Cavity type package structure

Abstract

The utility model provides a cavity kind of packaging structure, include: substrate, upper cover is set on the substrate upper surface with form sealed cavity with the substrate, the upper cover includes the first heat conduction part of extending to the substrate and second heat conduction part, chip is located in the cavity with set on the substrate upper surface, the first heat conduction part lower surface is connected with the chip upper surface, heat conduction member sets up in the substrate, the heat conduction member includes the third heat conduction part and fourth heat conduction part of interconnection, the third heat conduction part upper surface is connected with the chip lower surface, the fourth heat conduction part upper surface exposes to the substrate upper surface with with second heat conduction part lower surface is connected. The utility model cavity kind of packaging structure through the setting of upper cover and heat conduction member has realized to the chip double -sided direct heat dissipation, has improved the cavity kind of packaging structure heat dissipation performance greatly.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging, and in particular to a cavity-type packaging structure. Background Technology

[0002] In the field of modern electronics, with the development of various electronic products towards high performance and miniaturization, the application of high-power cavity chips is becoming increasingly widespread. The power density of high-power cavity chips can reach 50-500 W / cm². 2 During operation, these devices generate a large amount of heat, which is highly concentrated and can easily cause localized temperature rises. If this heat is not dissipated in a timely and effective manner, the chip temperature will continue to rise, severely impacting product performance, such as reduced signal transmission stability and slower processing speed. In extreme cases, it can even lead to complete product failure, which limits the mass production of cavity-type packaged products.

[0003] Currently, to address the heat dissipation challenges of high-power cavity chips, some high-end electronic products employ innovative water-cooling systems. These systems utilize internally integrated sealed circulating water channels to create a circulating heat dissipation path within the electronic product, while externally driven micro-pipeline packaging transfers heat to the outside for dissipation. However, these water-cooling systems also have significant drawbacks.

[0004] Figure 1 This is a schematic diagram of the encapsulation structure of an existing internally integrated sealed circulating water system. Please refer to [link / reference]. Figure 1 A concave top cover 100 is inverted onto a substrate 110, forming a cavity 120 with the substrate 110. A chip 130 is located within the cavity 120 and disposed on the upper surface of the substrate 110. A coolant microchannel 140 is formed within the top cover 100, and coolant is sealed within the coolant microchannel 140 for cooling the packaging structure.

[0005] Figure 1 In the packaging structure of the internally integrated sealed circulating water system shown, although the internally integrated sealed circulating water system of the product cover 100 can enhance the temperature regulation capability of the outer shell area, its heat dissipation effect is limited to the surface structure of the product and it is difficult to effectively act on key components such as the core heat-generating chip, and the overall heat dissipation efficiency is not significant.

[0006] Figure 2 This is a schematic diagram of the packaging structure of an existing micropipeline system using external drive. Please refer to [link / reference]. Figure 2A concave top cover 200 is inverted onto a substrate 210, forming a cavity 220 with the substrate 210. A chip 230 is located within the cavity 220 and disposed on the upper surface of the substrate 210. A coolant microchannel 240 is formed within the top cover 200. The coolant inlet and outlet of the coolant microchannel 240 are connected to an external driving device. The external driving device drives the coolant to continuously circulate within the coolant microchannel 240 for cooling the packaging structure. Figure 3 This is a schematic diagram of another existing packaging structure for a micropipeline system using external drive. Please refer to [link / reference]. Figure 3 A concave top cover 300 is inverted onto a substrate 310, forming a cavity 320 with the substrate 310. A chip 330 is located within the cavity 320 and disposed on the upper surface of the substrate 310. A thermally conductive medium 350 covers the surface of the chip 330. A coolant microchannel 340 is formed within the thermally conductive medium 350. The coolant inlet and outlet of the coolant microchannel 340 are connected to an external driving device. The external driving device drives the coolant to continuously circulate within the coolant microchannel 340 for cooling the packaging structure.

[0007] Figure 2 and Figure 3 In the packaging structure of the externally driven microchannel system shown, the cross-sectional area and flow length of the coolant microchannel are strictly limited due to the compact packaging specifications of electronic products. This results in a short residence time of the coolant in the coolant microchannel, and the heat exchange completed per unit time cannot meet the heat dissipation requirements of high-power devices, ultimately causing the heat conduction efficiency to be significantly lower than the theoretical expected value.

[0008] Therefore, improving the heat dissipation performance of cavity-type packaging structures has become one of the key research focuses. Summary of the Invention

[0009] The technical problem to be solved by this utility model is to provide a cavity-type packaging structure that can dissipate heat from both sides of the chip and has good heat dissipation performance.

[0010] To address the aforementioned problems, this utility model provides a cavity-type packaging structure, comprising: a substrate; a top cover disposed on the upper surface of the substrate and forming a sealed cavity with the substrate, the top cover including a first heat-conducting portion and a second heat-conducting portion extending toward the substrate; a chip located within the cavity and disposed on the upper surface of the substrate, the lower surface of the first heat-conducting portion being connected to the upper surface of the chip; and a heat-conducting member disposed within the substrate, the heat-conducting member including a third heat-conducting portion and a fourth heat-conducting portion interconnected, the upper surface of the third heat-conducting portion being connected to the lower surface of the chip, and the upper surface of the fourth heat-conducting portion being exposed on the upper surface of the substrate and connected to the lower surface of the second heat-conducting portion.

[0011] In one specific embodiment, the first heat-conducting part includes a first heat-conducting pillar, the lower surface of which is connected to the upper surface of the chip.

[0012] In one specific embodiment, the first heat-conducting part includes a plurality of first heat-conducting pillars, all of which have the same height.

[0013] In one specific embodiment, the first heat-conducting part includes a plurality of first heat-conducting pillars, at least some of which have different heights.

[0014] In one specific embodiment, the first heat-conducting part includes a plurality of first heat-conducting pillars, the upper surface of the chip is connected to the lower surface of the plurality of first heat-conducting pillars, and the plurality of first heat-conducting pillars are arranged according to a set rule.

