PCB full-board copper layer thickening device

Abstract

This utility model relates to the field of PCB manufacturing technology, and more particularly to a device for uniformly thickening the copper layer during full-board electroplating of PCBs. The technical solution includes a housing and a thickness control structure disposed on the inner wall of the housing. The thickness control mechanism includes a connecting frame disposed at the center of the housing. Both ends of the inner wall of the connecting frame are fixedly connected to horizontal connecting frames via support blocks. Multiple fixing plates are fixedly connected to the inner wall of the connecting frame. Filter bags are fixedly connected to one side of the two horizontal connecting frames and both sides of the outer wall of the fixing plates via hanging ears. PCB boards are disposed on the inner walls of the multiple filter bags. Support structures are disposed on both sides of the inner wall of the housing located on the thickness control structure. This utility model's device for uniformly thickening the copper layer during full-board electroplating of PCBs effectively avoids the phenomenon of excessively thick or thin copper layers in certain areas, improving the quality and performance of the PCB board, and also has the advantage of structural stability during the electroplating process.

Description

Technical Field

[0001] This utility model relates to the field of PCB manufacturing technology, and in particular to a device for uniformly thickening the copper layer in the electroplating of the entire PCB board. Background Technology

[0002] Electroplating is a crucial step in PCB manufacturing. It involves depositing a coating onto a substrate using electrolysis. Typically, the coating metal serves as the anode, and the PCB as the cathode. Both are immersed in the electroplating solution in parallel and perpendicular directions to complete the electroplating process. However, traditional PCB full-board copper layer thickening devices are prone to uneven copper layer thickness during electroplating due to factors such as the placement of the PCB, current distribution, and the flow state of the electroplating solution. This can result in localized areas that are too thick or too thin, affecting the quality and performance of the PCB. Therefore, this application proposes a device for uniformly thickening the copper layer in full-board PCB electroplating. Utility Model Content

[0003] The purpose of this invention is to address the problem in the background technology that leads to uneven copper layer thickness, with some areas being too thick or too thin, which affects the quality and performance of PCB boards. The invention proposes a device for uniformly thickening the copper layer of the entire PCB board through electroplating.

[0004] The technical solution of this utility model: a device for uniformly thickening the copper layer of a PCB full-board electroplating, including a box and a thickness control structure set on the inner wall of the box. The thickness control structure includes a connecting frame set at the center of the box. Both ends of the inner wall of the connecting frame are fixedly connected to a horizontal connecting frame by a support block. Multiple fixing plates are fixedly connected to the inner wall of the connecting frame. Filter bags are fixedly connected to one side of the two horizontal connecting frames and both sides of the outer wall of the fixing plates by a hanging ear. PCB boards are set on the inner walls of the multiple filter bags.

[0005] The inner wall of the box is provided with support structures on both sides of the thickness control structure;

[0006] The outer walls of the connecting frame are provided with buffer structures on both sides.

[0007] Optionally, the support structure includes support steps fixed to both sides of the inner wall of the box, and a support rod is fixedly connected to the top of each of the two support steps.

[0008] Optionally, the top ends of the two support rods are connected to push rods, and the top ends of the two push rods are connected to a transmission structure, the outer wall of which is fitted with a transmission box.

[0009] Optionally, the outer wall of the transmission box is fitted with two sleeve blocks, and the bottom ends of the two sleeve blocks are connected to the top end of the connecting frame.

[0010] Optionally, the buffer structure includes connecting rods fixed to both sides of the outer wall of the connecting frame, with rotating joints rotatably connected to the ends of the two connecting rods away from the connecting frame, and rotating arms rotatably connected to the inner walls of the two rotating joints.

[0011] Optionally, an extension plate is fixedly connected to the end of the rotating arm away from the rotating joint, and a telescopic frame is fixedly connected to the bottom end of the extension plate. One side of the bottom end of the telescopic frame is fixed to the outer wall of the box.

[0012] Optionally, the bottom of both sides of the outer wall of the box is fixedly connected with support legs, and the inner wall of the box is provided with an immersion tank between two support steps, the immersion tank corresponding to multiple filter bags.

