Keyboard silencing wrap

Abstract

The application relates to the technical field of keyboard accessories, in particular to a keyboard soundproofing package which comprises, from top to bottom, sandwich cotton, shaft lower pads, sound-optimizing pads, shaft seat cotton and shaft bottom pads arranged between a top shell and a bottom shell of a keyboard, the sandwich cotton is located above a keyboard positioning plate and is used for absorbing shaft body bottom impact and high-frequency noise, the shaft lower pads are tightly attached to a lower surface of the keyboard positioning plate and are provided with shaft pins of a mechanical shaft body and form a covering for shaft pin roots, the sound-optimizing pads are covered on an upper surface of a PCB and are located between the shaft lower pads and the PCB, the shaft seat cotton is filled in a cavity between the PCB and the bottom shell, and the shaft bottom pads are attached to an inner bottom surface of the bottom shell, so that the application can inhibit noise generated by shaft pin holes of the PCB.

Description

Technical Field

[0001] This application relates to the technical field of keyboard accessories, and more specifically, it relates to a keyboard mute kit. Background Technology

[0002] With the increasing popularity of mechanical keyboards in office, e-sports, and home settings, the noise generated during keystrokes has become a growing concern for users. Keyboard noise primarily originates from the following sources: the bottoming-out sound of the switches, the rebound sound of the internal springs, the wobble of the keycaps, and the amplification effect of resonance within the keyboard's internal cavity. Among these, the amplification effect of resonance within the keyboard's internal cavity, typically enclosed by the mounting plate, PCB board, and bottom shell, is one of the key factors contributing to significant and unpleasant noise.

[0003] To suppress keyboard noise and improve the user experience, the industry commonly uses a solution of filling the inside of the keyboard with sound-absorbing materials. A common structure involves placing a sandwich of foam above the mounting plate to absorb the impact of the switches bottoming out and some high-frequency noise; placing switch-mounting foam below the PCB to fill the gap between the PCB and the bottom case, absorbing downward-propagating sound waves and suppressing cavity resonance; and adding switch-bottom pads under the bottom case to further isolate noise from being transmitted to the desktop. Some solutions also include sound-enhancing pads between the PCB and the mounting plate, and under the switches, designed to specifically absorb noise generated by the switch movement.

[0004] However, in keyboards with pins, mechanical switches are soldered and fixed by their pins passing through pin holes on the PCB. These pin holes on the PCB are inherent and difficult-to-avoid acoustic leakage points. Mid-to-high frequency sound waves can easily propagate and escape between the upper and lower layers of the keyboard's internal cavity through these pin holes. Traditional sound-absorbing foam pads and other similar materials are mostly located above or flush with the mounting plate, mainly covering the sides and top areas of the switches. The switch base foam and bottom pads, located below the PCB, have their effective area below the PCB and cannot effectively cover and seal the pin holes on the upper surface of the PCB. Therefore, the pin hole area becomes a critical acoustic weak point, a channel for internal noise, especially noise generated above the PCB, to leak downwards or for external noise to be conducted upwards, thus limiting the overall quietness of the keyboard. Utility Model Content

[0005] To address the problem that traditional noise-reducing kits are ineffective at suppressing noise generated by the pin holes on the PCB board in keyboards with key pins, this application provides a keyboard noise-reducing kit.

[0006] A keyboard noise reduction package includes, from top to bottom, a core pad, a switch underpad, a sound-enhancing pad, a switch seat pad, and a switch bottom pad, arranged sequentially between the top and bottom shells of the keyboard. The core pad is located above the keyboard positioning plate to absorb the bottoming-out impact of the switches and high-frequency noise. The switch underpad is in close contact with the lower surface of the keyboard positioning plate and allows the mechanical switch needles to pierce through it, while also covering the base of the needles. The sound-enhancing pad covers the upper surface of the PCB board and is located between the switch underpad and the PCB board. The switch seat pad fills the cavity between the PCB board and the bottom shell. The switch bottom pad is attached to the inner bottom surface of the bottom shell.

