Transport lift structure, robot and annealing apparatus

Abstract

The utility model relates to perovskite solar cell industrialization manufacturing field discloses transfer and lifts structure, manipulator and annealing equipment, including horizontal arm and located the end supporting arm of both ends of horizontal arm and between the at least one middle part supporting arm of both ends end supporting arm, end supporting arm with middle part supporting arm all are along the length direction interval arrangement of horizontal arm with horizontal arm is connected, at least end supporting arm is provided with adsorption subassembly, at least middle part supporting arm is along its length direction interval and is equipped with a plurality of thimble, thimble is used for supporting the substrate interval middle part supporting arm or end supporting arm. Can solve the position of the existing manipulator and chip contact will have temperature change, lead to the grain growth of contact position and other position is not consistent, will lead to the problem of chip film surface difference and defect generation.

Description

Technical Field

[0001] This utility model relates to the field of industrial manufacturing technology for perovskite solar cells, specifically to a transfer and lifting structure, a robotic arm, and annealing equipment. Background Technology

[0002] Perovskite solar cells are solar cells that utilize perovskite-type organometal halide semiconductors as light-absorbing materials. In recent years, the highest photoelectric conversion efficiency of perovskite solar cells has increased from 3.8% to 25.7%. This efficiency not only surpasses that of other earlier-developed thin-film solar cells but has also reached or even exceeded that of industrialized solar cell technologies such as polycrystalline silicon solar cells, demonstrating enormous potential for industrial development.

[0003] Perovskite solar cells generally include: 1. A front electrode, which is a transparent conductive glass or a flexible transparent conductive film; 2. A first carrier transport layer, which is a P-type or N-type semiconductor material, and can be a metal oxide or an organic semiconductor material; 3. A perovskite light absorption layer ABX3 material, where A is a monovalent group or ion such as methylamino (MA), formamidinyl (FA), or cesium (Cs); B is a divalent element such as lead (Pb) or Sn, or two monovalent element ions; and X is a halogen element or other negative monovalent group; 4. A second carrier transport layer, which is an N-type or P-type semiconductor material, and can be a metal oxide or an organic semiconductor material; 5. A back electrode, which can be a metal material, graphite, or a conductive oxide.

[0004] Perovskite, as the core film layer, plays a crucial role in the conversion efficiency of the module. Currently, among the mainstream methods for preparing high-efficiency perovskite films, wet processing has an absolute advantage. In wet processing, annealing plays an important role in the crystallization and growth of perovskite. Rapid annealing after crystallization can better promote the growth of perovskite grains, improve the quality of crystals, ensure the uniformity and constant temperature of the film layer during annealing, effectively reduce the generation of defects, eliminate residual stress, and improve the conversion efficiency of the cell.

[0005] Existing mass-produced perovskite annealing equipment typically has multiple zones, such as a preheating zone, a baking zone, and a cooling zone. During the transfer of chips between these zones, robotic arms are used for transport. Temperature changes occur at the points where the robotic arms contact the chips, causing inconsistencies in grain growth at these contact points compared to other locations. This can lead to differences in the chip film surface and defects. In particular, as perovskite commercialization progresses, the size and weight of chips increase dramatically, and the occurrence of defects leads to a sharp increase in costs. Utility Model Content

[0006] In view of this, the present invention provides a transfer and lifting structure, a robotic arm, and an annealing device to solve the problem that the temperature changes at the contact point between the existing robotic arm and the chip cause the grain growth at the contact point to be inconsistent with that at other points, which leads to differences and defects in the chip film surface.

[0007] In a first aspect, the present invention provides a transfer and lifting structure, including a horizontal arm and end support arms located at both ends of the horizontal arm and at least one middle support arm located between the end support arms at both ends, wherein the end support arms and the middle support arm are arranged at intervals along the length direction of the horizontal arm and connected to the horizontal arm.

[0008] At least one of the end support arms is provided with an adsorption component, and at least one of the middle support arms is provided with a plurality of pins spaced apart along its length. The pins are used to support the substrate spaced apart from the middle support arm or the end support arm.

