Silicon wafer transport apparatus

Abstract

The application relates to the technical field of photovoltaic solar cells, and discloses a silicon wafer conveying device, which comprises a conveying belt used for conveying silicon wafers along a first horizontal direction, a detection assembly, a correction assembly and a data processor. The detection assembly comprises a light emitter and a light receiver, the light emitter and the light receiver are arranged on two sides of the conveying belt in a vertical direction, and the light receiver is used for receiving detection light emitted by the light emitter. The correction assembly comprises two pushers which are arranged on two sides of the conveying belt in a second horizontal direction and can translate along the second horizontal direction to push the silicon wafers along the second horizontal direction. The data processor is used for receiving a position signal of the silicon wafers and controlling the movement of the pushers. In the application, the position signal of the silicon wafers is acquired through the detection assembly of the light emitter and the light receiver, then the correction assembly is controlled by the data processor to correct the position of the silicon wafers, so that the silicon wafers can be in a preset position and smoothly enter a next process under the conveying of the conveying belt, and the silicon wafers can be prevented from being jammed due to the inclination during conveying.

Description

Technical Field

[0001] This application relates to the field of photovoltaic solar cell technology, and more particularly to a silicon wafer transmission device. Background Technology

[0002] Solar cells are devices that directly convert solar energy into electrical energy using the photoelectric effect of semiconductor materials. The manufacturing process of solar cells mainly includes silicon wafer preparation, surface treatment, diffusion junction formation, anti-reflection layer deposition, electrode preparation, testing, and sorting. Between the processing steps of silicon wafers, they need to be transported, typically using conveyor belts to move them from one processing stage to the next, or from the processing area to the storage area.

[0003] In the prior art, when silicon wafers are transported on a conveyor belt, they are prone to shifting or tilting. Typically, a CDD (Charge Coupled Device) camera is used for visual positioning to determine the position of the silicon wafer. Then, clamps are used to correct the silicon wafer so that the conveyor belt can transport the silicon wafer into the basket carrier.

[0004] However, as production capacity and efficiency increase, the conveyor belt speed also needs to be increased. If the CDD camera's visual positioning is inaccurate, the silicon wafers will not be transported to the correct position, causing the wafer loading to become stuck. This not only requires a lot of manpower for tracking and debugging, but also directly affects the production line's breakage rate and production efficiency. Utility Model Content

[0005] This application discloses a silicon wafer transport device that can control the correction component through a data processor to correct the position of the silicon wafer, so that the silicon wafer can be placed in a preset position and smoothly transported by the conveyor belt to the next process, avoiding the silicon wafer from being skewed and causing transport blockage.

[0006] To achieve the above objectives, a silicon wafer transport device disclosed in this application includes: a conveyor belt for transporting silicon wafers along a first horizontal direction, wherein the width of the conveyor belt along a second horizontal direction is smaller than the width of the silicon wafer along the second horizontal direction;

[0007] Wherein, the first horizontal direction is perpendicular to the second horizontal direction;

[0008] The detection component includes a light emitter and a light receiver, which are respectively disposed on both sides of the conveyor belt along the vertical direction. The light receiver is used to receive the detection light emitted by the light emitter to obtain the position signal of the silicon wafer.

[0009] A correction assembly, comprising: two pushers, the two pushers being respectively disposed on both sides of the conveyor belt along the second horizontal direction and located behind the detection assembly in the transmission direction of the conveyor belt; both pushers are capable of translating along the second horizontal direction to push the silicon wafer along the second horizontal direction.

[0010] A data processor is used to receive the position signal of the silicon wafer and control the movement of the pusher to push the silicon wafer to a preset position.

[0011] As an optional implementation, the detection component is a through-beam photosensitive source, which includes:

[0012] A plurality of photosensitive source emitters, and an array of the plurality of photosensitive source emitters are disposed on one side of the conveyor belt along the vertical direction;

[0013] Multiple photosensitive source receivers are arranged one-to-one on the other side of the conveyor belt along the vertical direction.

