A push-pull type suction cup structure for production of egg tart crust

CN224368915UActive Publication Date: 2026-06-19FOSHAN WEITA INTELLIGENT EQUIPMENT CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
FOSHAN WEITA INTELLIGENT EQUIPMENT CO LTD
Filing Date
2025-07-10
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

When the egg tart crust is moved up the mold head, it is easy to stick to the mold head, causing it to come out of the pressing mold and affecting production efficiency.

Method used

It adopts a push-pull suction cup structure, which uses a negative pressure adsorption mechanism to adsorb and press the carrier inside the mold when the mold head moves up, preventing the dough and carrier from moving up with the mold head.

Benefits of technology

This effectively prevents the dough and carrier from detaching from the pressing mold when the mold head moves up, thus improving the efficiency and success rate of egg tart crust production.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224368915U_ABST
    Figure CN224368915U_ABST
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Abstract

This utility model discloses a push-pull suction cup structure for egg tart crust production, belonging to the technical field of egg tart crust production equipment. The machine platform has a tabletop on its top surface, a support frame on the tabletop, and a lower mounting plate below the tabletop. A pressing and forming mechanism is mounted on the support frame, and the pressing and forming mechanism has a die head that moves up and down reciprocally. A turntable mechanism is mounted on the tabletop, and the turntable mechanism has multiple pressing molds. The pressing molds are used to hold the carrier and dough. The turntable mechanism rotates intermittently so that each pressing mold moves in turn to the underside of the pressing and forming mechanism, where the die head presses the dough within the pressing mold. An adsorption mechanism is located between the tabletop and the lower mounting plate. The adsorption mechanism is used to apply negative pressure to the carrier within the pressing mold after the die head has pressed the dough. This utility model, by setting up an adsorption mechanism, can effectively prevent the dough and carrier from moving up with the die head and detaching from the pressing mold.
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