Pumping source heat dissipation structure

Abstract

This utility model relates to the field of pump source technology and discloses a pump source heat dissipation structure, including a pump source, a heat pipe heat dissipation component, and a cooling plate. The pump source includes a pump source housing with a hollow interior forming a space for accommodating a chip. The pump source housing is made of aluminum alloy. The cooling plate is disposed at one end of the pump source housing. A first accommodating groove is formed by an indentation at the end of the pump source housing near the cooling plate. The heat pipe heat dissipation component is disposed within the first accommodating groove and contacts the cooling plate. The use of an aluminum alloy pump source housing reduces costs, and the use of a heat pipe heat dissipation component compensates for the low thermal conductivity of aluminum alloy, meeting the heat dissipation requirements of high-power laser chips. This achieves efficient heat dissipation while controlling costs, resulting in a good balance between cost and performance.

Description

Technical Field

[0001] This utility model relates to the field of pump source technology, and in particular to a pump source heat dissipation structure. Background Technology

[0002] The main components of a laser are the resonant cavity, the pump source, and the working medium. The pump source is the excitation source that enables population inversion in the laser working medium. Currently, the most widely used pump source is the semiconductor laser pump source, which has many advantages such as high efficiency, low noise, stable frequency, long lifespan, and compact structure. The pump source generates a large amount of heat during operation, which, if not properly managed, can cause irreversible damage to the pump source itself and other components of the laser.

[0003] Chinese utility model patent with publication number CN217485929U discloses a composite base for a laser pump source, which is formed by assembling and fixing a copper heat sink and an aluminum base.

[0004] In the above technical solution, a composite structure of an aluminum base and a copper heat sink is used. Although the copper heat sink has good thermal conductivity, the thermal conductivity of the aluminum base is only 1 / 3 that of oxygen-free copper. This results in a bottleneck when heat is transferred from the copper heat sink to other parts of the base, limiting the overall heat dissipation efficiency and making it difficult to meet the heat dissipation requirements of high-power laser chips. Utility Model Content

[0005] To overcome at least one of the defects described in the prior art, this utility model provides a pump source heat dissipation structure. The pump source housing is made of aluminum alloy, reducing costs. A heat pipe heat dissipation component compensates for the low thermal conductivity of aluminum alloy, meeting the heat dissipation requirements of high-power laser chips. This achieves efficient heat dissipation while controlling costs, resulting in a good balance between cost and performance.

[0006] The technical solution of this utility model is implemented as follows:

[0007] A pump source heat dissipation structure includes a pump source, a heat pipe heat dissipation assembly, and a cooling plate. The pump source includes a pump source housing with a hollow interior forming a receiving space for accommodating a chip. The pump source housing is made of aluminum alloy. The cooling plate is disposed at one end of the pump source housing. A first receiving groove is formed by an inward recess at the end of the pump source housing near the cooling plate. The heat pipe heat dissipation assembly is disposed within the first receiving groove and contacts the cooling plate. The heat pipe heat dissipation assembly is used to conduct heat generated by the chip to the cooling plate.

[0008] Based on the above technical solutions, preferably, the heat pipe heat dissipation assembly includes a bottom shell, a cover plate, and a heat pipe, wherein the bottom shell is disposed in the first receiving groove, and the bottom shell is recessed to form a second receiving groove; the cover plate is disposed at one end of the bottom shell, and the cover plate is in contact with the cooling plate; the heat pipe is disposed in the second receiving groove.

[0009] Based on the above technical solutions, preferably, the bottom shell and the cover plate are made of oxygen-free copper.

[0010] Based on the above technical solutions, preferably, the heat pipe is welded and fixed to the bottom shell and the cover plate.

[0011] Based on the above technical solutions, preferably, the heat pipe heat dissipation assembly is detachably connected to the pump source housing.

[0012] Based on the above technical solutions, preferably, the area of ​​the cooling plate is larger than the area of ​​the pump source housing.

[0013] Based on the above technical solutions, preferably, the first receiving groove is coated with thermally conductive silicone grease.

[0014] Based on the above technical solutions, preferably, it also includes a fastening structure for securing the pump source housing and the cooling plate.