[0014] As an optional implementation, the silicon wafer transport device includes: a transport motor;

[0015] The output end of the transmission motor is connected to the transmission belt, and the transmission motor is used to drive the transmission belt to rotate.

[0016] The transmission motor is electrically connected to the data processor.

[0017] As an optional implementation, the vertical height of the pusher is higher than that of the conveyor belt, and the distance by which the pusher is higher than the conveyor belt is less than the thickness of the silicon wafer.

[0018] As an optional implementation, the conveyor belt includes: two belt conveyor sections;

[0019] The two belt conveyors are arranged opposite each other, and the conveying speeds of the two belt conveyors are the same.

[0020] As an optional implementation, the corrective component further includes:

[0021] A slide rail extends along the second horizontal direction, and the pushing member is slidably disposed on the slide rail;

[0022] Two drive mechanisms are provided, each used to drive two pushers to slide along the slide rail in the second horizontal direction.

[0023] As an optional implementation, the pushing member is provided with a preset length along the first horizontal direction;

[0024] Wherein, the preset length is greater than or equal to the width of the silicon wafer along the first horizontal direction.

[0025] As an optional implementation, the pusher is used to push the side of the silicon wafer covered with a flexible layer;

[0026] Alternatively, the actuating element may be made of a flexible material.

[0027] As an optional implementation, the pusher is used to push the side of the silicon wafer, which is provided with multiple protrusions;

[0028] The protrusions of the multiple protrusion structures have the same protrusion height.

[0029] As an optional implementation, the pusher is used to push the side of the silicon wafer, which is provided with multiple pulleys;

[0030] The axles of the plurality of pulleys extend vertically;

[0031] The distance from the end of each pulley away from the pusher to the pusher is the same.

[0032] Compared with the prior art, the beneficial effects of this application are:

[0033] The silicon wafer transport device provided in this application embodiment can receive the position signal obtained by the detection component through the data processor, and then control the correction component to correct the position of the silicon wafer, so that the silicon wafer moves to a preset position on the conveyor belt. This allows the conveyor belt to accurately transport the silicon wafer to the entrance of the next process for processing or to a basket for standby and storage. Moreover, compared with the prior art, which obtains the position information of the silicon wafer by acquiring image information through a camera, the detection component proposed in this application obtains the position information of the silicon wafer more accurately through a light emitter and a light receiver. It also avoids the image information becoming blurred due to the speed of the conveyor belt, which could lead to errors in the judgment of the position of the silicon wafer, causing the silicon wafer to shift and fail to be transported to the correct position, resulting in wafer loading blockage. This not only requires a lot of manpower for tracking and debugging, but also directly affects the breakage rate and production efficiency of the production line. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the silicon wafer transmission device disclosed in the embodiments of this application;

[0036] Figure 2 This is a schematic diagram illustrating the detection principle of the detection component disclosed in the embodiments of this application;

[0037] Figure 3 This is a schematic diagram of the structure of the pusher with pulley disclosed in the embodiments of this application.

[0038] Explanation of reference numerals in the attached figures:

[0039] 1-Conveyor belt; 11-Belt conveyor; 2-Detection component; 21-Light emitter; 211-Photosensitive source emitter; 22-Light receiver; 221-Photosensitive source receiver; 3-Correction component; 31-Pushing component; 311-Pulley; 32-Slide rail; 4-Transmission motor; 5-Silicon wafer; a-First horizontal direction; b-Second horizontal direction; c-Vertical direction. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0041] In this application, the terms "upper," "lower," "top," "bottom," "inner," "vertical," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0042] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0043] Furthermore, the terms "set up," "equipped with," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0044] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0045] A solar cell is a device that directly converts solar energy into electrical energy using the photoelectric effect of semiconductor materials. Its core principle is the photoelectric effect, and the specific process is as follows: 1. Photon absorption: When sunlight shines on the surface of the solar cell, photons are absorbed by the semiconductor material; 2. Electron-hole pair generation: After absorbing photons, electrons in the semiconductor material are excited, forming electron-hole pairs; 3. Electric field separation: Under the influence of the built-in electric field of the PN junction, electrons and holes are separated, with electrons moving towards the N-region and holes moving towards the P-region; 4. Current output: By connecting electrodes at both ends of the cell, the movement of electrons and holes forms a current, thereby realizing the output of electrical energy.

