Power contact structure for automated testing of semiconductor modules
By designing an automated testing contact structure, and using elastic elements to drive the contact boss to achieve rapid docking and separation with the semiconductor module electrode contacts, the problem of low efficiency in manual clamping is solved, and the testing efficiency of semiconductor modules is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHITWING DONGGUAN TECH
- Filing Date
- 2025-06-13
- Publication Date
- 2026-06-19
AI Technical Summary
In the existing technology, the manual opening and unclogging of the clamps leads to low testing efficiency for power semiconductor modules.
An automated test contact structure for semiconductor modules was designed, including a connection mounting part, a column part, a contact head, and an elastic element. The elastic element allows the contact boss to extend and retract within the mounting groove, enabling rapid docking and separation with the electrode contacts of the semiconductor module.
This improves the testing efficiency of semiconductor modules, enables rapid docking and separation of semiconductor module electrode contacts, and enhances testing efficiency.
Smart Images
Figure CN224383309U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor module testing technology, and more specifically, to an energized contact structure for automated testing of semiconductor modules. Background Technology
[0002] A power semiconductor module is a combination of components configured with specific functions and patterns. It consists of high-power electronic devices combined and encapsulated into a single unit. Power semiconductor modules can achieve different functions depending on the packaged components, such as semiconductor field-effect transistors, insulated-gate bipolar transistors, and power integrated circuits. Power semiconductor modules come in various shapes and sizes, with one common type having conductive leads parallel to the base plate.
[0003] Existing module test fixtures typically involve placing the power semiconductor module in a positioning fixture during testing, and then manually clamping the electrode contacts of the power semiconductor module using electrode clips to energize it. This method involves manual clamping and unclamping, resulting in slow loading and unloading efficiency, which negatively impacts the efficiency of the power semiconductor module.
[0004] Therefore, existing technologies still need to be improved and developed. Utility Model Content
[0005] The purpose of this application is to provide an energized contact structure for automated testing of semiconductor modules, which solves the problem of slow loading and unloading efficiency caused by manual clamping in the prior art, thus affecting the efficiency of power semiconductor modules.
[0006] To achieve the above objectives, the technical solution adopted in this application is as follows:
[0007] This application provides an energized contact structure for automated testing of a semiconductor module, including: a connection mounting part for connecting to an external fixture;
[0008] The column part is set on the connecting mounting part, and the column part has a mounting groove along the height direction, and a guide through hole is provided through the first direction, which is connected to the mounting groove.
[0009] The contact head includes a contact guide plate and a contact boss. The contact boss is fixedly disposed on one side of the contact guide plate in the height direction. The contact guide plate is inserted into the guide through hole so that the contact boss is located on the open side of the mounting groove.
[0010] The elastic element is set in the mounting groove and connected to the contact guide plate. Under the elastic force of the elastic element, the contact boss of the contact guide plate expands and contracts on the open side of the mounting groove.
[0011] In an optional embodiment, the contact guide plate is divided into a guide plate head and a guide plate tail in the first direction by the contact boss, and the guide through hole is divided into a first opening and a second opening in the first direction by the mounting groove, and the first opening and the second opening are located on opposite sides of the column portion.
[0012] In the first direction, the length of the guide plate head is less than the length of the guide plate tail. The guide plate head is movably embedded in the first orifice along the height direction, and the guide plate tail extends out of the second orifice.
[0013] In an optional embodiment, the guide plate head is square, the first orifice is square, and the two sides of the square guide plate head cooperate with the two side walls of the first orifice to allow the contact boss to move along the height direction.
[0014] In an optional embodiment, a connector is provided on the tail of the guide plate, the connector being located outside the second opening, and the connector is used to connect a cable.
[0015] In an optional embodiment, a threaded hole is provided on the tail of the guide plate, and the connector includes a conductive plate, with a locking through hole provided on the guide plate.
