Wafer electroplating apparatus

Abstract

The embodiment of the utility model provides a kind of wafer electroplating equipment, it is related to semiconductor production technical field.The utility model provides the wafer electroplating equipment including the tray for positioning and fixed wafer, the electroplating cavity for storing electroplating solution, rack and flexible protective cover, rack has top plate, bottom plate and drive assembly, top plate and bottom plate are respectively set in the two sides of drive assembly, top plate is used to connect with external device, tray is set in the side of bottom plate away from top plate;Flexible protective cover is connected between top plate and bottom plate, to be used to form the closed space containing drive assembly between top plate and bottom plate;Drive assembly includes lifting piece and tilting piece, lifting piece is used to change the distance between top plate and bottom plate;Tilting piece is used to change the included angle between bottom plate and top plate;Drive assembly is always in closed space when drive assembly acts.The utility model has improved the mechanism of driving wafer motion is easy to be corroded by volatile electroplating solution and damaged.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and more specifically, to a wafer electroplating device. Background Technology

[0002] Wafer electroplating is one of the key processes in semiconductor manufacturing, mainly used to deposit metal layers on the surface of wafers. In existing wafer electroplating equipment, the plating solution is acidic or alkaline. During the wafer electroplating process, the evaporating plating solution can easily damage the mechanical structure of the mechanism that drives the wafer movement. Utility Model Content

[0003] The purpose of this invention is to provide a wafer electroplating device that can improve the problem that the mechanism driving the wafer movement is easily corroded and damaged by the volatile electroplating solution.

[0004] The embodiments of this utility model can be implemented as follows:

[0005] In a first aspect, this utility model provides a wafer electroplating apparatus, comprising:

[0006] Carrier disk, used for positioning and holding wafers;

[0007] The electroplating chamber is used to contain the electroplating solution and provide space for wafer electroplating.

[0008] A frame has a top plate, a bottom plate, and a drive assembly. The top plate and the bottom plate are respectively disposed on both sides of the drive assembly. The top plate is used to connect to external equipment, and the carrier plate is disposed on the side of the bottom plate away from the top plate.

[0009] A flexible protective cover is connected between the top plate and the bottom plate to form a closed space between the top plate and the bottom plate, and the drive assembly is located within the closed space;

[0010] The driving component includes a lifting member and a tilting member. The lifting member is used to drive the base plate to move to change the distance between the top plate and the base plate. The tilting member is used to drive the base plate to rotate to change the angle between the base plate and the top plate. When the driving component is in operation, the driving component is always within the enclosed space.

[0011] In an optional embodiment, a rotating assembly is further provided within the frame, the rotating assembly being used to drive the carrier disk to rotate.

[0012] In an optional embodiment, the rotating assembly includes a rotating shaft, and the base plate has a through hole for the rotating shaft to pass through, and the rotating shaft is connected to the carrier disk.

[0013] In an optional embodiment, a sealing structure is provided inside the through hole, the sealing structure being used to fill the gap between the through hole and the rotating shaft.

[0014] In an optional embodiment, the sealing structure is a sealing ring.

[0015] In an optional embodiment, the drive assembly includes a main lifting assembly and a mounting frame, the main lifting assembly and the mounting frame being sequentially connected between the top plate and the bottom plate, the lifting member and the tilting member being disposed on the mounting frame, the main lifting assembly being used to drive the mounting frame to move in the vertical direction, and the lifting member being used to drive the tilting member to move in the vertical direction.

[0016] In an optional embodiment, the lifting component includes a cylinder with its output end extending vertically downward.

[0017] In an optional embodiment, the rotating assembly includes a motor, the output shaft of which is connected to the rotating shaft.

[0018] In an optional embodiment, the tilting member includes a piston rod, the output end of which is connected to the base plate, and the piston rod is used to drive one end of the base plate to rotate the base plate.

[0019] The beneficial effects of the wafer electroplating equipment provided in this embodiment of the present invention include:

[0020] By connecting a flexible protective cover between the top and bottom plates of the rack, the flexible protective cover deforms accordingly when the drive assembly moves the carrier to drive the wafer into and out of the electroplating chamber for electroplating. This ensures that the drive assembly is always in a closed space during the movement of the bottom plate, preventing the electroplating liquid evaporating from the electroplating chamber from directly contacting the drive assembly and causing corrosion damage to the mechanical structure of the drive assembly. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the wafer electroplating equipment provided in this embodiment from a first-view perspective;

[0023] Figure 2 This is a schematic diagram of the internal structure of the wafer electroplating equipment provided in this embodiment;

[0024] Figure 3 This is a bottom view of the wafer plating equipment provided in this embodiment.