[0046] With technological advancements and cost reductions, the application areas of solar cells continue to expand. Their advantages in environmental protection, economy, and sustainable development will drive their widespread application globally, and the manufacturing process of solar cells is of paramount importance.

[0047] The manufacturing process of solar cells is extremely complex, mainly including: 1. Silicon wafer preparation: using monocrystalline or polycrystalline silicon materials, cutting them into wafers with a thickness of approximately 200-350 micrometers; 2. Removal of the cutting damage layer, usually through acid or alkali etching; 3. Surface treatment: texturing, using acid or alkali etching to form a pyramid structure on the silicon wafer surface to reduce light reflection; 4. Diffusion junction formation: diffusing phosphorus elements on the silicon wafer surface to form a PN junction; 5. Antireflection layer deposition: using PECVD (Plasma Enhanced Chemical Vapor Deposition) technology to deposit silicon nitride (Si3N4) as an antireflection layer, while simultaneously achieving surface passivation; 6. Electrode preparation: using screen printing technology to print silver paste and aluminum paste on the front and back of the cell to form electrodes. A co-firing process is then used to form good metal contact; 7. Testing and classification: the completed solar cells are tested and classified according to their performance.

[0048] Silicon wafers are a fundamental material in semiconductor manufacturing and the photovoltaic industry. They are thin sheets made by processing high-purity silicon through a series of processes, such as extraction, wire drawing, and slicing.

[0049] In the production of photovoltaic solar cells, silicon wafers require further processing, including diffusion, oxidation, annealing and other processes.

[0050] The diffusion process typically involves diffusing a dopant source, such as boron or phosphorus, through an ultrathin silicon oxide layer into a silicon substrate to achieve the desired doping concentration and distribution. High temperatures are necessary in this process because they promote the diffusion rate of dopant atoms, resulting in more uniform and deeper doping. The diffusion temperature and time need to be precisely controlled to ensure the formation of the ideal doping concentration and distribution while avoiding unnecessary damage to the silicon substrate.

[0051] The oxidation process is used to grow an ultrathin silicon oxide layer on a silicon substrate. This silicon oxide layer not only passivates surface defects on the crystalline silicon substrate but also acts as a tunneling layer, allowing charge carriers to transport through the tunneling effect. The oxidation process is typically performed using methods such as thermal oxidation, chemical oxidation, or plasma-assisted oxidation. In these methods, high temperatures can accelerate the oxidation reaction, increasing the growth rate and quality of the oxide layer. Simultaneously, high temperatures can also help remove defects and impurities from the oxide layer, improving its passivation effect.

[0052] The annealing process is used to crystallize the deposited doped silicon thin layer and optimize its performance. High temperature is essential in this process because it promotes the crystallization and activation of the doped silicon thin layer, improving parameters such as carrier transport performance and contact resistance. The annealing temperature and time need to be precisely controlled to ensure that the doped silicon thin layer can fully crystallize and achieve optimal performance, while avoiding damage to the battery structure.

[0053] Between the processing steps of silicon wafers, the wafers need to be transported, usually by conveyor belts, which transport the wafers from one processing stage to the next, or from the processing area to the storage area.

[0054] During transport, conveyor belts typically deliver silicon wafers into baskets, which are containers used for storing and transporting silicon wafers. These baskets are usually made of plastic or metal and have multiple slots inside to neatly arrange multiple silicon wafers, preventing them from colliding with each other or becoming contaminated during transport.