[0015] Based on the above technical solutions, preferably, the fastening structure includes a connecting part and a fastener, wherein the connecting part is disposed on the pump source housing, and a first mounting hole is provided on the connecting part; a second mounting hole corresponding to the position of the first mounting hole is provided on the cooling plate; and the fastener passes through the first mounting hole and the second mounting hole.

[0016] Based on the above technical solutions, preferably, the fastener is a screw.

[0017] In summary, the pump source heat dissipation structure provided by this utility model has the following advantages over the prior art:

[0018] (1) The pump source housing is made of aluminum alloy and is equipped with heat pipe heat dissipation components. The heat pipe has a thermal conductivity much higher than that of oxygen-free copper, which can quickly conduct the heat generated by the chip to the cooling plate through the heat pipe heat dissipation components. This effectively breaks through the heat dissipation limitation of traditional aluminum base and can meet the heat dissipation requirements of high-power laser chips, avoiding heat accumulation that could damage components.

[0019] (2) The pump source housing is made of aluminum alloy, which has a low cost. At the same time, the heat pipe heat dissipation component makes up for the low thermal conductivity of aluminum alloy, achieving efficient heat dissipation while controlling costs, and achieving a good balance between cost and performance.

[0020] (3) The pump source housing is recessed at one end near the cooling plate to form a first receiving groove. The heat pipe heat dissipation assembly is placed in the receiving groove and in contact with the cooling plate. This structural design allows the heat pipe heat dissipation assembly to receive the heat generated by the chip at a closer distance and quickly transfer the heat to the cooling plate, shortening the heat transfer path, reducing heat loss, and further improving heat dissipation efficiency. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present utility model;

[0023] Figure 2 This is a three-dimensional structural diagram of the pump source housing according to an embodiment of the present utility model;

[0024] Figure 3 This is a schematic diagram of the bottom structure of the pump source according to an embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram of the internal structure of the pump source housing according to an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the heat pipe heat dissipation assembly structure according to an embodiment of the present utility model;

[0027] Figure 6 This is a three-dimensional structural diagram of the bottom shell according to an embodiment of the present utility model;

[0028] Figure 7 This is a schematic diagram of the planar structure of the cooling plate according to an embodiment of the present utility model;

[0029] The reference numerals in the attached drawings have the following meanings: 1. Pump source; 11. Pump source housing; 111. Accommodation space; 112. First accommodation groove; 113. Fifth mounting hole; 2. Heat pipe heat dissipation assembly; 21. Bottom shell; 211. Second accommodation groove; 212. Third mounting hole; 22. Cover plate; 221. Fourth mounting hole; 23. Heat pipe; 3. Cooling plate; 31. Second mounting hole; 4. Fastening structure; 41. Connecting part; 411. First mounting hole; 42. Fastener; 421. Screw; 5. Chip. Detailed Implementation

[0030] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0031] See Figures 1-7 This utility model discloses a heat dissipation structure for a pump source 1, including a pump source 1, a heat pipe heat dissipation assembly 2, and a cooling plate 3.

[0032] See Figure 2 and Figure 4 As shown, in this embodiment, the pump source 1 includes a pump source housing 11. The interior of the pump source housing 11 is hollow, forming a receiving space 111. A chip 5 is placed inside the receiving space 111. The chip 5 is placed at the bottom of the receiving space 111 and in contact with the inner bottom wall of the pump source housing 11. The receiving space 111 can provide a relatively closed environment for the chip 5, reducing the erosion and contamination of the chip 5 by external dust, moisture, impurities, etc., and reducing the probability of the chip 5 failing due to external environmental influences, thereby protecting the normal working state of the chip 5. Moreover, the heat generated by the chip 5 during operation will first be transferred to the bottom of the pump source housing 11. The heat transfer path is shorter and more concentrated, which is conducive to the rapid conduction of heat to the pump source housing 11. Then, the heat is dissipated through the heat pipe heat dissipation assembly 2 connected to the pump source housing 11, thereby improving the heat dissipation efficiency.

