Wafer handling device
By combining flexible grippers and a pneumatic control module, the problem of wafer breakage caused by concentrated stress during wafer handling is solved, achieving stable and safe wafer clamping, which is suitable for automated production in semiconductor manufacturing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU WINMAX TECH CORP
- Filing Date
- 2025-08-05
- Publication Date
- 2026-06-16
Smart Images
Figure CN224368281U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer handling technology, and in particular to a wafer handling device. Background Technology
[0002] In existing technologies, wafer handling typically involves using multiple vacuum suction ports on an adsorption arm to grip the back side of the wafer. This method relies on rigid supports, which can create concentrated stress on the wafer surface, posing a risk of breakage or deformation. Therefore, there is an urgent need to design a wafer handling device that can avoid creating concentrated stress on the wafer surface. Utility Model Content
[0003] One objective of this invention is to provide a wafer handling device that solves the technical problem of stress concentration caused by adsorption on the wafer surface in the prior art.
[0004] A further objective of this invention is to ensure stability and safety during the wafer clamping process.
[0005] Specifically, this utility model provides a wafer handling device, comprising:
[0006] support;
[0007] Multiple clamping assemblies are mounted on the support and extend outward toward the support, the multiple clamping members defining a clamping space for accommodating a wafer;
[0008] Each of the clamping components includes deformable jaws, a plurality of which are configured to bend toward one side of the clamping space when inflated, thereby switching from an open state to a bent state to collectively clamp the wafer; and to return to the open state after deflation to unload the wafer.
[0009] Optionally, the grippers are made of an elastic material;
[0010] Each of the grippers includes multiple air chambers located on the side of the gripper away from the clamping space and spaced apart along the extension direction of the gripper.
[0011] Optionally, the plurality of air chambers are configured to expand when the grippers are inflated to compress the inner side of the grippers, causing the grippers to bend.
[0012] Optionally, each of the clamping components further includes a pneumatic control module and an interface module. The interface module has an inflation port that connects to an external air supply device. The pneumatic control module is located between the interface module and the gripper and is used to control the air pressure inside the gripper.
[0013] Optionally, it also includes:
[0014] An identification module is installed at the bottom of the bracket and connected to the air pressure control module. The identification module is used to identify the size of the wafer.
[0015] Optionally, the identification module is installed at the center of the bracket.
[0016] Optionally, each of the clamping components further includes a pressure sensor mounted on the jaws and in contact with the wafer, for detecting the contact pressure between the jaws and the wafer.
[0017] Optionally, it also includes:
[0018] A central controller is connected to the pressure sensor and the air pressure control module, and the central controller is mounted on the bracket.
[0019] Optionally, the bracket is circular, and a plurality of the clamping components are arranged at intervals along the periphery of the bracket.
[0020] Optionally, the number of clamping components is four, and the four clamping components are evenly arranged around the periphery of the bracket.
[0021] In this invention, multiple clamping components are mounted on a support and extend outwards from the support, defining a clamping space for accommodating the wafer. Each clamping component includes deformable jaws, which are configured to bend towards one side of the clamping space during inflation, switching from an open state to a bent state to jointly clamp the wafer. After deflation, they return to the open state to unload the wafer. This technical solution achieves flexible clamping of the wafer's edge through the bending of the jaws, while the opening of the jaws unloads the wafer, avoiding concentrated stress from contact with the wafer surface and mitigating the risk of wafer breakage associated with rigid contact.
[0022] Furthermore, the central controller of this invention is connected to a pressure sensor and a pneumatic control module, and the central controller is mounted on a bracket. This means that the central controller can control the pneumatic control module to adjust the pneumatic pressure within the grippers based on the contact pressure between the grippers and the wafer detected by the pressure sensor, thus ensuring stability and safety during wafer handling.
[0023] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description
[0024] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:
[0025] Figure 1 This is a schematic structural diagram of a wafer handling device according to an embodiment of the present invention;
[0026] Figure 2 This is a schematic structural diagram of a wafer handling device according to another embodiment of the present invention;
[0027] Figure 3 This is a schematic structural diagram of a clamping assembly according to an embodiment of the present invention.
[0028] Figure label:
[0029] 100-Wafer handling device, 10-Support, 20-Clamping assembly, 21-Gripper, 211-Air chamber, 22-Interface module, 221-Inflation port, 23-Pressure sensor, 24-Air pressure control module, 30-Central controller, 40-Identification module, 50-Clamping space. Detailed Implementation
[0030] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.