[0015] In one specific embodiment, a thermally conductive adhesive layer is disposed on the upper surface of the chip, and the lower surface of the first thermally conductive portion is embedded in the thermally conductive adhesive layer.

[0016] In one specific embodiment, the second heat-conducting part includes a second heat-conducting pillar, and the lower surface of the second heat-conducting pillar is connected to the upper surface of the fourth heat-conducting part.

[0017] In one specific embodiment, the second heat-conducting part includes a plurality of second heat-conducting pillars, which are arranged according to a set rule.

[0018] In one specific embodiment, the upper cover includes a concave body, which is upside down on the substrate and forms the cavity with the substrate. The first heat-conducting part and the second heat-conducting part extend from the inner top surface of the body toward the substrate.

[0019] In one specific embodiment, the main body, the first heat-conducting part, and the second heat-conducting part are integrally formed.

[0020] In one specific embodiment, the upper cover includes a concave body and a heat dissipation component. The body is upside down on the substrate and forms the cavity with the substrate. The heat dissipation component includes a first heat-conducting part and a second heat-conducting part, which extend from the top surface of the body through the body into the cavity.

[0021] In one specific embodiment, the heat dissipation component further includes a heat dissipation plate, which covers the outer top surface of the main body. One end of the first heat-conducting part and the second heat-conducting part are connected to the heat dissipation plate, and the other end passes through the main body into the cavity.

[0022] In one specific embodiment, the heat sink is fixed to the outer top surface of the main body by a thermally conductive adhesive layer.

[0023] In one specific embodiment, the heat sink has spaced protrusions on the surface opposite to the main body.

[0024] In one specific embodiment, the heat sink, the first heat-conducting part, and the second heat-conducting part are integrally formed.

[0025] In one specific embodiment, the heat-conducting component further includes a heat-conducting layer disposed within the substrate, and the third heat-conducting part and the fourth heat-conducting part are connected through the heat-conducting layer.

[0026] In one specific embodiment, the third heat-conducting part includes a third heat-conducting pillar, the upper surface of which is connected to the lower surface of the chip.

[0027] In one specific embodiment, the third heat-conducting part includes a plurality of third heat-conducting pillars, all of which have the same height.

[0028] In one specific embodiment, the third heat-conducting part includes a plurality of third heat-conducting pillars, at least some of which have different heights.

[0029] In one specific embodiment, the third heat-conducting part includes a plurality of third heat-conducting pillars, and the lower surface of the same chip is connected to the upper surface of the plurality of third heat-conducting pillars.

[0030] In one specific embodiment, the upper surface of the fourth heat-conducting part is flush with the upper surface of the substrate.

[0031] In one specific embodiment, the upper surface of the fourth heat-conducting part is higher than the upper surface of the substrate.

[0032] In one specific embodiment, a thermally conductive adhesive layer is provided on the upper surface of the fourth thermally conductive part, and the lower surface of the second thermally conductive part is embedded in the thermally conductive adhesive layer.

[0033] In one specific embodiment, the fourth heat-conducting part includes a fourth heat-conducting pillar, the upper surface of which is connected to the lower surface of the second heat-conducting part.

[0034] In one specific embodiment, the chip is flip-chip or upright-chip mounted on the upper surface of the substrate.

[0035] In the cavity-type packaging structure provided by this utility model, the upper surface of the chip is connected to the third heat-conducting part of the upper cover, so that the heat of the upper surface of the chip is conducted to the upper cover through the first heat-conducting part, and heat dissipation is achieved through the upper cover. The lower surface of the chip is connected to the third heat-conducting part of the heat-conducting component, and the fourth heat-conducting part of the heat-conducting component is connected to the third heat-conducting part and to the second heat-conducting part of the upper cover, so that the heat of the lower surface of the chip is conducted to the second heat-conducting part of the upper cover through the third heat-conducting part and the fourth heat-conducting part, and heat dissipation is achieved through the upper cover. The cavity-type packaging structure of this utility model achieves direct heat dissipation from both sides of the chip through the arrangement of the upper cover and the heat-conducting component, which greatly improves the heat dissipation performance of the cavity-type packaging structure. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0037] Figure 1 This is a schematic diagram of the encapsulation structure of an existing internally integrated sealed circulating water system.

[0038] Figure 2 This is a schematic diagram of the packaging structure of an existing micropipeline system using external drive;

[0039] Figure 3 This is a schematic diagram of another existing packaging structure for a micropipeline system that uses external drive;

[0040] Figure 4 This is a schematic diagram of the first specific embodiment of the cavity-type packaging structure of this utility model;

[0041] Figure 5 This is a top view schematic diagram of the distribution of the first heat-conducting pillars in the area corresponding to the second chip in the first specific embodiment of the cavity-type packaging structure of this utility model.

[0042] Figure 6 This is a schematic diagram of the second specific embodiment of the cavity-type packaging structure of this utility model;

[0043] Figure 7 This is a schematic diagram of the third specific embodiment of the cavity-type packaging structure of this utility model;

[0044] Figure 8 This is a schematic diagram of the fourth specific embodiment of the cavity-type packaging structure of this utility model;

[0045] Figure 9 This is a schematic diagram of the fifth specific embodiment of the cavity-type packaging structure of this utility model;

[0046] Figure 10 This is a top view of the distribution of the second heat-conducting pillars on the surface of the third heat-conducting part in the sixth specific embodiment of the cavity-type packaging structure of this utility model;

[0047] Figure 11 This is a schematic diagram of the seventh specific embodiment of the cavity-type packaging structure of this utility model;

[0048] Figure 12 This is a schematic diagram of the eighth specific embodiment of the cavity-type packaging structure of this utility model;

[0049] Figure 13 This is a schematic diagram of the ninth specific embodiment of the cavity-type packaging structure of this utility model;

[0050] Figure 14 This is a schematic diagram of the tenth specific embodiment of the cavity-type packaging structure of this utility model. Detailed Implementation

[0051] The specific embodiments of the cavity-type packaging structure provided by this utility model will be described in detail below with reference to the accompanying drawings.