[0013] Compared with the prior art, this application includes at least one of the following beneficial technical effects: In the thickness control structure of this device, the PCB board is suspended inside the filter bag, which ensures uniform contact between the electroplating solution and the PCB board. At the same time, the reasonable layout of the horizontal connecting frame and the fixing plate makes the current distribution among multiple PCB boards uniform, effectively avoiding the phenomenon of excessively thick or thin copper layers in some areas, thus improving the quality and performance of the PCB board. The support structure, through the synergistic action of components such as support rods, push rods, and transmission structures, can precisely adjust the depth of the PCB board in the electroplating solution, making operation convenient. The buffer structure can effectively reduce the shaking of the connecting frame, ensuring the structural stability of the device during the electroplating process and reducing the risk of PCB board position displacement caused by vibration. Attached Figure Description

[0014] Figure 1 A three-dimensional structural diagram of a device for uniformly thickening the copper layer during electroplating of the entire PCB board;

[0015] Figure 2 A schematic diagram of the internal structure of a device for uniformly thickening the copper layer during electroplating of the entire PCB board;

[0016] Figure 3 This is a schematic diagram of the connecting structure of the connecting frame;

[0017] Figure 4 This is a schematic diagram of the filter bag connection structure.

[0018] Reference numerals: 1. Box body; 2. Support leg; 3. Support step; 4. Immersion tank; 5. Support rod; 6. Push rod; 7. Transmission structure; 8. Transmission box; 9. Sleeve block; 10. Connecting frame; 11. Connecting rod; 12. Rotating joint; 13. Rotating arm; 14. Extension plate; 15. Telescopic frame; 16. Support block; 17. Horizontal joint frame; 18. Fixing plate; 19. Hanging lug; 20. Filter bag; 21. PCB board. Detailed Implementation

[0019] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments.

[0020] The components of the present invention embodiments described and shown in the accompanying drawings can typically be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.

[0021] Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0022] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0024] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Example

[0025] like Figures 1 to 4As shown, the present invention proposes a device for uniformly thickening the copper layer of a PCB board through electroplating, comprising a housing 1 and a thickness control structure disposed on the inner wall of the housing 1. The thickness control mechanism includes a connecting frame 10 disposed at the center of the housing 1. Both ends of the inner wall of the connecting frame 10 are fixedly connected to a horizontal connecting frame 17 via support blocks 16. Multiple fixing plates 18 are fixedly connected to the inner wall of the connecting frame 10. Filter bags 20 are fixedly connected to one side of each of the two horizontal connecting frames 17 and both sides of the outer wall of the fixing plates 18 via hanging ears 19. PCB boards 21 are disposed on the inner walls of the multiple filter bags 20. The connecting frame 10 is made of corrosion-resistant metal material, has a frame structure, is located at the center of the housing 1, and is the basic support component of the thickness control structure. The horizontal connecting frames 17 are fixedly connected to both ends of the inner wall of the connecting frame 10 via support blocks 16. Both the support blocks 16 and the horizontal connecting frames 17 are designed to be compatible with the connecting frame 10. Using the same materials, the horizontal connecting frame 17 further enhances the structural stability of the connecting frame 10 and provides support for the installation of the filter bag 20. Multiple fixing plates 18, made of metal and evenly distributed, are fixedly connected to the inner wall of the connecting frame 10 for installing the hanging ears 19. The filter bags 20 are fixedly connected to one side of the two horizontal connecting frames 17 and the two sides of the outer wall of the fixing plates 18 through the hanging ears 19. The hanging ears 19 are made of corrosion-resistant metal or plastic materials, and the filter bags 20 are made of nylon or polyester materials that are resistant to electroplating solution corrosion. They have good air permeability and filtration properties, allowing the electroplating solution to fully contact the PCB board 21 while preventing impurities from adhering to the surface of the PCB board 21. The inner wall of the filter bag 20 is provided with the PCB board 21, which is suspended inside the filter bag 20 through the hanging ears 19, ensuring that the PCB board 21 is stable in position during the electroplating process and can be evenly contacted with the electroplating solution to achieve uniform copper layer thickening.

