in the illustrated shapes should be anticipated, for example, due to manufacturing techniques and / or tolerances. Consequently, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but should include, for example, deviations in shape due to manufacturing processes. For instance, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, acute angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to represent the precise shapes of the regions, nor are they intended to limit the scope of the claims.

[0059] Figure 1 This is a schematic plan view of electronic device 1 according to an embodiment.

[0060] refer to Figure 1 Implementations of electronic device 1 may include a device for displaying moving or still images, and can be used as a display screen for various products and portable electronic devices, including televisions, laptops, monitors, billboards, Internet of Things (IoT) devices, and portable electronic devices including mobile phones, smartphones, tablet PCs, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, and ultra-mobile personal computers (UMPCs). Furthermore, electronic device 1 can be used in wearable devices including watches, watch phones, glasses displays, and head-mounted displays (HMDs). In addition, in embodiments, electronic device 1 can be used as a display in a car's dashboard, a car's central instrument panel or a central information display (CID) arranged on the dashboard, a mirror display replacing side mirrors in a car, and a display in an entertainment system for rear-seat passengers arranged on the back of the front seats in a car. For ease of illustration and description, Figure 1 An embodiment of electronic device 1 as a smartphone is shown.

[0061] In one embodiment, the electronic device 1 may have an approximately rectangular shape when viewed in a plan view or in the z-direction (i.e., the z-axis direction). In another embodiment, for example, as... Figure 1 As shown, the electronic device 1 can have a quadrilateral shape in a plan view, the quadrilateral shape having a short side in the x-direction (i.e., the x-axis direction) and a long side in the y-direction (i.e., the y-axis direction). The edge where the short side in the x-direction meets the long side in the y-direction can be rounded to have, as shown in the figure... Figure 1 The preset curvature shown may be formed at right angles. The planar shape of electronic device 1 is not limited to a rectangle, but may be other polygonal, elliptical or irregular shapes.

[0062] Electronic device 1 may include an opening region OA and a display area DA that partially surrounds the opening region OA. Electronic device 1 may include a central region MA and a peripheral region PA, wherein the central region MA is disposed between the opening region OA and the display area DA, and the peripheral region PA surrounds the outer side of the display area DA. The central region MA may have a closed-loop shape that completely surrounds the opening region OA in a plan view. Optionally, the central region MA may at least partially surround the opening region OA.

[0063] The opening area OA can be located (or limited) within the display area DA. In an implementation, such as... Figure 1 As shown, the opening area OA can be arranged at the upper center of the display area DA. Optionally, the opening area OA can be arranged on the upper left side or the upper right side of the display area DA. However, the opening area OA can be arranged in various positions. Although Figure 1 An embodiment of arranging a single opening region OA is shown, but in another embodiment, multiple opening regions OA can be arranged.

[0064] The peripheral region PA may include side regions SA corresponding to the edges of the electronic device 1. Side regions SA may be regions corresponding to, for example, the short or long sides of the electronic device 1 extending in the x or y direction. Side regions SA may also extend in the x or y direction.

[0065] The peripheral region PA may include a corner region CNA corresponding to the corner of the electronic device 1. The long side and short side of the electronic device 1 may meet each other at the corner of the electronic device 1. The corner region CNA may be a region corresponding to the corner. In an embodiment, the corner region CNA may correspond to the rounded region of the electronic device 1. In an embodiment, the corner region CNA may be located between two adjacent side regions SA, and the side regions SA may be located between two corner regions CNA.

[0066] Figure 2 It is according to the implementation method along Figure 1 A schematic cross-sectional view of electronic device 1 taken from line II-II'.

[0067] refer to Figure 2 An embodiment of electronic device 1 may include display device 2 and component CP disposed in the opening region OA of electronic device 1. Display device 2 and component CP may be disposed or housed in housing HS.

[0068] The display device 2 may include a substrate SUB, an image generation layer 10, an input sensing layer 20, an optical functional layer 30, an adhesive layer 40, and a cover window 50.

[0069] Image generation layer 10 may include display elements configured to emit light to display an image. The display elements may include light-emitting diodes (LEDs), such as organic light-emitting diodes (OLEDs) including an organic light-emitting layer. In another embodiment, the LED may be an inorganic LED comprising inorganic materials. The inorganic LED may include a PN junction diode comprising a material based on an inorganic semiconductor. When a forward voltage is applied to the PN junction diode, holes and electrons are injected, and the energy generated by the recombination of holes and electrons is converted into light energy, thus emitting light of a predetermined color. The inorganic LED may have a width of several micrometers to hundreds of micrometers or several nanometers to hundreds of nanometers. In an embodiment, image generation layer 10 may include quantum dot LEDs. In an embodiment, for example, the emitting layer of image generation layer 10 may include organic materials, inorganic materials, quantum dots, organic materials and quantum dots, or inorganic materials and quantum dots.

[0070] The input sensing layer 20 can be configured to obtain coordinate information corresponding to external inputs (e.g., touch events). The input sensing layer 20 may include sensing electrodes (or touch electrodes) and traces connected to the touch electrodes. The input sensing layer 20 may be disposed on the image generation layer 10. The input sensing layer 20 can sense external inputs using self-capacitance and / or mutual capacitance methods.

[0071] The input sensing layer 20 can be formed directly on the image generation layer 10, or it can be formed separately and then bonded to the image generation layer 10 using an optically transparent adhesive. In some embodiments, for example, the input sensing layer 20 can be formed sequentially after the process of forming the image generation layer 10. In such embodiments, an adhesive layer may not be required between the input sensing layer 20 and the image generation layer 10. Although Figure 2 An embodiment is shown in which the input sensing layer 20 is disposed between the image generation layer 10 and the optical functional layer 30, but in another embodiment, the input sensing layer 20 may be disposed on the optical functional layer 30.

[0072] The optical functional layer 30 may include an anti-reflection layer. The anti-reflection layer reduces the reflectivity of light (external light) incident from the outside through the cover window 50 toward the display device 2. In one embodiment, the anti-reflection layer may include a phase delayer and a polarizer. In another embodiment, the anti-reflection layer may include a black matrix and a color filter. The color filter may be arranged based on the arrangement of the colors of the light emitted from the light-emitting diodes of the image generation layer 10.

[0073] The display device 2 may be provided with an opening 2OP to improve the transmittance of the opening region OA. The opening 2OP is defined or formed by constituting or forming part of a layer of the display device 2. The opening 2OP may include a first opening 10OP, a second opening 20OP, and a third opening 30OP defined or formed by the image generation layer 10, the input sensing layer 20, and the optical functional layer 30, respectively. The first opening 10OP of the image generation layer 10, the second opening 20OP of the input sensing layer 20, and the third opening 30OP of the optical functional layer 30 may overlap each other to jointly form the opening 2OP of the display device 2.

[0074] Cover window 50 can be disposed on optical functional layer 30. Cover window 50 can be attached to optical functional layer 30 by adhesive layer 40 such as transparent optically clear adhesive (OCA) disposed between cover window 50 and optical functional layer 30. Cover window 50 can cover the first opening 10OP of image generation layer 10, the second opening 20OP of input sensing layer 20 and the third opening 30OP of optical functional layer 30.

[0075] The cover window 50 may include glass or plastic materials. The glass material may include ultra-thin glass (Samsung). Plastic materials may include polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate.

[0076] The opening area OA can be a component area (e.g., sensor area, camera area, speaker area, etc.) where the component CP for adding various functions to the electronic device 1 is located.

[0077] Component CP may include electronic elements. In some embodiments, component CP may be, for example, an electronic element that uses light or sound. In some embodiments, the electronic element may include, for example, a sensor that uses light, such as an infrared sensor, a camera that receives light to capture an image, a sensor that outputs and senses light or sound to measure distance or identify fingerprints, a small light that outputs light, and a speaker that outputs sound. Electronic elements using light can use light in various wavelength bands, such as visible light, infrared light, ultraviolet light, etc. The opening region OA corresponds to the area through which light and / or sound from component CP output to the outside or from the outside toward the electronic element can pass.

[0078] In one embodiment, the method of manufacturing the electronic device 1 includes manufacturing a display device 2 and disposing the display device 2 in a housing HS. In another embodiment, the method of manufacturing the electronic device 1 further includes disposing electronic components in the housing HS.

[0079] Figure 3This is a schematic plan view of the display substrate 3 according to the embodiment. Figure 4 It is according to the implementation method along Figure 3 A schematic cross-sectional view of the display substrate 3 taken along line IV-IV'.

