A non-expanding solid-state capacitor

CN224384102UActive Publication Date: 2026-06-19FULIKANG TECHNOLOGY (NANJING) CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
FULIKANG TECHNOLOGY (NANJING) CO LTD
Filing Date
2025-06-17
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing capacitors are prone to expansion in high-temperature environments, which can damage the casing. Furthermore, the vent holes allow impurities to enter, affecting the stability and lifespan of the capacitor.

Method used

The capacitor uses an aluminum shell to enclose the core and has a buffer pad inside. The buffer pad is compressed to create space when the gas expands. Combined with the sealing components and insulation structure, it prevents impurities from entering and ensures the stability and sealing of the capacitor.

Benefits of technology

It effectively prevents the capacitor casing from expanding, extends the capacitor's lifespan, and improves the capacitor's stability and safety.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224384102U_ABST
    Figure CN224384102U_ABST
Patent Text Reader

Abstract

The utility model discloses a kind of anti-expansion solid-state capacitor, including core package, aluminum shell, buffer pad, the core package is connected with two pins, the pin is connected with cover through sealing element, the cover side is equipped with clamping groove, the aluminum shell sleeve is outside core package, the concave ring of aluminum shell is connected with clamping groove, the buffer pad is installed to aluminum shell interior, and the buffer pad is located above core package;Buffer pad is arranged in aluminum shell interior, when core package heating causes gas expansion, the pressure of gas is increased and compressed buffer pad, and then reduce the air pressure in aluminum shell interior, can avoid aluminum shell expansion, solid-state capacitor is more durable, rubber cap improves the sealing between pin and cover, can block impurity into aluminum shell and core package contact, improve the stability of core package work, prolong the life of solid-state capacitor.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of solid-state capacitor technology, specifically to an anti-expansion solid-state capacitor. Background Technology

[0002] During operation, capacitors generate heat, which increases the air pressure in the sealed space inside the capacitor casing. Furthermore, prolonged exposure to high temperatures can cause the casing to expand, leading to capacitor damage.

[0003] To solve the above problems, there is a solution for a capacitor with anti-expansion function (publication number CN218160005U). The heat inside the capacitor body is discharged through a heat pipe, so that the heat-conducting shell absorbs the heat from the heat pipe, and finally the heat is discharged to the outside through the heat sink, thereby achieving heat dissipation of the device and preventing the capacitor shell from expanding due to excessive temperature.

[0004] However, the above solution involves setting vent holes on the heat-conducting shell to expel the gas that expands due to heat. Although this can prevent the solid capacitor from expanding, impurities will enter the heat-conducting shell through the vent holes. These impurities will interfere with the operation of the capacitor body and reduce the stability and lifespan of the solid capacitor. Utility Model Content

[0005] The purpose of this invention is to provide an anti-expansion solid capacitor to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an anti-expansion solid capacitor, comprising a core package, wherein the core package is connected to two pins, and a cover is connected to the pins through a sealing element. The cover has a slot on its side, which facilitates soldering the capacitor to a circuit board.

[0007] An aluminum shell is fitted over the core package. The concave ring of the aluminum shell is connected to the slot. The aluminum shell serves to dissipate heat and protect the core package.

[0008] A buffer pad is installed inside the aluminum shell and is located above the core package. The buffer pad can be compressed to make room for expanding gas and prevent the aluminum shell from expanding due to gas expansion.

[0009] Furthermore, an insulating base is fitted onto the pin, which covers the aluminum shell to prevent the aluminum shell from making electrical contact with other components on the circuit board, thus making it safer to use.

[0010] Furthermore, an insulating tube is fitted onto the surface of the core package, and the upper and lower ends of the core package are in contact with the buffer pad and the cover, ensuring that the core package is stably insulated and separated, the core package works stably, and circuit problems are not likely to occur.

[0011] Furthermore, the sealing element includes a rubber cap and a sealing groove. The sealing groove is disposed on the surface of the cap, and the rubber cap is fitted onto the pin to improve the sealing effect, block impurities, and prevent impurities from affecting the life of the core package.

[0012] Furthermore, the buffer pad has a buffer cavity inside, and a support ring is provided inside the buffer cavity to improve the elasticity of the buffer pad.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] (1) A buffer pad is set inside the aluminum shell. When the core pack heats up and causes the gas to expand, the gas pressure increases and is compressed by the buffer pad, thereby reducing the gas pressure inside the aluminum shell. This can prevent the aluminum shell from expanding and make the solid capacitor more durable.

[0015] (2) The rubber cap improves the sealing between the pin and the cover, which can prevent impurities from entering the aluminum shell and contacting the core, improve the stability of the core working, and extend the life of the solid capacitor. Attached Figure Description

[0016] Figure 1 This is a perspective view of the present utility model;

[0017] Figure 2 This is a schematic diagram of the insulating base and pin connection of this utility model;

[0018] Figure 3 This is a schematic diagram of the interior of the aluminum shell of this utility model;

[0019] Figure 4 This is a schematic diagram showing the disassembled parts of this utility model;

[0020] Figure 5 This is a cross-sectional view of the buffer pad of this utility model;

[0021] Figure 6 This is a schematic diagram showing the connection between the air outlet nozzle and the aluminum shell of this utility model.