[0033] In this embodiment, the pump source housing 11 is made of aluminum alloy, which is produced by die casting. Die casting can precisely manufacture pump source housings 11 with complex shapes. Molten aluminum alloy is injected into a mold under high pressure, which can quickly form the housing, ensuring the dimensional accuracy and shape consistency of the housing. This allows the housing to fit tightly with the internal chip 5 and other components, improving the structural stability of the entire pump source 1. At the same time, the die-cast aluminum alloy housing has high strength and can withstand certain external impacts and vibrations, protecting the internal chip 5 from damage and adapting to different working environments. Moreover, the use of die casting greatly reduces subsequent processing time and production costs. Compared with oxygen-free copper, which is commonly used in the market, aluminum alloy is more economical. Using aluminum alloy as the housing material can significantly reduce raw material costs and improve the product's market competitiveness.

[0034] See Figure 1As shown, in this embodiment, the cooling plate 3 is disposed at one end of the pump source housing 11. More specifically, the cooling plate 3 is disposed at the bottom of the pump source housing 11. By placing the cooling plate 3 at the bottom, the heat generated by the chip 5 is conducted to the bottom cooling plate 3 through the pump source housing 11, which makes the heat transfer more smoothly downward, reduces the resistance in the heat conduction process, and speeds up the transfer speed of heat from the chip 5 to the cooling plate 3, thereby improving the overall heat dissipation effect.

[0035] See Figure 3 , Figure 5 and Figure 6 As shown, in this embodiment, the pump source housing 11 is recessed at one end near the cooling plate 3 to form a first receiving groove 112. Specifically, the bottom of the pump source housing 11 is recessed to form the first receiving groove 112. The heat pipe heat dissipation assembly 2 is disposed in the first receiving groove 112. The first receiving groove 112 allows the heat pipe heat dissipation assembly 2 to fit more tightly and precisely with the pump source housing 11, reducing air gaps during heat transfer. Specifically, the heat pipe heat dissipation assembly 2 is in contact with the cooling plate 3 and is used to conduct the heat generated by the chip 5 to the cooling plate 3. The bottom surface of the pump source housing 11 is also in contact with the cooling plate 3. With its high thermal conductivity, the heat pipe heat dissipation assembly 2 can quickly conduct the heat generated by the chip 5 to the cooling plate 3. The direct contact between the bottom surface of the pump source housing 11 and the cooling plate 3 opens a channel for heat transfer, allowing the heat generated by the chip 5 to be transferred to the cooling plate 3 at a faster speed, greatly improving heat dissipation efficiency and effectively preventing the chip 5 from degrading or being damaged due to excessive temperature. The bottom surfaces of the heat pipe heat dissipation component 2 and the pump source 1 are in contact with the cooling plate 3 at the same time, which is equivalent to increasing the contact area with the cooling plate 3 and expanding the heat dissipation area.

[0036] See Figure 5 and Figure 6 As shown, in this embodiment, the heat pipe cooling assembly 2 includes a bottom shell 21, a cover plate 22, and a heat pipe 23. The bottom shell 21 has a recessed second receiving groove 211. The cover plate 22 is disposed at one end of the bottom shell 21, specifically at the bottom of the bottom plate, and contacts the cooling plate 3. The heat pipe 23 is disposed within the second receiving groove 211. The second receiving groove 211 allows the heat pipe 23 to be tightly embedded in the bottom shell 21, reducing air gaps during heat transfer, lowering thermal resistance, and enabling the heat generated by the chip 5 to be transferred more efficiently from the bottom shell 21 to the heat pipe 23. At the same time, the cover plate 22 is in direct contact with the cooling plate 3, accelerating the heat dissipation speed and effectively controlling the operating temperature of the pump source housing 11.

[0037] Specifically, the bottom shell 21 and the cover plate 22 are made of oxygen-free copper. Oxygen-free copper has a good thermal conductivity, which can conduct the heat generated by the chip 5 to the heat pipe 23 in a timely manner.