[0080] In this disclosure, the display substrate 3 may represent a semi-finished product undergoing the process of manufacturing the display device 2. The display substrate 3 may not include some of the components of the display device 2. For example, see also... Figure 2 and Figure 4 The display device 2 may include an optical functional layer 30, an adhesive layer 40, and a cover window 50, while the display substrate 3 may not include these elements. In other words, the display substrate 3 may include an image generation layer 10 and an input sensing layer 20 during the manufacture of the display device 2, and may be in a state prior to the provision or formation of the optical functional layer 30 on the input sensing layer 20. This is provided as an example, and the present disclosure is not limited to the configuration of only these specific layers.

[0081] refer to Figure 3 Similar to electronic device 1 (see Figure 1 The display substrate 3 may include a display area DA, a peripheral area PA (including a corner area CNA and a side area SA), an opening area OA, and a central area MA. In an embodiment, the shape of the display substrate 3 in a plan view may be similar to that of the electronic device 1 (see [reference]). Figure 1 (The shape of)

[0082] refer to Figure 4 An embodiment of the display substrate 3 may include a substrate SUB, an image generation layer 10, and an input sensing layer 20. The image generation layer 10 may be disposed on the substrate SUB, and the input sensing layer 20 may be disposed on the image generation layer 10. Each of a portion of the image generation layer 10 and a portion of the input sensing layer 20 may be open. An opening 3OP of the display substrate 3 may include a first opening 10OP of the image generation layer 10 and a second opening 20OP of the input sensing layer 20.

[0083] Figure 5 It is an enlarged plan view of a portion of the display substrate 3 according to the embodiment and is Figure 3 A magnified planar view of region V.

[0084] exist Figure 5 The image shows a magnified view of display substrate 3 (see image). Figure 3 The corner area CNA of ) . In the implementation, such as Figure 5 As shown, multiple first protrusions PR1 can be arranged in the corner region CNA. In an embodiment, each of the first protrusions PR1 can be circular in plan view. This disclosure is not limited to... Figure 5The shape of the first protrusion PR1 shown is described below, and the shape of the first protrusion PR1 can be modified in various ways as described below.

[0085] In an embodiment, the first protrusions PR1 may be arranged along an imaginary line (e.g., first line L1). In an embodiment, for example, the center of each of the first protrusions PR1 may be located on the first line L1. In an embodiment, the first line L1 may be a curve extending along the circumference of the rounded corner region CNA (or in the same direction as the circumference of the rounded corner region CNA). In an embodiment, for example, the first line L1 may have an arc shape with a radius larger than the radius of the rounded corner of the display area DA and smaller than the radius of the rounded corner region CNA. In other words, the first line L1 may be located between the boundary of the display area DA and the corner region CNA and the outer edge of the corner region CNA. Therefore, the first protrusions PR1 may also be located between the boundary of the display area DA and the corner region CNA and the outer edge of the corner region CNA, i.e., within the corner region CNA. Although in Figure 5 Only one first line L1 is shown in the figure, but this disclosure is not limited to this, and there may be multiple imaginary lines on which the first protrusion PR1 is arranged.

[0086] The first protrusion PR1 may be disposed on the input sensing layer 20. In an embodiment, for example, the input sensing layer 20 may include a second touch insulating layer 204, and the first protrusion PR1 may be disposed on the second touch insulating layer 204.

[0087] Figure 6 It is an enlarged plan view of a portion of the display substrate 3 according to the embodiment and is Figure 3 An enlarged plan view of region VI.

[0088] exist Figure 6 The image shows a magnified view of display substrate 3 (see image). Figure 3 The side region SA of the display substrate 3. In the following description, although the description is based on the display substrate 3 (see [link to display substrate 3]), Figure 3 This is performed in the side region SA in the +x direction, but this is for ease of description, and the features described below can be applied to display substrate 3 (see...). Figure 3 Each of the side regions SA in the +y, -y, and -x directions.

[0089] Multiple second protrusions PR2 can be arranged in the side region SA. In an embodiment, each of the second protrusions PR2 may be circular in a plan view. This disclosure is not limited to the shape of the second protrusions PR2, and the shape of the second protrusions PR2 can be modified in various ways as described below.

[0090] In one embodiment, the second protrusion PR2 may be arranged along an imaginary line (e.g., second line L2). In another embodiment, for example, the center of the second protrusion PR2 may be located on the second line L2. In another embodiment, the second line L2 may be a straight line extending in the direction of the lateral region SA. In yet another embodiment, for example, as... Figure 6 As shown, the side region SA and the second line L2 can extend in the y-axis direction. In another region, for example, in the region where the side region SA extends along the x-axis direction, the second line L2 can extend in the x-axis direction. The second protrusion PR2 can be arranged between the boundary of the display region DA and the side region SA and the outer edge of the side region SA. In an embodiment, the second protrusion PR2 can be arranged in a predetermined region within the side region SA, for example, within the second protrusion region PRA2. The second protrusion region PRA2 is referenced below. Figure 7 To describe. Although in Figure 6 Only one second line L2 is shown in the figure, but this disclosure is not limited to this, and there may be multiple imaginary lines on which second protrusions PR2 are arranged.

[0091] The second protrusion PR2 may be disposed on the input sensing layer 20. In an embodiment, for example, the input sensing layer 20 may include a second touch insulating layer 204, and the second protrusion PR2 may be disposed on the second touch insulating layer 204.

[0092] Figure 7 This is a cross-sectional view of a portion of the display substrate 3 according to the embodiment, and is along... Figure 6 The cross-sectional view of the display substrate 3 is taken from line VII-VII'.

[0093] refer to Figure 7 In one embodiment, the image generation layer 10 may include a display element layer (DISL) and a thin-film encapsulation layer (TFE), wherein the display element layer (DISL) includes display elements, and the thin-film encapsulation layer (TFE) encapsulates and protects the display element layer (DISL). An input sensing layer 20 is disposed on the image generation layer 10, wherein the input sensing layer 20 is configured to receive user input (e.g., touch).

[0094] Display element layer DISL, including the various layers described below, can be disposed on substrate SUB.

[0095] Multiple sub-pixels, serving as display elements, can be arranged in a display area DA. Each sub-pixel may include a corresponding light-emitting diode (LED) and a corresponding thin-film transistor (TFT). In an embodiment, for example, a first sub-pixel SPX1 (including a first LED1 and its corresponding first TFT1), a second sub-pixel SPX2 (including a second LED2 and its corresponding second TFT2), and a third sub-pixel SPX3 (including a third LED3 and its corresponding third TFT3) may be arranged in the display area DA. The first LED1, the second LED2, and the third LED3 may be configured to emit light of different colors. In an embodiment, the first LED1 may be configured to emit blue light, the second LED2 may be configured to emit green light, and the third LED3 may be configured to emit red light.

[0096] A buffer layer 101 may be disposed on the substrate SUB. The buffer layer 101 protects the upper surface of the substrate SUB while simultaneously planarizing the upper surface of the substrate SUB. The buffer layer 101 may comprise an inorganic insulating material, such as silicon oxide (SiO2). x ), silicon nitride (SiN) x The material comprises silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO2), and has a single-layer or multi-layer structure, wherein each layer comprises at least one material selected from the above materials.

[0097] A first thin-film transistor (TFT1), a second thin-film transistor (TFT2), and a third thin-film transistor (TFT3) can be disposed on a buffer layer 101. Each TFT can be connected to a corresponding light-emitting diode (LED) to drive the LED. The first TFT1 may include a first active layer ACT1, a first gate electrode GE1, a first source electrode SE1, and a first drain electrode DE1. The second TFT2 may include a second active layer ACT2, a second gate electrode GE2, a second source electrode SE2, and a second drain electrode DE2. The third TFT3 may include a third active layer ACT3, a third gate electrode GE3, a third source electrode SE3, and a third drain electrode DE3.

[0098] The first active layer ACT1, the second active layer ACT2, and the third active layer ACT3 may be spaced apart from each other on the buffer layer 101 in a planar view or when viewed in the z-direction. Here, the z-direction may be the thickness direction of the substrate SUB or the display substrate 3. The first active layer ACT1 may include a drain region overlapping with the first drain electrode DE1, a source region overlapping with the first source electrode SE1, and a channel region between the drain region and the source region. The second active layer ACT2 may include a drain region overlapping with the second drain electrode DE2, a source region overlapping with the second source electrode SE2, and a channel region between the drain region and the source region. The third active layer ACT3 may include a drain region overlapping with the third drain electrode DE3, a source region overlapping with the third source electrode SE3, and a channel region between the drain region and the source region. Each of the drain region and the source region may be a region doped with impurities.

