A heat dissipation base with telescopic baffle
The flexible connection design of the telescopic baffle solves the problem of mismatch in the adjustment of the laptop heat sink baffle, achieving adaptive adjustment and efficient heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- H&Y TECH CO LTD
- Filing Date
- 2025-06-13
- Publication Date
- 2026-06-19
AI Technical Summary
The existing laptop cooler's baffle adjustment has a gap mismatch problem, which leads to ineffective or excessive clamping, affecting the heat dissipation effect.
The design features a telescopic baffle, with the main baffle and the secondary baffle connected by an elastic element, enabling stepless adjustment and ensuring that the pressure block is completely flat and pressed against the laptop.
It achieves adaptive adjustment based on the thickness of the laptop, improving heat dissipation and airtightness, preventing air leakage, and protecting the laptop.
Smart Images

Figure CN224383653U_ABST