[0052] Figure 4 This is a schematic diagram of the first specific embodiment of the cavity-type packaging structure of this utility model. Please refer to [the diagram]. Figure 4The cavity-type packaging structure of this utility model includes: a substrate 400; a top cover 410 disposed on the upper surface of the substrate 400 and forming a sealed cavity 420 with the substrate 400, the top cover 410 including a first heat-conducting part 411 and a second heat-conducting part 412 extending toward the substrate 400; chips (e.g., a first chip 430, a second chip 431, a third chip 630 and a fourth chip 730) located in the cavity 420 and disposed on the upper surface of the substrate 400, the lower surface of the first heat-conducting part 411 being connected to the upper surface of the chip; and a heat-conducting member 440 disposed in the substrate 400, the heat-conducting member 440 including a third heat-conducting part 441 and a fourth heat-conducting part 442 connected to each other, the upper surface of the third heat-conducting part 441 being connected to the lower surface of the chip, and the upper surface of the fourth heat-conducting part 442 being exposed on the upper surface of the substrate 400 and connected to the lower surface of the second heat-conducting part 412.

[0053] In this cavity-type packaging structure, heat from the upper surface of the chip is conducted to the upper cover 410 via the first heat-conducting part 411, whereby heat dissipation is achieved. Heat from the lower surface of the chip is conducted to the second heat-conducting part 412 of the upper cover 410 via the third heat-conducting part 441 and the fourth heat-conducting part 442, whereby heat dissipation is also achieved through the upper cover 410. This cavity-type packaging structure achieves direct heat dissipation from both sides of the chip through the upper cover 410 and the heat-conducting component 440, significantly improving the heat dissipation performance of the cavity-type packaging structure.

[0054] The substrate 400 can be an existing ceramic substrate, lead frame, laminated substrate, MIS (Molded Interconnect System) plastic-encapsulated interconnect substrate, or redistribution stack layer, etc. The substrate 400 includes an upper surface and a lower surface that are relatively distributed. A circuit layer (not shown in the figures) is disposed within the substrate 400 for the transmission and distribution of electrical signals. In some embodiments, a plurality of solder balls electrically connected to the circuit layer are disposed on the lower surface of the substrate 400, providing electrical connection. In some embodiments, a plurality of solder pads electrically connected to the circuit layer are disposed on the upper surface of the substrate 400, and the chip is electrically connected to the solder pads to realize the transmission of electrical signals between the chip and the substrate 400.

[0055] The chip is located inside the cavity 420 and is mounted upside down or upright on the upper surface of the substrate 400.

[0056] In some specific embodiments, the cavity-type packaging structure of this utility model includes multiple chips, which are flip-chip or upright mounted on the upper surface of the substrate 400. For example, as... Figure 4As shown, in the first specific embodiment, the cavity-type packaging structure of this utility model includes two chips, namely a first chip 430 and a second chip 431. The first chip 430 is upright mounted on the upper surface of the substrate 400, and the second chip 431 is flip-mounted on the upper surface of the substrate 400.

[0057] The first chip 430 includes an upper surface and a lower surface disposed opposite to each other. The upper surface of the first chip 430 has a functional area (not shown in the figures), which is electrically connected to a solder pad on the upper surface of the substrate 400 via a lead 432. The lead 432 can be a gold wire, silver wire, copper wire, aluminum wire, or alloy wire, etc. The lower surface of the first chip 430 is attached to the upper surface of the substrate 400 via an adhesive layer 433, achieving both mechanical bonding and thermal conductivity. Heat from the lower surface of the first chip 430 can be conducted to the substrate 400 through the adhesive layer 433, which is beneficial for heat dissipation of the first chip 430.

[0058] The second chip 431 includes an upper surface and a lower surface disposed opposite to each other. A functional area (not shown in the figures) is provided on the lower surface of the second chip 431. This functional area is electrically connected to the circuit layer within the substrate 400 via conductive bumps 434. In this specific embodiment, an adhesive material 435 fills the gap between the second chip 431 and the substrate 400. The adhesive material 435 can be an underfill, which has excellent flowability, adhesive strength, and thermal stability, further enhancing the mechanical connection between the second chip 431 and the substrate 400. The coefficient of thermal expansion of the underfill can be optimized based on the material properties of the second chip 431 and the substrate 400 to reduce stress generated during thermal cycling and extend the service life of the package structure.

[0059] In some specific embodiments, the cavity-type packaging structure of this utility model includes one or more chips, all of which are upright mounted on the upper surface of the substrate 400. For example, Figure 6 This is a schematic diagram of the second specific embodiment of the cavity-type packaging structure of this utility model. Please refer to [the diagram]. Figure 6 In a second specific embodiment, the cavity-type packaging structure of this utility model includes a third chip 630, which is mounted upright on the upper surface of the substrate 400. Specifically, the third chip 630 includes an upper surface and a lower surface disposed opposite to each other. The upper surface of the third chip 630 is provided with a functional area (not shown in the figures), which is electrically connected to the solder pads on the upper surface of the substrate 400 via leads 632. The lower surface of the third chip 630 is attached to the upper surface of the substrate 400 via an adhesive layer 633, achieving mechanical fixation and thermal conduction connection.

[0060] In some specific embodiments, the cavity-type packaging structure of this utility model includes one or more chips, all of which are flip-chip mounted on the upper surface of the substrate 400. For example, Figure 7 This is a schematic diagram of the third specific embodiment of the cavity-type packaging structure of this utility model. Please refer to [the diagram]. Figure 7 In a third specific embodiment, the cavity-type packaging structure of this utility model includes a fourth chip 730, which is flip-chip disposed on the upper surface of the substrate 400. Specifically, the fourth chip 730 includes an upper surface and a lower surface disposed opposite to each other. The lower surface of the fourth chip 730 is provided with a functional area (not shown in the figures), which is electrically connected to the circuit layer in the substrate 400 through conductive bumps 734.

