Optical functional plate and backlight module

Abstract

The application provides an optical functional plate and a backlight module. The optical functional plate comprises an optical film and a diffusion plate which are arranged in layers, and a non-continuous welding line is formed around the periphery of the optical film to enable the optical film to be fusion welded to the diffusion plate. The optical functional plate can realize simple structure, ensure fixing stability, reduce the generation of light spots and ensure display effect.

Description

Technical Field

[0001] This utility model relates to the field of liquid crystal display technology, and in particular to an optical functional board and a backlight module. Background Technology

[0002] Large-sized optical films are typically assembled using the following three methods:

[0003] Firstly, the diffuser plate and optical film are stacked sequentially, and then the OC and cover plate are assembled sequentially to complete the optical display module. However, this method requires consideration of the fixing method when placing the optical film and the limitation of the relative position between the diffuser plate and the optical film. Therefore, some additional mechanisms and parts need to be designed to fix them to prevent displacement and falling. The structure is complex, making the assembly process cumbersome and inefficient, and unable to further reduce production costs.

[0004] Secondly, the diffuser plate and the optical film are bonded together with glue or tape, and then the OC and cover plate are assembled in sequence to complete the assembly of the optical display module. For example, the utility model patent application with application number CN201320464112.3. Although this method pre-bonds the diffuser plate and the optical film together, which can reduce the complexity of the mechanical structure, it is difficult to avoid glue or tape adhering to other positions and causing dirt inside the film during the process of bonding and placing the optical film on the diffuser film. This results in poor display effect, and the glue or tape is prone to aging, which affects the fixing stability of the diffuser plate and the optical film.

[0005] Thirdly, the diffuser plate is welded to the optical film, and then the 0C and cover plate are assembled in sequence to complete the optical display module of the whole machine. For example, the utility model patent application with application number CN 202022289683.0 uses this method to ensure the fixed stability of the diffuser plate and the optical film. However, because the thermal expansion or contraction stress of the materials of the diffuser plate and the optical film are different, or even far different, the optical film will bulge during use if the edges of the diffuser plate and the optical film are welded into a whole structure, which will produce light spots and affect the liquid crystal display effect. Utility Model Content

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide an optical functional board and backlight module that can simplify the structure, ensure fixed stability, and reduce the generation of light spots to ensure display effect.

[0007] The objective of this utility model is achieved through the following technical solution:

[0008] An optical functional board includes an optical film and a diffuser plate stacked together, wherein discontinuous bonding lines are formed around the periphery of the optical film to weld the optical film to the diffuser plate.

[0009] In one embodiment, the optical functional board is provided with a plurality of heat source corresponding areas, and a heat-avoiding soldering area is provided between every two adjacent heat source corresponding areas. Each heat-avoiding soldering area is located at the periphery of the optical film, and each heat-avoiding soldering area is used to form the solder line.

[0010] In one embodiment, the heat-resistant soldering area is used to form raised solder joints that diffuse from the optical film toward the diffuser plate, and to be fused to the diffuser plate to form the solder line.

[0011] In one embodiment, the height of the raised solder joint is 0.1mm to 0.3mm.

[0012] In one embodiment, the shortest straight-line distance between the heat-avoiding welding area and the adjacent heat source corresponding area is greater than or equal to 2 cm.

[0013] In one embodiment, the longest straight-line distance between the welding wire and the adjacent heat source corresponding area is less than or equal to 8 cm.

[0014] In one embodiment, the distance between the heat-avoiding welding area and the area corresponding to the heat source increases as the area corresponding to the heat source increases.

[0015] In one embodiment, the distance between two adjacent heat-avoiding welding zones increases by 0.5 cm to 2 cm for every 5 to 10 square centimeters of the area corresponding to the heat source.

[0016] In one embodiment, the length of each weld wire segment is greater than or equal to 2 cm.

[0017] In one embodiment, the optical film is a polyethylene terephthalate optical film.

[0018] In one embodiment, the diffusion plate is a polymethyl methacrylate diffusion plate, a polycarbonate diffusion plate, or a polystyrene diffusion plate.

