Corrosion-resistant pure copper planar target material
By designing a backplate and a heat exchange structure, the problem of poor heat dissipation of planar targets is solved, achieving effective thermal management, preventing thermal corrosion and oxidation, and extending the service life of the targets.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHIGAO (ZHEJIANG) NEW MATERIALS CO LTD
- Filing Date
- 2025-08-05
- Publication Date
- 2026-06-19
AI Technical Summary
Existing technologies have failed to effectively solve the heat dissipation problem of planar targets, especially the poor heat dissipation effect of direct contact between the target blank bonding surface and the back plate, which leads to thermal corrosion and oxidation.
The backplate design includes a backplate body, a backplate extension, and a backplate side. Through the through holes and groove structure of the backplate body, deionized water is used for direct and indirect heat exchange, which promotes cooling water flow, reduces cooling dead zones, and improves heat dissipation efficiency.
Effective heat dissipation prevents thermal corrosion and oxidation, extends the service life of the target material, and improves overall heat dissipation efficiency and edge area cooling performance.
Smart Images

Figure CN224378183U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of target materials, specifically relating to a corrosion-resistant pure copper planar target material. Background Technology
[0002] The patent, with publication number CN209741264U and subject title "Utility Model Patent for a Planar Target Material," and IPC classification number C23C14 / 35, discloses that "the planar target material includes a back plate, a target material assembly disposed on the back plate, and a pressure strip disposed on the target material assembly. The target material assembly is detachably fixed to the back plate by the pressure strip. The target material assembly includes multiple sub-target materials arranged in multiple columns and rows. The number of rows of the sub-target materials is a multiple of two, and the target material assembly is arranged vertically symmetrically with respect to the center line of the back plate."
[0003] Therefore, the above utility model patents have disclosed one technical solution for planar target materials. However, the technical solutions disclosed in the above utility model patents focus on ensuring the uniformity of sub-target material consumption and ensuring target material utilization, but do not further solve problems such as effective heat dissipation from the direct contact surface of the target blank, and need to be further improved. Utility Model Content
[0004] This invention addresses the shortcomings of the existing technology by providing a corrosion-resistant pure copper planar target.
[0005] This utility model adopts the following technical solution: a corrosion-resistant pure copper planar target material, comprising a target blank and a back plate, wherein:
[0006] The target blank has a relatively distributed bonding surface and a sputtering surface, with the bonding surface bonded to the back plate;
[0007] The back panel has a back panel body and two back panel extensions integrally formed with the back panel body. Each long side of the back panel body has a back panel extension. The back panel body has two back panel body through holes and multiple back panel body grooves. The multiple back panel body grooves are located between two back panel body through holes at the same time. There is a gap between two adjacent back panel body grooves. Each long side of the back panel body has two extension grooves.
[0008] As a preferred technical solution to the above technical solutions, the thickness of the back plate extension is less than the thickness of the back plate body.
[0009] As a preferred technical solution to the above technical solutions, the back panel is also provided with four back panel sides, which are integrally formed with the back panel body.
[0010] As a preferred technical solution of the above technical solution, each long side of the back plate body is provided with two back plate side portions, and the extension groove is located between the back plate extension portion and the back plate side portion, and the back plate side portions are symmetrically distributed relative to the back plate extension portion.
[0011] As a preferred technical solution to the above technical solutions, the thickness of the back plate side is less than the thickness of the back plate body, and the thickness of the back plate side is the same as the thickness of the back plate extension.
[0012] The corrosion-resistant pure copper planar target disclosed in this utility model has the following advantages: heat exchange with deionized water is achieved through the through holes in the backplate body, allowing direct contact with the target blank bonding surface for effective heat dissipation. Simultaneously, indirect heat exchange occurs through the grooves in the backplate body. Combined with the thinner thickness of the backplate extension and sides, this promotes cooling water flow, reduces cooling dead zones, prevents thermal corrosion or oxidation caused by localized overheating, improves the overall heat dissipation efficiency of the target material and the cooling performance of the edge areas, and extends its service life. Attached Figure Description
[0013] Figure 1 This is a three-dimensional view of the application in its combined state.
[0014] Figure 2 This is the main view of this application in its combined state.
[0015] Figure 3 This is a top view of the application in its combined state.
[0016] Figure 4 This is a side view of the application in its combined state.
[0017] Figure 5 This is a three-dimensional view of the application in its split state.
[0018] Figure 6 This is the front view of this application in its split state.
[0019] Figure 7 This is a bottom view of the application in its split state.
[0020] Figure 8 This is a side view of the application in its split state.
[0021] The reference numerals in the attached drawings include: 100-target blank; 101-coating surface; 102-sputtering surface; 200-backplate; 210-backplate body; 211-backplate extension; 212-extension groove; 213-backplate side; 220-backplate body through hole; 230-backplate body groove. Detailed Implementation
[0022] This utility model discloses a corrosion-resistant pure copper planar target material. The following description, in conjunction with a preferred embodiment (Example 1), is shown in the accompanying drawings. Figures 1 to 8 The specific embodiments of this utility model will be further described below.
