A welding device for switching power supply chip processing

Abstract

This utility model belongs to the field of welding equipment, specifically relating to a welding device for processing switching power supply chips. It includes a base, with a pad adhered to the upper end of the base. A clamping mechanism is provided on the base. A side plate is fixedly connected to the upper end of the base, and a cleaning mechanism is provided on the side plate. A bracket is fixedly connected to the upper end of the base, and a cylinder is fixedly mounted in the middle of the upper end of the bracket. The cylinder rod passes through the bracket and is slidably connected to it. A welding machine is provided at the end of the cylinder rod. This utility model utilizes the spiral motion of rotating the pressure ring and stud to cause a spring to elastically press down the slide plate. Furthermore, by rotating the adjusting rod and the slide block to perform spiral motion, the position of the slide block within the guide seat is adjusted. This allows the device to conveniently clamp and limit chips of different aspect ratios and sizes, preventing chip displacement during the welding process.

Description

Technical Field

[0001] This utility model relates to the field of welding equipment technology, specifically a welding device for processing switching power supply chips. Background Technology

[0002] Utility model patent CN221435243U discloses a chip welding device, relating to the field of electronic processing technology. The device includes a table, with a pad and a rotating seat fixedly connected to the outer surface of the table. A cover plate is rotatably connected to the outer surface of the rotating seat, and a load-bearing frame is fixedly connected to the outer surface of the cover plate. A mounting frame is fixedly connected to the outer surface of the load-bearing frame, and a shifting mechanism is provided above the table. This utility model has a reasonable design structure, enabling efficient coordination between the load-bearing frame, motor, drive wheel, pressing mechanism, and shifting mechanism. The load-bearing frame provides support for the mounting frame and motor, the motor drives the drive wheel to rotate, the pressing mechanism fixes the chip to the electronic substrate, and the shifting mechanism controls the position of the electronic substrate. This frees up the operator's hands, allowing for more flexible welding, thus solving the problem of manual application of solder paste and drying processes requiring only one hand, which leads to inconvenience and reduces welding time.

[0003] However, the device has certain shortcomings in use. It is not convenient to adjust the clamping of chips with different aspect ratios. At the same time, dust on the chip surface can affect the soldering quality of the chip. Utility Model Content

[0004] The purpose of this invention is to provide a welding device for processing switching power supply chips, which solves the problems of the device being inconvenient to adjust for limiting and clamping chips with different aspect ratios, and the dust on the chip surface affecting the welding quality of the chips.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a welding device for processing switching power supply chips, comprising a base, a pad adhered to the upper end of the base, a clamping mechanism provided on the base, a side plate fixedly connected to the upper end of the base, a cleaning mechanism provided on the side plate, a bracket fixedly connected to the upper end of the base, a cylinder fixedly installed in the middle of the upper end of the bracket, the cylinder rod of the cylinder passing through the bracket and slidably connected to the bracket, and a welding machine provided at the end of the cylinder rod.

[0006] Preferably, the clamping mechanism includes a stud, a stud fixedly connected to the lower end of the base, a slide plate slidably connected to the outer side of the stud, a pressure ring threadedly connected to the outer side of the stud, a spring disposed on the outer side of the stud, a guide seat fixedly connected to the upper end of the slide plate, a slide block slidably connected inside the guide seat, an adjusting rod mounted inside the guide seat via a bearing, the adjusting rod and the slide block being threadedly connected, a connecting rod hinged inside the slide block, a slide rod hinged to the upper end of the connecting rod, the slide rod being slidably connected to the base, and a clamping block fixedly connected to the upper end of the slide rod. By rotating the pressure ring and stud to perform threaded movement, the spring elastically presses down on the slide plate, and by rotating the adjusting rod and the slide block to perform threaded movement, the position of the slide block within the guide seat is adjusted, thereby allowing the device to conveniently clamp and limit chips of different aspect ratios and sizes, preventing chip displacement during the soldering process.

[0007] Preferably, one end of the spring is fixedly connected to the pressure ring, and the other end of the spring contacts the slide. By setting the spring, the slide is elastically pressed down.