[0019] In one embodiment, the thickness of the optical film is 100 μm to 600 μm.

[0020] In one embodiment, the thickness of the diffuser plate is greater than 0.3 mm.

[0021] A backlight module includes the optical functional board described in any of the above embodiments.

[0022] Compared with the prior art, the present invention has at least the following advantages:

[0023] The optical functional plate of this invention features discontinuous bonding lines forming around the periphery of the stacked optical film and diffuser plate. Specifically, each pair of adjacent bonding lines on each edge of the optical functional plate is spaced apart but linearly continuous. All bonding lines on each edge of the optical functional plate extend in the same direction but are discontinuous. This bonding line arrangement effectively ensures the welding and fixing strength between the optical film and the diffuser plate, simplifying the structure. Furthermore, the unwelded portions between the bonding lines do not undergo thermal expansion during the welding of the optical film to the diffuser plate, effectively reducing the overall cooling and shrinkage stress difference of the optical film. This, in turn, reduces wrinkles and warping of the optical functional plate, thereby reducing light spots and ensuring optimal display performance. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a flowchart illustrating the fabrication process of the optical functional plate according to one embodiment of the present invention.

[0026] Figure 2 This is a schematic diagram of the structure of an optical functional plate according to one embodiment of the present invention;

[0027] Figure 3 for Figure 2 A partial cross-sectional view of the optical functional panel shown. Detailed Implementation

[0028] To facilitate understanding of this utility model, a more comprehensive description will be given below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of this utility model. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0029] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0031] This application provides a fabrication process for an optical functional plate. The fabrication process of the optical functional plate includes the following steps: obtaining an optical film and a diffuser plate; performing a stacking process on the optical film and the diffuser plate to form a pre-treated optical functional plate; performing a discontinuous welding operation on the pre-treated optical functional plate to form discontinuous weld lines on the pre-treated optical functional plate, and the weld lines are arranged around the periphery of the pre-treated optical functional plate to obtain the optical functional plate.

[0032] The aforementioned optical functional plate fabrication process involves discontinuous welding of the stacked optical films and diffuser plates, resulting in discontinuous weld lines on the pre-processed optical functional plate. This means multiple weld lines are formed on the pre-processed optical functional plate, surrounding its perimeter. Each pair of adjacent weld lines on each edge of the optical film is spaced apart but linearly continuous; that is, all weld lines on each edge of the optical film extend in the same direction but are discontinuous. This weld line arrangement effectively ensures the welding strength between the optical film and the diffuser plate, simplifying the structure. Furthermore, the unwelded portions between weld lines do not undergo thermal expansion during the welding of the optical film to the diffuser plate, effectively reducing the overall cooling and shrinkage stress difference of the optical film. This, in turn, reduces wrinkles and warping of the optical functional plate, thereby minimizing light spots and ensuring optimal display performance.

[0033] To better understand the fabrication process of the optical functional plate of this application, the following further explanation of the fabrication process of the optical functional plate of this application is provided:

[0034] Please see Figure 1 The fabrication process of the optical functional plate according to one embodiment includes the following steps:

[0035] S100, Obtain optical films and diffusers.

[0036] S200: The optical film and diffuser plate are stacked to form a pre-processed optical functional plate. It can be understood that stacking the obtained optical film and diffuser plate ensures the accurate arrangement of their relative positions.

[0037] S300. A discontinuous welding operation is performed on the pre-processed optical functional board to form discontinuous weld lines on the pre-processed optical functional board, and the weld lines are arranged around the periphery of the pre-processed optical functional board to obtain the optical functional board. It can be understood that the discontinuous welding of the stacked optical film and diffuser plate forms discontinuous weld lines on the pre-processed optical functional board, that is, multiple weld lines are formed on the pre-processed optical functional board, and the multiple weld lines are arranged around the periphery of the pre-processed optical functional board. Each pair of adjacent weld lines on each edge of the optical film is spaced apart but linearly continuous. That is, all weld lines on each edge of the optical film extend in the same direction but are not continuous. In this way, the arrangement of the weld lines ensures the welding fixation strength of the optical film to the diffuser plate, and simplifies the structure. The unwelded parts between the weld lines do not undergo thermal expansion when the optical film is welded to the diffuser plate, which effectively reduces the overall cooling and contraction stress difference of the optical film, thereby reducing the bulging of the optical film and reducing the generation of light spots, thus ensuring the display effect.