[0023] See attached diagram. Figures 1 to 8 , Figures 1 to 4The images show corrosion-resistant pure copper planar targets in their combined state. Figures 5 to 8 The images show corrosion-resistant pure copper planar targets in their split state.
[0024] Example 1.
[0025] Preferably, the corrosion-resistant pure copper planar target material includes a target blank 100 and a back plate 200, wherein:
[0026] The target blank 100 has a bonding surface 101 and a sputtering surface 102 that are relatively distributed. The bonding surface 101 is bonded to the back plate 200, such that the sputtering surface 102 faces the ion beam generator (not shown in the figure). The heat generated during the magnetron sputtering process is conducted from the target blank 100 to the back plate 200 through the bonding surface 101.
[0027] The back panel 200 has a back panel body 210 and two back panel extensions 211 integrally formed with the back panel body 210. Each long side of the back panel body 210 has a back panel extension 211 (the two back panel extensions 211 are respectively located on the two long sides of the back panel body 210). The back panel body 210 has two back panel body through holes 220 (the back panel body through holes 220 penetrate the back panel body 210) and multiple back panel body grooves 230 (the back panel body grooves 230 do not penetrate the back panel body 210). Multiple backplate body grooves 230 are located between two backplate body through holes 220, and there is a gap between two adjacent backplate body grooves 230. Each backplate body 210 has two extension grooves 212 on its long side. This allows deionized water to be injected into the backplate body through holes 220, thereby directly contacting the mating surface 101 of the target blank 100 to achieve heat exchange. At the same time, deionized water can also be injected into the backplate body grooves 230, and heat exchange can be indirectly achieved through the backplate body 210.
[0028] The thickness of the back plate extension 211 is less than the thickness of the back plate body 210, which makes it easier for deionized water to flow near the groove 230 of the back plate body, promotes indirect heat exchange, avoids the cooling dead zone that may be caused by the excessive thickness of the back plate body 210, and thus prevents thermal corrosion or oxidation caused by local overheating.
[0029] The back plate 200 is also provided with four back plate sides 213, which are integrally formed with the back plate body 210. This makes the extension groove 212 an indirect heat exchange channel for cooling water. The thinner thickness of the back plate sides 213 helps to improve the cooling efficiency of the edge area of the back plate 200.
[0030] The back panel body 210 has two back panel side portions 213 on each long side, and the extension groove 212 is located between the back panel extension portion 211 and the back panel side portion 213. The back panel side portions 213 are symmetrically distributed relative to the back panel extension portion 211.
[0031] The thickness of the back panel side portion 213 is less than the thickness of the back panel body 210, and the thickness of the back panel side portion 213 is the same as the thickness of the back panel extension portion 211.
[0032] The backplate 200 is preferably made of pure copper.
[0033] The following describes the overall concept of the corrosion-resistant pure copper planar target material disclosed in this embodiment: The through-hole 220 in the backplate body enables heat exchange with deionized water, directly contacting the mating surface 101 of the target blank 100 for effective heat dissipation. Simultaneously, indirect heat exchange occurs through the groove 230 in the backplate body. Combined with the relatively thin thickness of the backplate extension 211 and the backplate side portion 213, this promotes cooling water flow, reduces cooling dead zones, prevents thermal corrosion or oxidation caused by localized overheating, improves the overall heat dissipation efficiency of the target material and the cooling performance of the edge areas, and extends its service life.
[0034] It is worth mentioning that the specific material and other technical features of the target blank 100 involved in this utility model patent application should be regarded as prior art. The specific structure, working principle and possible control methods and spatial arrangement methods of these technical features can be conventionally selected in the field and should not be regarded as the inventive point of this utility model patent. This utility model patent will not elaborate further.
[0035] For those skilled in the art, modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A corrosion-resistant pure copper flat target material, characterized by, Includes the target blank and back plate, wherein: The target blank has a relatively distributed bonding surface and a sputtering surface, with the bonding surface bonded to the back plate; The back panel has a back panel body and two back panel extensions integrally formed with the back panel body. Each long side of the back panel body has a back panel extension. The back panel body has two back panel body through holes and multiple back panel body grooves. The multiple back panel body grooves are located between two back panel body through holes at the same time. There is a gap between two adjacent back panel body grooves. Each long side of the back panel body has two extension grooves.
2. The corrosion-resistant pure copper flat target material according to claim 1, characterized by The thickness of the backplate extension is less than the thickness of the backplate body.
3. The corrosion-resistant, pure copper planar target material of claim 1, wherein The back panel also has four back panel sides, which are integrally formed with the back panel body.
4. The corrosion-resistant pure copper flat target material according to claim 3, characterized by Each long side of the backplate body has two backplate side portions, and the extension groove is located between the backplate extension portion and the backplate side portion. The backplate side portions are symmetrically distributed relative to the backplate extension portion.
5. The corrosion-resistant, pure copper planar target material according to claim 3, wherein The thickness of the back panel side is less than the thickness of the back panel body, and the thickness of the back panel side is the same as the thickness of the back panel extension.
Citation Information
Patent Citations
Planar target material
CN209741264U