[0022] In the diagram: 1. Insulating base; 2. Aluminum shell; 3. Pin; 4. Insulating tube; 5. Buffer pad; 6. Cover; 7. Rubber cap; 8. Retaining ring; 9. Concave ring; 10. Core package; 11. Slot; 12. Buffer cavity; 13. Support ring; 14. Receiving groove; 15. Sealing groove; 16. Air outlet. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Example:

[0025] Please see Figure 1-6 This utility model provides a technical solution: an anti-expansion solid capacitor, including a core package 10, the core package 10 being connected to two pins 3, and a cover 6 being connected to the pins 3 via a sealing element. The cover 6 has a slot 11 on its side, and the pins 3 are soldered to a circuit board.

[0026] Aluminum shell 2 is fitted over the core package 10. The concave ring 9 of the aluminum shell 2 is connected to the slot 11, so that the aluminum shell 2 can wrap the core package 10 and protect the core package 10. The aluminum shell 2, together with the cap 6, can achieve full coverage protection of the core package 10.

[0027] The buffer pad 5 is installed inside the aluminum shell 2 and is located above the core package 10. The buffer pad 5 can be compressed. When the air pressure inside the aluminum shell 2 increases, the buffer pad 5 is compressed to make room and reduce the pressure inside the aluminum shell 2.

[0028] In this embodiment, as Figure 1 and Figure 2 As shown, an insulating base 1 is sleeved on the pin 3. The insulating base 1 covers the aluminum shell 2. The insulating base 1 is made of plastic. The insulating base 1 can prevent the aluminum shell 2 from being energized with other components on the circuit board, thus protecting the circuit board.

[0029] In this embodiment, as Figure 2 As shown, the surface of the insulating base 1 is provided with a receiving groove 14, and the pin 3 is placed inside the receiving groove 14, which can prevent the pin 3 from protruding on the insulating base 1 and reduce the space occupied by the solid capacitor.

[0030] In this embodiment, as Figure 4 As shown, an insulating tube 4 is sleeved on the surface of the core package 10. The upper and lower ends of the core package 10 are in contact with the buffer pad 5 and the cover 6. The insulating tube 4 can be made of plastic. The insulating sleeve can prevent the core package 10 from making electrical contact with the aluminum shell 2 and avoid leakage problems. The buffer pad 5 and the cover 6 also play an insulating role.

[0031] In this embodiment, as Figure 3 and Figure 4As shown, the surface of the cover 6 is provided with a retaining ring 8, which holds the core package 10 in place and can position the core package 10, thereby improving the installation accuracy of the core package 10.

[0032] In this embodiment, as Figure 3 and Figure 4 As shown, the sealing element includes a rubber cap 7 and a sealing groove 15. The sealing groove 15 is disposed on the surface of the cover 6. The rubber cap 7 is fitted onto the pin 3. The rubber cap 7 is elastic. Placing the rubber cap 7 into the sealing groove 15 improves the sealing performance between the pin 3 and the cover 6, which can prevent impurities from entering the aluminum shell 2.

[0033] In this embodiment, as Figure 5 and Figure 6 As shown, the buffer pad 5 has a buffer cavity 12 inside, and a support ring 13 is provided inside the buffer cavity 12. The support ring 13 gives the buffer pad 5 a certain compressive strength. An air vent 16 can be set on the buffer pad 5. The air vent 16 passes through the aluminum shell 2. When the buffer pad 5 is squeezed, air can be discharged, which improves the deformation ability of the buffer pad 5 and can better make space inside the aluminum shell 2.

[0034] Specifically, during use, the core package 10 heats up after being energized through pin 3. The gas inside the aluminum shell 2 expands due to the heat, which increases the gas pressure inside the aluminum shell 2. This gas compresses the buffer pad 5, reducing its volume. Therefore, the space occupied by the buffer pad 5 in the aluminum shell 2 is reduced, allowing it to better accommodate the expanded gas and thus lowering the gas pressure inside the aluminum shell 2. This prevents the aluminum shell 2 from expanding. After the core package 10 is de-energized, the gas temperature decreases, the gas pressure inside the aluminum shell 2 decreases, and the buffer pad 5 elastically returns to its initial state, which can extend the life of the solid-state capacitor.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An anti-expansion solid capacitor, characterized in that, include: Core package (10), the core package (10) is connected to two pins (3), the pins (3) are connected to a cover (6) by a sealing element, and the cover (6) has a slot (11) on its side; An aluminum shell (2) is fitted over the core package (10), and the concave ring (9) of the aluminum shell (2) is connected to the slot (11). A buffer pad (5) is installed inside the aluminum shell (2) and is located above the core package (10).

2. The anti-expansion solid capacitor according to claim 1, characterized in that: An insulating base (1) is fitted onto the pin (3), and the insulating base (1) covers the aluminum shell (2).

3. The anti-expansion solid capacitor according to claim 2, characterized in that: The insulating base (1) has a receiving groove (14) on its surface, and the pin (3) is placed inside the receiving groove (14).

4. The anti-expansion solid capacitor according to claim 1, characterized in that: An insulating tube (4) is fitted onto the surface of the core package (10), and the upper and lower ends of the core package (10) are in contact with the buffer pad (5) and the cover (6).

5. The anti-expansion solid capacitor according to claim 1, characterized in that: The cover (6) has a retaining ring (8) on its surface, which holds the core package (10) in place.

6. The anti-expansion solid capacitor according to claim 1, characterized in that: The sealing element includes a rubber cap (7) and a sealing groove (15), the sealing groove (15) being disposed on the surface of the cover (6), and the rubber cap (7) being fitted onto the pin (3).

7. The anti-expansion solid capacitor according to claim 1, characterized in that: The buffer pad (5) has a buffer cavity (12) inside, and the buffer cavity (12) has a support ring (13) inside.