[0031] In the description of this utility model, it should be understood that the terms "inner" and "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0032] In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.
[0033] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0034] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.
[0035] Figure 1 This is a schematic structural diagram of a wafer handling device 100 according to an embodiment of the present invention. Figure 2 This is a schematic structural diagram of a wafer handling device 100 according to another embodiment of the present invention. Figure 3 This is a schematic structural diagram of a clamping assembly 20 according to an embodiment of the present invention. Figures 1 to 3 As shown, in one specific embodiment, the wafer handling device 100 includes a support 10 and a plurality of clamping assemblies 20. The plurality of clamping assemblies 20 are mounted on the support 10 and extend outward from the support 10, defining a clamping space 50 for accommodating a wafer. Each clamping assembly 20 includes a deformable jaw 21, which is configured to bend toward one side of the clamping space 50 when inflated, thereby switching from an open state to a bent state to collectively clamp the wafer; and to return to the open state after deflating to unload the wafer. Here, the jaw 21 can be understood as a flexible jaw. See also Figure 1 At this time, the gripper 21 is in the open state.
[0036] This embodiment achieves flexible clamping of the wafer edge by bending the gripper 21. When the gripper 21 is released, the wafer is unloaded. This can avoid the concentrated stress caused by contact with the wafer surface and avoid the risk of wafer breakage caused by rigid contact.
[0037] In some embodiments, the grippers 21 are made of an elastic material. Each gripper 21 includes a plurality of air chambers 211 located on the side of the gripper 21 away from the gripping space 50 and spaced apart along the extending direction of the gripper 21. Here, the material of the grippers 21 is selected as an elastic material with excellent chemical inertness, corrosion resistance and cleanliness compatibility, which is suitable for semiconductor workshops.
[0038] In some embodiments, multiple air cavities 211 are configured to expand when the grippers 21 are inflated, thereby compressing the inner side of the grippers 21 and causing the grippers 21 to bend. Here, each gripper 21 is equivalent to a hollow corrugated tube structure, with the outside covered by a highly elastic material such as silicone or TPU, and the inside provided with a closed air cavity 211. The bending and opening actions of the grippers 21 are realized by adjusting the air pressure, thereby flexibly clamping the wafer edge.
[0039] In this embodiment, the gripper 21 is made of elastic material and has a pressure-controllable air chamber 211 inside. By adjusting the air pressure of the air chamber 211, the gripper 21 can be bent and deformed and opened, which has good flexibility and bonding performance with the wafer.
[0040] In some embodiments, each clamping assembly 20 further includes a pneumatic control module 24 and an interface module 22. The interface module 22 has an inflation port 221 connected to an external air supply device. The pneumatic control module 24 is located between the interface module 22 and the gripper 21 and is used to control the air pressure inside the gripper 21. This embodiment is equivalent to configuring a pneumatic control module 24 for each gripper 21. The deformation angle and clamping trajectory of the gripper 21 can be controlled by the independent pneumatic control module 24. The clamping process does not require rigid support, thus avoiding the formation of stress concentration points on the wafer surface.
[0041] In some embodiments, to facilitate the adaptation of the wafer handling device 100 to various automated production equipment and to integrate the wafer handling device 100 into different types of robotic arms, loading / unloading platforms, or track slider systems, thereby improving versatility and modularity, the interface module 22 can be used in conjunction with the robotic arm, track slider, or lifting mechanism. Furthermore, the interface module 22 has multiple pneumatic, electrical, or signal channels reserved for easy connection to the main control system. Its lightweight overall design is suitable for cantilevered and high-speed track operation scenarios.
[0042] In some embodiments, the wafer handling device 100 further includes an identification module 40, which is mounted on the bottom of the support 10 and connected to the air pressure control module 24. The identification module 40 is used to identify the size of the wafer.
[0043] In some embodiments, the identification module 40 is installed at the center of the bracket 10.
[0044] In some embodiments, each clamping assembly 20 further includes a pressure sensor 23 mounted on the gripper 21 and in contact with the wafer, for detecting the contact pressure between the gripper 21 and the wafer.
[0045] In some embodiments, the pressure sensor 23 is disposed at the end of the gripper 21 and can monitor the stress state of the wafer in real time.
