A transfer device for processing high-frequency composite dielectric substrates

Abstract

The utility model relates to high frequency composite medium substrate processing transfers the device field, and disclose a high frequency composite medium substrate processing transfers the device, including the transfer frame, the bottom of transfer frame is provided with the trundle, the inside of transfer frame is connected with the support frame of multiple number through fastener fixedly, the outside of corresponding two two support frames is provided with the rest plate, the inside of multiple rest plates all is provided with the first threaded hole of multiple number, the inside of multiple first threaded hole all is connected with the threaded rod of screw thread, the top of multiple threaded rods all is fixedly connected with the connecting frame, the inside of multiple connecting frames all is provided with the limiting device, the inside left and right walls of transfer frame all are provided with the second threaded hole of multiple number. This high frequency composite medium substrate processing transfers the device, has the advantage that can be to multiple different size's substrate fixedly, and the versatility is higher, and the advantage that the transfer transport is convenient.

Description

Technical Field

[0001] This utility model relates to the field of transfer devices for processing high-frequency composite dielectric substrates, specifically a transfer device for processing high-frequency composite dielectric substrates. Background Technology

[0002] High-frequency composite dielectric substrates are composite material substrates used in high-frequency circuits. They are usually composed of multiple materials and have the characteristics of low dielectric constant, low dielectric loss, good thermal stability and low coefficient of thermal expansion. They can meet the special impedance and dielectric constant requirements of microwave high-frequency circuits in different industries. In the processing of high-frequency composite dielectric substrates, the substrate usually needs to be transported.

[0003] Traditional transfer methods typically involve manual handling. However, during manual handling using trolleys, the substrates are generally not secured, making them prone to collisions and surface damage. Furthermore, some substrate fixing frames can only hold substrates of a single size, resulting in poor adaptability. Therefore, a transfer device for high-frequency composite dielectric substrate processing is proposed to address these issues. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this utility model provides a transfer device for processing high-frequency composite dielectric substrates. It has the advantages of being able to limit and fix substrates of various sizes, having high versatility, and being convenient for transfer and transportation. It solves the problem that traditional transfer methods usually rely on manual handling, but during manual handling by trolley, the substrates are generally not fixed, which can easily lead to relative collisions and damage to the substrate surface. In addition, some substrate fixing frames can only fix substrates of one type and size, resulting in poor adaptability.

[0006] (II) Technical Solution

[0007] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A transfer device for processing high-frequency composite dielectric substrates includes a transfer frame, the bottom of which is provided with casters, and a plurality of support frames are fixedly connected inside the transfer frame by fasteners. Placement plates are provided on the outer sides of each pair of support frames on the left and right. A plurality of first threaded holes are opened inside the plurality of placement plates, and threaded rods are threadedly connected inside the plurality of first threaded holes. A connecting frame is fixedly connected to the top of each of the plurality of threaded rods, and a limit device is provided inside the plurality of connecting frames.

[0008] The beneficial effects of this utility model are:

[0009] This high-frequency composite dielectric substrate processing transfer device has the advantages of being able to limit and fix substrates of various sizes, having high versatility, and being convenient for transfer and transportation.

[0010] Based on the above technical solution, the present invention can be further improved as follows.

[0011] Furthermore, the inner left and right walls of the transfer frame are provided with a number of second threaded holes, and the interior of the multiple support frames are each threaded with bolts that are respectively threaded to the multiple second threaded holes.

[0012] The beneficial effect of adopting the above-mentioned further solution is that by opening second threaded holes on the left and right walls inside the transfer frame and connecting the support frame to the transfer frame with bolts, the installation of the support frame is more stable, the structural stability of the entire device is improved, and the position of the support frame can be easily adjusted according to the height of the substrate.

[0013] Furthermore, each of the multiple support frames has a sliding groove inside, and each of the multiple placement plates has two sliding plates fixedly connected to its bottom, which are symmetrically distributed on the left and right and are slidably connected to the multiple sliding grooves respectively.

[0014] The advantage of adopting the above-mentioned further solution is that the arrangement of the chute and slide plate allows the placement plate to slide back and forth inside the support frame to remove the placement plate.