[0038] The aforementioned optical functional plate fabrication process involves discontinuous welding of the stacked optical films and diffuser plates, resulting in discontinuous weld lines on the pre-processed optical functional plate. This means multiple weld lines are formed on the pre-processed optical functional plate, surrounding its perimeter. Each pair of adjacent weld lines on each edge of the optical film is spaced apart but linearly continuous; that is, all weld lines on each edge of the optical film extend in the same direction but are discontinuous. This weld line arrangement effectively ensures the welding strength between the optical film and the diffuser plate, simplifying the structure. Furthermore, the unwelded portions between weld lines do not undergo thermal expansion during the welding of the optical film to the diffuser plate, effectively reducing the overall cooling and shrinkage stress difference of the optical film. This, in turn, reduces wrinkles and warping of the optical functional plate, thereby minimizing light spots and ensuring optimal display performance.

[0039] It should be noted that although discontinuous solder lines are formed on the optical functional board, effectively reducing wrinkles and warpage, the proximity of the optical functional board to heat sources, such as LED beads and driver ICs, in the backlight module due to the thinning of LCD displays, combined with the significant difference in thermal expansion stress between the optical films and diffusers in the optical functional board, can easily cause wrinkles and warpage during use, resulting in light spots and significantly impacting the display effect. To further reduce light spots and ensure display quality, in one embodiment, a discontinuous soldering operation is performed on the pre-processed optical functional board, including the following steps:

[0040] S310. Obtain heat source information of the optical film, including the number of heat sources and the distribution area of ​​the heat sources.

[0041] It can be understood that the heat source distribution area is the corresponding area of ​​the heat-generating components in the optical film and the backlight module, such as LED beads and driver ICs. Thus, the size of the heat source distribution areas may be different, the same, or partially the same, and the heat source distribution area is information determined through the design of the backlight module and before the backlight module is processed.

[0042] S330. Set up heat-avoiding soldering zones according to heat source information. Each heat-avoiding soldering zone is located between every two adjacent heat source distribution areas, and the heat-avoiding soldering zone is located at the periphery of the optical functional board.

[0043] It is understandable that heat-avoiding soldering zones are set according to the distribution area and number of heat sources. Each heat-avoiding soldering zone is located between every two adjacent heat source distribution areas, and the heat-avoiding soldering zone is located at the periphery of the optical functional board. This ensures that subsequent solder lines are formed between every two adjacent heat source distribution areas, that is, the solder lines are formed at the periphery of the optical functional board, and the solder lines are formed between the periphery of the optical functional board and the area corresponding to the heat source distribution area, thus achieving the setting of solder lines avoiding heat sources.

[0044] S350. Perform welding treatment on the heat-shielded welding area to form a weld line at each heat-shielded welding area.

[0045] It is understandable that, due to the fact that the optical film corresponding to the heat source on the optical functional board is prone to thermal expansion during use, and the degree of thermal expansion of the optical film is greater than that of the diffuser plate, the bonding wires in the area corresponding to the heat source are subjected to greater deformation stress, resulting in severe wrinkles and warping at the bonding wires. Therefore, in this application, in order to further reduce the wrinkles and warping of the optical functional board, bonding wires are formed on the heat-avoiding bonding area, so that the bonding wires are formed between the two heat source distribution areas and better avoid the heat source distribution areas, thus preventing the formation of bonding wires on the optical functional board in the area corresponding to the heat source. This design ensures that the unwelded portion of the optical functional board between each pair of adjacent solder lines serves as a buffer for the thermal expansion stress of the optical functional board. In other words, it causes the deformation of the optical functional board caused by the thermal expansion stress to be buffered, distributing the thermal expansion stress across the entire optical functional board between each pair of adjacent solder lines. This prevents localized high stress from causing bulging of the optical film in the soldered portion of the optical functional board, effectively reducing light leakage, wrinkles, and warping, thus ensuring optimal display performance.