[0009] Beneficial Effects: This utility model's transfer and lifting structure, by setting an adsorption component on the end support arm and multiple ejector pins on the middle support arm, allows the ejector pins in the transfer and lifting structure to press against the chip's substrate when the robotic arm transfers the chip, creating a gap between the chip and the middle and end support arms. This prevents the chip from contacting the support arms with the substrate, thus avoiding uneven temperature at the contact points during annealing. Furthermore, the adsorption component adsorbs the edge of the substrate, ensuring stability during chip transfer. The ejector pins' pushing action and the adsorption component's adsorption action prevent large-area contact between the robotic arm and the chip, avoiding temperature differences between the chip contact surface and other areas. The adsorption force of the adsorption component provides stable transfer conditions for the chip. This design is better suited for large-area perovskite products, effectively preventing chip defects caused by uneven temperature on the chip film surface during transfer between different chambers during annealing, and ensuring that large-size chip products are not physically damaged during transfer.

[0010] In one specific embodiment, the adsorption assembly includes at least one suction cup module disposed on the end support arm, and in the adsorption state, the adsorption plane of the suction cup module is coplanar with the top surface of the ejector pin.

[0011] In one specific embodiment, the end support arm is provided with a plurality of grippers on the outside of the adsorption assembly. The grippers are spaced apart along the length direction of the end support arm and are rotatably adjustable on the end support arm. The grippers have an open state that is rotated to be offset from the substrate and a clamping state that is rotated to be pressed on the substrate.

[0012] In one specific embodiment, the end support arm is further provided with a thickness adjustment member in the area between the gripper and the suction cup module, and the thickness adjustment member is disposed on the end support arm. The side of the thickness adjustment member facing the gripper is the support base surface. In the adsorption state, the support base surface and the adsorption surface of the suction cup module are coplanar.

[0013] In one specific embodiment, the suction cup module includes a retractable suction cup having an extended position and a retracted position. In the extended position, the top surface of the suction cup is higher than the top surface of the thickness adjustment member. In the retracted position, the top surface of the suction cup is flush with the top surface of the thickness adjustment member.

[0014] In one specific embodiment, the suction cup module includes a telescopic rod and a suction cup. The telescopic rod extends in a direction perpendicular to the supporting surface. One end of the telescopic rod is connected to the end support arm, and the other end is connected to the suction cup.

[0015] In one specific embodiment, the plurality of grippers and the plurality of suction cups are staggered along the length of the end support arm.

[0016] In one specific embodiment, the ejector pin is made of a polymer material that is corrosion-resistant, high-temperature resistant, and has low thermal conductivity.

[0017] Secondly, this utility model also provides a robotic arm, including the aforementioned transfer and lifting structure.

[0018] Beneficial effects: Mounting the transfer and lifting structure on a robotic arm provides greater freedom of movement, accommodating loading and unloading at different locations and transfer between equipment. It is better suited for large-area perovskite products, effectively preventing physical damage during chip transfer and reducing temperature differences between the chip contact surface and other areas. This ensures the uniformity of the perovskite chip crystals after annealing, guaranteeing both chip appearance and transfer efficiency.

[0019] Thirdly, this utility model also provides an annealing device, including an annealing furnace and the aforementioned robotic arm. The robotic arm drives the transfer and lifting structure to feed and unload materials into the annealing furnace. A linear displacement mechanism is also provided at the bottom of the robotic arm, and the robotic arm moves between upstream and downstream workstations through the linear displacement mechanism.

[0020] Beneficial effects: Since the annealing equipment includes a robotic arm, it has all the effects of a robotic arm, which will not be elaborated here. Attached Figure Description

[0021] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a top view schematic diagram of an annealing device according to an embodiment of the present utility model;

[0023] Figure 2 for Figure 1 A top view of the transfer and lifting structure with chips placed on it;

[0024] Figure 3 for Figure 2 A schematic diagram of the cross-section under the supported condition;

[0025] Figure 4 for Figure 3 A magnified view of part A in the image;

[0026] Figure 5 for Figure 2 Add a front view diagram of the connector mechanism;

[0027] Figure 6 This is a schematic diagram showing the cooperation relationship between the gripper and the end support arm in a transfer and lifting structure according to an embodiment of the present utility model.