[0015] Furthermore, each of the limiting devices includes a first bolt knob that is internally threaded to the single connecting frame, a limiting plate that is rotatably connected to the outer side of the first bolt knob, and a limiting rod that passes through and extends to the outer side of the connecting frame is fixedly connected to the outer side of the limiting plate.

[0016] The beneficial effect of adopting the above-mentioned further solution is that the limiting device includes a first bolt knob, a limiting plate and a limiting rod. By tightening the first bolt knob, the limiting plate and the limiting rod can be moved outward, thereby limiting the substrate placed on the placement plate and preventing the substrate from falling off due to shaking during the transfer process.

[0017] Furthermore, threaded sleeves are threadedly connected to the outer sides of the plurality of first bolt knobs, and buffer pads are provided on the outer sides of the plurality of limiting plates.

[0018] The beneficial effect of adopting the above-mentioned further solution is that the cooperation between the threaded sleeve and the first bolt knob can further adjust the tightness of the limiting device, so that the limiting device can fix the substrate more accurately.

[0019] Furthermore, each of the multiple support frames has a third threaded hole inside, and each of the multiple placement plates is threadedly connected to a second bolt knob that is threadedly connected to the multiple third threaded holes.

[0020] The beneficial effect of adopting the above-mentioned further solution is that by opening a third threaded hole inside the support frame and connecting the placement plate to the support frame with a second bolt knob, the fixing stability of the placement plate is further enhanced, ensuring that the placement plate will not loosen during transportation. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the front structure of this utility model;

[0022] Figure 2 This is a schematic diagram of the support frame structure of this utility model;

[0023] Figure 3 This is a schematic diagram of the placement plate structure of this utility model;

[0024] Figure 4 This is a schematic diagram of the limiting device structure of this utility model.

[0025] In the diagram: 1. Transfer frame; 2. Casters; 3. Support frame; 4. Placement plate; 5. Threaded rod; 6. Connecting frame; 7. Limiting device; 71. First bolt knob; 72. Limiting plate; 73. Limiting rod; 8. Slide plate; 9. Threaded sleeve; 10. Second bolt knob. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] In the embodiments, by Figure 1-4 The present invention discloses a transfer device for processing high-frequency composite dielectric substrates. The present invention includes a transfer frame 1, with casters 2 at the bottom of the transfer frame 1. A plurality of support frames 3 are fixedly connected inside the transfer frame 1 by fasteners. Placement plates 4 are provided on the outer sides of each pair of support frames 3. A plurality of first threaded holes are opened inside the plurality of placement plates 4. Threaded rods 5 are threadedly connected inside the plurality of first threaded holes. Connecting frames 6 are fixedly connected to the top of the plurality of threaded rods 5. Limiting devices 7 are provided inside the plurality of connecting frames 6.

[0028] The internal left and right walls of the transfer frame 1 are provided with a number of second threaded holes, and the internal parts of the multiple support frames 3 are each threaded with bolts that are threaded to the multiple second threaded holes.

[0029] In this embodiment, during actual use, this bolt connection method can ensure that the support frame 3 will not loosen or shift during transportation, thereby ensuring that the substrate placed on the placement plate 4 can be stably supported and will not fall off due to device shaking. In addition, the positions of the multiple second threaded holes can be conveniently moved or adjusted after the bolts are removed, so as to adjust the width between the two support frames 3 to accommodate the thickness of various substrates.

[0030] Among them, each of the multiple support frames 3 has a sliding groove inside, and each of the multiple placement plates 4 has two slide plates 8 that are symmetrically distributed on the left and right and are slidably connected to the multiple sliding grooves.

[0031] In this embodiment, during actual use, the operator can slide the placement plate 4 to extend the slide plate 8 below the placement plate 4 into the slide groove, so that the placement plate 4 can be stably attached to the support frame 3. At the same time, the cooperation between the slide plate 8 and the slide groove also ensures the stability and docking accuracy of the placement plate 4 during the sliding process.

[0032] The single limiting device 7 includes a first bolt knob 71 that is internally threaded to a single connecting frame 6. A limiting plate 72 is rotatably connected to the outside of the first bolt knob 71. A limiting rod 73 that penetrates through and extends to the outside of the connecting frame 6 is fixedly connected to the outside of the limiting plate 72.