[0099] The gate insulating layer 103 may cover the first active layer ACT1, the second active layer ACT2, and the third active layer ACT3. The gate insulating layer 103 may include an inorganic insulating material, such as silicon oxide (SiO2). x ), silicon nitride (SiN) x The material comprises silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO2), and has a single-layer or multi-layer structure, wherein each layer comprises at least one material selected from the above materials.

[0100] The first gate electrode GE1, the second gate electrode GE2, and the third gate electrode GE3 may be disposed on the gate insulating layer 103. Each gate electrode may overlap with the channel region of the corresponding active layer. In an embodiment, for example, the first gate electrode GE1 may overlap with the channel region of the first active layer ACT1, the second gate electrode GE2 may overlap with the channel region of the second active layer ACT2, and the third gate electrode GE3 may overlap with the channel region of the third active layer ACT3. The first gate electrode GE1, the second gate electrode GE2, and the third gate electrode GE3 may comprise aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), and may comprise a single-layer or multi-layer structure, wherein each layer comprises at least one material selected from the above materials.

[0101] Interlayer insulating layer 105 may cover the first gate electrode GE1, the second gate electrode GE2, and the third gate electrode GE3. Interlayer insulating layer 105 may include an inorganic insulating material, such as silicon oxide (SiO2). x ), silicon nitride (SiN)x The material comprises silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO2), and has a single-layer or multi-layer structure, wherein each layer comprises at least one material selected from the above materials.

[0102] The gate insulating layer 103 and the interlayer insulating layer 105 may include contact holes that overlap with the source and drain regions of each of the first active layer ACT1, the second active layer ACT2, and the third active layer ACT3. A first source electrode SE1 may be disposed on the interlayer insulating layer 105 to overlap with the source region of the first active layer ACT1 and connected to the first active layer ACT1 through the contact holes. A first drain electrode DE1 may be disposed on the interlayer insulating layer 105 to overlap with the drain region of the first active layer ACT1 and connected to the first active layer ACT1 through contact holes. A second source electrode SE2 may be disposed on the interlayer insulating layer 105 to overlap with the source region of the second active layer ACT2 and connected to the second active layer ACT2 through contact holes. A second drain electrode DE2 may be disposed on the interlayer insulating layer 105 to overlap with the drain region of the second active layer ACT2 and connected to the second active layer ACT2 through contact holes. The third source electrode SE3 can be disposed on the interlayer insulating layer 105 to overlap with the source region of the third active layer ACT3, and connected to the third active layer ACT3 through a contact hole. The third drain electrode DE3 can be disposed on the interlayer insulating layer 105 to overlap with the drain region of the third active layer ACT3, and connected to the third active layer ACT3 through a contact hole.

[0103] Various configurations, including the initialization voltage line Vint, the common voltage line ELVSS, the scan driver SCD, and the emitter driver EMD, can be arranged in the side region SA. In an embodiment, the scan driver SCD and the emitter driver EMD may also include thin-film transistors, and the structure of the thin-film transistors may be similar to the structure of the first thin-film transistor TFT1, the second thin-film transistor TFT2, or the third thin-film transistor TFT3. The initialization voltage line Vint and the common voltage line ELVSS can be disposed on the interlayer insulating layer 105. In an embodiment, the initialization voltage line Vint, the common voltage line ELVSS, the first source electrode SE1, the first drain electrode DE1, the second source electrode SE2, the second drain electrode DE2, the third source electrode SE3, and the third drain electrode DE3 can be disposed in the same layer as each other (or directly disposed on the same layer as each other) and formed simultaneously by the same process.

[0104] A first organic insulating layer 107 can be provided to cover the first source electrode SE1, the first drain electrode DE1, the second source electrode SE2, the second drain electrode DE2, the third source electrode SE3, and the third drain electrode DE3. The first organic insulating layer 107 can be completely arranged not only in the display area DA but also in the side area SA.

[0105] The first organic insulating layer 107 may include a general polymer such as benzocyclobutene, polyimide, hexamethyldisiloxane, polymethyl methacrylate or polystyrene, a polymer derivative having a phenol-based group, an acrylic acid-based polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer or a vinyl alcohol-based polymer, and has a single-layer or multi-layer structure, each layer including at least one selected from the above materials.

[0106] The first organic insulating layer 107 may include contact holes that overlap with the first drain electrode DE1, the second drain electrode DE2, and the third drain electrode DE3, respectively. A first conductive layer 108 may be disposed on the first organic insulating layer 107 and may include a first contact metal 1108, a second contact metal 2108, and a third contact metal 3108. The first contact metal 1108 may overlap with the first drain electrode DE1 and be connected to the first drain electrode DE1 through the contact holes of the first organic insulating layer 107. The second contact metal 2108 may overlap with the second drain electrode DE2 and be connected to the second drain electrode DE2 through the contact holes of the first organic insulating layer 107. The third contact metal 3108 may overlap with the third drain electrode DE3 and be connected to the third drain electrode DE3 through the contact holes of the first organic insulating layer 107.

[0107] The first organic insulating layer 107 may include an opening that overlaps with the initialization voltage line Vint, and a portion of the first conductive layer 108 may be disposed in the opening of the first organic insulating layer 107 and connected to the initialization voltage line Vint by direct contact with it.

[0108] The first organic insulating layer 107 may include an opening that overlaps with the common voltage line ELVSS, and a portion of the first conductive layer 108 may be disposed in the opening of the first organic insulating layer 107 and connected to the common voltage line ELVSS by direct contact with it.

[0109] The second organic insulating layer 109 can be disposed on the first organic insulating layer 107. The second organic insulating layer 109 can be completely disposed not only in the display area DA but also in the side area SA.

[0110] The second organic insulating layer 109 may include a general polymer such as benzocyclobutene, polyimide, hexamethyldisiloxane, polymethyl methacrylate or polystyrene, a polymer derivative having a phenol-based group, an acrylic acid-based polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer or a vinyl alcohol-based polymer, and has a single-layer or multi-layer structure, wherein each layer includes at least one material selected from the above materials.

[0111] The second organic insulating layer 109 may include contact holes that overlap with the first contact metal 1108, the second contact metal 2108, and the third contact metal 3108, respectively. A second conductive layer 110 may be disposed on the second organic insulating layer 109 and may include a first sub-pixel electrode 1110, a second sub-pixel electrode 2110, and a third sub-pixel electrode 3110. The first sub-pixel electrode 1110 may overlap with the first contact metal 1108 and be connected to the first drain electrode DE1 through the first contact metal 1108. The second sub-pixel electrode 2110 may overlap with the second contact metal 2108 and be connected to the second drain electrode DE2 through the second contact metal 2108. The third sub-pixel electrode 3110 may overlap with the third contact metal 3108 and be connected to the third drain electrode DE3 through the third contact metal 3108.

[0112] The second organic insulating layer 109 may include an opening that overlaps with the common voltage line ELVSS, and a portion of the second conductive layer 110 may be disposed in the opening of the first organic insulating layer 107 and the second organic insulating layer 109 to directly contact a portion of the first conductive layer 108 and further connected to the common voltage line ELVSS.

[0113] A pixel defining layer 111 may be disposed on the second organic insulating layer 109. The pixel defining layer 111 may have openings that expose the central portions of the first sub-pixel electrode 1110, the second sub-pixel electrode 2110, and the third sub-pixel electrode 3110, respectively. In other words, the pixel defining layer 111 may cover the edge region (or edge) of each of the first sub-pixel electrode 1110, the second sub-pixel electrode 2110, and the third sub-pixel electrode 3110. The openings of the pixel defining layer 111 may define the emission regions of the light-emitting diodes (e.g., the first light-emitting diode LED1, the second light-emitting diode LED2, and the third light-emitting diode LED3), respectively.

[0114] An emitting layer 112 may be disposed on the pixel defining layer 111. The emitting layer 112 may include a first emitting portion 1112 overlapping with a first sub-pixel electrode 1110, a second emitting portion 2112 overlapping with a second sub-pixel electrode 2110, and a third emitting portion 3112 overlapping with a third sub-pixel electrode 3110. The first emitting portion 1112 may be disposed in an opening in the pixel defining layer 111 corresponding to the first sub-pixel electrode 1110. The second emitting portion 2112 may be disposed in an opening in the pixel defining layer 111 corresponding to the second sub-pixel electrode 2110. The third emitting portion 3112 may be disposed in an opening in the pixel defining layer 111 corresponding to the third sub-pixel electrode 3110. The emitting layer 112 may include a material that emits light of a preset color when a voltage is applied thereto. The emitting layer 112 may include an organic or inorganic material that emits light.