[0028] Figure 7 This is a schematic diagram showing the interaction between the gripper in the open state and the end support arm in a transfer and lifting structure according to an embodiment of this utility model.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. Robotic arm; 101. Robotic arm; 102. Transfer and lifting structure; 1021. Horizontal arm; 1022. End support arm; 1023. Middle support arm; 1024. Suction cup; 1025. Ejector pin; 1026. Gripper; 1027. Elastic pad; 1028. Thickness adjustment plate; 103. Connector mechanism; 2. Chip; 201. Edge cleaning area; 3. Annealing furnace; 4. Linear displacement mechanism. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0032] The following is combined Figures 1 to 7 The present invention will be illustrated as shown.

[0033] First, it should be noted that the substrate of chip 2 is glass. The film layer required for perovskite solar cells is deposited on the glass, and the individual sub-cells are connected in series by laser scribing.

[0034] On the one hand, such as Figure 2 and Figure 3 As shown, the present invention provides a transfer and lifting structure 102, including a horizontal arm 1021, end support arms 1022 located at both ends of the horizontal arm 1021, and at least one middle support arm 1023 located between the end support arms 1022 at both ends. The end support arms 1022 and the middle support arm 1023 are arranged at intervals along the length direction of the horizontal arm 1021 and connected to the horizontal arm 1021.

[0035] At least the end support arm 1022 is provided with an adsorption component, such as Figure 3 and Figure 4 As shown, at least the middle support arm 1023 is provided with a plurality of ejector pins 1025 spaced apart along its length direction. The ejector pins 1025 are used to support the substrate spaced apart from the middle support arm 1023 or the end support arm 1022.

[0036] The transfer and lifting structure 102 of this invention features an adsorption component on the end support arm 1022 and multiple ejector pins 1025 on the middle support arm 1023. When the robot arm 1 transfers the chip 2, the ejector pins 1025 in the transfer and lifting structure 102 press against the substrate of the chip 2, creating a gap between the chip 2 and the middle and end support arms 1023 and 1022. This allows the chip 2 to move away from the middle and end support arms 1023 and is fixed in position by the adsorption component, ensuring the stability of the chip 2 during transfer. Through the pushing action of the ejector pins 1025 and the adsorption action of the adsorption component, the temperature difference between the contact surface of the chip 2 and other locations caused by large-area contact between the robot arm 1 and the chip 2 can be avoided. Furthermore, the adsorption force of the adsorption component provides stable transfer conditions for the chip 2. It is better suited for large-area perovskite products, and can effectively avoid the generation of chip 2 defects caused by uneven temperature on the film surface of chip 2 during the transfer of chip 2 between different chambers during annealing, and can ensure that large-size chip 2 products are not physically damaged during the transfer process.

[0037] In this embodiment, "at least the end support arm 1022 is provided with an adsorption component, and at least the middle support arm 1023 is provided with a plurality of pins 1025 spaced apart along its length" means that the adsorption component can be provided only on the end support arm 1022 or on both the end support arm 1022 and the middle support arm 1023. If the adsorption component is provided on the middle support arm 1023, it is located at the end of the middle support arm 1023 and corresponds to the clearing area 201 of the substrate, which is used to avoid the projection area of ​​the cell film surface of the chip 2 and also increases the adsorption stability. Similarly, the adsorption component can also be provided on the horizontal arm 1021 and corresponds to the clearing area of ​​the substrate. Pins 1025 can be provided only on the middle support arm 1023 or on both the end support arm 1022 and the middle support arm 1023. Preferably, the adsorption assembly is disposed on the end support arm 1022, and the ejector pin 1025 is disposed on the middle support arm 1023.

[0038] In one specific embodiment, both the end support arm 1022 and the middle support arm 1023 are arranged perpendicularly to the cross arm 1021.

[0039] In this embodiment, to reduce the contact area between the ejector pin 1025 and the substrate of chip 2, the top of the ejector pin 1025 can be configured as a pointed tip. To facilitate the installation of the ejector pin 1025, a mounting base can be provided at the bottom of the ejector pin 1025 for easy installation on the central support arm 1023. Specifically, the installation method can involve providing a mounting groove on the central support arm 1023, with the ejector pin 1025 mounted and fixed in the mounting groove via the mounting base. Of course, the ejector pin 1025 can also be installed using other suitable methods.

