Wafer carrier table

Abstract

The utility model discloses a kind of wafer bearing tables, it is related to wafer detection technical field, wherein, wafer bearing table includes test table and multiple adsorption components, test table includes first support platform and second support platform, second support platform is located below first support platform, and it is arranged in ladder with first support platform, and the outer periphery of second support platform extends the outer periphery of first support platform, the upper surface of first support platform forms test area, and test area is used to support body;Multiple adsorption components are spaced apart and set to the outer periphery of second support platform, and adsorption component is used to adsorb wafer ring to with body flush.This utility model is adsorbed to wafer ring by adsorption component, so that wafer ring is adsorbed to with body flush, to guarantee the flatness of wafer ring and wafer, avoid the problem that probe scratches chip level and falls off in testing process.

Description

Technical Field

[0001] This utility model relates to the field of wafer inspection technology, and in particular to a wafer carrier stage. Background Technology

[0002] In traditional MEMS chip performance testing, wafer fixation typically employs a table (porous ceramic disk) vacuum adsorption method. The wafer ring itself does not absorb anything; the wafer is fixed for testing primarily by the vacuum adsorption of the area within the wafer ring using the table.

[0003] However, when using the above structure to fix the wafer, it is only effective for testing wafers whose wafer rings have not been deformed. For wafers whose wafer rings have been deformed, the wafer and wafer ring surfaces are uneven, and during the testing process, probes will frequently scratch the chip and fall off. Utility Model Content

[0004] The main purpose of this invention is to propose a wafer carrier stage, which aims to solve the problem in the prior art where wafers with deformed wafer rings frequently suffer from probe scratches and chip detachment during testing.

[0005] To achieve the above objectives, the present invention proposes a wafer carrier stage, wherein the wafer includes a body, a connecting film, and a wafer ring, the wafer ring being sleeved on the outer periphery of the body and connected to the body through the connecting film; the wafer carrier stage includes:

[0006] The test platform includes a first support platform and a second support platform. The second support platform is located below the first support platform and is stepped with the first support platform. The outer periphery of the second support platform extends beyond the outer periphery of the first support platform. The upper surface of the first support platform forms a test area, which is used to support the body.

[0007] Multiple adsorption components are spaced apart on the outer periphery of the second support platform, and the adsorption components are used to adsorb the wafer ring until it is flush with the body.

[0008] In one embodiment, each of the adsorption components includes a fixing member and a suction nozzle. The fixing member is connected to the outer periphery of the second support platform, and the suction nozzle is mounted on the fixing member and used to adsorb the wafer ring.

[0009] In one embodiment, the fixing member includes a mounting part and two connecting parts. The mounting part has a mounting hole, and the suction nozzle is installed in the mounting hole. The two connecting parts are arranged vertically at intervals on the mounting part, and the mounting part and the two connecting parts form a connecting groove. The opening of the connecting groove is opposite to the mounting part. The outer peripheral wall of the second support platform is inserted into the connecting groove and abuts against the mounting part. The outer peripheral wall of the second support platform is detachably connected to the two connecting parts.

[0010] In one embodiment, the upper connecting part is a first connecting part, and the lower connecting part is a second connecting part. The second support platform test platform includes a base layer and a support layer. The support layer is stacked with the first support platform. The support layer is supported above the base layer by a support member so that an insertion groove is formed between the base layer and the support layer. The first connecting part is inserted into the insertion groove, and the second connecting part is detachably connected to the bottom surface of the base layer.

[0011] In one embodiment, a transition slope is formed at the connection between the top of the first connecting portion and the mounting portion. The transition slope slopes upward along the groove toward the mounting portion and is used to abut against the outer peripheral wall of the support layer.

[0012] In one embodiment, a locking member is provided on the second connecting portion, the locking member being used to abut against or loosen against the bottom surface of the base layer to connect or remove the fixing member from the base layer accordingly.

[0013] In one embodiment, the thickness of the connecting groove is greater than the thickness of the first connecting part, the locking member is a screw, and each of the fixing members is provided with a screw hole that is threaded to the locking member. The height of each fixing member is adjusted by turning the corresponding locking member so that the height of each suction nozzle is aligned.

[0014] In one embodiment, each of the mounting portions has an air hole on its bottom wall, the air hole and the mounting hole are interconnected to form an air passage, the nozzle is connected to the air passage, and an external air source draws air into the nozzle through the air passage.

[0015] In one embodiment, each of the mounting parts has a transition hole on its side wall that connects to the air passage, and the transition holes on the plurality of mounting parts are connected in series by an air pipe that is connected to an external air source.

[0016] In one embodiment, the shape of the test area matches the shape of the body, and the shape of the second support platform matches the shape of the connecting membrane, so that the adsorption component is arranged corresponding to the wafer ring.