[0007] Preferably, the under-shaft pad has a through hole at the position corresponding to the shaft pin, and the diameter of the through hole is smaller than the diameter of the shaft pin.

[0008] Preferably, a silicone pad is disposed in a groove recessed on the inner surface of the bottom shell and located below the shaft bottom pad.

[0009] Preferably, the material of the sandwich filling includes any one of cross-linked polyolefin foam, polyurethane foam, and ethylene-vinyl acetate copolymer.

[0010] Preferably, the material of the under-shaft pad includes any one of polyethylene foam, polypropylene foam, and silicone rubber.

[0011] Preferably, the material of the sound-enhancing pad includes any one of PET film, PI film, and PTFE film.

[0012] Preferably, the material of the bearing seat cotton includes any one of PO cotton, PU slow rebound cotton, recycled polyester fiber cotton, and glass fiber cotton.

[0013] Preferably, the material of the shaft bottom pad is any one of butyl rubber composite material, asphalt-based damping sheet, and foamed tape.

[0014] Preferably, the thickness of the core cotton is 1-5mm, the thickness of the under-shaft pad is 0.3-1mm, the thickness of the sound-enhancing pad is 0.01-0.5mm, the thickness of the bearing seat cotton is 1.5-5mm, and the thickness of the shaft bottom pad is 0.01-2mm.

[0015] The beneficial technical effects of this application are as follows: A newly added under-axis pad is tightly attached to the lower surface of the positioning plate, allowing the axis pins to pierce and covering the base of the pins. This design allows it to directly cover and seal the axis pin hole area on the upper surface of the PCB board, blocking the main channel for mid-to-high frequency sound waves to propagate and escape between the upper and lower cavities of the keyboard through the axis pin holes, thus suppressing the noise. Furthermore, the multi-layered structure forms a sound-absorbing package, creating a three-dimensional, continuous, and all-around sealing and sound-absorbing barrier, significantly reducing the chance of noise generated in various areas inside the keyboard propagating to the outside or interfering with crosstalk between different cavities. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a keyboard mute pack according to this embodiment.

[0017] Figure 2 for Figure 1 A magnified view of position A in the middle.

[0018] Attached reference numerals: 1. Sandwich pad; 2. Shaft under pad; 21. Perforation; 3. Soundproof pad; 4. Shaft seat pad; 5. Shaft bottom pad; 6. Silicone pad. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] A keyboard noise reduction package includes a sandwich foam 1 laid on the upper surface of the keyboard positioning plate, a shaft under-pad 2 tightly attached to the lower surface of the keyboard positioning plate, a sound-enhancing pad 3 laid flat below the shaft under-pad 2, a shaft seat foam 4 filling the cavity between the PCB board and the bottom shell, a shaft bottom pad 5 attached to the inner bottom surface of the bottom shell, and a silicone pad 6 filling a groove in the inner surface of the bottom shell. The sandwich foam 1 is made of any one of cross-linked polyolefin foam, polyurethane foam, and ethylene-vinyl acetate copolymer, preferably polyurethane foam. The shaft under-pad 2 is made of any one of polyethylene foam, polypropylene foam, and silicone rubber, preferably polyethylene foam. The sound-enhancing pad 3 is made of PET film, PI film, etc. The material of the PTFE film is preferably PET film. The material of the spindle seat cotton 4 includes any one of PO cotton, PU slow rebound cotton, recycled polyester fiber cotton, and glass fiber cotton, preferably PO cotton. The material of the spindle bottom pad 5 is preferably butyl rubber composite material, asphalt-based damping sheet, and foam tape, preferably butyl rubber composite material. The thickness of the sandwich cotton 1 is 1-5mm, the thickness of the spindle bottom pad 2 is 0.3-1mm, the thickness of the sound pad 3 is 0.01-0.5mm, the thickness of the spindle seat cotton 4 is 1.5-5mm, the thickness of the spindle bottom pad 5 is 0.01-2mm, and the thickness of the silicone pad 6 is 1-20mm. The thickness of each structural layer is selected according to the structure of the keyboard. The sandwich pad 1 directly covers the upper part of all mechanical switches to absorb the impact energy of the switches hitting the bottom and the high-frequency noise generated by the keycap shaking. The switch pad 2 is provided with a through hole 21 corresponding to the mechanical switch needle, and the diameter of the through hole 21 is smaller than the diameter of the needle. During assembly, the needle pierces the through hole 21, and the material undergoes elastic deformation due to interference fit, forming a ring-shaped sealing around the base of the needle, thereby completely sealing the needle hole on the upper surface of the PCB board and blocking the path of mid-to-high frequency sound waves leaking between the upper and lower cavities of the keyboard through the needle hole. The sound insulation pad 3 covers the entire upper surface of the PCB board to absorb the sound of the spring rebound and contact friction inside the switches, and acts as a secondary barrier to supplement the sealing effect of the switch pad 2, absorbing the downward propagating sound waves. The switch seat cotton 4 suppresses the low-frequency resonance of the cavity between the PCB board and the bottom shell. The switch bottom pad 5 isolates the internal residual noise from being transmitted to the desktop, and at the same time reflects external vibration noise. The silicone pad 6 fills the space, adds weight, and plays a role in buffering and insulation. It can be set or not according to needs.