[0061] The upper cover 410 has a concave shape, is inverted and pressed onto the upper surface of the substrate 400, and forms a sealed cavity 420 with the substrate 400. This concave design not only provides ample installation space for the chip and other electronic components, but also enhances the mechanical stability and sealing of the overall structure through the tight fit between the sidewall of the upper cover 410 and the substrate 400.

[0062] In some specific implementations, such as Figure 4 As shown, the upper cover 410 includes a concave body 413 and a heat sink. The body 413 is upside down on the substrate 400 and forms the cavity 420 with the substrate 400. The heat sink includes a first heat-conducting part 411 and a second heat-conducting part 412, which penetrate from the top surface of the body 413 into the cavity 420. In one specific embodiment, the top of the body 413 has a through hole (not shown in the figure) to allow the first heat-conducting part 411 and the second heat-conducting part 412 to pass through the through hole into the cavity 420.

[0063] In one specific embodiment, the bottom sidewall of the main body 413 is fixed to the upper surface of the substrate 400 via an adhesive layer 415, thereby forming a sealed cavity 420. The adhesive layer 415 is typically made of a material with high thermal conductivity and a certain degree of elasticity, such as epoxy resin or silicone, to ensure a firm connection between the top cover 410 and the substrate 400, while also mitigating stress caused by differences in thermal expansion coefficients. The main body 413 can be a metal body, a ceramic body, a composite material body, a graphite body, etc. Different materials have different advantages and uses, meeting diverse application requirements. For example, in some specific embodiments, the main body 413 can be made of non-metallic materials, such as ceramic covers, composite material covers, graphite covers, etc., to prevent interference with the radio frequency signals emitted by the chip.

[0064] The heat sink can be a metal component to increase its heat dissipation performance. In some embodiments, the heat sink further includes a heat sink plate 414, which covers the outer top surface of the main body 413. One end of the first heat-conducting part 411 and the second heat-conducting part 412 are connected to the heat sink plate 414, and the other end passes through a through hole in the main body 413 into the cavity 420. In some embodiments, the heat sink plate 414, the first heat-conducting part 411, and the second heat-conducting part 412 are integrally formed to increase the heat conduction capacity of the heat sink.

[0065] In some embodiments, the lower surface of the heat sink 414 is in direct contact with the upper surface of the main body 413 to achieve heat conduction. In other embodiments, to improve heat conduction efficiency, the lower surface of the heat sink 414 can be connected to the upper surface of the main body 413 through a thermally conductive adhesive layer. Specifically, Figure 8 This is a schematic diagram of the fourth specific embodiment of the cavity-type packaging structure of this utility model. Please refer to [the diagram]. Figure 8 In this specific embodiment, the lower surface of the heat sink 414 is connected to the upper surface of the main body 413 via a thermally conductive adhesive layer 800. The thermally conductive adhesive layer has high thermal conductivity and can increase the heat conduction area and reduce the contact thermal resistance between the heat sink 414 and the main body 413, thereby improving the heat conduction efficiency between the heat sink 414 and the main body 413. Furthermore, the thermally conductive adhesive layer 800 can also fix the heat sink 414 to the main body 413, preventing misalignment of the heat sink 414 and forming a tight and stable heat conduction structure. The thermally conductive adhesive layer 800 is typically composed of a high thermal conductivity filler (such as metal oxides, carbon nanomaterials, metal powders, etc.) and a polymer matrix, exhibiting significantly higher thermal conductivity than ordinary adhesives. In some specific embodiments, the surface of the heat sink 414 facing away from the main body 413 has spaced protrusions 416, such as... Figure 4 As shown, the protrusion 416 increases the surface area of ​​the heat sink 414, thereby increasing the heat dissipation area and improving the heat dissipation performance of the cavity-type encapsulation structure.

[0066] This utility model's cavity-type packaging structure utilizes the combination of the upper cover 410 and the heat-conducting component 440 to achieve double-sided heat dissipation of the chip in the cavity-type packaging structure, greatly improving the heat dissipation performance of the cavity-type packaging structure. The lower surface of the first heat-conducting part 411 of the upper cover 410 is connected to the upper surface of the chip. The heat generated by the chip during operation is conducted through its upper surface to the first heat-conducting part 411, and then through the first heat-conducting part 411 to other areas of the upper cover 410, thereby achieving heat dissipation of the upper surface of the chip. The lower surface of the chip is connected to the third heat-conducting part 441 of the heat-conducting member 440. The third heat-conducting part 441 is connected to the fourth heat-conducting part 442. The upper surface of the fourth heat-conducting part 442 is connected to the lower surface of the second heat-conducting part 412. The heat generated by the chip during operation can be conducted through the lower surface of the chip to the third heat-conducting part 441, then through the third heat-conducting part 441 to the fourth heat-conducting part 442, then through the fourth heat-conducting part 442 to the second heat-conducting part 412, and then through the second heat-conducting part 412 to other areas of the upper cover 410, thereby achieving heat dissipation of the lower surface of the chip.

[0067] Specifically, such as Figure 4 As shown, the lower surface of the first heat-conducting part 411 of the upper cover 410 is connected to the upper surface of the first chip 430. The heat generated by the first chip 430 during operation is conducted to the first heat-conducting part 411 through its upper surface, and then to other areas of the upper cover 410 through the first heat-conducting part 411, thereby achieving heat dissipation of the upper surface of the first chip 430. The third heat-conducting part 441 of the heat-conducting member 440 is connected to the lower surface of the first chip 430. The upper surface of the fourth heat-conducting part 442 is exposed to the upper surface of the substrate 400. The fourth heat-conducting part 442 is connected to the third heat-conducting part 441, so that the heat of the lower surface of the first chip 430 is conducted to the fourth heat-conducting part 442 through the third heat-conducting part 441, and then to the second heat-conducting part 412 through the fourth heat-conducting part 442, and then to other areas of the upper cover 410 through the second heat-conducting part 412, thereby achieving heat dissipation of the lower surface of the first chip 430.