[0008] Preferably, a protrusion is fixedly connected to the lower end of the clamping block, and the protrusion is slidably connected to the base. By providing the protrusion, the friction between the clamping block and the base is reduced.

[0009] Preferably, the cleaning mechanism includes a motor. The motor is fixedly mounted on the right end of the side plate. The output end of the motor passes through the side plate and is rotatably connected to it. A lead screw is fixedly connected to the end of the motor's output end. The lead screw is rotatably connected to the side plate. A sliding plate is threadedly connected to the outer side of the lead screw. A guide rod is fixedly connected to the surface of the side plate. The guide rod is slidably connected to the sliding plate. A screw is mounted inside the sliding plate via a bearing. A threaded tube is threadedly connected to the outer side of the screw. A sliding tube is slidably connected to the outer side of the threaded tube. A cleaning plate is fixedly connected to the lower end of the sliding tube. A compression spring is installed inside the sliding tube. The motor drives the lead screw to rotate and the sliding plate to perform threaded movement, thereby moving the sliding plate. This causes the wet sponge strip on the cleaning plate to move and brush the surface of the chip, making it easier to remove dust from the chip and preventing dust from affecting the chip's soldering quality.

[0010] Preferably, one end of the compression spring is fixedly connected to the solenoid, and the other end of the compression spring is fixedly connected to the cleaning plate. By setting the compression spring, the cleaning plate is elastically pressed down.

[0011] Preferably, a hanger rod is fixedly connected to the upper end of the cleaning plate, and the hanger rod is slidably connected to the sliding plate. The hanger rod guides the movement of the cleaning plate.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] 1. This utility model uses the rotating pressure ring and stud to make threaded movement, which causes the spring to elastically press down the slide. By rotating the adjusting rod and the slide to make threaded movement, the position of the slide in the guide seat is adjusted, so that the device can easily clamp and limit chips with different aspect ratios and sizes, and avoid chip displacement during the welding process.

[0014] 2. This utility model uses a motor to drive a lead screw to rotate and a sliding plate to make a spiral motion, which in turn moves the sliding plate and causes the wet sponge strip on the cleaning plate to move and brush the surface of the chip, making it easier to remove dust from the chip and preventing dust from affecting the soldering quality of the chip. Attached Figure Description

[0015] Figure 1 This is a perspective view of the overall structure of this utility model;

[0016] Figure 2 This utility model Figure 1 A three-dimensional view of the local structure;

[0017] Figure 3 This utility model Figure 2 A partial structural bottom view;

[0018] Figure 4 This utility model Figure 1 A 3D model of a skateboard.

[0019] In the diagram: 1. Base; 2. Pad; 3. Clamping mechanism; 4. Side plate; 5. Cleaning mechanism; 6. Bracket; 7. Cylinder; 8. Welding machine; 31. Stud; 32. Slide plate; 33. Pressure ring; 34. Spring; 35. Guide seat; 36. Slide seat; 37. Adjusting rod; 38. Connecting rod; 39. Slide rod; 310. Clamping block; 311. Protrusion; 51. Motor; 52. Lead screw; 53. Slide plate; 54. Guide rod; 55. Screw; 56. Screw tube; 57. Slide tube; 58. Cleaning plate; 59. Compression spring; 510. Hanging rod. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1A welding device for processing switching power supply chips includes a base 1, a pad 2 bonded to the upper end of the base 1, a clamping mechanism 3 provided on the base 1, a side plate 4 fixedly connected to the upper end of the base 1, a cleaning mechanism 5 provided on the side plate 4, a bracket 6 fixedly connected to the upper end of the base 1, a cylinder 7 fixedly installed in the middle of the upper end of the bracket 6, the cylinder rod of the cylinder 7 passing through the bracket 6 and slidably connected to the bracket 6, and a welding machine 8 provided at the end of the cylinder rod of the cylinder 7.