[0016] The conductive plate is screwed into the threaded hole by passing a screw through the locking through hole, so that the conductive plate and the tail of the guide plate can be detachably connected.
[0017] In an optional embodiment, a limiting groove is provided on the side of the contact guide plate away from the contact boss, and one end of the elastic element is disposed in the limiting groove.
[0018] In an optional embodiment, an insulating spacer is provided in the limiting groove, and the elastic element abuts against the insulating spacer.
[0019] In an optional embodiment, the column portion includes: a column body, and a guide hole and a mounting groove are both formed on the column body;
[0020] The bottom cover is attached to the bottom of the column to seal the mounting groove.
[0021] In an optional embodiment, the connecting mounting part includes: a support plate, the support plate being connected to the column part;
[0022] The waist-shaped hole is set on the support plate and can be adjusted to the external clamp by passing through screws.
[0023] In an optional embodiment, the bottom of the support plate is provided with a sliding groove for fitting onto an external clamp.
[0024] The beneficial effects of the energized contact structure for automated testing of semiconductor modules provided in this application are at least as follows: By fixing the connecting mounting part to an external clamp, the column can extend upwards. The contact guide plate of the contact head is connected to an external cable for energization, thereby energizing the contact boss. Since the elastic element is located in the mounting groove and connected to the contact guide plate, the contact guide plate can move up and down under the elastic force of the elastic element, allowing the contact boss to extend and retract on the open side of the mounting groove. When energizing the semiconductor module is required, the electrode contacts of the semiconductor module are simply placed on the contact boss. Under the elastic force of the elastic element, the contact boss abuts against the electrode contacts of the semiconductor module, achieving rapid engagement. After testing, simply lifting the semiconductor module disengages the electrode contacts from the contact boss, achieving rapid separation. Therefore, the testing efficiency of semiconductor modules is improved. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 A schematic diagram of the structure of an energized contact for automated testing of a semiconductor module provided in this application embodiment during use;
[0027] Figure 2 A schematic diagram of a power-on contact structure for automated testing of a semiconductor module provided in an embodiment of this application;
[0028] Figure 3 A cross-sectional view of an energized contact structure for automated testing of a semiconductor module, provided as an embodiment of this application;
[0029] Figure 4 This is a cross-sectional view of another structure of the energized contact structure for automated testing of a semiconductor module provided in this application embodiment.
[0030] The following are the labeling elements in the figure:
[0031] 10. Fixture; 20. Semiconductor module; 100. Connecting mounting part; 110. Support plate; 120. Waist-shaped hole; 130. Sliding groove; 200. Column part; 210. Mounting groove; 220. Guide through hole; 221. First opening; 222. Second opening; 230. Column body; 240. Bottom cover; 300. Contact head; 310. Contact guide plate; 311. Guide plate head; 312. Guide plate tail; 320. Contact boss; 330. Connector; 331. Threaded hole; 332. Conductive plate; 340. Limiting groove; 341. Insulating spacer; 400. Elastic element. Detailed Implementation
[0032] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.
[0033] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.
[0034] like Figure 1 As shown, this embodiment proposes an energized contact structure for automated testing of semiconductor modules. This structure can be mounted on an external fixture 10 and used to test a semiconductor module 20 positioned on the fixture 10. After the semiconductor module 20 is positioned on the fixture 10, its electrode contacts are used to establish electrical connection with this energized contact structure. For ease of description, the structure is illustrated using the orientation of the semiconductor module during testing as an example. The long side of the semiconductor module 20 is positioned along the front-back direction, and the wide side is positioned along the left-right direction. All components in this embodiment are described with reference to the above orientation.