[0115] A counter electrode 113 may be disposed on the pixel defining layer 111. A portion of the counter electrode 113 may be disposed in an opening of the pixel defining layer 111 and in direct contact with the first emitting portion 1112. A portion of the counter electrode 113 may be disposed in an opening of the pixel defining layer 111 and in direct contact with the second emitting portion 2112. A portion of the counter electrode 113 may be disposed in an opening of the pixel defining layer 111 and in direct contact with the third emitting portion 3112.

[0116] The relative electrode 113 may extend not only to the display area DA but also to the side area SA. In one embodiment, for example, the relative electrode 113 may extend to the side area SA and directly contact a portion of the second conductive layer 110 in the region overlapping with the initialization voltage line Vint and the common voltage line ELVSS. In such an embodiment, the relative electrode 113 may be electrically connected to the second conductive layer 110, the first conductive layer 108, and the common voltage line ELVSS.

[0117] The first light-emitting diode (LED1) may include the first sub-pixel electrode 1110, the first emitting portion 1112, and the opposite electrode 113 described above. The second light-emitting diode (LED2) may include the second sub-pixel electrode 2110, the second emitting portion 2112, and the opposite electrode 113 described above. The third light-emitting diode (LED3) may include the third sub-pixel electrode 3110, the third emitting portion 3112, and the opposite electrode 113 described above. Because the opposite electrode 113 can be integrally formed as an indivisible part of a single unit, the opposite electrode 113 can be understood as a portion of the light-emitting diode at the point where it overlaps with the sub-pixel electrode of each light-emitting diode.

[0118] The first dam DM1 and the second dam DM2 can be arranged in the side region SA. In an embodiment, the first dam DM1 can overlap with the common voltage line ELVSS, and the second dam DM2 can be located in the +x direction of the common voltage line ELVSS. The first dam DM1 and the second dam DM2 can be configured to prevent the organic encapsulation layer 117 from overflowing beyond the edge of the display substrate 3.

[0119] The first dam DM1 may include a portion of the second organic insulating layer 109. In an embodiment, for example, the first dam DM1 may include a first dam portion 109-1 of the second organic insulating layer 109. The first dam portion 109-1 of the second organic insulating layer 109 may be disposed on the common voltage line ELVSS. The first dam DM1 may include a portion of the pixel defining layer 111. In an embodiment, for example, the first dam DM1 may include a first dam portion 111-1 of the pixel defining layer 111. The first dam portion 111-1 of the pixel defining layer 111 may be disposed on the first dam portion 109-1 of the second organic insulating layer 109. The first dam DM1 may also include a first spacer SPC-1 disposed on the first dam portion 111-1 of the pixel defining layer 111.

[0120] The second dam DM2 may include a portion of the first organic insulating layer 107. In an embodiment, for example, the second dam DM2 may include a second dam portion 107-2 of the first organic insulating layer 107. The second dam portion 107-2 of the first organic insulating layer 107 may be disposed on the interlayer insulating layer 105. The second dam DM2 may include a portion of the second organic insulating layer 109. In an embodiment, for example, the second dam DM2 may include a second dam portion 109-2 of the second organic insulating layer 109. The second dam portion 109-2 of the second organic insulating layer 109 may be disposed on the second dam portion 107-2 of the first organic insulating layer 107. The second dam DM2 may include a portion of the pixel defining layer 111. In an embodiment, for example, the second dam DM2 may include a second dam portion 111-2 of the pixel defining layer 111. The second dam portion 111-2 of the pixel defining layer 111 may be disposed on the second dam portion 109-2 of the second organic insulating layer 109. The second dam DM2 may also include a second spacer SPC-2 disposed on the second dam portion 111-2 of the pixel defining layer 111.

[0121] A thin-film encapsulation layer (TFE) can be disposed on the display element layer (DISL) to completely cover the DISL. The TFE can include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In an embodiment, for example, the TFE can include a first inorganic encapsulation layer 115, an organic encapsulation layer 117, and a second inorganic encapsulation layer 119. The first inorganic encapsulation layer 115 can be disposed on the DISL and integrally formed over the display area DA and the side area SA. The organic encapsulation layer 117 can be disposed on the first inorganic encapsulation layer 115. A portion of the organic encapsulation layer 117 can be disposed in the display area DA and the side area SA, and a portion of the organic encapsulation layer 117 can be blocked by a first dam DM1 or a second dam DM2, and therefore can be disposed outside of the first dam DM1 or the second dam DM2. The second inorganic encapsulation layer 119 can be disposed on the organic encapsulation layer 117 and integrally formed over the display area DA and the side area SA.

[0122] The first inorganic encapsulation layer 115 and the second inorganic encapsulation layer 119 may include materials selected from silicon oxide (SiO2). x ), silicon nitride (SiN) x The organic encapsulation layer 117 may include at least one inorganic insulating material selected from silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), and zinc oxide (ZnO2). The organic encapsulation layer 117 may include a polymer-based material. The polymer-based material may include at least one selected from silicon-based resins, acrylic resins, epoxy resins, polyimide, and polyethylene.

[0123] The input sensing layer 20 may include at least one insulating layer and at least one conductive layer. In one embodiment, for example, the input sensing layer 20 may include a first touch conductive layer 201, a first touch insulating layer 202, a second touch conductive layer 203, and a second touch insulating layer 204. The first touch conductive layer 201 may be disposed on the second inorganic encapsulation layer 119 and may include multiple electrodes. In another embodiment, an additional insulating layer may be disposed between the first touch conductive layer 201 and the second inorganic encapsulation layer 119. The first touch insulating layer 202 may be configured to cover the first touch conductive layer 201. In one embodiment, the first touch insulating layer 202 may be a planarization layer. The second touch conductive layer 203 may be disposed on the first touch insulating layer 202 and may include multiple electrodes. In one embodiment, some of the electrodes of the second touch conductive layer 203 may be electrically connected to some of the electrodes of the first touch conductive layer 201 through contact holes defined or formed in the first touch insulating layer 202. The second touch insulating layer 204 may be configured to cover the second touch conductive layer 203. In one embodiment, the second touch insulating layer 204 may be a planarization layer.

[0124] The second protrusion PR2 can be disposed on the input sensing layer 20 (e.g., the upper surface of the second touch insulating layer 204). The second protrusion PR2 can be disposed within a second protrusion region PRA2. The second protrusion region PRA2 can be a region in which no organic layer is disposed. In an embodiment, for example, the second protrusion region PRA2 can be a region in which the organic encapsulation layer 117, the first organic insulating layer 107, the second organic insulating layer 109, etc., are not disposed. In an embodiment, the second protrusion region PRA2 can be the region between the edge of the second dam DM2 in the +x direction and the edge of the buffer layer 101 in the +x direction. In an embodiment, the length of the second protrusion region PRA2 in the x-axis direction can be approximately 200 μm.

[0125] Figure 8 It is an enlarged plan view of a portion of the display substrate 3 according to the embodiment and is Figure 3 A magnified plan view of region VIII.

[0126] exist Figure 8 The image shows a magnified view of display substrate 3 (see image). Figure 3 The intermediate region MA of the central region. Multiple third protrusions PR3 can be arranged in the intermediate region MA. In an embodiment, the third protrusions PR3 may be circular in plan view. This disclosure is not limited to the shape of the third protrusions PR3, and the shape of the third protrusions PR3 can be modified in various ways as described below.

[0127] In one embodiment, the third protrusion PR3 may be arranged along an imaginary line (e.g., third line L3). In another embodiment, for example, the center of the third protrusion PR3 may be located on the third line L3. In another embodiment, the third line L3 may be a curve extending in the direction of the intermediate region MA. The third protrusion PR3 may be arranged between the boundary of the display area DA and the intermediate region MA and the boundary between the intermediate region MA and the opening area OA. In another embodiment, the third protrusion PR3 may be arranged in a predetermined area within the intermediate region MA, for example, within the third protrusion area PRA3. The third protrusion area PRA3 will be referenced... Figure 9 To describe in more detail. Although in Figure 8 Only one third line L3 is shown in the figure, but this disclosure is not limited to this, and there may be multiple imaginary lines on which third protrusions PR3 are arranged.

[0128] The third protrusion PR3 may be disposed on the input sensing layer 20. In an embodiment, for example, the input sensing layer 20 may include a second touch insulating layer 204, and the third protrusion PR3 may be disposed on the second touch insulating layer 204.

[0129] Figure 9This is a cross-sectional view of a portion of the display substrate 3 according to the embodiment, and is along... Figure 8 The cross-sectional view of the display substrate 3 is taken by line IX-IX'.

