Silicon wafer tank processing apparatus

Abstract

The utility model provides a kind of silicon wafer tank type processing equipment, it includes tank body, the positioning base of being arranged in the tank body bottom, be arranged in the silicon wafer basket on the positioning base, first air pipe group and second air pipe group, silicon wafer is vertically, stacked loading in the silicon wafer basket, first air pipe group is horizontally arranged and is parallel to the stacking direction of silicon wafer, in vertical direction, first air pipe group is higher than second air pipe group, first air pipe group provides horizontal airflow to the side of silicon wafer, second air pipe group provides oblique airflow to the side of silicon wafer.The utility model is set above, both can guarantee that liquid medicine and silicon wafer are fully contacted, also avoid the phenomenon of silicon wafer tooth and patching due to bubble impact, in subsequent process, reduce the generation of fragment and scorched piece, substantially improve product yield;Meanwhile, equipment operation stability improves, production efficiency is optimized, reduce the cost loss due to defective product.

Description

Technical Field

[0001] This utility model relates to the field of solar cell production, and in particular to a silicon wafer trough processing device. Background Technology

[0002] In the production of crystalline silicon solar cells, wafer trough processing equipment plays a crucial role in wafer cleaning and etching, and its processing effect directly impacts wafer quality and chip yield. Existing wafer trough processing equipment often uses bottom bubbling to ensure sufficient contact and reaction between the chemical solution and the wafer. However, this method has significant drawbacks. Bottom-up bubbling generates strong impact force, causing the wafers loaded in the wafer basket to shake violently in the chemical solution, leading to wafer detachment (the wafer separating from the basket's slot). Simultaneously, the shaking can cause wafers to squeeze and adhere to each other, resulting in bonding problems. Once wafer detachment and bonding occur, uneven stress during subsequent automated wafer unloading processes can easily cause fragmentation, or charring during high-temperature processing, severely impacting production efficiency and product quality, increasing production costs and defect rates.

[0003] Therefore, it is necessary to design a silicon wafer tank processing device to solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to provide a silicon wafer trough-type processing device to prevent silicon wafers from being removed from the silicon wafer basket and from being attached to the wafer.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a silicon wafer tank processing device, comprising a tank body, a positioning base disposed at the bottom of the tank body, a silicon wafer basket disposed on the positioning base, a first air pipe group and a second air pipe group, wherein silicon wafers are vertically and stacked in the silicon wafer basket, the first air pipe group is horizontally arranged and parallel to the stacking direction of the silicon wafers, and in the vertical direction, the first air pipe group is higher than the second air pipe group, the first air pipe group provides horizontal airflow to one side of the silicon wafers, and the second air pipe group provides oblique upward airflow to one side of the silicon wafers. A positioning base is installed at the bottom of the tank to securely load silicon wafers in conjunction with the wafer basket, reducing external interference with wafer positioning. The first and second air pipe groups abandon the traditional bottom bubbling method. The first air pipe group provides horizontal airflow to one side of the wafer, while the second air pipe group provides upward-sloping airflow. These two airflows work together to create a stable and controllable fluid environment around the wafers. This airflow layout ensures sufficient contact between the chemical solution and the wafer while avoiding wafer chip removal and bonding issues caused by bubbling impacts. As a result, the wafers maintain their integrity in subsequent processes, reducing the generation of fragments and burnt wafers, significantly improving product yield. Simultaneously, equipment operational stability is improved, production efficiency is optimized, and cost losses due to defective products are reduced.

[0006] As a further improvement of the present invention, the first tracheal assembly includes a first trachea and a plurality of first air outlets arranged in a row on the first trachea. The inner diameter of the first trachea is 15-25mm, the length of the first trachea is 100-200cm, the inner diameter of the first air outlet is 1-2mm, and the spacing between the first air outlets is 4-6mm.

[0007] As a further improvement of this utility model, the height of the first air pipe corresponds to 85-95% of the height of the silicon wafer.

[0008] As a further improvement of this utility model, the second air tube assembly includes a second air tube and a plurality of second air outlets arranged in a row on the second air tube. The inner diameter of the second air tube is 15-25 mm, the length of the second air tube is 100-200 cm, the inner diameter of the second air outlet is 1-2 mm, and the spacing between the second air outlets is 1 / 3-1 / 2 of the spacing between the first air outlets. With this arrangement, the dense, oblique airflow below first breaks large bubbles into smaller microbubbles, and the horizontal airflow above then quickly carries the microbubbles away from the silicon wafer surface. This two-stage treatment reduces the amount of residual bubbles on the silicon wafer surface, increases the contact time between the silicon wafer surface and the solution, and accelerates the chemical reaction rate.