[0068] Within the cavity 420, the first heat-conducting portion 411 extends toward the substrate 400 and connects to the upper surface of the chip. In some specific embodiments, the first heat-conducting portion 411 includes a first heat-conducting pillar. Specifically, as... Figure 6 As shown, the first heat-conducting part 411 includes a first heat-conducting pillar, and the lower surface of the first heat-conducting pillar is connected to the upper surface of the third chip 630.

[0069] In other embodiments, the first heat-conducting portion 411 includes a plurality of first heat-conducting pillars, at least some of which have different heights. Specifically, such as Figure 4 As shown, the first heat-conducting part 411 includes a plurality of first heat-conducting pillars, some of which have different heights, while others have the same height. That is, the height of the first heat-conducting pillars in the corresponding area on the upper surface of the first chip 430 is different from the height of the first heat-conducting pillars in the corresponding area on the upper surface of the second chip 431, while the plurality of first heat-conducting pillars in the corresponding area on the upper surface of the second chip 431 have the same height. In other specific embodiments, the first heat-conducting part 411 includes a plurality of first heat-conducting pillars, all of which have the same height. For example... Figure 7 As shown, the first heat-conducting part 411 includes a plurality of first heat-conducting pillars, the plurality of first heat-conducting pillars having the same height, and the lower surface of the plurality of first heat-conducting pillars contacting the upper surface of the fourth chip 730.

[0070] In one specific embodiment, the upper surface of the chip is connected to the lower surface of one of the first thermally conductive pillars, or the upper surface of the chip is connected to the lower surfaces of multiple first thermally conductive pillars. Specifically, as... Figure 4 As shown, the upper surface of the first chip 430 is connected to the lower surface of one of the first heat-conducting pillars, and the upper surface of the second chip 431 is connected to the lower surfaces of multiple first heat-conducting pillars.

[0071] Figure 5 This is a top view of the distribution of the first heat-conducting pillars in the region corresponding to the second chip 431 in the first specific embodiment of the cavity-type packaging structure of this utility model. In this specific embodiment, a plurality of the first heat-conducting pillars 511 are arranged according to a set rule. For example, a plurality of the first heat-conducting pillars 511 are arranged in an array, that is, a plurality of the first heat-conducting pillars 511 are arranged in an array along the length and width directions of the upper surface of the second chip 431, with the boundary of the upper surface of the second chip 431 as the boundary, so as to increase the contact area between the upper surface of the second chip 431 and the first heat-conducting part 411 and improve the heat dissipation efficiency.

[0072] In some embodiments, the upper surface of the chip directly contacts the lower surface of the first thermally conductive part 411 to achieve heat conduction. In other embodiments, to improve heat conduction efficiency, the upper surface of the chip can be connected to the lower surface of the first thermally conductive part 411 through a thermally conductive adhesive layer. Specifically, Figure 9 This is a schematic diagram of the fifth specific embodiment of the cavity-type packaging structure of this utility model. Please refer to [the diagram]. Figure 9In this specific embodiment, a thermally conductive adhesive layer 810 is disposed on the upper surface of the chip, and the lower surface of the first thermally conductive part 411 is embedded in the thermally conductive adhesive layer 810. The upper surfaces of the first chip 430 and the second chip 431 are connected to the lower surface of the first thermally conductive part 411 through the thermally conductive adhesive layer 810. The thermally conductive adhesive layer 810 has a high thermal conductivity and can increase the heat conduction area and reduce the contact thermal resistance between the first chip 430 and the second chip 431 and the first thermally conductive part 411, thereby improving the heat conduction efficiency between the first chip 430 and the second chip 431 and the first thermally conductive part 411. Furthermore, the thermally conductive adhesive layer 810 can also fix the first chip 430 and the second chip 431 to the first thermally conductive part 411, preventing the first thermally conductive part 411 from being misaligned, and forming a tight and stable heat conduction structure. The thermally conductive adhesive layer 810 is typically composed of a high thermal conductivity filler (such as metal oxides, carbon nanomaterials, metal powders, etc.) and a polymer matrix, and has significantly higher thermal conductivity than ordinary adhesives.

[0073] Within the cavity 420, the second heat-conducting portion 412 extends toward the substrate 400 and connects to the fourth heat-conducting portion 442. In some specific embodiments, the second heat-conducting portion 412 includes a second heat-conducting pillar, the lower surface of which is connected to the upper surface of the fourth heat-conducting portion 442. Specifically, as... Figure 4 As shown, the second heat-conducting part 412 includes a second heat-conducting pillar, and the lower surface of the second heat-conducting pillar is connected to the upper surface of the fourth heat-conducting part 442. Figure 10 This is a top view schematic diagram of the distribution of the second heat-conducting pillars on the surface of the third heat-conducting part 441 in the sixth specific embodiment of the cavity-type packaging structure of this utility model. Please refer to [link / reference]. Figure 10 In this specific embodiment, the second heat-conducting portion 412 includes a plurality of second heat-conducting pillars 512, which are arranged according to a predetermined rule. For example, the plurality of second heat-conducting pillars 512 are arranged along the extending direction of the fourth heat-conducting portion 442 on the surface of the substrate 400 (e.g., Figure 10 Arranged sequentially at intervals along the Y direction (in the middle).