[0017] The technical solution of this utility model uses a first support platform and a second support platform to form a test platform. The test area of ​​the first support platform supports the wafer body. Then, by extending the outer periphery of the second support platform beyond the outer periphery of the first support platform, the outer periphery of the second support platform corresponds to the position of the wafer ring. An adsorption component is set on the outside of the second support platform. The wafer ring is adsorbed by the adsorption component, so that the wafer ring is adsorbed to be flush with the body, thereby ensuring the flatness of the wafer ring and the wafer and avoiding the problem of probes scratching the chip level and falling off during the test. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 An exploded view of the wafer carrier stage and wafer provided in an embodiment of this utility model;

[0020] Figure 2 A side view of the wafer carrier stage provided in an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the structure of a fastener provided in an embodiment of the present utility model;

[0022] Figure 4 A side view of the fastener provided in an embodiment of the present utility model;

[0023] Figure 5 This is a bottom view of the fastener provided in an embodiment of the present invention.

[0024] Explanation of icon numbers:

[0025] 100. Wafer carrier stage; 1. Test stage; 11. First support stage; 12. Second support stage; 121. Base layer; 122. Support layer; 123. Support component; 124. Insertion slot; 2. Adsorption assembly; 21. Fixing component; 211. Mounting part; 2111. Vent; 2112. Adapter hole; 212. Connecting part; 2121. First connecting part; 2122. Second connecting part; 213. Mounting hole; 214. Connecting groove; 215. Transition ramp; 216. Locking component; 22. Nozzle; 3. Wafer; 31. Body; 32. Connecting film; 33. Wafer ring.

[0026] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only one partial embodiment of the present utility model, and not the entire embodiment. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0028] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of each shell in a certain specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0029] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0030] When using the above structure to fix the wafer, it is effective for testing wafers with no deformation of the wafer ring. However, for wafers with deformed wafer rings, probes will frequently scratch the chip and fall off during the testing process.

[0031] Please combine Figure 1 and Figure 2To address the aforementioned issues, this invention proposes a wafer carrier stage 100. The wafer 3 includes a body 31, a connecting film 32, and a wafer ring 33. The wafer ring 33 is fitted around the outer periphery of the body 31 and connected to the body 31 through the connecting film 32. The wafer carrier stage 100 includes a test stage 1 and multiple adsorption components 2. The test stage 1 includes a first support stage 11 and a second support stage 12. The second support stage 12 is located below the first support stage 11 and is stepped with the first support stage 11. The outer periphery of the second support stage 12 extends beyond the outer periphery of the first support stage 11. The upper surface of the first support stage 11 forms a test area, which is used to support the body 31. Multiple adsorption components 2 are spaced apart around the outer periphery of the second support stage 12. The adsorption components 2 are used to adsorb the wafer ring 33 until it is flush with the body 31.

[0032] The technical solution of this utility model uses a first support platform 11 and a second support platform 12 to form a test platform 1. The test area of ​​the first support platform 11 supports the body 31 of the wafer 3. Then, by extending the outer periphery of the second support platform 12 out of the outer periphery of the first support platform 11, the outer periphery of the second support platform 12 corresponds to the position of the wafer ring 33. An adsorption component 2 is set on the outside of the second support platform 12. The wafer ring 33 is adsorbed by the adsorption component 2, so that the wafer ring 33 is adsorbed to be flush with the body 31, thereby ensuring the flatness of the wafer ring 33 and the wafer 3 and avoiding the problem of probe scratching the chip level and falling off during the test.

[0033] In one embodiment, each adsorption component 2 includes a fixing member 21 and a suction nozzle 22. The fixing member 21 is connected to the outer periphery of the second support platform 12, and the suction nozzle 22 is mounted on the fixing member 21 and used to adsorb the wafer ring 33.

[0034] The fixing component 21 installs the suction nozzle 22 on the outer periphery of the second support platform 12, which corresponds to the wafer ring 33. This enables the suction nozzle 22 to be precisely positioned with the wafer ring 33, ensuring accurate docking with the corresponding area of ​​the wafer ring 33. This avoids insufficient suction or unstable position caused by adsorption offset, thereby improving the reliability and stability of adsorption on the wafer ring 33, effectively improving the overall flatness of the wafer 3, and further reducing the risk of probe scratching the chip or chip falling off.

[0035] Please combine Figures 3 to 5 In one embodiment, the fixing member 21 includes a mounting part 211 and two connecting parts 212. The mounting part 211 has a mounting hole 213, and the suction nozzle 22 is installed in the mounting hole 213. The two connecting parts 212 are arranged vertically at intervals on the mounting part 211, and the mounting part 211 and the two connecting parts 212 form a connecting groove 214. The opening of the connecting groove 214 is opposite to the mounting part 211. The outer peripheral wall of the second support platform 12 is inserted into the connecting groove 214 and abuts against the mounting part 211. The outer peripheral wall of the second support platform 12 is detachably connected to the two connecting parts 212.