[0035] like Figure 1 , Figure 2As shown, the energized contact structure of this embodiment mainly includes: a connecting mounting part 100, a column part 200, a contact head 300, and an elastic element 400. The connecting mounting part 100 is used to connect to an external clamp to fix the entire structure. The column part 200 is disposed on the connecting mounting part 100, and a mounting groove 210 is formed on the column part 200 along the height direction. The opening of the mounting groove 210 faces upward to form an open side. A guide through hole 220 is provided through the column part 200 along a first direction, which can be a front-back direction. The guide through hole 220 is connected to the mounting groove 210 to form a mounting position. The contact head 300 includes a contact guide plate 310 and a contact boss 320. The contact boss 320 is fixedly disposed on one side of the contact guide plate 310 in the height direction. The contact guide plate 310 is inserted into the guide hole 220 so that the contact boss 320 is located on the open side of the mounting groove 210. The guide hole 220 is relatively large in the vertical direction, which is sufficient to allow the contact guide plate 310 and the contact boss 320 to pass through the guide hole 220 in the direction from front to back. After the contact boss 320 reaches the position of the mounting groove 210, the contact guide plate 310 can be lifted upward so that the contact boss 320 is installed in the mounting groove 210 and protrudes from the open side of the mounting groove 210. The elastic element 400 is disposed within the mounting groove 210 and connected to the contact guide plate 310. Under the elastic force of the elastic element 400, the contact guide plate 310 causes the contact boss 320 to extend and retract on the open side of the mounting groove 210. When the contact guide plate 310 and the contact boss 320 are inserted into the guide through hole 220 in the front-to-back direction, the elastic element 400 is pressed down; when the contact boss 320 reaches the position of the mounting groove 210, the contact boss 320 is lifted by the action of the elastic element 400, thereby allowing the contact boss 320 to move up and down. It is easy to imagine that the first direction can also be the left-right direction.
[0036] like Figure 1As shown, the energized contact structure for automated testing of a semiconductor module in this embodiment is fixed by connecting and mounting part 100 to an external clamp, allowing the column part 200 to extend upwards. The contact guide plate 310 of the contact head 300 is connected to an external cable for energization, thereby energizing the contact boss 320. Since the elastic member 400 is disposed in the mounting groove 210 and connected to the contact guide plate 310, the contact guide plate 310 can move up and down under the elastic force of the elastic member 400, thereby allowing the contact boss 320 to extend and retract on the open side of the mounting groove 210. When power needs to be applied to the semiconductor module, simply place the electrode contacts of the semiconductor module onto the contact protrusion 320. Under the elastic force of the elastic element 400, the contact protrusion 320 will press firmly against the electrode contacts of the semiconductor module, achieving rapid connection. After testing, simply lift the semiconductor module to disengage the electrode contacts from the contact protrusion 320, thus achieving rapid separation. This improves the testing efficiency of the semiconductor module.
[0037] like Figure 2 , Figure 3 As shown, further, in this embodiment, the contact guide plate 310 is divided into a guide plate head 311 and a guide plate tail 312 in the first direction, with the contact boss 320 as the boundary. The guide through hole 220 is divided into a first opening 221 and a second opening 222 in the first direction, with the mounting groove 210 as the boundary. The first opening 221 and the second opening 222 are located on opposite sides of the column portion 200. In the first direction, the length of the guide plate head 311 is less than the length of the guide plate tail 312. The guide plate head 311 is movably embedded in the first opening 221 along the height direction, and the guide plate tail 312 extends out of the second opening 222. In the specific structure, the contact guide plate 310 extends a predetermined length in the front-to-back direction to form a long strip. The contact boss 320 is located on the upper surface of the contact guide plate 310 and is located near the rear end. This makes the length of the guide plate head 311 greater than the length of the guide plate tail 312, which facilitates the guide plate tail 312 and the contact boss 320 to be inserted into the guide through hole 220 first. When the guide plate head 311 is embedded in the first hole 221, the contact boss 320 is embedded in the mounting groove 210 and moves in the up-down direction.