[0074] In some embodiments, the lower surface of the second heat-conducting part 412 directly contacts the upper surface of the fourth heat-conducting part 442 to achieve heat conduction. In other embodiments, to improve heat conduction efficiency, a thermally conductive adhesive layer can be used to connect the lower surface of the second heat-conducting part 412 to the upper surface of the fourth heat-conducting part 442. Specifically, Figure 11 This is a schematic diagram of the seventh specific embodiment of the cavity-type packaging structure of this utility model. Please refer to it. Figure 11A thermally conductive adhesive layer 820 is provided on the upper surface of the fourth thermally conductive part 442, and the lower surface of the second thermally conductive part 412 is embedded in the thermally conductive adhesive layer 820. The lower surface of the second thermally conductive part 412 and the upper surface of the fourth thermally conductive part 442 are connected by the thermally conductive adhesive layer 820. The thermally conductive adhesive layer 820 has a high thermal conductivity, and can increase the heat conduction area and reduce the contact thermal resistance between the second thermally conductive part 412 and the fourth thermally conductive part 442, thereby improving the heat conduction efficiency between the second thermally conductive part 412 and the fourth thermally conductive part 442. Furthermore, the thermally conductive adhesive layer 820 can also fix the second thermally conductive part 412 and the fourth thermally conductive part 442, preventing the second thermally conductive part 412 from being misaligned, forming a tight and stable heat conduction structure.

[0075] The thermally conductive component 440 is used to conduct heat from the lower surface of the chip. In some specific embodiments, the thermally conductive component 440 may be a metal component to improve heat conduction efficiency. The thermally conductive component 440 includes a third thermally conductive part 441 and a fourth thermally conductive part 442. The upper surface of the third thermally conductive part 441 is connected to the lower surface of the chip, and the upper surface of the fourth thermally conductive part 442 is exposed to the upper surface of the substrate 400. The fourth thermally conductive part 442 is connected to the third thermally conductive part 441, so that the heat from the lower surface of the chip is conducted through the third thermally conductive part 441 to the fourth thermally conductive part 442, and then through the fourth thermally conductive part 442 to the second thermally conductive part 412 of the upper cover 410, thereby realizing the conduction of heat from the lower surface of the chip.

[0076] In some specific embodiments, the thermally conductive component 440 further includes a thermally conductive layer 443 disposed within the substrate 400. The third thermally conductive portion 441 and the fourth thermally conductive portion 442 are connected through the thermally conductive layer 443. Heat from the lower surface of the chip is conducted through the third thermally conductive portion 441 to the thermally conductive layer 443, and then to the fourth thermally conductive portion 442. In one specific embodiment, the thermally conductive layer 443 is a flat plate layer disposed within the substrate 400. The thermally conductive layer 443 extends within the substrate 400 and connects the third thermally conductive portion 441 and the fourth thermally conductive portion 442.

[0077] The position of the heat-conducting layer 443 can be set according to the structure of the substrate 400 to avoid the heat-conducting layer 443 affecting the arrangement of the conventional structure of the substrate 400. For example, see Figure 4 , Figure 6 and Figure 7As shown, the thermal conductive layer 443 is a flat plate layer disposed in the substrate 400. The thermal conductive layer 443 extends in the substrate 400 and connects the bottom of the third thermal conductive part 441 and the bottom of the fourth thermal conductive part 442 to avoid the circuit layer and other structures in the substrate 400. Figure 12 This is a schematic diagram of the eighth specific embodiment of the cavity-type packaging structure of this utility model. Please refer to it. Figure 12 In the eighth embodiment, the thermally conductive layer 443 is a flat plate layer disposed in the substrate 400. The thermally conductive layer 443 extends in the substrate 400 and connects the middle part of the third thermally conductive part 441 and the middle part of the fourth thermally conductive part 442 to avoid the circuit layer and other structures in the substrate 400.

[0078] The third heat-conducting part 441 is disposed within the substrate 400, wherein all or part of the upper surface of the third heat-conducting part 441 is higher than the upper surface of the substrate 400, or all of the upper surface of the third heat-conducting part 441 is flush with the upper surface of the substrate 400. Since the upper surface of the third heat-conducting part 441 needs to be connected to the lower surface of the chip to conduct heat from the lower surface of the chip, the positional relationship between the upper surface of the third heat-conducting part 441 and the upper surface of the substrate 400 can be determined based on the distance between the lower surface of the chip and the upper surface of the substrate 400. If the chip is mounted upright on the upper surface of the substrate 400, and the distance between the lower surface of the chip and the upper surface of the substrate 400 is small, then the entire area of ​​the upper surface of the third heat-conducting part 441 corresponding to the chip can be set to be flush with the upper surface of the substrate 400, or the entire area of ​​the upper surface of the third heat-conducting part 441 corresponding to the chip can be set to be slightly higher than the upper surface of the substrate 400. If the chip is mounted flip-chip on the upper surface of the substrate 400, and the distance between the lower surface of the chip and the upper surface of the substrate 400 is large, then the entire area of ​​the upper surface of the third heat-conducting part 441 corresponding to the chip can be set to be higher than the upper surface of the substrate 400.

[0079] Specifically, such as Figure 4 As shown, the cavity-type packaging structure includes two chips. The first chip 430 is mounted upright on the upper surface of the substrate 400. The entire area of ​​the upper surface of the third heat-conducting part 441 corresponding to the first chip 430 is flush with the upper surface of the substrate 400. The upper surface of the third heat-conducting part 441 is connected to the lower surface of the first chip 430 through an adhesive layer 433. The second chip 431 is flip-chip mounted on the upper surface of the substrate 400. The entire area of ​​the upper surface of the third heat-conducting part 441 corresponding to the second chip 431 is higher than the upper surface of the substrate 400 and in contact with the lower surface of the second chip 431. Figure 6As shown, the third chip 630 is mounted upright on the upper surface of the substrate 400, and the entire area of ​​the upper surface of the third heat-conducting part 441 is slightly higher than the upper surface of the substrate 400 and directly contacts the lower surface of the third chip 630.