[0130] refer to Figure 9 Multiple separator SEPs can be arranged in the intermediate region MA. The separator SEPs can be disposed on the inorganic insulating layer IIL. The inorganic insulating layer IIL may include a buffer layer 101, a gate insulating layer 103, and an interlayer insulating layer 105. The separator SEPs can disconnect specific layers in the intermediate region MA. Each separator SEP may include a portion contained in the first organic insulating layer 107 and a portion contained in the first conductive layer 108.

[0131] The third dam DM3, the fourth dam DM4, and the fifth dam DM5 can be arranged in the intermediate region MA. The third dam DM3, the fourth dam DM4, and the fifth dam DM5 can be set on the inorganic insulation layer IIL. The third dam DM3, the fourth dam DM4, and the fifth dam DM5 can be positioned in the direction from the display area DA to the opening area OA (e.g., Figure 9 They are arranged sequentially in the +x direction. The third dam DM3, the fourth dam DM4, and the fifth dam DM5 can prevent the organic encapsulation layer 117 from overflowing in the direction toward the opening region OA.

[0132] The third dam DM3 may include a portion of the first organic insulating layer 107. In an embodiment, for example, the third dam DM3 may include a third dam portion 107-3 of the first organic insulating layer 107. The third dam portion 107-3 of the first organic insulating layer 107 may be disposed on the inorganic insulating layer 111. The third dam DM3 may include a portion of the second organic insulating layer 109. In an embodiment, for example, the third dam DM3 may include a third dam portion 109-3 of the second organic insulating layer 109. The third dam portion 109-3 of the second organic insulating layer 109 may be disposed on the third dam portion 107-3 of the first organic insulating layer 107. The third dam DM3 may include a portion of the pixel defining layer 111. In an embodiment, for example, the third dam DM3 may include a third dam portion 111-3 of the pixel defining layer 111. The third dam portion 111-3 of the pixel defining layer 111 may be disposed on the third dam portion 109-3 of the second organic insulating layer 109. The third dam DM3 may include a third spacer SPC-3 disposed on the third dam portion 111-3 of the pixel limiting layer 111.

[0133] The fourth dam DM4 may include a portion of the first organic insulating layer 107. In an embodiment, for example, the fourth dam DM4 may include a fourth dam portion 107-4 of the first organic insulating layer 107. The fourth dam portion 107-4 of the first organic insulating layer 107 may be disposed on the inorganic insulating layer 111. The fourth dam DM4 may include a portion of the pixel defining layer 111. In an embodiment, for example, the fourth dam DM4 may include a fourth dam portion 111-4 of the pixel defining layer 111. The fourth dam portion 111-4 of the pixel defining layer 111 may be disposed on the fourth dam portion 107-4 of the first organic insulating layer 107. The fourth dam DM4 may include a fourth spacer SPC-4 disposed on the fourth dam portion 111-4 of the pixel defining layer 111.

[0134] The fifth dam DM5 may include a portion of the first organic insulating layer 107. In an embodiment, for example, the fifth dam DM5 may include a fifth dam portion 107-5 of the first organic insulating layer 107. The fifth dam portion 107-5 of the first organic insulating layer 107 may be disposed on the inorganic insulating layer 111. The fifth dam DM5 may include a portion of the pixel defining layer 111. In an embodiment, for example, the fifth dam DM5 may include a fifth dam portion 111-5 of the pixel defining layer 111. The fifth dam portion 111-5 of the pixel defining layer 111 may be disposed on the fifth dam portion 107-5 of the first organic insulating layer 107. The fifth dam DM5 may include a fifth spacer SPC-5 disposed on the fifth dam portion 111-5 of the pixel defining layer 111.

[0135] The first inorganic encapsulation layer 115 and the second inorganic encapsulation layer 119 of the thin-film encapsulation layer TFE can be arranged integrally or jointly in the intermediate region MA. The first inorganic encapsulation layer 115 can cover the separator SEP, the third dam DM3, the fourth dam DM4, and the fifth dam DM5. The organic encapsulation layer 117 can be arranged in a portion of the intermediate region MA and the display region DA. In an embodiment, for example, the organic encapsulation layer 117 can be positioned relative to the third dam DM3 in the direction toward the display region DA (e.g., Figure 9 The organic encapsulation layer 117 is arranged in the -x direction. The organic encapsulation layer 117 can be blocked by the third dam DM3, and therefore may not be arranged outside the third dam DM3. In another embodiment, a portion of the organic encapsulation layer 117 can be arranged outside the third dam DM3 and blocked by the fourth dam DM4, and therefore may not be arranged outside the fourth dam DM4. In yet another embodiment, a portion of the organic encapsulation layer 117 can be arranged outside both the third dam DM3 and the fourth dam DM4 and blocked by the fifth dam DM5, and therefore may not be arranged outside the fifth dam DM5.

[0136] The first touch insulating layer 202 and the second touch insulating layer 204 can be sequentially disposed on the thin-film encapsulation layer TFE. Similar to... Figure 7 The first touch insulating layer 202 and the second touch insulating layer 204 can be planarization layers. Although for ease of description... Figure 9 The first touch conductive layer 201 is shown without it (see [reference]). Figure 7 ) and the second touch conductive layer 203 (see Figure 7 This disclosure is not limited to the implementation of the first touch conductive layer 201 (see [link to implementation details]). Figure 7 ) and the second touch conductive layer 203 (see Figure 7 A portion of it can be placed in the middle region MA.

[0137] A third protrusion PR3 may be disposed on the upper surface of the second touch insulating layer 204. The third protrusion PR3 may be arranged within a third protrusion region PRA3. The third protrusion region PRA3 may be located relative to the first dam DM1 in a direction toward the display area DA (e.g., the -x direction). For example, four separators SEP may be arranged relative to the first dam DM1 in a direction toward the display area DA (e.g., the -x direction). In an embodiment, the region between the edge of the separator SEP closest to the display area DA in the direction toward the display area DA (e.g., the -x direction) and the edge of the separator SEP closest to the first dam DM1 in the direction toward the first dam DM1 (e.g., the +x direction) may be defined as the third protrusion region PRA3. In an embodiment, the length of the third protrusion region PRA3 in the x-axis direction may be approximately 200 micrometers (μm).

[0138] Figure 10A , Figure 10B , Figure 10C , Figure 10D , Figure 10E and Figure 10F It is a perspective view of the protrusion according to various implementation methods.

[0139] The following is for reference. Figures 10A to 10F Each of the protrusions PR described can correspond to Figure 5 The first protrusion PR1, Figure 6 and Figure 7 The second protrusion PR2 or Figure 8 and Figure 9 The third protrusion PR3. In other words, the first protrusion PR1, the second protrusion PR2, and the third protrusion PR3 can all be referred to as protrusions PR, and can have... Figures 10A to 10F One of the structures shown. The protrusion PR can extend along the display area DA (see...). Figure 3 At least a portion of the edge of the ) is arranged.

[0140] refer to Figure 10A In one embodiment, the protrusion PR can have a cylindrical structure. In such an embodiment, the diameter of the upper surface and the diameter of the lower surface of the protrusion PR can be equal to each other.

[0141] refer to Figure 10B In another embodiment, the protrusion PR may have a hemispherical structure. In such an embodiment, the radius R of the protrusion PR may be constant.

[0142] refer to Figure 10C In another embodiment, the protrusion PR may have a hemispherical structure. In such an embodiment, the protrusion PR may have a large radius M, a small radius N, and a height O.

[0143] refer to Figure 10D In another embodiment, the protrusion PR can have a cylindrical structure. In such an embodiment, the diameter of the upper surface of the protrusion PR can be smaller than the diameter of the lower surface. In another embodiment, the diameter of the upper surface of the protrusion PR can be larger than the diameter of the lower surface.

[0144] refer to Figure 10E In another embodiment, the protrusion PR may have a hexahedral structure. For example, in this embodiment, the protrusion PR may be a cube in which each edge has the same length, or it may be a cuboid in which each edge has a different length.

[0145] refer to Figure 10F In another embodiment, the protrusion PR can have a column structure with a generally arc-shaped bottom surface. In such an embodiment, the protrusion PR can be three-dimensional, with its bottom surface corresponding to the shape of a portion of an arc having a width and a predetermined curvature and extending in one direction (e.g., the +z direction). The curvature of the arc can be adjusted to correspond to the curvature of the region in which the protrusion PR is arranged (e.g., the corner region CNA or the intermediate region MA).

[0146] In one embodiment, the first protrusion PR1, the second protrusion PR2, and the third protrusion PR3 within the display substrate 3 may not have the same shape as each other. For example, in another embodiment, the first protrusion PR1 may have... Figure 10A The cylindrical structure, the second protrusion PR2 can have Figure 10B The hemispherical structure, and the third protrusion PR3 can have Figure 10E Its hexahedral structure.