[0040] In one specific embodiment, the adsorption assembly includes at least one suction cup module disposed on the end support arm 1022, and in the adsorption state, the adsorption plane of the suction cup module is coplanar with the top surface of the ejector pin 1025. This coplanar arrangement ensures that when the ejector pin 1025 abuts against the substrate of the chip 2, the suction cup module can be completely adsorbed onto the substrate of the chip 2. This allows the supporting force of the ejector pin 1025 and the adsorption force of the suction cup module to work simultaneously.

[0041] In one specific embodiment, the end support arm 1022, located outside the adsorption assembly, is also provided with a plurality of grippers 1026. The grippers 1026 are spaced apart along the length of the end support arm 1022, and are rotatably and adjustablely mounted on the end support arm 1022. Figure 7 As shown, the gripper 1026 has an open state that is rotated to be offset from the substrate, and as... Figure 6 As shown, the device has a clamping state where it is rotated to press against the substrate. The gripper 1026 is mounted on the end support arm 1022 via a fixed base. One end of the gripper 1026 is a free end used to press against the chip, and the other end is rotatably adjustable on the fixed base. The gripper 1026 is mounted on the fixed base via a rotating shaft, and one end of the rotating shaft is equipped with a rotation drive mechanism (not shown in the figure) for driving the gripper 1026 to rotate. The rotation drive mechanism can be a motor. By setting the gripper 1026, the chip 2 can be clamped from opposite ends (…). Figure 1 Applying downward pressure at both ends (as shown in the horizontal direction), in conjunction with the suction force of the suction cup module, ensures the stability and reliability of chip 2 during transfer. When chip 2 needs to be removed, simply use the clamping claws 1026 to remove chip 2 from the space between the clamping claws 1026 on both sides.

[0042] Furthermore, the gripper 1026 is vertically positioned in the open state, as shown below. Figure 6 and Figure 7 As shown, the bottom surface of the gripper 1026 is provided with an elastic pad 1027. When the gripper 1026 is in the clamping state, the elastic pad 1027 contacts the opposite ends of the chip 2.

[0043] In addition, the elastic gasket 1027 can be made of polymer materials such as EPDM and EPM, which are corrosion-resistant, high-temperature resistant, and impact-resistant.

[0044] In addition, such as Figure 2As shown, chip 2 has a certain width of edge-cleaning area 201 on its relatively peripheral edges. The edge-cleaning area 201 is an inactive area of ​​chip 2, specifically used for clamping and also the area for subsequent component encapsulation. The bottom surface of chip 2 includes a substrate, which is glass. The edge-cleaning area 201 is disposed on the glass, and the area where the film layer is removed from the outer edge of the glass is the edge-cleaning area. Therefore, in order to avoid affecting chip 2, the width of the elastic pad 1027 of the clamping jaw 1026 in contact with chip 2 is smaller than the width of the edge-cleaning area 201.

[0045] In a specific embodiment, such as Figure 6 As shown, the end support arm 1022, located in the area between the gripper 1026 and the suction cup module, also has a thickness adjustment component. This thickness adjustment component is mounted on the end support arm 1022, with the side facing the gripper 1026 serving as the support base surface. In the adsorption state, the support base surface and the adsorption surface of the suction cup module are coplanar. By providing the thickness adjustment component, the position of the chip 2 in the height direction can be finely adjusted, ensuring that the adsorption surface of the suction cup module contacts the bottom surface of the chip 2 precisely when adsorbed. Furthermore, by providing the thickness adjustment component, the precision requirements for the end support arm 1022 itself can be reduced, thereby lowering the manufacturing difficulty.

[0046] Specifically, the thickness adjustment component can be a single thickness adjustment piece 1028 or multiple thickness adjustment pieces 1028 stacked together. The specific number of thickness adjustment pieces 1028 is determined by the distance between the upper surface of the end support arm 1022 and the upper surface of the suction surface of the suction cup module in the suction state.