[0036] The mounting part 211 and the two connecting parts 212 form a connecting groove 214 for inserting into the outer peripheral wall of the second support platform 12. This not only enables precise installation and positioning of the nozzle 22, but also allows the fixing part 21 to be firmly locked onto the outer periphery of the second support platform 12, improving the stability of the overall structure. At the same time, the connecting part 212 and the second support platform 12 adopt a detachable connection method, which facilitates the quick replacement and maintenance of the nozzle 22 assembly. It also allows the nozzle 22 assembly to slide and adjust its position along the extension direction of the connecting groove 214, making it easy to adapt to different models of wafer rings 33.

[0037] In one embodiment, the upper connecting part 212 is the first connecting part 2121, and the lower connecting part 212 is the second connecting part 2122. The second support platform 12 test platform 1 includes a base layer 121 and a support layer 122. The support layer 122 is stacked with the first support platform 11. The support layer 122 is supported above the base layer 121 by a support member 123, so that an insertion groove 124 is formed between the base layer 121 and the support layer 122. The first connecting part 2121 is inserted into the insertion groove 124, and the second connecting part 2122 is detachably connected to the bottom surface of the base layer 121.

[0038] It should be noted that when the first connecting part 2121 is inserted into the insertion slot 124, it needs to avoid the support member 123. The first connecting part 2121 can be inserted into the insertion slot 124, and the second connecting part 2122 is connected to the bottom surface of the base layer 121. This allows the first connecting part 2121 and the second connecting part 2122 to be connected to the top and bottom surfaces of the base layer 121, respectively. This allows the mounting part 211 to be stably installed on the second support platform 12, enhancing the connection strength and positioning accuracy between the fixing member 21 and the test platform 1, and preventing the nozzle 22 from loosening or shifting during use.

[0039] In one embodiment, a transition slope 215 is formed at the connection between the top of the first connecting portion 2121 and the mounting portion 211. The transition slope 215 slopes upward along the groove toward the mounting portion 211 and is used to abut against the outer peripheral wall of the support layer 122.

[0040] By providing an upwardly inclined transition ramp 215 at the connection between the first connecting part 2121 and the mounting part 211, it can tightly abut against the outer peripheral wall of the support layer 122 during installation. This not only enhances the contact stability between the fixing member 21 and the test table 1, preventing the nozzle 22 from shifting or the adsorption effect from being unstable due to loose connection, but also provides a guiding function during assembly, facilitating the quick and accurate positioning of the fixing member 21.

[0041] In one embodiment, a locking member 216 is provided on the second connecting part 2122. The locking member 216 is used to abut against or loosen with the bottom surface of the base layer 121 to connect or remove the fixing member 21 from the base layer 121.

[0042] After the fastener 21 is inserted into the test bench 1, it can form a reliable tight connection with the base layer 121 through the locking member 216, which significantly improves the fixing strength and stability between the fastener 21 and the test bench 1, and effectively prevents the nozzle 22 from loosening or shifting due to vibration or changes in suction force during operation.

[0043] In one embodiment, the thickness of the connecting groove 214 is greater than the thickness of the first connecting part 2121, the locking member 216 is a screw, and each fixing member 21 is provided with a screw hole that is threadedly engaged with the locking member 216. The height of each fixing member 21 is adjusted by turning the corresponding locking member 216 so that the height of each suction nozzle 22 is aligned.

[0044] Using screws as locking components 216 not only ensures that each fixing component 21 can be firmly installed on the base layer 121, but also allows the insertion depth of the fixing component 21 in the connecting groove 214 to be adjusted by the screws. This precisely controls the height of each suction nozzle 22, ensuring that all suction nozzles 22 are at the same height when adsorbing the wafer ring 33. This effectively solves the problem of uneven adsorption or test interference caused by local warping or uneven support of the wafer ring 33.

[0045] In one embodiment, an air hole 2111 is provided on the bottom wall of the mounting part 211. The air hole 2111 and the mounting hole 213 are interconnected to form an air passage. The suction nozzle 22 is connected to the air passage, and an external air source draws air into the suction nozzle 22 through the air passage.

[0046] By setting an air hole 2111 on the bottom wall of the mounting part 211 and connecting it with the mounting hole 213 to form an air passage, an external air source can continuously supply air to the nozzle 22 through the air passage, thereby ensuring that the nozzle 22 has a stable and reliable adsorption capacity. This structure not only simplifies the layout of the air passage and improves the integration of the installation, but also effectively reduces the risk of leakage during the air passage connection process.

[0047] In one embodiment, each mounting part 211 has a transition hole 2112 on its side wall that connects to the air passage. The transition holes 2112 on the multiple mounting parts 211 are connected in series by an air pipe, which is connected to an external air source.