[0025] Icons: 100-Carrier tray; 200-Electroplating chamber; 300-Frame; 310-Top plate; 320-Base plate; 330-Drive assembly; 331-Main lifting assembly; 332-Mounting bracket; 333-Lifting component; 334-Rotating shaft; 335-Rotating assembly; 340-Tilting component; 400-Flexible protective cover; 500-Sealing ring. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0028] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0029] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0030] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0031] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.

[0032] Wafer electroplating is a key process in semiconductor manufacturing, primarily used to deposit metal layers on the surface of wafers. In existing wafer electroplating equipment, a mechanical mechanism drives the wafer to move into the electroplating chamber for processing. The electroplating solution is typically an acidic or alkaline liquid, which makes the volatile plating solution prone to corroding the mechanical structure of the driving components. Currently, a protective shield is usually installed outside the driving components. However, because the driving components operate and move the wafer during the electroplating process, traditional rigid protective shields cannot effectively protect the driving components.

[0033] To address the problem that volatile electroplating solutions can easily corrode and damage the mechanical mechanisms driving wafer movement, this invention provides a wafer electroplating device. The overall structure, working principle, and technical effects of the wafer electroplating device provided by this invention are described in detail below through embodiments and with reference to the accompanying drawings.

[0034] Please refer to Figures 1-3 This utility model provides a wafer electroplating equipment for wafer electroplating processes to deposit a metal layer on the wafer surface.

[0035] Please refer to Figure 1 and Figure 2 The wafer electroplating equipment provided by this utility model includes a carrier tray 100, an electroplating chamber 200, a frame 300, and a flexible protective cover 400. The carrier tray 100 is a common type used in wafer electroplating processes, used to fix and position the wafer during the electroplating process. Simultaneously, the carrier tray 100 drives the wafer to move during the electroplating process, meeting various movement requirements of the wafer. The electroplating chamber 200 is used to contain the electroplating solution for electroplating the wafer and provides working space for the wafer to enter the electroplating chamber 200 for electroplating operations. The frame 300 has a top plate 310, a bottom plate 320, and a drive assembly 330. The top plate 310 and the bottom plate 320 are respectively connected to both sides of the drive assembly 330. The top plate 310 is used to connect to external equipment or facilities, while the carrier tray 100 is installed on the side of the bottom plate 320 away from the top plate 310. Furthermore, a flexible protective cover 400 is connected between the top plate 310 and the bottom plate 320, forming a closed space between the flexible protective cover 400, the top plate 310, and the bottom plate 320 to isolate the drive assembly 330 from the outside. When the drive assembly 330 drives the bottom plate 320 to move, thereby driving the wafer on the carrier 100 to enter and exit the electroplating chamber 200 for electroplating, the distance between the top plate 310 and the bottom plate 320 changes. At this time, the flexible protective cover 400 deforms accordingly, so that the top plate 310 and the bottom plate 320 always remain isolated from the outside, thereby isolating the drive assembly 330 from the external environment.

[0036] Furthermore, the drive assembly 330 includes a lifting member 333 and a tilting member 340. The lifting member 333 drives the base plate 320 to move, thereby adjusting the distance between the top plate 310 and the base plate 320 to drive the wafer into the electroplating chamber 200. The tilting member 340 drives the base plate 320 to rotate, thereby changing the angle between the base plate 320 and the top plate 310, thus adjusting the tilt angle of the base plate 320, and consequently adjusting the angle of the wafer. This is used to remove air bubbles on the small surface of the wafer when it enters the electroplating chamber 200, improving the uniformity of wafer electroplating. It is understood that during the process of the drive assembly 330 driving the base plate 320 to move, the flexible protective cover 400 deforms accordingly, so that the drive assembly 330 is always in a closed space during the driving process, thereby protecting the drive assembly 330 through the flexible protective cover 400.