[0080] In some specific embodiments, the third heat-conducting part 441 includes a third heat-conducting pillar to increase the connection area between the upper surface of the third heat-conducting part 441 and the lower surface of the chip, thereby improving heat dissipation performance. Specifically, as... Figure 6 As shown, the third heat-conducting part 441 includes a third heat-conducting pillar, the upper surface of which is in contact with the lower surface of the third chip 630.

[0081] In other embodiments, the third heat-conducting portion 441 includes a plurality of third heat-conducting pillars, at least some of which have different heights, or all of which have the same height, to avoid conventional components on the chip and the substrate 400. Specifically, as Figure 4 As shown, the third heat-conducting part 441 includes a plurality of third heat-conducting pillars. Some of the third heat-conducting pillars have different heights; that is, the height of the third heat-conducting pillars in the corresponding area of ​​the lower surface of the first chip 430 is different from the height of the third heat-conducting pillars in the corresponding area of ​​the lower surface of the second chip 431. The plurality of third heat-conducting pillars in the corresponding area of ​​the lower surface of the first chip 430 have the same height, and the plurality of third heat-conducting pillars in the corresponding area of ​​the lower surface of the second chip 431 have the same height. Figure 7 As shown, the third heat-conducting part 441 includes a plurality of third heat-conducting pillars, the plurality of third heat-conducting pillars having the same height, and the plurality of third heat-conducting pillars passing through the gap of the conductive bump 734 and contacting the lower surface of the fourth chip 730.

[0082] In one specific embodiment, the lower surface of the same chip can be connected to the upper surfaces of multiple third heat-conducting pillars, or it can be connected to the upper surface of one third heat-conducting pillar. Specifically, as shown below... Figure 4 As shown, the lower surface of the first chip 430 is connected to the upper surface of the plurality of third heat-conducting pillars, and the lower surface of the second chip 431 is connected to the upper surface of the plurality of third heat-conducting pillars. Figure 6 As shown, the lower surface of the third chip 630 is connected to the upper surface of a third heat-conducting pillar.

[0083] The fourth heat-conducting part 442 is connected to the third heat-conducting part 441 and is used to conduct the heat of the third heat-conducting part 441 to the second heat-conducting part 412. The upper surface of the fourth heat-conducting part 442 is located outside the area of ​​the substrate 400 covered by the chip, so as to facilitate connection with the second heat-conducting part 412. That is, the upper surface of the fourth heat-conducting part 442 is not covered by the chip.

[0084] In some specific embodiments, the upper surface of the fourth heat-conducting part 442 is flush with the upper surface of the substrate 400, or the upper surface of the fourth heat-conducting part 442 is higher than the upper surface of the substrate 400. Specifically, such as Figure 4 As shown, the upper surface of the fourth heat-conducting part 442 is flush with the upper surface of the substrate 400. Figure 13 This is a schematic diagram of the ninth specific embodiment of the cavity-type packaging structure of this utility model. Please refer to it. Figure 13 In the ninth specific embodiment, the upper surface of the fourth heat-conducting part 442 is higher than the upper surface of the substrate 400, so as to raise the upper surface of the fourth heat-conducting part 442 and facilitate the connection between the fourth heat-conducting part 442 and the second heat-conducting part 412.

[0085] In some specific embodiments, the lower surface of the second heat-conducting part 412 is in direct contact with the upper surface of the fourth heat-conducting part 442 to achieve heat conduction, such as... Figure 4 As shown, in some other embodiments, to improve heat conduction efficiency, the lower surface of the second heat-conducting part 412 can be connected to the upper surface of the fourth heat-conducting part 442 via a thermally conductive adhesive layer 820, such as... Figure 11 As shown.

[0086] In some specific embodiments, the fourth heat-conducting part 442 includes a fourth heat-conducting pillar, the upper surface of which is connected to the lower surface of the second heat-conducting part 412. For example... Figure 4 As shown, the fourth heat-conducting part 442 includes a fourth heat-conducting pillar, the upper surface of which is connected to the lower surface of the second heat-conducting part 412. In some other embodiments, the fourth heat-conducting part 442 may also include multiple fourth heat-conducting pillars, the upper surfaces of which are all connected to the lower surface of the second heat-conducting part 412.

[0087] In some specific implementations, such as Figure 4 As shown, the upper cover 410 is composed of an independently disposed main body 413 and a heat dissipation component. The first heat-conducting part 411 and the second heat-conducting part 412 extend from the top surface of the main body 413 through the main body 413 into the cavity 420. In other specific embodiments, the upper cover 410 is composed of a concave main body 413 and the first heat-conducting part 411 and the second heat-conducting part 412 disposed on the inner top surface of the main body 413. Specifically, Figure 14 This is a schematic diagram of the tenth specific embodiment of the cavity-type packaging structure of this utility model. Please refer to [the diagram]. Figure 14In a tenth embodiment, the upper cover 410 includes a concave body 413, which is upside down onto the substrate 400 and forms the cavity 420 with the substrate 400. The first heat-conducting part 411 and the second heat-conducting part 412 extend from the inner top surface of the body 413 toward the substrate 400. The bottom of the sidewall of the body 413 is fixed to the upper surface of the substrate 400 by an adhesive layer 415, thereby forming a sealed cavity 420. In one embodiment, the upper cover 410 may be a metal component to increase the heat dissipation performance of the upper cover 410. In one embodiment, the body 413, the first heat-conducting part 411, and the second heat-conducting part 412 are integrally formed to increase the thermal conductivity of the upper cover 410.

[0088] This utility model's cavity-type packaging structure achieves direct heat dissipation from both sides of the chip through the arrangement of the top cover and heat-conducting components, greatly improving the heat dissipation performance of the cavity-type packaging structure. It should be noted that the terms "comprising" and "having," and their variations, used in this utility model document are intended to cover non-exclusive inclusion. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, unless the context explicitly indicates otherwise; it should be understood that such data used in this way can be interchanged where appropriate. The term "one or more," at least in part depending on the context, can be used to describe features, structures, or characteristics in a singular sense, or in a plural sense, to describe combinations of features, structures, or characteristics. The term "based on" can be understood as not necessarily intended to express an exclusive set of factors, but can instead, at least in part depending on the context, allow for the presence of other factors that are not necessarily explicitly described. Furthermore, embodiments and features in embodiments of this utility model can be combined with each other without conflict. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this utility model. In the above embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.