[0033] In this embodiment, during actual use, the operator can adjust the position of the limiting plate 72 by rotating the first bolt knob 71. The limiting rod 73 ensures the stability of the direction of movement of the limiting plate 72, so that it fits tightly against the edge of the substrate, thereby achieving stable fixation of the substrate. This limiting method is simple and effective and can adapt to substrates of various sizes and shapes.

[0034] Among them, the outer sides of multiple first bolt knobs 71 are threaded with threaded sleeves 9, and the outer sides of multiple limit plates 72 are provided with buffer pads.

[0035] In this embodiment, the buffer pad is a rubber pad in actual use. The buffer pad can reduce the direct contact between the limiting plate 72 and the substrate, prevent the limiting plate 72 from damaging the substrate, and also play a certain buffering role to reduce the impact on the substrate during transportation. The threaded sleeve 9 can further lock the first bolt knob 71 to prevent the first bolt knob 71 from loosening.

[0036] Among them, each of the multiple support frames 3 has a third threaded hole inside, and each of the multiple placement plates 4 has a second bolt knob 10 that is threaded to the multiple third threaded holes.

[0037] In this embodiment, during actual use, the setting of the second bolt knob 10 can ensure that the connection between the placement plate 4 and the support frame 3 is more secure. Even if a certain amount of shaking occurs during the movement of the device, the base plate on the placement plate 4 can remain stable and will not be affected by the loosening of the placement plate 4. At the same time, the second bolt knob 10 is also easy to manually tighten and install or disassemble, making it convenient to remove the placement plate 4.

[0038] Working principle:

[0039] During the transfer process, multiple substrates can be placed on the placement plate 4. Then, multiple connecting brackets 6 can be screwed on by the threaded rod 5. The position of the limiting plate 72 can be adjusted by the first bolt knob 71 to limit and fix the substrate. The number of support brackets 3 and placement plates 4 can be added or removed. The entire transfer frame 1 is moved by casters 2, which are self-locking casters for easy movement or stopping.

[0040] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0041] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A transfer device for high-frequency composite dielectric substrate processing, comprising a transfer frame (1), characterized in that: The bottom of the transfer frame (1) is provided with casters (2). The interior of the transfer frame (1) is fixedly connected with a number of support frames (3) by fasteners. The outer sides of each pair of support frames (3) are provided with placement plates (4). The interior of each of the placement plates (4) is provided with a number of first threaded holes. The interior of each of the first threaded holes is threaded with a threaded rod (5). The top of each of the threaded rods (5) is fixedly connected with a connecting frame (6). The interior of each of the connecting frames (6) is provided with a limit device (7).

2. The transfer device for processing high-frequency composite dielectric substrates according to claim 1, characterized in that: The internal left and right walls of the transfer frame (1) are provided with a number of second threaded holes, and the internal parts of the multiple support frames (3) are each threaded with bolts that are threaded to the multiple second threaded holes.

3. The transfer device for processing high-frequency composite dielectric substrates according to claim 1, characterized in that: Each of the multiple support frames (3) has a sliding groove inside, and each of the multiple placement plates (4) has two sliding plates (8) that are symmetrically distributed on the left and right and are slidably connected to the multiple sliding grooves.

4. The transfer device for processing high-frequency composite dielectric substrates according to claim 1, characterized in that: Each of the limiting devices (7) includes a first bolt knob (71) that is internally threaded to a single connecting frame (6), a limiting plate (72) that is rotatably connected to the outside of the first bolt knob (71), and a limiting rod (73) that passes through and extends to the outside of the connecting frame (6) that is fixedly connected to the outside of the limiting plate (72).

5. The transfer device for processing high-frequency composite dielectric substrates according to claim 4, characterized in that: The outer sides of the plurality of first bolt knobs (71) are threaded with threaded sleeves (9), and the outer sides of the plurality of limiting plates (72) are provided with buffer pads.

6. The transfer device for processing high-frequency composite dielectric substrates according to claim 1, characterized in that: Each of the multiple support frames (3) has a third threaded hole inside, and each of the multiple placement plates (4) has a second bolt knob (10) that is threaded to the multiple third threaded holes.

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