[0037] By connecting a flexible protective cover 400 between the top plate 310 and the bottom plate 320 of the rack 300, the flexible protective cover 400 deforms accordingly when the drive assembly 330 drives the carrier 100 to move to drive the wafer into and out of the electroplating chamber 200 for electroplating. This ensures that the drive assembly 330 remains in a closed space during the movement of the bottom plate 320, preventing externally volatilized electroplating liquid from directly contacting the drive assembly 330 and causing corrosion damage to the mechanical structure of the drive assembly 330.

[0038] Referring to 1, in some optional embodiments, the flexible protective cover 400 is a corrugated pipe, which is sleeved around the drive assembly 330, and its two ends are connected to the top plate 310 and the bottom plate 320, respectively. The corrugated pipe is composed of a series of annular pleats and can expand and contract in the circumferential direction, so that when the drive assembly 330 drives the bottom plate 320 to move, the corrugated pipe can expand and contract accordingly to ensure the isolation effect on the drive assembly 330. In other optional embodiments, the flexible protective cover 400 can also be a bellows pipe, which is composed of continuous transverse pleats and can also expand and contract in the axial direction, so as to still ensure the isolation effect on the drive assembly 330 when the bottom plate 320 moves. Furthermore, in other optional embodiments, the flexible protective cover 400 can also include a flexible tube body, which can deform in the axial and radial directions, and can also achieve the effect of corresponding deformation during the movement of the bottom plate 320 and isolating the drive assembly 330. The flexible tube body can be a rubber flexible tube, a plastic flexible tube, a metal flexible tube, etc.

[0039] Please refer to Figure 1 and Figure 2In this embodiment, the drive assembly 330 further includes a main lifting assembly 331 and a mounting frame 332 rotating assembly 335. The main lifting assembly 331 and the mounting frame 332 are sequentially installed between the top plate 310 and the bottom plate 320, that is, the top plate 310, the main lifting assembly 331, the mounting frame 332, and the bottom plate 320 are connected sequentially from top to bottom. The main lifting assembly 331 is used to drive the mounting frame 332 to move vertically, thereby driving the carrier plate 100 to move vertically and adjusting the position of the carrier plate 100 in the vertical direction. The main lifting assembly 331 can be a cylinder, an electric push rod, a hydraulic cylinder, or other structures, as long as it can drive the mounting frame 332 to move vertically. This utility model does not limit the specific structural form of the main lifting assembly 331.

[0040] Please refer to Figure 1 and Figure 2 In some optional embodiments, the rotating assembly 335 is mounted on the mounting bracket 332, and the rotating assembly 335 includes a rotating shaft 334. A through hole is provided on the base plate 320 for the rotating shaft 334 to pass through. The rotating shaft 334 extends beyond the base plate 320 through the through hole and is connected to the carrier disk 100. The rotating assembly 335 is used to drive the rotating shaft 334 to rotate, thereby driving the carrier disk 100 connected to the rotating shaft 334 to rotate, and further driving the wafer to rotate to meet different electroplating requirements. In this embodiment, the rotating assembly 335 includes a motor, and the output shaft of the motor is connected to the rotating shaft 334, so that the rotating shaft 334 is driven to rotate by the motor, thereby driving the wafer on the carrier disk 100 to rotate. In other optional embodiments, the rotating assembly 335 may also include an electric motor, an air pump, or other structures that can drive the rotating shaft 334 to rotate.

[0041] Please refer to Figure 3 Because the rotating component 335 drives the rotating shaft 334 to rotate throughout the entire electroplating process of the wafer, a gap exists between the rotating shaft 334 and the inner wall of the through hole. Evaporated electroplating solution can enter the enclosed space through this gap, causing corrosion to the internal driving component 330. Therefore, to improve the sealing between the rotating shaft 334 and the base plate 320 and prevent evaporated electroplating solution from entering the flexible protective cover 400 through the through hole and corroding the driving component 330, in some optional embodiments, a sealing structure is provided in the through hole. The sealing structure is used to seal the area between the through hole and the rotating shaft 334. Specifically, the sealing structure is a sealing ring 500, that is, a sealing ring 500 is provided between the rotating shaft 334 and the base plate 320 to seal the gap between the rotating shaft 334 and the base plate 320.