[0147] In one embodiment, the first protrusion PR1, the second protrusion PR2, and the third protrusion PR3 in the display substrate 3 may not have the same size as each other. In another embodiment, for example, all of the first protrusion PR1, the second protrusion PR2, and the third protrusion PR3 may have... Figure 10B The hemispherical structure shown can have different radii for the first protrusion PR1, the second protrusion PR2, and the third protrusion PR3.

[0148] The shape and size of the protrusion PR can be selectively determined or changed depending on the characteristics of the surface on which the protrusion PR is to be disposed. In one embodiment, forming the protrusion PR may include setting resin on the surface in a preset pattern and then curing the resin. In such an embodiment, the resin forming the protrusion PR may form a contact angle with the surface in the range of about 60° to about 100°, or in the range of about 5° to about 50°. In other words, the angle between the protrusion PR and the surface on which the protrusion PR is disposed (e.g., the upper surface of the input sensing layer 20) may be in the range of about 60° to about 100°, or in the range of about 5° to about 50°. In another embodiment, the planar area of ​​the protrusion PR (i.e., the area viewed from the +z direction) may be tens to hundreds of square micrometers (μm). 2 In an implementation, the height of the protrusion PR (i.e., the z-axis length) can be approximately 300 micrometers (μm) or less.

[0149] The shapes of the protrusions PR in various embodiments have been described with reference to the accompanying drawings, but these are merely examples. The protrusions PR of this disclosure are not necessarily limited to these shapes, sizes, and orientations. It should be understood that as long as the protrusions PR are arranged to be spaced apart from each other on a predetermined surface and can have a structure that protrudes from the surface, the protrusions PR fall within the scope of this disclosure regardless of their shape.

[0150] Figure 11A , Figure 11B , Figure 11C and Figure 11D This is a plan view illustrating various implementations in which protrusions can be arranged in corner areas.

[0151] For ease of description, the following description is based on the configuration or arrangement of the corner region CNA and the first protrusion PR1 therein, and it will be understood that the configuration or arrangement of the first protrusion PR1 described below also applies to... Figure 6 The lateral region SA and the second protrusion PR2 and Figure 8 The middle region MA and the third protrusion PR3.

[0152] refer to Figure 11AThe first protrusion PR1 can be arranged along multiple lines. In one embodiment, for example, the first protrusion PR1 can be arranged along two imaginary lines: a first first line (hereinafter referred to as "line 1-1") L1-1 and a second first line (hereinafter referred to as "line 1-2") L1-2, which extend along the arc of the corner area CNA. In such an embodiment, the center of each of the first protrusions PR1 can be located on either line 1-1 L1-1 or line 1-2 L1-2. Line 1-1 L1-1 can be arranged outside line 1-2 L1-2. That is, line 1-2 L1-2 can be closer to the display area DA than line 1-1 L1-1.

[0153] In this implementation, the first protrusion PR1 on line 1-1 L1-1 and the first protrusion PR1 on line 1-2 L1-2 can be aligned with each other. In such an implementation, an imaginary line (represented as a dashed line) along the radius of the arc of the corner region CNA can pass through both the first protrusion PR1 on line 1-1 L1-1 and the first protrusion PR1 on line 1-2 L1-2. In other words, the centers of the first protrusion PR1 on line 1-1 L1-1 and the first protrusion PR1 on line 1-2 L1-2 can lie on the same dashed line.

[0154] refer to Figure 11B In another embodiment, the first protrusion PR1 may be arranged along multiple imaginary lines (i.e., line 1-1 L1-1 and line 1-2 L1-2), as referenced above. Figure 11A As stated above.

[0155] In one implementation, the first protrusion PR1 on line 1-1 L1-1 and the first protrusion PR1 on line 1-2 L1-2 may intersect each other. In this implementation, an imaginary line (represented as a dashed line) along the radius of the arc of the corner region CNA may not simultaneously pass through the first protrusion PR1 on line 1-1 L1-1 and the first protrusion PR1 on line 1-2 L1-2. When drawing a dashed line that passes through the first protrusion PR1 on line 1-1 L1-1 along the radius of the arc of the corner region CNA and a dashed line that passes through the first protrusion PR1 on line 1-2 L1-2 along the radius of the arc of the corner region CNA, the two dashed lines do not overlap. In other words, the first protrusion PR1 may be alternately arranged on line 1-1 L1-1 and line 1-2 L1-2 along the curvature direction of the corner region CNA.

[0156] refer to Figure 11C In another embodiment, the first protrusion PR1 may be arranged along three imaginary lines. The first protrusion PR1 may be arranged along three imaginary lines: line 1-1 L1-1, line 1-2 L1-2, and the third first line (hereinafter referred to as "line 1-3") L1-3. Figure 11C Lines 1-1 (L1-1) and 1-2 (L1-2) in the reference... Figure 11A and Figure 11B The lines described are similar.

[0157] Line 1-3 L1-3 may extend in the same direction as lines 1-1 L1-1 and 1-2 L1-2 (i.e., the direction of curvature of the corner region CNA). Line 1-3 L1-3 may be arranged between lines 1-1 L1-1 and 1-2 L1-2. The first protrusion PR1 arranged on line 1-3 L1-3 may be different in shape from the first protrusion PR1 arranged on line 1-1 L1-1 or line 1-2 L1-2. In an embodiment, the first protrusion PR1 arranged on line 1-1 L1-1 or line 1-2 L1-2 may have a circular shape in the plan view. In an embodiment, for example, the first protrusion PR1 arranged on line 1-1 L1-1 or line 1-2 L1-2 may have a circular shape in the plan view. Figure 10A cylindrical shape or Figure 10B The shape is hemispherical. In an embodiment, the first protrusion PR1 arranged on line 1-3 L1-3 may have an arc shape in the plan view. In an embodiment, for example, the first protrusion PR1 arranged on line 1-3 L1-3 may have... Figure 10F The arc shape.

[0158] However, this disclosure is not limited to a specific shape of the first protrusion PR1. It will be understood that the first protrusion PR1 can be arranged along multiple paths (lines), and the first protrusion PR1 arranged on each path (line) can be shaped similar to... Figures 11A to 11C The implementation methods shown are different.

[0159] refer to Figure 11D The first protrusions PR1 can be randomly arranged without following a specific path or predetermined arrangement. In one embodiment, the first protrusions PR1 can be spaced apart from each other. In one embodiment, the distance between the first protrusions PR1 may not be constant. In one embodiment, the first protrusions PR1 may differ in shape or size. In one embodiment, the first protrusions PR1 can be arranged within the corner area CNA.

[0160] The above reference Figures 11A to 11D The configuration positions and relationships of the first protrusion PR1 in various embodiments are described. However, this disclosure is not limited to a specific configuration position of the first protrusion PR1. The configuration position of the first protrusion PR1 can accommodate process tolerances. In embodiments, process tolerances can be in the range of about 40 μm to about 60 μm.

[0161] Figure 12 This is an enlarged plan view of a portion of the display substrate 3 according to an embodiment, and shows the direction... Figure 5 The embodiments shown provide embodiments of resin RS.

[0162] refer to Figure 12 In this embodiment, the resin RS can be disposed on the display substrate 3. The resin RS can be configured to correspond to the area to be covered. In this embodiment, for example, the area to be covered by the resin RS can be a portion of the corner area CNA and the display area DA.

[0163] As described below, the resin RS can be disposed in a liquid state on the display substrate 3 and then cured. When the resin RS is disposed in a liquid state on the display substrate 3, the resin RS can flow on the display substrate 3. In this case, the resin RS can flow towards the edge of the display substrate 3 (e.g., towards the corner region CNA). When there is no structure to prevent the flow of the resin RS, the resin RS may overflow beyond the edge of the display substrate 3.

[0164] In one embodiment, a plurality of first protrusions PR1 can be configured to control the flow of resin RS in the corner region CNA. In such an embodiment, when resin RS encounters a first protrusion PR1 while flowing, the resin RS will flow around the first protrusion PR1. In this case, when the spacing between the first protrusions PR1 is sufficiently small, capillary effects or lateral capillary forces may occur between the first protrusions PR1 and the resin RS. Therefore, the resin RS can contact the first protrusions PR1 and may not move outside the first protrusions PR1. In other words, the edges of the resin RS can be formed between the first protrusions PR1.