[0009] As a further improvement of this utility model, the setting height of the second air tube corresponds to 60-70% of the height of the silicon wafer.

[0010] As a further improvement of this invention, the second air outlet is positioned at an upward angle of 40-50°. This upward airflow generates a self-cleaning effect, directly scouring the support teeth of the silicon wafer basket (usually a dead zone), carrying away deposited particulate impurities upwards, and extending the equipment maintenance cycle.

[0011] As a further improvement of this utility model, in the vertical direction, the height difference between the first air pipe and the second air pipe is 5-7cm, and in the horizontal direction, the distance between the first air pipe and the second air pipe and the silicon wafer is 5-10cm.

[0012] Within the aforementioned range, the horizontal airflow above and the oblique airflow below converge on the silicon wafer surface, inducing the formation of a spiral flow field. This prolongs the residence time of the chemical solution on the silicon wafer surface and improves the boundary layer renewal rate. The spiral flow field effectively breaks the gradient concentration commonly found in traditional equipment, controlling the chemical solution concentration deviation within ±2% in the tank, significantly improving the uniformity of etching or cleaning.

[0013] As a further improvement of this utility model, the silicon wafer flower basket is provided with the first air pipe group and the second air pipe group on both sides.

[0014] As a further improvement of this utility model, the silicon wafer flower basket is provided with the first air pipe group and the second air pipe group on one side.

[0015] As a further improvement of this utility model, the first air pipe assembly and the second air pipe assembly are fixed to the inner wall of the tank. Attached Figure Description

[0016] Figure 1 This is a perspective view of a silicon wafer tank processing device according to an embodiment of the present invention.

[0017] Figure 2 for Figure 1 A side view of a silicon wafer trough processing device.

[0018] Figure 3 This is a top-view diagram showing the position of the first air duct assembly and the silicon wafer.

[0019] Figure 4 This is a side view schematic diagram of the first tracheal group in two embodiments.

[0020] Figure 5 This is a side view schematic diagram of the second tracheal group in two embodiments. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] Please refer to Figure 1 and Figure 2 As shown, this utility model provides a silicon wafer tank processing device, which includes a tank body 10, a positioning base 20 disposed at the bottom of the tank body 10, a silicon wafer basket 30 disposed on the positioning base 20, a first air pipe group 51, a second air pipe group 52, and an air supply system.

[0023] Silicon wafers 40 are vertically and stacked within the silicon wafer basket 30. Please refer to... Figure 3 As shown, the first air pipe group 51 is horizontally arranged and parallel to the stacking direction of the silicon wafer 40. In this embodiment, the first air pipe group 51 and the second air pipe group 52 are provided on opposite sides of the silicon wafer basket. In other embodiments, the first air pipe group and the second air pipe group can be located on the same side or different sides of the silicon wafer basket according to actual needs. Preferably, the first air pipe group 51 and the second air pipe group 52 can be fixed to the inner wall of the tank 10 by means of an acid and alkali resistant PP bracket.

[0024] The first air duct group 51 provides horizontal airflow to one side of the silicon wafer 40. The first air duct group 51 includes a first air duct 511 and a plurality of first air outlets 512 arranged in a row on the first air duct 511. The inner diameter of the first air duct 511 is 20 mm and the length is 150 cm. The inner diameter of the first air outlets 512 is 1 mm and the spacing between the first air outlets 512 is 5 mm.

[0025] The second air duct assembly 52 provides an upwardly angled airflow to one side of the silicon wafer 40. The second air duct assembly 52 includes a second air duct 521 and a plurality of second air outlets 522 arranged in a row on the second air duct 521. The inner diameter of the second air duct 521 is 20 mm, and its length is 150 cm. The inner diameter of the second air outlets 522 is 1 mm, and the spacing between the second air outlets 522 is 2 / 5 of the spacing between the first air outlets 512, i.e., 2 mm. The air outlets 522 exit at an upward angle of 45°.