[0046] The aforementioned heat-avoiding soldering zones are set according to the distribution area and number of heat sources. Each heat-avoiding soldering zone is located between two adjacent heat source distribution areas and at the periphery of the optical functional board. This ensures that the solder lines are formed between two heat source distribution areas, effectively avoiding the heat source distribution areas. It also ensures that no solder lines are formed on the optical functional board at the locations corresponding to the heat sources. Furthermore, the unwelded portion of the optical functional board between each two adjacent solder lines serves as a distribution part of the thermal expansion stress of the optical functional board. This causes the deformation of the optical functional board corresponding to the unwelded portion between each two adjacent solder lines to be buffered by the thermal expansion stress. In other words, it causes the thermal expansion stress to be dispersed on the entire optical functional board corresponding to the unwelded portion between each two adjacent solder lines, avoiding the bulging of the optical film in the soldered part of the optical functional board due to large local stress. This effectively reduces light leakage and wrinkles and warping of the optical functional board, ensuring the display effect.

[0047] In one embodiment, the distance between the heat-shielded welding area and the heat source distribution area increases as the area of ​​the heat source distribution area increases.

[0048] It should be noted that the non-continuous welding method used to form discontinuous bonding lines on the optical functional board results in unwelded portions of the board located between two bonding lines. This makes it easier for the optical film and diffuser plate corresponding to the unwelded portions between the bonding lines to move relative to each other or for local gaps to increase due to wrinkles and warping. This can exacerbate light leakage problems. To reduce light spots and leakage and ensure display quality, in one embodiment, the heat-resistant bonding area is welded. The specific operation is as follows:

[0049] The heat-shielded welding area is pulsed to form raised weld points on the optical film at each heat-shielded welding area, which diffuse from the optical film toward the diffuser plate and are then fused to the diffuser plate to form weld lines.

[0050] It is understandable that pulse welding is used to form weld lines in the heat-avoiding welding area. Specifically, in each heat-avoiding welding area, the optical film forms raised weld points that diffuse from the optical film towards the diffuser plate, and these raised weld points are fused to the diffuser plate to form weld lines. In effect, the weld lines are formed by the fusion of raised weld points to the diffuser plate. The raised weld points are fused to the diffuser plate, making them appear as an integral structure with the optical film and the diffuser plate. That is, at good weld line locations, the optical film and the diffuser plate are tightly attached together. During the pulse welding process, the optical film as a whole remains unobstructed. The heat-fused diffusion method involves the raised solder joints diffusing from the optical film towards the diffuser plate during heat fusion. Heat is preferentially directed to the diffuser plate, which effectively reduces the thermal deformation of the optical film and further reduces wrinkles and warping at the solder lines. This ensures control of the gap between the unwelded portion of the optical film and the diffuser plate, reducing light spots and light leakage, thus ensuring the display effect. Furthermore, the solder lines are heat-fused to the diffuser plate through the raised solder joints, which effectively ensures the strength of the weld, i.e., effectively ensures the fixing strength of the optical functional board.