[0026] In addition, such as Figure 1 and Figure 2As shown, the inner wall of the box 1 is provided with support structures on both sides of the thickness control structure. The support structures include support steps 3 fixed to both sides of the inner wall of the box 1. The top of each support step 3 is fixedly connected to a support rod 5. The top of each support rod 5 is drivenly connected to a push rod 6. The top of each push rod 6 is drivenly connected to a transmission structure 7. The outer wall of the transmission structure 7 is fitted with a transmission box 8. The outer wall of the transmission box 8 is fitted with two fitting blocks 9. The bottom ends of the two fitting blocks 9 are connected to the top of the connecting frame 10. The bottom ends of both sides of the outer wall of the box 1 are fixedly connected to support legs 2. The inner wall of the box 1 is located on both sides of the thickness control structure. An immersion tank 4 is provided between the supporting steps 3, and the immersion tank 4 corresponds to multiple filter bags 20. The support rods 5 are made of high-strength metal material, perpendicular to the supporting steps 3, and provide support for other components of the support structure to ensure the stability of the support structure. The push rods 6, which are metal screws, are connected to the top of the two support rods 5 and can move in extension and retraction under the drive of the support rods 5. The transmission structure 7, which is connected to the top of the two push rods 6, can be gear-driven and is installed in the transmission box 8. The transmission box 8 is made of metal material to protect the transmission structure 7 from corrosion by the electroplating solution. Two fitting blocks 9 are fitted on its outer wall. The fitting blocks 9 are made of metal material and are connected to the top of the connecting frame 10 at their bottom ends. Through the coordinated action of the transmission structure 7 and the push rods 6, the height of the connecting frame 10 can be adjusted, thereby adjusting the depth of the PCB board 21 in the immersion tank 4 to ensure that the PCB board 21 is in full contact with the electroplating solution and to ensure uniform copper layer thickening.

[0027] And, as Figure 1As shown, buffer structures are provided on both sides of the outer wall of the connecting frame 10. The buffer structures include connecting rods 11 fixed to both sides of the outer wall of the connecting frame 10. The ends of the two connecting rods 11 away from the connecting frame 10 are rotatably connected to rotating joints 12. Rotating arms 13 are rotatably connected to the inner walls of the two rotating joints 12. An extension plate 14 is fixedly connected to the end of the rotating arm 13 away from the rotating joint 12. A telescopic frame 15 is fixedly connected to the bottom end of the extension plate 14. One side of the bottom end of the telescopic frame 15 is fixed to the outer wall of the box 1. The connecting rods 11 fixed on both sides of the outer wall of the connecting frame 10 are made of metal and are used to connect the rotating joints 12. The rotating joints 12 adopt a bearing structure and can rotate flexibly. The rotating arms 13 are rotatably connected to their inner walls. The rotating arm 13 is made of metal and its length can be designed as needed. The angle can be adjusted by rotating the rotating joint 12, which serves to buffer and balance the connecting frame 10. The end of the rotating arm 13 away from the rotating joint 12 is fixedly connected to the extension plate 14, which is also made of metal, to extend the range of action of the rotating arm 13. The bottom end of the extension plate 14 is fixedly connected to the telescopic frame 15, which is a telescopic metal frame. One side of the bottom end is fixed to the outer wall of the housing 1. When the connecting frame 10 moves up and down under the action of the support structure or is impacted by external force, the telescopic frame 15 will expand and contract. In conjunction with the rotation of the rotating arm 13 and the rotating joint 12, it plays a buffering role, reduces the vibration of the connecting frame 10, ensures the stability of the PCB board 21 during the electroplating process, and is conducive to the uniform thickening of the copper layer.