[0055] Currently, the production line uses a conveyor belt to guide silicon wafers into a basket carrier. A CDD camera visually positions and captures the location information. Then, a clamp is set at the front of the basket to correct the silicon wafer. During the transfer and guidance of the silicon wafer, changes in the CDD camera position or increased production capacity and conveyor belt speed can lead to inaccurate position information. This can cause the silicon wafer to fail to be transferred to the correct position, resulting in wafer loading blockage. This not only requires a lot of manpower for tracking and debugging, but also directly affects the breakage rate and production efficiency of the production line.

[0056] Based on this, embodiments of this application provide a silicon wafer transmission device.

[0057] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0058] Please see Figures 1 to 3 , Figure 1 This is a schematic diagram of the silicon wafer transmission device disclosed in an embodiment of this application. Figure 2 This is a schematic diagram illustrating the detection principle of the detection component disclosed in an embodiment of this application. Figure 3 This is a schematic diagram of the structure of a pusher with pulleys disclosed in an embodiment of this application. An embodiment of this application discloses a silicon wafer transport device, including:

[0059] Conveyor belt 1 is used to convey silicon wafer 5 along a first horizontal direction a, and the width of conveyor belt 1 along a second horizontal direction b is smaller than the width of silicon wafer 5 along the second horizontal direction b.

[0060] Wherein, the first horizontal direction a is perpendicular to the second horizontal direction b;

[0061] Detection component 2 includes: light emitter 21 and light receiver 22. The light emitter 21 and light receiver 22 are respectively disposed on both sides of the conveyor belt 1 along the vertical direction c. The light receiver 22 is used to receive the detection light emitted by the light emitter 21 to obtain the position signal of the silicon wafer 5.

[0062] The correction component 3 includes two pushers 31, which are respectively disposed on both sides of the conveyor belt 1 along the second horizontal direction b and located behind the detection component 2 in the transmission direction of the conveyor belt 1. Both pushers 31 can be translated along the second horizontal direction b to push the silicon wafer 5 along the second horizontal direction b.

[0063] The data processor is used to receive the position signal of the silicon wafer 5 and control the movement of the pusher 31 to push the silicon wafer 5 to a preset position.

[0064] Specifically, the conveyor belt 1 includes a belt body, a drive unit, a tensioning device, idlers, and rollers. The drive unit is connected to the rollers, and the rollers are connected to the belt body. The drive unit can drive the rollers to rotate, so that the belt body can perform transmission motion. The belt body can be made of rubber material to provide a certain cushioning for the silicon wafers 5 and prevent the silicon wafers 5 from being scratched. The idlers can support the belt body, reduce belt sagging, and ensure its smooth operation. The tensioning device can tension the belt body to prevent it from slipping or loosening.

[0065] The silicon wafer 5 moves under the drive of the conveyor belt 1. The silicon wafer 5 first passes through the detection component 2, then reaches the correction component 3, and then continues to move to the next process or the basket entrance.

[0066] The detection component 2 of the correction device can acquire the position information of the silicon wafer 5, the correction component 3 can move the silicon wafer 5 on the conveyor belt 1, and the data processor can receive the position information of the silicon wafer 5 acquired by the detection component 2, and then control the correction component 3 to change the position of the silicon wafer 5 according to the position information of the silicon wafer 5, so that the silicon wafer 5 can move to the preset position.

[0067] The preset position is the correct position of silicon wafer 5 on conveyor belt 1. At this position, silicon wafer 5 can enter the basket entrance through conveyor belt 1 or the entrance of the next process. If silicon wafer 5 is offset, it will cause conveyor belt 1 to be unable to send silicon wafer 5 into the basket entrance or the entrance of the next process.