[0051] It should be noted that if the bonding wires are not positioned to avoid the area corresponding to the heat source distribution region of the optical functional board, the bonding wires will experience significant warping and wrinkling due to the heat source. Combined with discontinuous bonding wires, this will cause significant bulging of the unbonded optical functional board adjacent to the bonding wires, greatly increasing light leakage. Therefore, discontinuous bonding wires are generally less common on the upper layer of the optical functional board. However, in this application, the bonding wires are formed to avoid the area corresponding to the heat source distribution region of the optical functional board, which on the one hand... This effectively reduces the distribution range of the bonding wires on the optical functional board, thus initially reducing warping and wrinkles. Furthermore, it avoids areas with high stress at the bonding wire locations, further reducing warping and wrinkles. However, even with these improvements, the discontinuous bonding wires on the optical functional board actually increase the risk of light leakage compared to continuous bonding wires around the perimeter. This is primarily because warping and wrinkles at the bonding wire locations are more likely to occur around the perimeter of the optical functional board. The relative displacement of certain parts and the increased gap between the optical film and the diffuser plate in the optical functional board are more likely to occur. In this application, the bonding wires are positioned away from the periphery of the optical functional board and the area corresponding to the heat source distribution area. This firstly reduces warping and wrinkling at the bonding wires. Secondly, it allows the optical film to form raised bonding points that diffuse from the optical film toward the diffuser plate in each heat-avoiding bonding area, and these points are fused to the diffuser plate to form bonding wires. That is, the raised bonding points are fused to the diffuser plate, making the raised bonding points appear as an integral structure with the optical film and the diffuser plate. In other words, at the bonding wire locations, the optical film and the diffuser plate are integrated. With the plates tightly bonded together, during the pulse welding process, the optical film as a whole does not exhibit significant heat diffusion. Only the raised solder joints during heat melting diffuse heat from the optical film toward the diffuser plate. Heat is preferentially directed to the diffuser plate, effectively reducing the thermal deformation of the optical film and further mitigating wrinkles and warping at the weld lines. This ensures control over the gap between the optical film and the diffuser plate in the unwelded sections between the weld lines, as well as control over the relative displacement between the optical film and the diffuser plate in the unwelded sections between the weld lines. Consequently, it effectively reduces light spots and light leakage, ensuring optimal display performance.

[0052] This application also provides an optical functional plate, which is prepared by the optical functional plate preparation method of any of the above embodiments. The optical functional plate includes an optical film and a diffuser plate stacked together, and discontinuous bonding lines are formed around the periphery of the optical film to weld the optical film to the diffuser plate.

[0053] The aforementioned optical functional board features discontinuous bonding lines around the periphery of the stacked optical films and diffuser plates. This means that each pair of adjacent bonding lines on each edge of the optical functional board is spaced apart but linearly continuous. In other words, all bonding lines on each edge of the optical functional board extend in the same direction but are discontinuous. This bonding line arrangement effectively ensures the welding and fixing strength between the optical films and the diffuser plate, simplifying the structure. Furthermore, the unwelded portions between the bonding lines do not undergo thermal expansion during the welding of the optical films to the diffuser plate, effectively reducing the overall cooling and shrinkage stress difference of the optical films. This, in turn, reduces wrinkles and warping in the optical functional board, thereby reducing light spots and ensuring optimal display performance.

[0054] To better understand the optical functional board of this application, the following further explanation is provided:

[0055] Please refer to the following: Figures 2 to 3 One embodiment of the optical functional plate 10 includes an optical film 100 and a diffuser plate 200 stacked together. The periphery of the optical film 100 is surrounded by discontinuous bonding lines (not shown) so that the optical film 100 is fused to the diffuser plate 200.

[0056] The aforementioned optical functional plate 10 has discontinuous bonding lines forming around the periphery of the stacked optical film 100 and diffuser plate 200. That is, each pair of adjacent bonding lines on each edge of the optical functional plate 10 are spaced apart but linearly continuous. In other words, all bonding lines on each edge of the optical functional plate 10 extend in the same direction but are not continuous. In this way, the bonding lines effectively ensure the welding and fixing strength of the optical film 100 to the diffuser plate 200, simplifying the structure. The unwelded parts between the bonding lines do not undergo thermal expansion when the optical film 100 is welded to the diffuser plate 200, effectively reducing the overall cooling and shrinkage stress difference of the optical film 100. This, in turn, reduces the wrinkles and warping of the optical functional plate 10, thereby reducing the generation of light spots and ensuring the display effect.