[0026] In the vertical direction, the first air pipe group 51 is higher than the second air pipe group 52. Specifically, the setting height of the first air pipe 511 corresponds to 90% of the silicon wafer height. The setting height of the second air pipe 512 corresponds to 65% of the silicon wafer height. The height difference between the first and second air pipes is 5.8 cm. In the horizontal direction, the distance between the first and second air pipes and the silicon wafer is 6.5 cm.

[0027] Please refer to Figure 4 and Figure 5 As shown, this embodiment adopts the form of a first air tube group 51a and a second air tube group 52a. That is, the first air outlet 512 is a horizontal tube with one end connected to the first air tube 511, and the second air outlet 522 is an inclined tube located at an upwardly inclined position of the second air tube 512. In other embodiments, the form of a first air tube group 51b and a second air tube group 52b can also be adopted. That is, the first air outlet 512' is a through hole directly opened on the horizontal side of the first air tube 511, and the second air outlet 522' is a through hole located at an upwardly inclined position of the second air tube 512.

[0028] The ends of the first air pipe 511 and the second air pipe 521 are respectively connected to the air supply system through separate pipes, and speed control valves are installed on the pipes to regulate the speed of the incoming gas.

[0029] The terms used herein, such as “upper,” “lower,” “front,” and “back,” indicating relative spatial positions, are for illustrative purposes to describe the relationship of one feature relative to another, as shown in the accompanying drawings. It is understood that, depending on the product's placement, these terms may be intended to include different orientations besides those shown in the figures, and should not be construed as limiting the claims.

[0030] Furthermore, the above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. The understanding of this specification should be based on those skilled in the art. Although the present utility model has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to the present utility model. All technical solutions and improvements that do not depart from the spirit and scope of the present utility model should be covered within the scope of the claims of the present utility model.

Claims

1. A silicon wafer tank processing device, characterized in that: The device includes a tank, a positioning base at the bottom of the tank, a silicon wafer basket on the positioning base, a first air pipe assembly, and a second air pipe assembly. The silicon wafers are vertically and stacked in the silicon wafer basket. The first air pipe assembly is horizontally arranged and parallel to the stacking direction of the silicon wafers. In the vertical direction, the first air pipe assembly is higher than the second air pipe assembly. The first air pipe assembly provides horizontal airflow to one side of the silicon wafers, and the second air pipe assembly provides oblique upward airflow to one side of the silicon wafers.

2. The silicon wafer tank processing equipment as described in claim 1, characterized in that: The first tracheal assembly includes a first trachea and a plurality of first air outlets arranged in a row on the first trachea. The inner diameter of the first trachea is 15-25 mm, the length of the first trachea is 100-200 cm, the inner diameter of the first air outlet is 1-2 mm, and the spacing between the first air outlets is 4-6 mm.

3. The silicon wafer trough processing equipment as described in claim 2, characterized in that: The height of the first air pipe corresponds to 85-95% of the height of the silicon wafer.

4. The silicon wafer trough processing equipment as described in claim 2, characterized in that: The second tracheal assembly includes a second trachea and a number of second air outlets arranged in a row on the second trachea. The inner diameter of the second trachea is 15-25 mm, the length of the second trachea is 100-200 cm, the inner diameter of the second air outlet is 1-2 mm, and the spacing between the second air outlets is 1 / 3-1 / 2 of the spacing between the first air outlets.

5. The silicon wafer tank processing equipment as described in claim 4, characterized in that: The second air pipe is set at a height corresponding to 60-70% of the height of the silicon wafer.

6. The silicon wafer tank processing equipment as described in claim 4, characterized in that: The second air outlet is vented at an angle of 40-50° upwards.

7. The silicon wafer tank processing equipment as described in claim 4, characterized in that: In the vertical direction, the height difference between the first and second air pipes is 5-7 cm, and in the horizontal direction, the distance between the first and second air pipes and the silicon wafer is 5-10 cm.

8. The silicon wafer tank processing equipment as described in claim 1, characterized in that: The silicon wafer basket is provided with the first air pipe group and the second air pipe group on both sides.

9. The silicon wafer tank processing equipment as described in claim 1, characterized in that: The silicon wafer basket is provided with the first air tube group and the second air tube group on one side.

10. The silicon wafer tank processing equipment as described in claim 1, characterized in that: The first air tube assembly and the second air tube assembly are fixed to the inner wall of the tank.

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