[0038] like Figure 2 , Figure 3As shown, in this embodiment, the guide plate head 311 is further configured as square, and the first opening 221 is a square hole. The two sides of the square guide plate head 311 cooperate with the two side walls of the first opening 221 to allow the contact protrusion 320 to move along the height direction. By limiting the position of the guide plate head 311 in the left and right directions through the two side walls of the first opening 221, the two side walls of the guide plate head 311 in the left and right directions can abut against the inner wall of the first opening 221 and move up and down, thereby limiting the position of the guide plate head 311 in the left and right directions, optimizing the structure, and ensuring the stability of the contact protrusion 320's movement and extension in the height direction.
[0039] In addition, the contact boss 320 can be square, and the open side of the mounting groove 210 also adopts a square opening. When the contact boss 320 is inserted into the mounting groove 210, it can cooperate with the square opening, especially the side wall in the front and rear direction and the inner wall in the front and rear direction of the square opening, so as to effectively limit the movement in the front and rear direction and ensure the stability of the contact boss 320 in the height direction.
[0040] like Figure 2 , Figure 3 As shown, in this embodiment, a connector 330 is further provided on the tail portion 312 of the guide plate. The connector 330 is located outside the second opening 222 and is used to connect cables. The connector 330 makes cable connection more convenient.
[0041] like Figure 2 , Figure 3 As shown, in this embodiment, a threaded hole 331 is provided on the tail portion 312 of the guide plate, and the connector 330 includes a conductive plate 332 with a locking through hole. A screw is threaded through the locking through hole and screwed onto the threaded hole 331, allowing the conductive plate 332 to be detachably connected to the tail portion 312 of the guide plate. Using screws for fixing facilitates the installation and removal of the conductive plate 332, and provides a stable fixation between the conductive plate 332 and the tail portion 312 of the guide plate. This prevents loosening during overall structural movement, effectively achieving a loosening effect.
[0042] like Figure 2 , Figure 4 As shown, further, in some structures of the contact guide plate 310, a limiting groove 340 is provided on the side of the contact guide plate 310 away from the contact boss 320, and one end of the elastic member 400 is disposed in the limiting groove 340. In this embodiment, the elastic member 400 can be a spring, which is limited at the lower part of the mounting groove 210 and abuts against the bottom of the contact guide plate 310 to push the contact guide plate 310. However, when the lower part of the limiting groove 340 is relatively shallow, the elastic member 400 will easily wobble at the bottom of the mounting groove 210. Therefore, the upper part of the spring is also limited by the limiting groove 340, so that the spring can be stably limited in the mounting groove 210.
[0043] like Figure 2 , Figure 4 As shown, an insulating spacer 341 is provided within the limiting groove 340, and the elastic element 400 abuts against the insulating spacer 341. Since electricity is conducted through the contact guide plate 310, and the spring is a metal spring, the insulating spacer 341 provides insulation, preventing the spring from conducting electricity. This allows the current to concentrate on the contact guide plate 310 and the contact boss 320, thus maximizing its utilization. Additionally, the insulating spacer 341 increases the contact friction with the spring, thereby keeping the spring position relatively fixed and preventing circumferential rotation during spring compression.
[0044] like Figure 1 , Figure 2 , Figure 3 As shown, the column portion 200 in this embodiment further includes a column body 230 and a bottom cover 240. A guide hole 220 and a mounting groove 210 are both formed on the column body 230, and the bottom cover 240 is connected to the bottom of the column body 230 to seal the mounting groove 210. The design of the column body 230 and the bottom cover 240 facilitates the creation of a guide hole 220 along the front-rear direction after an axial through hole is formed on the column. The bottom of the through hole is then sealed by the bottom cover 240 to form the mounting groove 210. This makes the machining of the hole and groove structure more convenient. Furthermore, a spring can be inserted into the mounting groove 210 from the bottom of the through hole and then sealed by the bottom cover 240, making spring installation more convenient and facilitating assembly and disassembly.