[0089] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A cavity-like encapsulation structure, characterized in that, include: substrate; A top cover is disposed on the upper surface of the substrate and forms a sealed cavity with the substrate. The top cover includes a first heat-conducting part and a second heat-conducting part extending toward the substrate. The chip is located inside the cavity and disposed on the upper surface of the substrate, and the lower surface of the first heat-conducting part is connected to the upper surface of the chip. A thermally conductive component is disposed within the substrate. The thermally conductive component includes a third thermally conductive part and a fourth thermally conductive part that are connected to each other. The upper surface of the third thermally conductive part is connected to the lower surface of the chip, and the upper surface of the fourth thermally conductive part is exposed on the upper surface of the substrate and connected to the lower surface of the second thermally conductive part.

2. The cavity-type encapsulation structure according to claim 1, characterized in that, The first heat-conducting part includes a first heat-conducting pillar, and the lower surface of the first heat-conducting pillar is connected to the upper surface of the chip.

3. The cavity-type encapsulation structure according to claim 2, characterized in that, The first heat-conducting part includes a plurality of first heat-conducting pillars, all of which have the same height.

4. The cavity-type encapsulation structure according to claim 2, characterized in that, The first heat-conducting part includes a plurality of first heat-conducting pillars, at least some of which have different heights.

5. The cavity-type encapsulation structure according to claim 2, characterized in that, The first heat-conducting part includes a plurality of first heat-conducting pillars, the upper surface of the chip is connected to the lower surface of the plurality of first heat-conducting pillars, and the plurality of first heat-conducting pillars are arranged according to a set rule.

6. The cavity-type encapsulation structure according to claim 1, characterized in that, A thermally conductive adhesive layer is provided on the upper surface of the chip, and the lower surface of the first thermally conductive part is embedded in the thermally conductive adhesive layer.

7. The cavity-type encapsulation structure according to claim 1, characterized in that, The second heat-conducting part includes a second heat-conducting pillar, and the lower surface of the second heat-conducting pillar is connected to the upper surface of the fourth heat-conducting part.

8. The cavity-type encapsulation structure according to claim 7, characterized in that, The second heat-conducting part includes a plurality of second heat-conducting pillars, which are arranged according to a set rule.

9. The cavity-type encapsulation structure according to claim 1, characterized in that, The top cover includes a concave body, which is upside down on the substrate and forms the cavity with the substrate. The first heat-conducting part and the second heat-conducting part extend from the inner top surface of the body toward the substrate.

10. The cavity-type encapsulation structure according to claim 9, characterized in that, The main body, the first heat-conducting part, and the second heat-conducting part are integrally formed.

11. The cavity-type encapsulation structure according to claim 1, characterized in that, The top cover includes a concave body and a heat dissipation component. The body is upside down on the substrate and forms the cavity with the substrate. The heat dissipation component includes a first heat-conducting part and a second heat-conducting part, which penetrate from the top surface of the body into the cavity.

12. The cavity-type encapsulation structure according to claim 11, characterized in that, The heat dissipation component also includes a heat dissipation plate, which covers the outer top surface of the main body. One end of the first heat-conducting part and the second heat-conducting part are connected to the heat dissipation plate, and the other end passes through the main body into the cavity.

13. The cavity-type encapsulation structure according to claim 12, characterized in that, The heat sink is fixed to the outer top surface of the main body by a thermally conductive adhesive layer.

14. The cavity-type encapsulation structure according to claim 12, characterized in that, The heat sink has spaced protrusions on the surface opposite to the main body.

15. The cavity-type encapsulation structure according to claim 12, characterized in that, The heat sink, the first heat-conducting part, and the second heat-conducting part are integrally formed.

16. The cavity-type encapsulation structure according to claim 1, characterized in that, The thermally conductive component further includes a thermally conductive layer disposed within the substrate, and the third thermally conductive part and the fourth thermally conductive part are connected through the thermally conductive layer.

17. The cavity-type encapsulation structure according to claim 1, characterized in that, The third heat-conducting part includes a third heat-conducting pillar, the upper surface of which is connected to the lower surface of the chip.

18. The cavity-type encapsulation structure according to claim 17, characterized in that, The third heat-conducting part includes a plurality of third heat-conducting pillars, all of which have the same height.

19. The cavity-type encapsulation structure according to claim 17, characterized in that, The third heat-conducting part includes a plurality of third heat-conducting pillars, at least some of which have different heights.

20. The cavity-type encapsulation structure according to claim 17, characterized in that, The third heat-conducting part includes a plurality of third heat-conducting pillars, and the lower surface of the same chip is connected to the upper surface of the plurality of third heat-conducting pillars.

21. The cavity-type encapsulation structure according to claim 1, characterized in that, The upper surface of the fourth heat-conducting part is flush with the upper surface of the substrate.

22. The cavity-type encapsulation structure according to claim 1, characterized in that, The upper surface of the fourth heat-conducting part is higher than the upper surface of the substrate.

23. The cavity-type encapsulation structure according to claim 1, characterized in that, The upper surface of the fourth heat-conducting part is provided with a heat-conducting adhesive layer, and the lower surface of the second heat-conducting part is embedded in the heat-conducting adhesive layer.

24. The cavity-type encapsulation structure according to claim 1, characterized in that, The fourth heat-conducting part includes a fourth heat-conducting pillar, the upper surface of which is connected to the lower surface of the second heat-conducting part.

25. The cavity-type encapsulation structure according to claim 1, characterized in that, The chip is mounted flip-flop or upright on the upper surface of the substrate.

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