[0068] The detection component 2 acquires the position information of the silicon wafer 5 through the light emitter 21 and the light receiver 22. The light emitter 21 can emit infrared light, and the light receiver 22 can convert the received light signal into an electrical signal. The light emitter 21 and the light receiver 22 can cooperate with each other. If the light receiver 22 receives the infrared light from the light emitter 21, it means that there is no object blocking the way. Otherwise, it means that there is an object.

[0069] Detection component 2 can be a through-beam photosensitive source, see reference. Figure 2 Multiple photosensitive source receivers 221 are arranged on the upper side of the conveyor belt 1, and multiple photosensitive source emitters 211 are arranged on the lower side. Alternatively, multiple photosensitive source emitters 211 can be arranged on the upper side of the conveyor belt 1, and multiple photosensitive source receivers 221 can be arranged on the lower side. The photosensitive source emitters 211 and photosensitive source receivers 221 can be arranged in a row, with one photosensitive source receiver 221 corresponding to one photosensitive source emitter 211. A 15x15 array can be set as needed, and preset positions can be set. For example, the photosensitive source receivers 221 and photosensitive source emitters 211 in the middle 5x5 array can be arranged in a row. The position 1 is the preset position of silicon wafer 5. If the 5x5 photosensitive receiver 221 in the very center does not receive a light signal, while the other photosensitive receivers 221 receive the light signal from the photosensitive emitter 211, it indicates that silicon wafer 5 has reached the preset position. If the five photosensitive receivers 221 on the far right of the center 5x5 photosensitive receiver 221 receive a light signal, it indicates that silicon wafer 5 has shifted. At this point, the position information of silicon wafer 5 can be determined based on the number and position of the other photosensitive emitters 211 and photosensitive receivers 221 that are blocked. Using the detection component 2 proposed in this application, the position information of silicon wafer 5 can be obtained quickly and accurately, unlike the visual positioning of a CDD camera where the increased conveyor speed of the conveyor belt 1 leads to image blurring and incorrect position information judgment.

[0070] The width of the conveyor belt 1 is set to be no more than the width of the silicon wafer 5. That is, the width of the conveyor belt 1 along the second horizontal direction b is less than the width of the silicon wafer 5 along the second horizontal direction b. This allows at least one side of the silicon wafer 5 on the conveyor belt 1 to be exposed along the second horizontal direction b, without being completely blocked by the conveyor belt 1. This enables the detection component 2 to correctly obtain the position information of the silicon wafer 5 through the light-blocking effect of the silicon wafer 5.

[0071] According to the silicon wafer transport device of this utility model embodiment, the data processor can receive the position signal obtained by the detection component 2 and control the correction component 3 to correct the position of the silicon wafer 5, so that the silicon wafer 5 moves to a preset position on the conveyor belt 1. The conveyor belt 1 can accurately transport the silicon wafer 5 to the entrance of the next process for processing or to the basket for standby and storage. Moreover, compared with the prior art, which obtains the position information of the silicon wafer 5 by acquiring image information through a CDD camera, the detection component 2 proposed in this application obtains the position information of the silicon wafer 5 more accurately through the light emitter 21 and the light receiver 22. It will not cause the image information to become blurred due to the speed of the conveyor belt 1, resulting in the incorrect judgment of the position of the silicon wafer 5, causing the silicon wafer 5 to be offset, which will prevent the silicon wafer 5 from being transported to the correct position and cause the wafer loading to jam. This not only requires a lot of manpower for tracking and debugging, but also directly affects the breakage rate and production efficiency of the production line.

[0072] In some embodiments, the detection component 2 is a through-beam photosensitive source, which includes:

[0073] Multiple photosensitive source emitters 211 are arranged in an array on one side of the conveyor belt 1 along the vertical direction c;

[0074] Multiple photosensitive source receivers 221 are arranged one-to-one on the other side of the conveyor belt 1 along the vertical direction c.