[0165] although Figure 12 An embodiment is shown in which the edge of the resin RS is approximately curved toward the display area DA; however, this is merely an example, and the scope of this disclosure is not limited thereto. The shape of the edge of the resin RS can be modified in various ways depending on the composition of the resin RS, the composition of the first protrusion PR1, the surface condition, etc.

[0166] In this embodiment, as described above, the edges of the resin RS are formed between the first protrusions PR1, such that the edges of the resin RS remain even as the resin RS cures. Without the first protrusions PR1, the resin RS may shrink during curing. In this case, the area intended to be covered by the resin RS may not be adequately or effectively covered. In the embodiment where the first protrusions PR1 are arranged, the edges of the resin RS are located between the first protrusions PR1, and when the resin RS cures, a force (e.g., capillary adhesive force) can be generated to counteract the shrinkage force. Therefore, the resin RS can be fixed in the intended position without shrinking.

[0167] In this embodiment, the resin RS is disposed on the display substrate 3, and the first protrusion PR1 defines the boundary (or edge) of the resin RS and maintains this boundary during resin RS curing. Therefore, the boundary of the area in which the resin RS is disposed can be precisely controlled by the first protrusion PR1. Due to the presence of the first protrusion PR1, the resin RS can be accurately disposed in a predetermined configuration area.

[0168] The surface tension of the material constituting the first protrusion PR1 may be greater than the surface tension of the material constituting the resin RS. In one embodiment, the material constituting the resin RS may be the same as the material constituting the first protrusion PR1. In another embodiment, for example, the first protrusion PR1 may be a structure formed by providing the same material as the resin RS and curing that material. In yet another embodiment, the material constituting the resin RS may be different from the material constituting the first protrusion PR1. In yet another embodiment, for example, the first protrusion PR1 and the resin RS may include materials such as silicone polymers, polyurethane (PU), acrylic, etc., but the composition ratio of these materials in the first protrusion PR1 and the resin RS may differ from each other.

[0169] Figure 13 This is an enlarged plan view of a portion of the display substrate 3 according to an embodiment, and shows the direction... Figure 6 The embodiments shown provide embodiments of resin RS.

[0170] The resin RS can be disposed on the display substrate 3. The resin RS can be configured to correspond to the area to be covered. In an embodiment, for example, the area to be covered by the resin RS can be a portion of the side area SA and the display area DA.

[0171] As referenced above Figure 12 As described, when the resin RS is disposed in a liquid state on the display substrate 3, a structure may be needed to control the flow of the resin RS. The second protrusion PR2 can control the flow of the resin RS in the side region SA. When the resin RS encounters the second protrusion PR2 while flowing, the resin RS will flow around the second protrusion PR2. In this case, when the spacing between the second protrusions PR2 is sufficiently small, capillary effects or lateral capillary forces may occur between the second protrusions PR2 and the resin RS. Therefore, the resin RS can contact the second protrusions PR2 and can not move outside the second protrusions PR2, and the edges of the resin RS can be formed between the second protrusions PR2.

[0172] although Figure 13 An embodiment is shown in which the edge of the resin RS is approximately a straight line extending in the y-axis direction; however, this is merely an example, and the scope of this disclosure is not limited thereto. The shape of the edge of the resin RS can be modified in various ways depending on the composition of the resin RS, the composition of the second protrusion PR2, the surface condition, etc.

[0173] In one embodiment, the edges of the resin RS are formed between the second protrusions PR2, such that the edges of the resin RS remain even as the resin RS cures. Without the second protrusions PR2, the resin RS may shrink during curing. In this case, the area intended to be covered by the resin RS may not be adequately or effectively covered. In the embodiment where the second protrusions PR2 are arranged, the edges of the resin RS are located between the second protrusions PR2, and when the resin RS cures, forces that counteract shrinkage (e.g., capillary adhesion) can be generated. Therefore, the resin RS can be fixed in the intended position (e.g., within the second protrusion region PRA2) without shrinking.

[0174] In embodiments where the resin RS is disposed on the display substrate 3, the second protrusion PR2 can define the boundary (or edge) of the resin RS and maintain this boundary during resin RS curing. Therefore, the boundary of the area in which the resin RS is disposed can be precisely controlled by the second protrusion PR2. Due to the presence of the second protrusion PR2, the resin RS can be accurately disposed within a predetermined configuration area.

[0175] The surface tension of the constituent material of the second protrusion PR2 may be greater than the surface tension of the constituent material of the resin RS. In one embodiment, the constituent material of the resin RS may be the same as that of the second protrusion PR2. In another embodiment, for example, the second protrusion PR2 may be a structure formed by setting the same material as the resin RS and curing that material. In yet another embodiment, the constituent material of the resin RS may be different from that of the second protrusion PR2. In yet another embodiment, for example, the second protrusion PR2 and the resin RS may include materials such as silicone polymers, polyurethane (PU), acrylic, etc., but the composition ratio of these materials in the second protrusion PR2 and the resin RS may be different from each other.

[0176] Figure 14 This is an enlarged plan view of a portion of the display substrate 3 according to an embodiment, and shows the direction... Figure 8 The embodiments shown provide embodiments of resin RS.

[0177] refer to Figure 14 The resin RS can be disposed on the display substrate 3. The resin RS can be configured to correspond to the area to be covered. In an embodiment, for example, the area to be covered by the resin RS can be a portion of the intermediate area MA and the display area DA.

[0178] As referenced above Figure 12As described, when the resin RS is disposed in a liquid state on the display substrate 3, a structure may be needed to control the flow of the resin RS. The third protrusion PR3 can control the flow of the resin RS in the intermediate region MA. When the resin RS encounters the third protrusion PR3 while flowing, the resin RS will flow around the third protrusion PR3. In this case, when the spacing between the third protrusions PR3 is sufficiently small, capillary effects or lateral capillary forces may occur between the third protrusions PR3 and the resin RS. Therefore, the resin RS can contact the third protrusions PR3 and can not move outside the third protrusions PR3, and the edges of the resin RS can be formed between the third protrusions PR3.

[0179] although Figure 14 An embodiment is shown in which the edge of the resin RS is a line that approximately contacts the arc of the central region MA; however, this is merely an example, and the scope of this disclosure is not limited thereto. The shape of the edge of the resin RS can be modified in various ways depending on the composition of the resin RS, the composition of the third protrusion PR3, the surface condition, etc.

[0180] In this embodiment, the edges of the resin RS are formed between the third protrusions PR3, and the edges of the resin RS can be maintained even when the resin RS cures. Without the third protrusions PR3, the resin RS may shrink during curing. In this case, the area intended to be covered by the resin RS may not be adequately or effectively covered. In the embodiment where the third protrusions PR3 are arranged, the edges of the resin RS are located between the third protrusions PR3, and when the resin RS cures, a force that counteracts the shrinkage force (e.g., capillary adhesion force) can be generated. Therefore, the resin RS can be fixed in the intended position (e.g., within the third protrusion region PRA3) without shrinking.

[0181] In embodiments where the resin RS is disposed on the display substrate 3, the third protrusion PR3 can define the boundary (or edge) of the resin RS and maintain this boundary during resin RS curing. Therefore, the boundary of the area in which the resin RS is disposed can be precisely controlled by the third protrusion PR3. Due to the presence of the third protrusion PR3, the resin RS can be accurately disposed within a predetermined configuration area.

[0182] The surface tension of the constituent material of the third protrusion PR3 may be greater than the surface tension of the constituent material of the resin RS. In an embodiment, the constituent material of the resin RS may be the same as that of the third protrusion PR3. In an embodiment, for example, the third protrusion PR3 may be a structure formed by setting the same material as the resin RS and curing the material. In an embodiment, the constituent material of the resin RS may be different from that of the third protrusion PR3. In an embodiment, for example, the third protrusion PR3 and the resin RS may include materials such as silicone polymers, polyurethane (PU), acrylic, etc., but the composition ratio of these materials in the third protrusion PR3 and the resin RS may be different from each other.

[0183] Figures 15A to 15G This is a schematic perspective view showing the operation corresponding to the manufacturing process of the display device according to the embodiment.

[0184] In the following text, reference will be made to Figures 15A to 15G This describes the process of forming a protective film on a display substrate 3 using resin, completing subsequent processes, and then removing the protective film. In the following text, in Figures 15A to 15G The enlarged view shows a portion of the peripheral region PA, a side region SA, and the corner region CNA of the display substrate 3, and will primarily describe this portion of the peripheral region PA of the display substrate 3. However, this is for ease of illustration and description, and this disclosure is not necessarily limited thereto. It will be understood that the process described primarily for the corner region CNA also applies to the side region SA (see [link to documentation]). Figure 13 ) and the intermediate region MA (see Figure 14 ).

