A rapid packaging device for microfluidic chip
By combining laser emitter-assisted local heating with heating plate heating, the problem of long packaging time in traditional microfluidic chip packaging devices is solved, achieving rapid packaging and efficient curing, thus improving packaging efficiency.
CN224371501UActive Publication Date: 2026-06-19山东凡知智造医药科技有限公司
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 山东凡知智造医药科技有限公司
- Filing Date
- 2025-07-21
- Publication Date
- 2026-06-19
AI Technical Summary
Technical Problem
Traditional rapid packaging devices for microfluidic chips take a long time to heat and cure, making it impossible to quickly perform the next packaging operation, resulting in low packaging efficiency.
Method used
A combination of laser emitter-assisted local heating and heating at the connection between the heating plate and the substrate and cover plate is used, along with pressure sensor detection and control board control of servo motor operation, to achieve selective and rapid bonding and heating curing.
Benefits of technology
It significantly shortens the curing time, improves packaging efficiency, and facilitates the rapid execution of the next chip packaging operation.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 1 Figure 2
Abstract
The utility model relates to chip processing technical field, and disclose a kind of quick packaging device of microfluidic chip, including base, the top of base is fixedly installed with vertical board, the top of vertical board is fixedly installed with top plate.The utility model is by starting cylinder, makes suction disc to drive cover plate and substrate contact, laser emitter emits laser auxiliary local solidification at substrate and cover plate junction, utilize laser focusing energy local heating material, realize selective quick adhesion, compared with traditional quick packaging device of microfluidic chip, the quick packaging device of this microfluidic chip is positioned to substrate and cover plate by groove, pressure sensor detects the pressure of cover plate and substrate, prevent cover plate damage caused by excessive pressure, by control board control servo motor one and laser emitter operation, make laser emitter carry out local heating solidification at the junction of substrate and cover plate, to reduce solidification time, it is convenient to carry out the next chip's packaging operation quickly.
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