[0022] Please see Figures 1-3 The clamping mechanism 3 includes a stud 31. The lower end of the base 1 is fixedly connected to the stud 31. A slide plate 32 is slidably connected to the outer side of the stud 31. A pressure ring 33 is threadedly connected to the outer side of the stud 31. A spring 34 is provided on the outer side of the stud 31. One end of the spring 34 is fixedly connected to the pressure ring 33, and the other end of the spring 34 contacts the slide plate 32. By providing the spring 34, the slide plate 32 is elastically pressed down. The upper end of the slide plate 32 is fixedly connected to a guide seat 35. A slide 36 is slidably connected inside the guide seat 35. An adjusting rod 37 is installed inside the guide seat 35 through a bearing. The adjusting rod 37 and the slide 36 are threadedly connected. A connecting rod 38 is hinged inside the slide 36. A slide rod 39 is hinged to the upper end of the rod 38. The slide rod 39 is slidably connected to the base 1. A clamping block 310 is fixedly connected to the upper end of the slide rod 39. A protrusion 311 is fixedly connected to the lower end of the clamping block 310. The protrusion 311 is slidably connected to the base 1. By setting the protrusion 311, the friction between the clamping block 310 and the base 1 is reduced. By rotating the pressure ring 33 and the stud 31 to make threaded movement, the spring 34 elastically presses down the slide plate 32. By rotating the adjusting rod 37 and the slide seat 36 to make threaded movement, the position of the slide seat 36 within the guide seat 35 is adjusted. This allows the device to easily clamp and limit chips of different aspect ratios and sizes, preventing chip displacement during the soldering process.

[0023] Please see Figure 1 , Figure 4The cleaning mechanism 5 includes a motor 51. The motor 51 is fixedly mounted on the right end of the side plate 4. The output end of the motor 51 passes through the side plate 4 and is rotatably connected to it. A lead screw 52 is fixedly connected to the end of the output end of the motor 51. The lead screw 52 is rotatably connected to the side plate 4. A sliding plate 53 is threadedly connected to the outside of the lead screw 52. A guide rod 54 is fixedly connected to the surface of the side plate 4. The guide rod 54 and the sliding plate 53 are slidably connected. A screw 55 is mounted inside the sliding plate 53 via a bearing. A screw tube 56 is threadedly connected to the outside of the screw 55. A sliding tube 57 is slidably connected to the outside of the screw tube 56. A cleaning plate 58 is fixedly connected to the lower end of the sliding tube 57. The part is equipped with a compression spring 59. One end of the compression spring 59 is fixedly connected to the screw tube 56, and the other end of the compression spring 59 is fixedly connected to the cleaning plate 58. By setting the compression spring 59, the cleaning plate 58 is elastically pressed down. The upper end of the cleaning plate 58 is fixedly connected to the lifting rod 510, which is slidably connected to the sliding plate 53. By setting the lifting rod 510, the movement of the cleaning plate 58 is guided. The motor 51 drives the lead screw 52 to rotate and the sliding plate 53 to make threaded movement, thereby causing the sliding plate 53 to move. This causes the wet sponge strip on the cleaning plate 58 to move and brush the upper surface of the chip, making it easier to remove dust from the chip and preventing dust from affecting the soldering quality of the chip.

[0024] The specific implementation process of this utility model is as follows: In use, according to the chip aspect ratio adjustment device, manually rotate the adjustment rod 37. The rotation of the adjustment rod 37 and the slide 36 make a threaded movement, which in turn causes the slide 36 to drive the connecting rod 38 to move. The connecting rod 38 drives the slide 39 to move. The slide 39 drives the clamping block 310 to move. Then rotate the pressure ring 33. The rotation of the pressure ring 33 and the screw 31 make a threaded movement, which in turn causes the spring 34 to elastically press down the slide 32, which in turn causes the guide seat 35 to drive the slide 36 to move, which in turn causes the multiple connecting rods 38 to move synchronously, which in turn causes the slide 39 to move, which in turn causes the clamping block 310 to move, elastically clamping and limiting the chip. The motor 51 is started, which drives the lead screw 52 to rotate and the slide plate 53 to make threaded motion, thereby moving the slide plate 53. According to the chip thickness adjustment device, the screw 55 is manually rotated, which rotates and the screw tube 56 to make threaded motion, thereby moving the screw tube 56. The movement of the screw tube 56 compresses the compression spring 59, causing the cleaning plate 58 to be elastically pressed down, thereby causing the wet sponge strip on the cleaning plate 58 to move and brush the upper surface of the chip, making it easier to wipe away the dust on the chip and preventing the dust from affecting the chip soldering quality. Then, the welding machine 8 is started, the welding head position is adjusted, and the cylinder 7 is started to drive the welding machine 8 to move so that the welding head contacts the chip to solder the chip.

