Busbar assembly and battery module

By using a busbar assembly with circuit boards and heat sinks in the battery module, quality defects in the welding assembly process were resolved, achieving efficient heat dissipation and improved safety of the battery module, and simplifying the disassembly and repair process.

CN224384465UActive Publication Date: 2026-06-19JOYCUBE BATTERY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JOYCUBE BATTERY CO LTD
Filing Date
2025-06-17
Publication Date
2026-06-19

AI Technical Summary

⚠Technical Problem

Existing battery modules suffer from quality defects during the welding assembly process, such as desoldering, burn-through, and excessively large heat-affected zones, which affect the safety and heat dissipation of the battery modules.

⚗Method used

A busbar assembly is used, including a circuit board, spring contacts, and a heat sink. The spring contacts enable electrical connection of the battery cell body, and the heat sink on the circuit board conducts heat away to prevent heat backflow. The heat dissipation efficiency is improved by using a thermally conductive insulating layer and a busbar layer.

🎯Benefits of technology

This technology enables solderless connection of battery modules, improves heat dissipation, enhances the safety and disassembly/maintenance of battery modules, and reduces production costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model discloses a busbar assembly and a battery module. The busbar assembly is used for the series and parallel connection of battery cells within a battery module. The busbar assembly includes a current plate, spring contacts, and a heat sink. The circuit board includes a metal substrate, a thermally conductive insulating layer, and a busbar layer arranged sequentially along the thickness direction. Mounting holes corresponding one-to-one with the battery cells are provided on the circuit board. At least one spring contact is provided at each mounting hole, and the spring contact is fixedly connected to and conductively connected to the busbar layer, without contacting the metal substrate. The heat sink extends along at least a portion of the edge of the substrate towards the thickness direction of the circuit board. A gap is left between the heat sink and the battery module, and the heat sink contacts the heat sink module for heat conduction. The busbar assembly enables the battery module to be solderless while efficiently dissipating heat, improving the safety of the battery module.
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