[0045] like Figure 1 , Figure 2 , Figure 3 As shown, the connection mounting part 100 in this embodiment further includes a support plate 110, which is connected to the column part 200. The support plate 110 can be disposed on one side of the column in a first direction. An oblong hole 120 is provided on the support plate 110, and it can be adjusted and connected to an external clamp by passing screws through it. By adjusting the position of the oblong hole 120 and the screw, the position of the energized contact structure can be easily adjusted, making the energized contact structure more practical.
[0046] like Figure 1 , Figure 2 , Figure 3 As shown, in this embodiment, the bottom of the support plate 110 is provided with a sliding groove 130, which is used to be sleeved on the external clamp. Typically, the support plate 110 is used to connect to the horizontal plate of the external clamp. By sleeved on the horizontal plate through the sliding groove 130 and cooperating with the side wall of the horizontal plate for guidance, the support plate 110 can be moved stably, so that the energized contact structure can be adjusted with high precision.
[0047] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. An energizing contact structure for automated testing of a semiconductor module, characterized by include: A connecting mounting part, which is used to connect to an external clamp; The column portion is disposed on the connecting mounting portion, and the column portion is provided with a mounting groove along the height direction and a guide through hole is provided through the first direction, the guide through hole being connected to the mounting groove; The contact head includes a contact guide plate and a contact boss. The contact boss is fixedly disposed on one side of the contact guide plate in the height direction. The contact guide plate is inserted into the guide through hole so that the contact boss is located on the open side of the mounting groove. An elastic element is disposed in the mounting groove and connected to the contact guide plate. Under the elastic force of the elastic element, the contact guide plate causes the contact boss to extend and retract on the open side of the mounting groove.
2. The power contact structure for automated testing of semiconductor modules of claim 1, wherein, The contact guide plate is divided into a guide plate head and a guide plate tail in the first direction by the contact boss. The guide through hole is divided into a first opening and a second opening in the first direction by the mounting groove. The first opening and the second opening are located on opposite sides of the column portion. In a first direction, the length of the guide plate head is less than the length of the guide plate tail. The guide plate head is movably embedded in the first orifice along the height direction, and the guide plate tail extends out of the second orifice.
3. The power contact structure for automated testing of semiconductor modules of claim 2, wherein, The guide plate head is square, and the first orifice is a square hole. The two sides of the square guide plate head cooperate with the two side walls of the first orifice so that the contact protrusion can move along the height direction.
4. The power contact structure for automated testing of semiconductor modules of claim 3, wherein, A connector is provided at the tail of the guide plate. The connector is located outside the second opening and is used to connect a cable.
5. The power contact structure for automated testing of semiconductor modules of claim 4, wherein, The guide plate has a threaded hole at its tail end, and the connector includes a conductive plate with a locking through hole. The conductive plate is screwed into the threaded hole by passing a screw through the locking through hole, so that the conductive plate and the tail of the guide plate are detachably connected.
6. The power contact structure for automated testing of semiconductor modules of claim 5, wherein, The contact guide plate is provided with a limiting groove on the side opposite to the contact boss, and one end of the elastic element is disposed in the limiting groove.
7. The power contact structure for automated testing of semiconductor modules of claim 6, wherein, An insulating spacer is provided inside the limiting groove, and the elastic element abuts against the insulating spacer.
8. The power contact structure for automated testing of semiconductor modules of claim 1, wherein, The column part Includes: a column, wherein the guide hole and the mounting groove are both formed on the column; A bottom cover, which is attached to the bottom of the column to seal the mounting groove.
9. An energizing contact structure for automated testing of semiconductor modules according to any one of claims 1 to 8, characterized in that The connecting and mounting part includes: a support plate, which is connected to the column part; The waist-shaped hole is provided on the support plate and is adjustablely connected to an external clamp by means of screws.
10. The power contact structure for automated testing of semiconductor modules of claim 9, wherein, The bottom of the support plate is provided with a sliding groove, which is used to fit onto an external clamp.