[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A welding device for processing switching power supply chips, comprising a base (1), characterized in that: A pad (2) is glued to the upper end of the base (1). A clamping mechanism (3) is provided on the base (1). A side plate (4) is fixedly connected to the upper end of the base (1). A cleaning mechanism (5) is provided on the side plate (4). A bracket (6) is fixedly connected to the upper end of the base (1). A cylinder (7) is fixedly installed in the middle of the upper end of the bracket (6). The cylinder rod of the cylinder (7) passes through the bracket (6) and is slidably connected to the bracket (6). A welding machine (8) is provided at the end of the cylinder rod of the cylinder (7).

2. The welding equipment for processing switching power supply chips according to claim 1, characterized in that: The clamping mechanism (3) includes a stud (31). The lower end of the base (1) is fixedly connected to the stud (31). A slide plate (32) is slidably connected to the outside of the stud (31). A pressure ring (33) is threadedly connected to the outside of the stud (31). A spring (34) is provided on the outside of the stud (31). A guide seat (35) is fixedly connected to the upper end of the slide plate (32). A slide seat (36) is slidably connected inside the guide seat (35). An adjusting rod (37) is installed inside the guide seat (35) through a bearing. The adjusting rod (37) and the slide seat (36) are threadedly connected. A connecting rod (38) is hinged inside the slide seat (36). A slide rod (39) is hinged to the upper end of the connecting rod (38). The slide rod (39) is slidably connected to the base (1). A clamping block (310) is fixedly connected to the upper end of the slide rod (39).

3. The welding equipment for processing switching power supply chips according to claim 2, characterized in that: One end of the spring (34) is fixedly connected to the pressure ring (33), and the other end of the spring (34) is in contact with the slide (32).

4. The welding equipment for processing switching power supply chips according to claim 2, characterized in that: The lower end of the clamping block (310) is fixedly connected to a protrusion (311), and the protrusion (311) and the base (1) are slidably connected.

5. The welding equipment for processing switching power supply chips according to claim 1, characterized in that: The cleaning mechanism (5) includes a motor (51). The motor (51) is fixedly installed at the right end of the side plate (4). The output end of the motor (51) passes through the side plate (4) and is rotatably connected to the side plate (4). The output end of the motor (51) is fixedly connected to a lead screw (52). The lead screw (52) is rotatably connected to the side plate (4). The outer side of the lead screw (52) is connected to a sliding plate (53) by a thread. The surface of the side plate (4) is fixedly connected to a guide rod (54). The guide rod (54) and the sliding plate (53) are slidably connected. The inside of the sliding plate (53) is equipped with a screw (55) through a bearing. The outer side of the screw (55) is connected to a screw tube (56) by a thread. The outer side of the screw tube (56) is slidably connected to a slide tube (57). The lower end of the slide tube (57) is fixedly connected to a cleaning plate (58). The inside of the slide tube (57) is provided with a compression spring (59).

6. The welding equipment for processing switching power supply chips according to claim 5, characterized in that: One end of the compression spring (59) is fixedly connected to the screw tube (56), and the other end of the compression spring (59) is fixedly connected to the cleaning plate (58).

7. The welding equipment for processing switching power supply chips according to claim 5, characterized in that: The upper end of the cleaning plate (58) is fixedly connected to a hanging rod (510), and the hanging rod (510) and the sliding plate (53) are slidably connected.

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