[0075] Specifically, the photosensitive source emitter 211 can be located on the upper side of the conveyor belt 1, and the photosensitive source receiver 221 can be located on the lower side of the conveyor belt 1, or the photosensitive source receiver 221 can be located on the lower side of the conveyor belt 1, and the photosensitive source emitter 211 can be located on the lower side of the conveyor belt 1. The number of photosensitive source emitters 211 and photosensitive source receivers 221 are the same, and they are set in pairs, with each photosensitive source emitter 211 corresponding to one photosensitive source receiver 221. After the detection starts, if the corresponding photosensitive source receiver 221 receives a light signal, it means that there is no object blocking the middle and the silicon wafer 5 has not reached this position. If the corresponding photosensitive source receiver 221 does not receive a light signal, it means that there is an object blocking the middle and the silicon wafer 5 has reached this position. In this way, the coordinate information of the silicon wafer 5 can be obtained, so that the detection component 2 can quickly and accurately obtain the position information of the silicon wafer 5.

[0076] In some embodiments, the silicon wafer transport device includes: a transport motor 4;

[0077] The output end of the transmission motor 4 is connected to the transmission belt 1 for driving the transmission motor 4 to rotate the transmission belt 1.

[0078] Among them, the transmission motor 4 is electrically connected to the data processor.

[0079] Specifically, the driving device can be a transmission motor 4, which drives the conveyor belt 1. The transmission motor 4 is also electrically connected to the data processor, which can control the start, stop and speed of the transmission motor 4, that is, control the start, stop and conveying speed of the conveyor belt 1. After the data processor receives the position information of the silicon wafer 5, it can process the position information. When the offset of the silicon wafer 5 reaches a preset value, which can be a large offset value, the transmission motor 4 can be stopped in time when the offset of the silicon wafer 5 reaches the preset value, so that the conveyor belt 1 stops transporting the silicon wafer 5, avoiding the accumulation of offset silicon wafers 5 and damage to other correctly positioned silicon wafers 5.

[0080] An alarm device can be added, which can be an alarm light and / or an alarm horn. When the offset of silicon wafer 5 reaches a preset value, the data processor stops the operation of conveyor belt 1 and at the same time controls the alarm device to emit an alarm sound and / or alarm light to remind the surrounding staff to deal with it in time and avoid production line stagnation and long-term idleness.

[0081] In some embodiments, the height of the pusher 31 along the vertical direction c is higher than that of the conveyor belt 1, and the distance by which the pusher 31 is higher than that of the conveyor belt 1 is less than the thickness of the silicon wafer 5.

[0082] Specifically, the height restriction of the pusher 31 ensures that the pusher 31 can push the silicon wafer 5 without interfering with the conveyor belt 1. That is, the height of the pusher 31 in the vertical direction c is higher than that of the conveyor belt 1, so that the pusher 31 moves above the conveyor belt and is not blocked by the conveyor belt 1. The distance of the pusher 31 above the conveyor belt 1 is less than the thickness of the silicon wafer 5, so that the pusher 31 can push the silicon wafer 5 and will not be unable to touch the silicon wafer 5 due to being too high, thus losing its corrective effect on the silicon wafer 5.

[0083] In some embodiments, the conveyor belt 1 includes: two belt conveyor sections 11;

[0084] Two belt conveyor units 11 are arranged opposite each other, and the conveying speed of the two belt conveyor units 11 is the same.

[0085] Specifically, the conveyor belt 1 can be a split belt, with two belt conveyor sections 11 supporting two parts of the silicon wafer 5 along the second horizontal direction b to convey the silicon wafer 5. Due to the split design, the contact area between the silicon wafer 5 and the conveyor belt 1 can be reduced. When the correction component 3 moves the silicon wafer 5, the probability of the silicon wafer 5 being damaged by friction by the conveyor belt 1 can be reduced.

[0086] In some embodiments, the corrective component 3 further includes:

[0087] The slide rail 32 extends along the second horizontal direction b, and the pusher 31 is slidably disposed on the slide rail 32;

[0088] Two drive mechanisms are used to drive two pushers 31 to slide along the second horizontal direction b on the slide rail 32.