[0057] Please refer to the following: Figures 2 to 3In one embodiment, the optical functional plate 10 is provided with a plurality of heat source corresponding areas 101, and a heat-avoiding soldering area 102 is provided between every two adjacent heat source corresponding areas 101. Each heat-avoiding soldering area 102 is located at the periphery of the optical film 100, and each heat-avoiding soldering area 102 is used to form a solder line (not shown). It is understood that since the optical film 100 corresponding to the heat source of the optical functional plate 10 is prone to thermal expansion when heated during use, and the degree of thermal expansion of the optical film 100 is greater than that of the diffuser plate 200, the solder line at the part corresponding to the heat source area is subjected to greater deformation stress, resulting in more severe wrinkles and warping at the solder line. Therefore, in this application, in order to further reduce the wrinkles and warping of the optical functional plate 10, the solder line is formed on the heat-avoiding soldering area 102, so that the solder line is formed between two heat source distribution areas and better avoids the heat source distribution areas, so that the optical functional plate 10 does not form a solder line at the part corresponding to the heat source. This design ensures that the unwelded portion between each pair of adjacent solder lines serves as a buffer for the thermal expansion stress of the optical functional board 10. In other words, it causes a transitional buffering effect on the deformation caused by the thermal expansion stress of the optical functional board 10, dispersing the thermal expansion stress across the entire optical functional board 10. This prevents excessive localized stress from causing bulging of the optical film 100 in the soldered portion of the optical functional board 10, effectively reducing light leakage and wrinkles and warping of the optical functional board 10, thus ensuring optimal display performance.

[0058] In one embodiment, the heat-resistant soldering area is used to form raised solder joints that diffuse from the optical film toward the diffuser plate and are fused to the diffuser plate to form solder lines. It is understandable that the optical film forms raised solder points at each heat-avoiding soldering area, which diffuse from the optical film toward the diffuser plate. These raised solder points are fused to the diffuser plate to form solder lines. In effect, the solder lines are formed by the fusion of raised solder points to the diffuser plate. The raised solder points are fused to the diffuser plate, making them appear as an integral structure with the optical film and the diffuser plate. That is, at good solder line locations, the optical film and the diffuser plate are tightly attached together. During pulse welding, the optical film as a whole does not exhibit significant heat diffusion. Only during heat melting, the raised solder points diffuse from the optical film toward the diffuser plate. Heat is preferentially directed to the diffuser plate, which effectively reduces the thermal deformation of the optical film and further reduces wrinkles and warping at the solder lines. This ensures the control of the gap between the unwelded portion of the optical film and the diffuser plate between the solder lines, reducing light spots and light leakage, thereby ensuring the display effect. Furthermore, the solder lines are fused to the diffuser plate through the raised solder points, which effectively ensures the strength of the weld, that is, effectively ensures the fixing strength of the optical functional board.

[0059] In one embodiment, the height of the raised solder joint is 0.1mm to 0.3mm, which better ensures the strength of the solder joint, that is, better ensures the fixing strength of the optical functional board.

[0060] In one embodiment, the distance between the heat-shielding soldering area and the corresponding heat source area increases with the area of ​​the corresponding heat source area. Further, the distance between two adjacent heat-shielding soldering areas increases by 0.5cm to 2cm for every 5 to 10 square centimeters of the area corresponding to the heat source area. That is, the distance between two adjacent heat-shielding soldering areas changes with the area of ​​the heat source area located between the two adjacent heat-shielding soldering areas, increasing by 0.5cm to 2cm for every 5 to 10 square centimeters. This better ensures the strength of the soldering, thus better ensuring the fixing strength of the optical functional board, and better reducing light leakage. It also effectively reduces the occurrence of wrinkles and warping of the optical functional board, ensuring the display effect.

[0061] In one embodiment, the shortest straight-line distance 'a' between the solder wire and the adjacent heat source corresponding area is greater than or equal to 2 cm. Further, the longest straight-line distance 'a' between the solder wire and the adjacent heat source corresponding area is less than or equal to 8 cm. Further, the shortest straight-line distance 'b' between two adjacent heat-shielding solder areas is greater than or equal to 4 cm. The length of each solder wire segment is greater than or equal to 2 cm, which better ensures the strength of the solder joint, thus better ensuring the fixing strength of the optical functional board, and better reducing light leakage. It also effectively reduces the occurrence of wrinkles and warping of the optical functional board, ensuring the display effect.

[0062] In one embodiment, the optical film is a polyethylene terephthalate optical film.