[0028] In this embodiment, the PCB board 21 requiring copper layer thickening is placed inside the filter bag 20. The filter bag 20 is fixed to the horizontal connecting frame 17 and the fixing plate 18 by the hanging ears 19, ensuring that the PCB board 21 is stably positioned inside the filter bag 20 and that multiple PCB boards 21 maintain an appropriate distance to avoid mutual obstruction affecting the electroplating effect. The drive device of the support structure is activated. The drive device drives the push rod 6 to extend and retract through the transmission structure 7. The push rod 6 drives the transmission box 8 and the sleeve block 9 to move up and down, thereby adjusting the height of the connecting frame 10 so that the PCB board 21 is completely immersed in the electroplating solution in the immersion tank 4, and the immersion depth is uniform. During the electroplating process, current passes through the electroplating solution to form a copper layer on the surface of the PCB board 21. The PCB board 21 is suspended inside the filter bag 20, which allows the electroplating solution to flow evenly over the surface of the PCB board 21. At the same time, the reasonable layout of the cross bracket 17 and the fixing plate 18 ensures that the current distribution among multiple PCB boards 21 is uniform, thereby achieving uniform copper layer thickening. During the electroplating process, if the connecting frame 10 shakes due to external force, the buffer structure will play a role. The shaking of the connecting frame 10 is transmitted to the rotating joint 12 and the rotating arm 13 through the connecting rod 11. The rotating arm 13 rotates around the rotating joint 12, while driving the extension plate 14 and the telescopic frame 15 to move. The telescopic deformation of the telescopic frame 15 absorbs the shaking energy, reduces the vibration of the connecting frame 10, ensures that the PCB board 21 is in a stable position in the electroplating solution, and ensures uniform copper layer thickening.

[0029] The above specific embodiments are merely several optional embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A device for uniformly thickening the copper layer of PCB full-plate electroplating, comprising a box body (1) and a thickness control structure arranged on the inner wall of the box body (1), characterized in that: The thickness control structure includes a connecting frame (10) located at the center of the box (1). Both ends of the inner wall of the connecting frame (10) are fixedly connected to a cross frame (17) via a support block (16). The inner wall of the connecting frame (10) is fixedly connected to multiple fixing plates (18). Filter bags (20) are fixedly connected to one side of the two cross frames (17) and both sides of the outer wall of the fixing plates (18) via hanging ears (19). PCB boards (21) are provided on the inner walls of the multiple filter bags (20). The inner wall of the box (1) is provided with a support structure on both sides of the thickness control structure; The outer walls of the connecting frame (10) are provided with buffer structures on both sides.

2. The apparatus for PCB full panel copper plating even thickening of claim 1, wherein, The support structure includes support steps (3) fixed to both sides of the inner wall of the box (1), and support rods (5) are fixedly connected to the top of each of the two support steps (3).

3. The apparatus for PCB full panel copper plating even thickening of claim 2, wherein, The top ends of the two support rods (5) are connected to push rods (6), and the top ends of the two push rods (6) are connected to a transmission structure (7). The outer wall of the transmission structure (7) is fitted with a transmission box (8).

4. The apparatus for PCB full panel copper plating even thickening of claim 3, wherein, The outer wall of the transmission box (8) is fitted with two sleeve blocks (9), and the bottom ends of the two sleeve blocks (9) are connected to the top end of the connecting frame (10).

5. The apparatus for PCB full panel copper plating even thickening of claim 1, wherein, The buffer structure includes connecting rods (11) fixed to both sides of the outer wall of the connecting frame (10), and rotating joints (12) rotatably connected to the ends of the two connecting rods (11) away from the connecting frame (10), and rotating arms (13) rotatably connected to the inner walls of the two rotating joints (12).

6. The apparatus for PCB full panel copper plating even thickening of claim 5, wherein, An extension plate (14) is fixedly connected to one end of the rotating arm (13) away from the rotating joint (12). A telescopic frame (15) is fixedly connected to the bottom end of the extension plate (14). One side of the bottom end of the telescopic frame (15) is fixed to the outer wall of the box (1).

7. The apparatus for PCB full panel copper plating even thickening of claim 1, wherein, The bottom of both sides of the outer wall of the box (1) is fixedly connected with support legs (2), and the inner wall of the box (1) is provided with an immersion tank (4) between two support steps (3), and the immersion tank (4) corresponds to multiple filter bags (20).

Images