[0021] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A keyboard mute pack, characterized in that: The keyboard includes, from top to bottom, a sandwich cotton (1), a switch pad (2), a sound-enhancing pad (3), a switch seat cotton (4), and a switch bottom pad (5) arranged between the top and bottom shells of the keyboard. The sandwich cotton (1) is located above the keyboard positioning plate and is used to absorb the bottom impact of the switch and high-frequency noise. The switch pad (2) is close to the lower surface of the keyboard positioning plate and is pierced by the mechanical switch needles and covers the root of the needles. The sound-enhancing pad (3) covers the upper surface of the PCB board and is located between the switch pad (2) and the PCB board. The switch seat cotton (4) fills the cavity between the PCB board and the bottom shell. The switch bottom pad (5) is attached to the inner bottom surface of the bottom shell.

2. The keyboard mute pack according to claim 1, characterized in that: The underpin pad (2) is provided with a through hole (21) corresponding to the position of the pin, and the diameter of the through hole (21) is smaller than the diameter of the pin.

3. The keyboard mute pack according to claim 1, characterized in that: It also includes a silicone pad (6) set in a groove recessed on the inner surface of the bottom shell and located below the shaft bottom pad (5).

4. A keyboard mute pack according to claim 1, characterized in that: The material of the sandwich foam (1) includes any one of cross-linked polyolefin foam, polyurethane foam, and ethylene-vinyl acetate copolymer.

5. A keyboard mute pack according to claim 1, characterized in that: The material of the under-shaft pad (2) includes any one of polyethylene foam, polypropylene foam, and silicone rubber.

6. A keyboard mute pack according to claim 1, characterized in that: The material of the sound pad (3) includes any one of PET film, PI film, and PTFE film.

7. A keyboard mute pack according to claim 1, characterized in that: The material of the bearing cotton (4) includes any one of PO cotton, PU slow rebound cotton, recycled polyester fiber cotton, and glass fiber cotton.

8. A keyboard mute pack according to claim 1, characterized in that: The shaft bottom pad (5) is made of any one of butyl rubber composite material, asphalt-based damping sheet, or foam tape.

9. A keyboard mute pack according to any one of claims 1-8, characterized in that: The thickness of the sandwich cotton (1) is 1-5mm, the thickness of the shaft under pad (2) is 0.3-1mm; the thickness of the sound pad (3) is 0.01-0.5mm, the thickness of the shaft seat cotton (4) is 1.5-5mm, and the thickness of the shaft bottom pad (5) is 0.01-2mm.

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