[0048] The adapter holes 2112 on multiple mounting parts 211 are connected in series through air pipes, realizing unified air supply control for multiple suction nozzles 22. This not only simplifies the structure of the overall air circuit system and reduces wiring complexity and installation costs, but also ensures that each suction nozzle 22 obtains a stable and synchronized negative pressure adsorption force, avoiding differences in adsorption intensity caused by uneven air supply. This improves the overall adsorption consistency and stability of the wafer ring 33, effectively ensuring the flatness and positioning accuracy of the wafer 3 during MEMS testing.

[0049] In one embodiment, the shape of the first support platform 11 matches the shape of the body 31 to support the body 31, and the shape of the second support platform 12 matches the shape of the connecting film 32 so that the adsorption component 2 is positioned corresponding to the wafer ring 33. The shape of the first support platform 11 matches the shape of the wafer 3 body 31, enabling it to stably support the area of ​​the body 31. At the same time, the shape of the second support platform 12 matches the shape of the connecting film 32, so that the adsorption component 2 accurately corresponds to the distribution position of the wafer ring 33. This achieves dual support and positioning for both the wafer 3 body 31 and the wafer ring 33, improving the overall stability and flatness of the wafer 3 on the test stage 1, and effectively avoiding deformation, warping, or probe mis-contact caused by the wafer ring 33 being suspended or under uneven force.

[0050] The above are merely optional embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made under the concept of this utility model using the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A wafer carrier stage, characterized in that, The wafer includes a body, a connecting film, and a wafer ring, wherein the wafer ring is sleeved around the outer periphery of the body and connected to the body through the connecting film; the wafer carrier stage includes: The test platform includes a first support platform and a second support platform. The second support platform is located below the first support platform and is stepped with the first support platform. The outer periphery of the second support platform extends beyond the outer periphery of the first support platform. The upper surface of the first support platform forms a test area, which is used to support the body. Multiple adsorption components are spaced apart on the outer periphery of the second support platform, and the adsorption components are used to adsorb the wafer ring until it is flush with the body.

2. The wafer carrier stage as described in claim 1, characterized in that, Each of the adsorption components includes a fixing member and a suction nozzle. The fixing member is connected to the outer periphery of the second support platform, and the suction nozzle is mounted on the fixing member and used to adsorb the wafer ring.

3. The wafer carrier stage as described in claim 2, characterized in that, The fastener includes a mounting part and two connecting parts. The mounting part has a mounting hole, and the suction nozzle is installed in the mounting hole. The two connecting parts are arranged vertically at intervals on the mounting part, and the mounting part and the two connecting parts form a connecting groove. The opening of the connecting groove is opposite to the mounting part. The outer peripheral wall of the second support platform is inserted into the connecting groove and abuts against the mounting part. The outer peripheral wall of the second support platform is detachably connected to the two connecting parts.

4. The wafer carrier stage as described in claim 3, characterized in that, The upper connecting part is the first connecting part, and the lower connecting part is the second connecting part. The second support platform includes a base layer and a support layer. The support layer is stacked with the first support platform. The support layer is supported above the base layer by a support member so that an insertion groove is formed between the base layer and the support layer. The first connecting part is inserted into the insertion groove, and the second connecting part is detachably connected to the bottom surface of the base layer.

5. The wafer carrier stage as described in claim 4, characterized in that, A transition slope is formed at the connection between the top of the first connecting part and the mounting part. The transition slope slopes upward along the groove towards the mounting part and is used to abut against the outer peripheral wall of the support layer.

6. The wafer carrier stage as described in claim 4, characterized in that, The second connecting part is provided with a locking member, which is used to abut against or loosen with the bottom surface of the base layer to connect or remove the fixing member from the base layer.

7. The wafer carrier stage as described in claim 6, characterized in that, The thickness of the connecting groove is greater than the thickness of the first connecting part. The locking member is a screw. Each of the fixing members is provided with a screw hole that is threaded to the locking member. The height of each fixing member is adjusted by turning the corresponding locking member so that the height of each suction nozzle is aligned.

8. The wafer carrier stage as described in any one of claims 3 to 7, characterized in that, Each of the mounting parts has an air hole on its bottom wall. The air hole and the mounting hole are interconnected to form an air passage. The nozzle is connected to the air passage, and an external air source draws air into the nozzle through the air passage.

9. The wafer carrier stage as described in claim 8, characterized in that, Each of the mounting parts has a transition hole on its side wall that connects to the air passage. The transition holes on the multiple mounting parts are connected in series by an air pipe, which is connected to an external air source.

10. The wafer carrier stage according to any one of claims 1 to 7, characterized in that, The shape of the test area matches the shape of the body, and the shape of the second support platform matches the shape of the connecting membrane, so that the adsorption component is set to correspond to the wafer ring.

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