[0047] In a specific embodiment, such as Figure 6 As shown, the suction cup module includes a retractable suction cup 1024, which has an extended position and a retracted position. In the extended position, the top surface of the suction cup 1024 is higher than the top surface of the thickness adjustment component. In the retracted position, the top surface of the suction cup 1024 is flush with the top surface of the thickness adjustment component. Normally, the suction cup 1024 is higher than the thickness adjustment component. After the suction cup 1024 adsorbs the glass of the chip 2, it retracts to be flush with the thickness adjustment component, and the glass of the chip 2 is completely in contact with it. This design prevents the chip 2 from contacting the thickness adjustment component or other parts when it is first placed on the suction cup 1024, thus avoiding impact. After the chip 2 is placed stably, the suction cup 1024 retracts, making the upper surface of the glass of the chip 2 flush with the upper surface of the thickness adjustment component.

[0048] In one specific embodiment, the suction cup module includes a telescopic rod and a suction cup 1024. The telescopic rod extends perpendicular to the supporting surface. One end of the telescopic rod is connected to the end support arm 1022, and the other end is connected to the suction cup 1024. The telescopic rod provides support and height adjustment, facilitating height adjustment of the suction cup 1024. The specific structure of the telescopic rod can adopt any existing telescopic form, such as a spring telescopic module.

[0049] In one specific embodiment, multiple grippers 1026 and multiple suction cups 1024 are staggered along the length of the end support arm 1022. This ensures that the grippers 1026 and suction cups 1024 do not interfere with each other, work together, and make full use of the space on the upper surface of the end support arm 1022.

[0050] In one specific embodiment, the ejector pin 1025 is made of a corrosion-resistant, high-temperature-resistant, and low-thermal-conductivity polymer material. Specifically, the ejector pin 1025 can be made of any one of PEEK, PI, or PTFE. PEEK (polyetheretherketone) is a high-performance thermoplastic engineering plastic; polyimide is an aromatic heterocyclic polymer compound containing an imide ring (-CO-NH-CO-) in its molecular backbone, belonging to high-performance engineering plastics; PTFE, short for polytetrafluoroethylene, is a polymer polymerized from tetrafluoroethylene monomers, possessing excellent properties. Ejector pins 1025 made from these materials can reduce the temperature difference between the supported and unsupported positions of chip 2.

[0051] On the other hand, this utility model also provides a robotic arm 1, including the aforementioned transfer and lifting structure 102. For example... Figure 1 , Figure 2 and Figure 5 As shown, specifically, the robotic arm 1 also includes a robotic arm 101, which is connected to the horizontal arm 1021 of the transfer and lifting structure 102 via a joint mechanism 103. By controlling the position and angle of the horizontal arm 1021, the end support arm 1022, and the middle support arm 1023 through various actions such as rotation and movement of the robotic arm 1, the placement of the glass chip 2 is controlled.

[0052] In this embodiment, the transfer and lifting structure 102 is mounted on the robotic arm 1, providing more degrees of freedom of movement to accommodate loading and unloading at different locations and transfer between equipment. It is better suited for large-area perovskite products, effectively preventing physical damage to the chip 2 during transfer, reducing the temperature difference between the chip 2 contact surface and ordinary locations, ensuring the uniformity of the perovskite chip 2 crystals after annealing, and guaranteeing the appearance and transfer efficiency of the chip 2.

[0053] On the other hand, such asFigure 1 As shown, this utility model also provides an annealing device, including an annealing furnace 3 and the aforementioned robot 1. The robot 1 drives the transfer and lifting structure 102 to feed and unload materials into the annealing furnace 3. A linear displacement mechanism 4 is also provided at the bottom of the robot 1, and the robot 1 moves between the upstream and downstream workstations through the linear displacement mechanism 4.

[0054] Specifically, the annealing furnace 3 has a heating chamber and a cooling chamber. The heating chamber, depending on the process formulation, can be divided into a preheating chamber and a curing chamber, with different temperature gradients for the crystallization and curing of the perovskite product. The cooling chamber cools the heated perovskite product to room temperature, facilitating product transfer and subsequent processes. A robotic arm 1 is used to grasp and transfer the perovskite product. A transfer and lifting structure 102 is mounted on the robotic arm 1, and its movement enables the transfer actions. The robotic arm 1 is mounted on a linear displacement mechanism 4, such as a ground rail, increasing its stroke in the X-direction and ensuring sufficient travel space for the perovskite product during transfer between the preheating, heating, and cooling chambers. Upstream and downstream workstations are interconnected with the robotic arm 1 to facilitate the transfer of the perovskite product (i.e., chip 2) between the production line and the annealing furnace 3.