[0063] In one embodiment, the diffusion plate is a polymethyl methacrylate diffusion plate, a polycarbonate diffusion plate, or a polystyrene diffusion plate.

[0064] In one embodiment, the thickness of the optical film is 100 μm to 600 μm.

[0065] In one embodiment, the thickness of the diffuser plate is greater than 0.3 mm.

[0066] It should be noted that the defect rate of light spots generated by the optical functional boards prepared by the above-described optical functional board manufacturing process within the above parameter range can all reach less than 0.02%.

[0067] This application also provides a backlight module, including the optical functional board of any of the above embodiments. Further details are also available in the following documents. Figures 2 to 3In this embodiment, the optical functional plate 10 includes an optical film 100 and a diffuser plate 200 stacked together. The periphery of the optical film 100 is surrounded by discontinuous bonding lines so that the optical film 100 is fused to the diffuser plate 200.

[0068] Compared with the prior art, the present invention has at least the following advantages:

[0069] The manufacturing process of the optical functional plate 10 of this invention involves discontinuous welding of the stacked optical film 100 and diffuser plate 200, resulting in discontinuous weld lines on the pre-processed optical functional plate 10. This means multiple weld lines are formed on the pre-processed optical functional plate 10, surrounding its periphery. Each pair of adjacent weld lines on each edge of the optical film 100 are spaced apart but linearly continuous. In other words, all weld lines on each edge of the optical film 100 extend in the same direction but are discontinuous. This weld line arrangement effectively ensures the welding and fixing strength between the optical film 100 and the diffuser plate 200, simplifying the structure. Furthermore, the unwelded portions between the weld lines do not undergo thermal expansion when the optical film 100 is welded to the diffuser plate 200, effectively reducing the overall cooling and shrinkage stress difference of the optical film 100. This, in turn, reduces wrinkles and warping of the optical functional plate 10, thereby reducing light spots and ensuring display performance.

[0070] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An optical functional panel, characterized in that, The optical functional board includes an optical film and a diffuser plate stacked together. The periphery of the optical film is surrounded by discontinuous bonding lines so that the optical film is fused to the diffuser plate.

2. The optical functional plate according to claim 1, characterized in that, The optical functional board is provided with multiple heat source corresponding areas, and a heat-avoiding soldering area is provided between every two adjacent heat source corresponding areas. Each heat-avoiding soldering area is located at the periphery of the optical film, and each heat-avoiding soldering area is used to form the solder line.

3. The optical functional plate according to claim 2, characterized in that, The heat-resistant soldering area is used to form raised solder joints that diffuse from the optical film toward the diffuser plate, and to weld them onto the diffuser plate to form the solder line.

4. The optical functional plate according to claim 3, characterized in that, The height of the raised solder joint is 0.1mm~0.3mm.

5. The optical functional plate according to claim 2, characterized in that, The shortest straight-line distance between the heat-avoiding welding zone and the adjacent heat source zone is greater than or equal to 2 cm; and / or, The longest straight-line distance between the welding line and the adjacent heat source corresponding area is less than or equal to 8cm.

6. The optical functional plate according to claim 2, characterized in that, The distance between the heat-avoiding welding area and the area corresponding to the heat source increases as the area corresponding to the heat source increases.

7. The optical functional plate according to claim 2, characterized in that, The distance between two adjacent heat-resistant welding zones increases by 0.5cm to 2cm for every 5 to 10 square centimeters of the area corresponding to the heat source; and / or, The length of each welding wire segment is greater than or equal to 2cm.

8. The optical functional plate according to claim 1, characterized in that, The optical film is a polyethylene terephthalate optical film; and / or... The diffusion plate is a polymethyl methacrylate diffusion plate, a polycarbonate diffusion plate, or a polystyrene diffusion plate.

9. The optical functional plate according to claim 1, characterized in that, The thickness of the optical film is 100μm~600μm; and / or, The thickness of the diffuser plate is greater than 0.3 mm.

10. A backlight module, characterized in that, Includes the optical functional panel according to any one of claims 1 to 9.

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