[0185] refer to Figure 15A A display substrate 3 comprising a substrate SUB, an image generation layer 10, and an input sensing layer 20 can be fabricated. The image generation layer 10 and the input sensing layer 20 can be sequentially disposed on the substrate SUB. The display substrate 3 (or substrate SUB) may include a display area DA and a peripheral area PA. The peripheral area PA may include a side area SA corresponding to the side edge of the display substrate 3 (or substrate SUB) and a corner area CNA corresponding to the corner.

[0186] refer to Figure 15B Protrusions PR can be provided (formed or set) on the input sensing layer 20. The protrusions PR can be arranged in the side region SA and the corner region CNA. It will be understood that the protrusion PR arranged in the corner region CNA is the first protrusion PR1, and the protrusion PR arranged in the side region SA is the second protrusion PR2. In the following text, for ease of description, these protrusions will be collectively referred to as protrusions PR.

[0187] The protrusions PR can be arranged in the direction extending from the side region SA and the corner region CNA. In other words, the protrusions PR can be arranged along the peripheral region PA. That is, the protrusions PR can be set approximately along the edge of the display substrate 3. Therefore, the protrusions PR can form a boundary or fence within the peripheral region PA.

[0188] refer to Figure 15C A resin RS can be provided or disposed on the input sensing layer 20. In this operation, the resin RS can be liquid. Therefore, the resin RS can be amorphous. In one embodiment, the resin RS can be arranged within the display area DA. In another embodiment, the resin RS can be arranged throughout the display area DA and the peripheral area PA. In the current operation, the resin RS can be separated from the protrusion PR.

[0189] refer to Figure 15D The resin RS can flow. In one embodiment, the resin RS can flow toward the peripheral region PA (i.e., toward the edge of the display substrate 3). In another embodiment, the flow of the resin RS can be caused by gravity. In yet another embodiment, the flow of the resin RS can occur due to pressure (e.g., pressure in the -z direction).

[0190] refer to Figure 15E The resin RS can contact the protrusion PR and stop flowing. In other words, the edge of the area where the resin RS is disposed can be defined by the protrusion PR. In this case, the edge of the resin RS can be located between the protrusion PR, as referenced above. Figures 12 to 14 As described.

[0191] although Figure 15E An embodiment is shown in which the thickness (or length in the z-axis direction) of the resin RS is substantially equal to the height (or length in the z-axis direction) of the protrusion PR, but this disclosure is not necessarily limited thereto. In another embodiment, the thickness of the resin RS may be greater than the height of the protrusion PR. In such an embodiment, the resin RS may have a predetermined slope and be in contact with the protrusion PR. The tilt angle of the resin RS can be varied depending on the type of resin RS material, the amount of resin RS provided, etc. In this embodiment, the tilt angle of the resin RS may be in the range of about 1° to about 30°.

[0192] Let's refer to each other. Figure 15E and Figure 15F The resin RS can be cured. In one embodiment, a film HRS (or cured resin) can be formed by curing the resin RS. In another embodiment, curing the resin RS may include irradiating the entire surface of the resin RS with ultraviolet (UV) rays. In such an embodiment, the resin RS may comprise a UV-curable resin.

[0193] When the resin RS cures and changes the film HRS, the resin RS may generate shrinkage forces. If no force is provided to prevent the resin RS from shrinking, the resin RS may shrink, and the edge of the film HRS may move towards the display area DA, potentially ending up within the display area DA. The film HRS can protect the display substrate 3 during subsequent processes. Therefore, if the resin RS shrinks during curing and the edge of the film HRS moves, a portion of the surface of the display substrate 3 that was covered by the resin RS before the curing operation but is exposed through the resin RS after the curing operation may be compromised. This could ultimately lead to a deterioration in the quality of the display device.

[0194] The raised PRs effectively prevent this phenomenon. As mentioned above, the edges of the resin RS are positioned between the raised PRs through capillary effect or lateral capillary force. The force provided by the lateral capillary force can counteract the forces that cause the resin RS to shrink during curing. Therefore, the resin RS can maintain its shape as described above. Figure 15E Simultaneous curing at the locations shown. Therefore, Figure 15F The shape of the membrane HRS (or cured resin) shown is equal to Figure 15E The shape of the resin RS is shown. The edge of the resin RS before curing can be equal to the edge of the membrane HRS after curing. Therefore, in the embodiment with the protrusion PR, the resin RS can be cured while keeping the edge of the resin RS in the desired position, so that the membrane HRS can be accurately set and developed in the desired position. In such an embodiment, the desired position of the membrane HRS is determined in advance, and then the protrusion PR can be set in the relevant position.

[0195] After the HRS film is formed by curing resin RS, subsequent processes can be performed. While performing these subsequent processes, the HRS film can protect the surface of the display substrate 3.

[0196] refer to Figure 15G HRS can be removed from the membrane after subsequent processes are performed.

[0197] The HRS film can be attached to the protrusion PR during curing. Therefore, when the HRS film is removed from the surface of the display substrate 3, the protrusion PR can be removed together with the HRS film. In this embodiment, by applying an external force to the HRS film, the HRS film can be separated from the surface of the display substrate 3, and the protrusion PR can be separated from the surface of the display substrate 3 integrally with the HRS film. Although Figure 15G An embodiment is shown in which all protruding PRs are separated from the surface of the display substrate 3 together with the film HRS, but this disclosure is not necessarily limited thereto. In another embodiment, some of the protruding PRs may be removed together with the film HRS, and other protruding PRs may remain on the display substrate 3.

[0198] Coating traces MK may remain where the protrusions PR are removed along with the film HRS. The coating traces MK may have a band shape extending in the direction in which the protrusions PR are arranged. Therefore, the coating traces MK may extend along the edge of the display substrate 3 and at least partially surround the display area DA. These coating traces MK may remain on the display substrate 3 and may also remain on the display device as the final product.

[0199] In embodiments of this disclosure, as described above, the protrusion PR is disposed on the upper surface of the input sensing layer 20. However, this disclosure is not limited thereto. In another embodiment, the protrusion PR may be disposed on the image generation layer 10 and on another layer disposed on the input sensing layer 20. That is, in the default operation of the process for manufacturing the display device, the protrusion PR may be differently applied to situations where resin is desired for the purpose of protecting the display substrate.

[0200] According to one embodiment, the display substrate includes protrusions configured to control the flow of resin during resin application. According to another embodiment, a method of manufacturing a display device includes disposing the protrusions on the display substrate and applying resin to form a protective film.

[0201] In this implementation, the precision of the areas where the resin is developed can be improved when a liquid (or resin) protective film is applied. Therefore, the display substrate can be protected more precisely during the process, and the quality of the display device can be improved.

[0202] This disclosure should not be construed as limiting itself to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of this disclosure to those skilled in the art.

[0203] Although this disclosure has been specifically shown and described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit or scope of this disclosure as defined by the appended claims.

Claims

1. A display substrate, characterized by, Comprising: a substrate including a display area and a peripheral area surrounding the display area; a plurality of light emitting diodes arranged over the substrate in the display area; a thin film encapsulation layer covering the plurality of light emitting diodes; and a plurality of protrusions arranged on the thin film encapsulation layer in the peripheral area, wherein the plurality of protrusions are arranged along at least a portion of an edge of the display area. Further comprising a resin disposed on the thin film encapsulation layer and overlapping the display area.

2. The display substrate according to claim 1, wherein The resin is in direct contact with at least one of the plurality of protrusions.

3. The display substrate according to claim 2, wherein The plurality of protrusions are spaced apart from each other, and a portion of an edge of the resin is between two adjacent protrusions among the plurality of protrusions.

4. The display substrate according to claim 2, wherein The substrate further includes an opening area within the display area and an intermediate area between the opening area and the display area, 5. The display substrate according to claim 1, wherein wherein the intermediate area at least partially surrounds the opening area, and wherein the display substrate further includes a plurality of additional protrusions disposed on the thin film encapsulation layer in the intermediate area. Further comprising an input sensing layer disposed on the thin film encapsulation layer and including a conductive layer and an insulating layer, wherein the plurality of protrusions are disposed on the input sensing layer.

6. The display substrate according to claim 1, wherein The thin film encapsulation layer includes:

7. The display substrate according to claim 1, wherein a first inorganic encapsulation layer covering the plurality of light emitting diodes; an organic encapsulation layer disposed on the first inorganic encapsulation layer; and a second inorganic encapsulation layer covering the organic encapsulation layer. The plurality of protrusions are arranged outside of an area in which the organic encapsulation layer is arranged.

8. The display substrate according to claim 7, wherein ​

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