[0046] In some embodiments, the wafer handling device 100 further includes a central controller 30, which is connected to a pressure sensor 23 and a pneumatic control module 24. The central controller 30 is mounted on a support 10. Here, the central controller 30 can control the pneumatic control module 24 to dynamically adjust the pressure of the air chamber 211 based on the force information fed back by the pressure sensor 23, thereby achieving dual closed-loop control of the bending deformation of the gripper 21 and the clamping pressure. This ensures that the clamping force is controllable, uniform, and trackable throughout the entire wafer handling process, effectively avoiding wafer warping, fragmentation, or contamination caused by excessive or uneven clamping force, and improving the safety, adaptability, and yield of the wafer handling process. The gripper 21 can achieve compliant fit for wafers of different sizes and shapes, such as wafers with sizes between 6 inches and 12 inches.
[0047] In some embodiments, the central controller 30 is also connected to the identification module 40 and is used to control the air pressure control module 24 to adjust the pressure of the air chamber 211 according to the wafer size identified by the identification module 40, that is, to adjust the degree of bending of the gripper 21. For example, if the wafer size is small, the degree of bending of the gripper 21 is large; if the wafer size is large, the degree of bending of the gripper 21 is small.
[0048] In some embodiments, the central controller 30 can set upper and lower limits for the clamping force to achieve dynamic protection during the clamping process. The central controller 30 can support PLC, industrial PC, or embedded platform to achieve seamless integration with existing production systems. All movements of the grippers 21 are coordinated and executed by the central controller 30, which has intelligent judgment, parameter self-adaptation, and anomaly response functions.
[0049] In some embodiments, the bracket 10 is circular, and a plurality of clamping components 20 are arranged spaced apart along the periphery of the bracket 10.
[0050] In some embodiments, the number of clamping components 20 is four, and the four clamping components 20 are evenly arranged around the periphery of the bracket 10. In other embodiments, the number of clamping components 20 can be determined according to specific design requirements, such as three, five, or six.
[0051] This embodiment employs a high-precision wafer handling device 100 based on flexible grippers 21, an identification module 40, a pneumatic control module 24, and a clamping sensing closed-loop control. The system can dynamically control the pressure of the air chambers 211 of each gripper 21 according to parameters such as the size of the wafer, avoiding over-pressure clamping or wafer detachment during the clamping process. It is particularly suitable for loading, unloading, and intermediate transfer tasks of ultra-thin, fragile, and highly clean wafers in the semiconductor manufacturing process on automated production lines.
[0052] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.
Claims
1. A wafer handling device, characterized in that, include: support; Multiple clamping assemblies are mounted on the support and extend outward toward the outside of the support, the multiple clamping assemblies defining a clamping space for accommodating a wafer; Each of the clamping components includes deformable jaws, and the plurality of jaws are configured to bend toward one side of the clamping space when inflated, thereby switching from an open state to a bent state to collectively clamp the wafer; After degassing, the wafer is returned to the open state to unload it.
2. The wafer handling device according to claim 1, characterized in that, The grippers are made of an elastic material; Each of the grippers includes multiple air chambers located on the side of the gripper away from the clamping space and spaced apart along the extension direction of the gripper.
3. The wafer handling device according to claim 2, characterized in that, The plurality of air chambers are configured to expand when the grippers are inflated to compress the inner side of the grippers, causing the grippers to bend.
4. The wafer handling device according to claim 3, characterized in that, Each of the clamping components further includes a pneumatic control module and an interface module. The interface module has an inflation port that connects to an external air supply device. The pneumatic control module is located between the interface module and the gripper and is used to control the air pressure inside the gripper.
5. The wafer handling device according to claim 4, characterized in that, Also includes: An identification module is installed at the bottom of the bracket and connected to the air pressure control module. The identification module is used to identify the size of the wafer.
6. The wafer handling apparatus according to claim 5, characterized in that, The identification module is installed at the center of the bracket.
7. The wafer handling apparatus according to claim 5, characterized in that, Each of the clamping assemblies also includes a pressure sensor mounted on the jaws and in contact with the wafer, for detecting the contact pressure between the jaws and the wafer.
8. The wafer handling apparatus according to claim 7, characterized in that, Also includes: A central controller is connected to the pressure sensor and the air pressure control module, and the central controller is mounted on the bracket.
9. The wafer handling apparatus according to any one of claims 1-8, characterized in that, The bracket is circular, and multiple clamping components are arranged at intervals along the periphery of the bracket.
10. The wafer handling apparatus according to claim 9, characterized in that, The number of clamping components is four, and the four clamping components are evenly arranged around the periphery of the bracket.