[0089] Specifically, there can be one slide rail 32, with both pushers 31 mounted on one slide rail 32. Alternatively, there can be two slide rails 32, mounted on both sides of the conveyor belt 1 along the second horizontal direction b, with the two pushers 31 mounted on the two slide rails 32 respectively. The pushers 31 can be slidably connected to the slide rails 32 via support rods. The height of the support rods is adjustable, allowing for adjustment of the height of the pushers 31.

[0090] In some embodiments, the pusher 31 is provided with a preset length along the first horizontal direction a;

[0091] The preset length is greater than or equal to the width of the silicon wafer 5 along the first horizontal direction a.

[0092] Specifically, the pusher 31 can be a rod with a certain preset length, which can push the silicon wafer 5 so that when the silicon wafer 5 is displaced on the conveyor belt 1, the silicon wafer 5 will not be skewed, and it will not contact and push the silicon wafer 5 as a single point, causing the silicon wafer 5 to rotate around this point. Moreover, the pusher 31 proposed in this application can also correct the silicon wafer 5 with a certain degree of skew.

[0093] In some embodiments, the pusher 31 is used to push the side of the silicon wafer 5 covered with a flexible layer;

[0094] Alternatively, the actuator 31 may be made of a flexible material.

[0095] Specifically, the flexible layer can be made of rubber, sponge or foam, etc., and the flexible material can be rubber or other materials. Since the pusher 31 pushes the silicon wafer 5 while the conveyor belt 1 is also moving the silicon wafer 5, the flexible layer or flexible material can prevent the pusher 31 from scratching the silicon wafer 5 when it comes into contact with the silicon wafer 5, thus affecting the quality of the silicon wafer 5.

[0096] In some embodiments, the pusher 31 is used to push the side of the silicon wafer 5, which is provided with a plurality of protrusions.

[0097] The protrusions of multiple protrusion structures have the same height.

[0098] Specifically, the pusher 31 can also be provided with multiple protrusions of the same height on one side of the silicon wafer 5, which greatly reduces the contact area between the pusher 31 and the silicon wafer 5, avoids the pusher 31 scratching the silicon wafer 5, and the pusher 31 can push together with multiple protrusions of the same height, so that the pusher 31 can have multiple pushing forces in the same direction, and avoids the silicon wafer 5 from tilting when pushing the silicon wafer 5.

[0099] In some embodiments, the pusher 31 is used to push the side of the silicon wafer 5, which is provided with a plurality of pulleys 311;

[0100] The axles of multiple pulleys 311 extend in the vertical direction c;

[0101] The distance from the end of the multiple pulleys 311 away from the pusher 31 to the pusher 31 is the same.

[0102] Specifically, refer to Figure 3 The pushing member 31 can also be equipped with multiple pulleys 311 on one side of the silicon wafer 5. When the pushing member 31 needs to push the silicon wafer 5, the pulleys 311 will contact the silicon wafer 5. At this time, the silicon wafer 5 is still moving under the drive of the conveyor belt 1. The pushing member 31, which is stationary relative to the silicon wafer 5 along the first horizontal direction a, is prone to static friction with the silicon wafer 5 during the pushing process, causing wear on the silicon wafer 5. The pulleys 311 proposed in this application can avoid friction between the pushing member 31 and the silicon wafer 5 moving in the second horizontal direction b when pushing the silicon wafer 5, thus preventing damage to the silicon wafer 5. It also does not require stopping the operation of the conveyor belt 1, thus ensuring transmission efficiency. The design of multiple pulleys 311 can give the pushing member 31 multiple pushing forces in the same horizontal direction, which can prevent the silicon wafer 5 from tilting when pushing it.