[0055] In the fabrication process of chip 2, a bottom electrode layer is first formed on a glass substrate and then laser-etched. Next, a first carrier transport layer and a perovskite absorption layer are deposited sequentially. The substrate with the deposited perovskite absorption layer is then placed in an annealing furnace 3 using ordinary inserts and the transfer and support structure 102 of this embodiment for processing. The process is set at 150°C and an annealing time of 20 minutes. The substrate is then removed from the annealing furnace 3 using ordinary inserts and the transfer and support structure 102 of this embodiment, and the surface appearance of chip 2 after annealing is observed. Observation reveals that chip 2 removed from the annealing furnace 3 using ordinary inserts has visible patches at the corresponding positions when viewed from the glass surface, while chip 2 using the transfer and support structure 102 of this embodiment has a uniform surface color and no patches.

[0056] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A transfer and lifting structure, characterized in that, include: A cross arm (1021) and end support arms (1022) located at both ends of the cross arm (1021) and at least one middle support arm (1023) located between the end support arms (1022) at both ends, wherein the end support arms (1022) and the middle support arm (1023) are arranged at intervals along the length direction of the cross arm (1021) and connected to the cross arm (1021); At least the end support arm (1022) is provided with an adsorption component, and at least the middle support arm (1023) is provided with a plurality of pins (1025) spaced apart along its length direction. The pins (1025) are used to support the substrate spaced apart from the middle support arm (1023) or the end support arm (1022).

2. The transfer and lifting structure according to claim 1, characterized in that, The adsorption assembly includes at least one suction cup module disposed on the end support arm (1022), and in the adsorption state, the adsorption plane of the suction cup module is coplanar with the top surface of the ejector pin (1025).

3. The transfer and lifting structure according to claim 2, characterized in that, The end support arm (1022) located on the outside of the adsorption assembly is also provided with a plurality of grippers (1026). The grippers (1026) are spaced apart along the length direction of the end support arm (1022), and the grippers (1026) are rotatably adjustable on the end support arm (1022). The grippers (1026) have an open state that is rotated to be offset from the substrate, and a clamping state that is rotated to be pressed on the substrate.

4. The transfer and lifting structure according to claim 3, characterized in that, The end support arm (1022) is provided with a thickness adjustment component in the area between the gripper (1026) and the suction cup module. The thickness adjustment component is disposed on the end support arm (1022). The side of the thickness adjustment component facing the gripper (1026) is the support base surface. In the adsorption state, the support base surface is coplanar with the adsorption surface of the suction cup module.

5. The transfer and lifting structure according to claim 4, characterized in that, The suction cup module includes a retractable suction cup (1024) having an extended position and a retracted position. When the suction cup (1024) is in the extended position, the top surface of the suction cup (1024) is higher than the top surface of the thickness adjustment member. When the suction cup (1024) is in the retracted position, the top surface of the suction cup (1024) is flush with the top surface of the thickness adjustment member.

6. The transfer and lifting structure according to claim 5, characterized in that, The suction cup module includes a telescopic rod and a suction cup (1024). The telescopic rod extends in a direction perpendicular to the supporting surface. One end of the telescopic rod is connected to the end support arm (1022), and the other end is connected to the suction cup (1024).

7. The transfer and lifting structure according to claim 5, characterized in that, The plurality of grippers (1026) and the plurality of suction cups (1024) are offset in the length direction of the end support arm (1022).

8. The transfer and lifting structure according to claim 1, characterized in that, The ejector pin (1025) is made of a high-molecular material that is corrosion-resistant, high-temperature resistant and has low thermal conductivity.

9. A robotic arm, characterized in that, Includes the transfer and lifting structure (102) as described in any one of claims 1 to 8.

10. An annealing apparatus, characterized in that, The system includes an annealing furnace (3) and a robotic arm (1) as described in claim 9. The robotic arm (1) drives the transfer and lifting structure (102) to load and unload materials into the annealing furnace (3). The bottom of the robotic arm (1) is also provided with a linear displacement mechanism (4), and the robotic arm (1) moves between the upstream and downstream workstations through the linear displacement mechanism (4).

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