[0042] Please refer to Figure 1 and Figure 2Furthermore, the lifting component 333 is mounted on the mounting frame 332 and connected to the tilting component 340. The lifting component 333 drives the tilting component 340 to move vertically, thereby adjusting the position of the wafer on the carrier 100 in the vertical direction and improving the electroplating effect of the wafer. Simultaneously, the lifting component 333 can drive the carrier 100 to move closer to or further away from the base plate 320, facilitating the adjustment of the relative position of the carrier 100 to adapt to different electroplating environments and improve its applicability. The lifting component 333 can be a cylinder, electric push rod, hydraulic cylinder, or other structure, as long as it can drive the rotating shaft 334 to move vertically. This invention does not limit the specific structural form of the lifting component 333.

[0043] For further details, please refer to Figure 1 and Figure 2 The tilting element 340 is disposed between the mounting bracket 332 and the base plate 320. In the wafer electroplating process, it keeps the wafer tilted during the immersion of the wafer in the electroplating solution to remove bubbles formed on the small surface of the wafer and ensure the uniformity of the electroplated layer. Specifically, the tilting element 340 includes multiple piston rods arranged in a circular pattern. By adjusting the extension and retraction of the multiple piston rods, the base plate 320 is driven to shift at a small angle, thereby adjusting the tilt angle of the wafer on the carrier 100, facilitating the immersion of the wafer in the electroplating solution at an inclined angle.

[0044] In summary, the implementation principle of the wafer electroplating equipment provided by this utility model is as follows: by connecting a flexible protective cover 400 between the top plate 310 and the bottom plate 320 of the frame 300, when the drive assembly 330 drives the carrier 100 to move to drive the wafer into and out of the electroplating chamber 200 for electroplating processing, the flexible protective cover 400 deforms accordingly, thereby maintaining the isolation of the drive assembly 330 during the movement of the bottom plate 320, and preventing externally volatilized electroplating liquid from directly contacting the drive assembly 330 and causing corrosion damage to the mechanical structure of the drive assembly 330.

[0045] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer electroplating apparatus, characterized by, include: Carrier tray, used for positioning and holding the wafer; The electroplating chamber is used to contain the electroplating solution and provide space for wafer electroplating. A frame has a top plate, a bottom plate, and a drive assembly. The top plate and the bottom plate are respectively disposed on both sides of the drive assembly. The top plate is used to connect to external equipment, and the carrier plate is disposed on the side of the bottom plate away from the top plate. A flexible protective cover is connected between the top plate and the bottom plate to form a closed space between the top plate and the bottom plate, and the drive assembly is located within the closed space; The drive assembly includes a lifting component and a tilting component. The lifting component is used to drive the base plate to move in order to change the distance between the top plate and the base plate. The tilting member is used to drive the base plate to rotate so as to change the angle between the base plate and the top plate; when the driving component is in operation, the driving component is always within the enclosed space.

2. The wafer electroplating apparatus of claim 1, wherein, The frame is also equipped with a rotating component, which is used to drive the carrier disk to rotate.

3. The wafer electroplating apparatus of claim 2, wherein, The rotating assembly includes a rotating shaft, and a through hole is provided on the base plate for the rotating shaft to pass through. The rotating shaft is connected to the carrier disk.

4. The wafer electroplating apparatus of claim 3, wherein, A sealing structure is provided inside the through hole, which is used to fill the gap between the through hole and the rotating shaft.

5. The wafer electroplating equipment according to claim 1, characterized in that, The flexible protective cover includes one of the following: corrugated pipe, bellows pipe, and flexible pipe.

6. The wafer electroplating equipment according to claim 4, characterized in that, The sealing structure is a sealing ring.

7. The wafer electroplating equipment according to claim 3, characterized in that, The rotating assembly includes a motor, and the output shaft of the motor is connected to the rotating shaft.

8. The wafer electroplating equipment according to any one of claims 1-7, characterized in that, The drive assembly further includes a main lifting assembly and a mounting frame. The main lifting assembly and the mounting frame are sequentially connected between the top plate and the bottom plate. The lifting member and the tilting member are disposed on the mounting frame. The main lifting assembly is used to drive the mounting frame to move in the vertical direction, and the lifting member is used to drive the tilting member to move in the vertical direction.

9. The wafer electroplating equipment according to claim 1, characterized in that, The lifting component includes a cylinder, the output end of which extends vertically downward.

10. The wafer electroplating equipment according to claim 1, characterized in that, The tilting member includes a piston rod, the output end of which is connected to the base plate. The piston rod is used to drive one end of the base plate to rotate the base plate.

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