[0103] A flexible layer, such as rubber or sponge, can be wrapped around the surface of pulley 311. Alternatively, a flexible wheel, such as a rubber wheel, can be used directly to further protect the silicon wafer 5 that moves with the conveyor belt 1.

[0104] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A silicon wafer transmission device, characterized in that, include: A conveyor belt (1) is used to convey a silicon wafer (5) along a first horizontal direction (a), and the width of the conveyor belt (1) along a second horizontal direction (b) is smaller than the width of the silicon wafer (5) along the second horizontal direction (b). Wherein, the first horizontal direction (a) is perpendicular to the second horizontal direction (b); The detection component (2) includes a light emitter (21) and a light receiver (22). The light emitter (21) and the light receiver (22) are respectively disposed on both sides of the conveyor belt (1) along the vertical direction (c). The light receiver (22) is used to receive the detection light emitted by the light emitter (21) to obtain the position signal of the silicon wafer (5). The correction component (3) includes two pushers (31), which are respectively disposed on both sides of the conveyor belt (1) along the second horizontal direction (b) and located behind the detection component (2) in the transmission direction of the conveyor belt (1). Both pushers (31) are capable of translating along the second horizontal direction (b) to push the silicon wafer (5) along the second horizontal direction (b). A data processor is used to receive the position signal of the silicon wafer (5) and control the pusher (31) to move so as to push the silicon wafer (5) to a preset position.

2. The silicon wafer transmission device according to claim 1, characterized in that, The detection component (2) is a through-beam photosensitive source, which includes: Multiple photosensitive source emitters (211) are arranged in an array on one side of the conveyor belt (1) along the vertical direction (c); Multiple photosensitive source receivers (221) are arranged one-to-one on the other side of the conveyor belt (1) along the vertical direction (c).

3. The silicon wafer transmission device according to claim 1, characterized in that, The height of the pusher (31) in the vertical direction (c) is higher than that of the conveyor belt (1), and the distance by which the pusher (31) is higher than that of the conveyor belt (1) is less than the thickness of the silicon wafer (5).

4. The silicon wafer transmission device according to claim 1, characterized in that, The silicon wafer transport device includes: a transport motor (4); The output end of the transmission motor (4) is connected to the conveyor belt (1) for transmission, and the transmission motor (4) is used to drive the conveyor belt (1) to rotate; The transmission motor (4) is electrically connected to the data processor.

5. The silicon wafer transmission device according to claim 1, characterized in that, The conveyor belt (1) includes: two belt conveyor sections (11); The two belt conveyor units (11) are arranged opposite each other, and the conveying speed of the two belt conveyor units (11) is the same.

6. The silicon wafer transmission device according to claim 1, characterized in that, The corrective component (3) also includes: A slide rail (32) extends along the second horizontal direction (b), and the pusher (31) is slidably disposed on the slide rail (32); Two drive mechanisms are provided, each of which drives two pushers (31) to slide along the second horizontal direction (b) on the slide rail (32).

7. The silicon wafer transmission device according to claim 1, characterized in that, The pusher (31) is provided with a preset length along the first horizontal direction (a); Wherein, the preset length is greater than or equal to the width of the silicon wafer (5) along the first horizontal direction (a).

8. The silicon wafer transmission device according to claim 7, characterized in that, The pusher (31) is used to push the side of the silicon wafer (5) which is covered with a flexible layer; Alternatively, the pusher (31) may be made of a flexible material.

9. The silicon wafer transmission device according to claim 7, characterized in that, The pusher (31) is used to push the silicon wafer (5) and has a plurality of protrusions on its side. The protrusions of the multiple protrusion structures have the same protrusion height.

10. The silicon wafer transport device according to claim 7, characterized in that, The pusher (31) is used to push the silicon wafer (5) and a plurality of pulleys (311) are provided on the side. The pivots of the plurality of pulleys (311) extend in the vertical direction (c); The distance from the end of each pulley (311) away from the pusher (31) to the pusher (31) is the same.

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