[0038] In this embodiment, the heat pipe heat dissipation assembly 2 is detachably connected to the pump source housing 11. The detachable connection between the heat pipe heat dissipation assembly 2 and the pump source housing 11 is a screw connection 421. Specifically, the bottom shell 21 has a third mounting hole 212 at each of its four corners, the cover plate 22 has a fourth mounting hole 221 at a position corresponding to the third mounting hole 212, and the pump source housing 11 has a fifth mounting hole 113 at a position corresponding to the third mounting hole 212. Screws 421 are inserted into the third mounting hole 212, the fourth mounting hole 221, and the fifth mounting hole 113.

[0039] When installing the heat pipe cooling assembly 2 and the pump source housing 11, simply align the mounting holes on the bottom shell 21, cover plate 22, and pump source housing 11, then insert the screws 421 in sequence and tighten them to complete the assembly. This standardized installation process can greatly improve installation efficiency, reduce installation time and labor costs, and this detachable method facilitates the replacement of the heat pipe cooling assembly 2. Furthermore, the detachable connection between the heat pipe cooling assembly 2 and the pump source housing 11 is beneficial because the pump source housing 11 will undergo high-temperature welding in subsequent production, and the heat pipe 23 is at risk of bursting at around 200℃. Therefore, by detaching the heat pipe cooling assembly 2 from the pump source housing 11, the heat pipe cooling assembly 2 can be removed when the pump source housing 11 is subjected to high-temperature welding, and then reassembled onto the pump source housing 11 after welding, thus avoiding damage to the heat pipe 23 caused by high temperatures.

[0040] In this embodiment, the heat pipe 23 is welded to the bottom shell 21 and to the cover plate 22. Specifically, the heat pipe 23 is welded to the bottom shell 21 and the cover plate 22 using low-temperature solder paste to ensure that the heat pipe 23 is not damaged due to high temperature. The welding method ensures a seamless connection between the heat pipe 23 and the bottom shell 21 and the cover plate 22, eliminating air gaps. The welding method also ensures uniform heat conduction between the heat pipe 23 and the bottom shell 21 and the cover plate 22, thus reducing thermal stress caused by local overheating. By reducing thermal stress, the service life of the equipment can be extended.

[0041] See Figure 2 and Figure 3 As shown, in this embodiment, the bottom shell 21 is disposed in the first receiving groove 112 and the bottom shell 21 is in contact with the top wall of the first receiving groove 112. The first receiving groove 112 is coated with thermally conductive silicone grease. After the thermally conductive silicone grease is applied, it can fill these tiny air gaps, so that the bottom shell 21 and the top wall form a good thermal contact, which greatly reduces the thermal resistance and allows heat to be conducted from the bottom shell 21 to the top wall of the first receiving groove 112 more quickly and efficiently, and then dissipated, improving the overall heat dissipation effect and ensuring good contact.

[0042] See Figure 1As shown, the area of ​​the cooling plate 3 is larger than the area of ​​the pump source housing 11. Under natural convection heat dissipation, the larger surface area allows more air to come into contact with the cooling plate 3, accelerating heat dissipation and improving heat dissipation efficiency.

[0043] See Figure 2 , Figure 3 , Figure 4 and Figure 7 As shown, in this embodiment, a fastening structure 4 for fastening the pump source housing 11 and the cooling plate 3 is also included. Specifically, the fastening structure 4 includes a connecting part 41 and a fastener 42. The connecting part 41 is disposed on the pump source housing 11, specifically, the connecting part 41 is disposed on the pump source housing 11 parallel to the cooling plate 3 and in contact with the cooling plate 3. The connecting part 41 has three holes located on both sides of the pump source housing 11. A first mounting hole 411 is provided on the connecting part 41, and a second mounting hole 31 is provided on the cooling plate 3 at a position corresponding to the first mounting hole 411. The fastener 42 passes through the first mounting hole 411 and the second mounting hole 31. The three connecting parts 41 can provide stable support and prevent loosening, displacement or deformation between the pump source housing 11 and the cooling plate 3 due to uneven force. Specifically, the connecting part 41 and the pump source housing 11 are integrally formed, which facilitates processing and production.

[0044] Specifically, the fastener 42 is a screw 421, which can firmly fix the pump source housing 11 to the cooling plate 3, and is also easy to disassemble.

[0045] In this embodiment, the heat pipe cooling assembly 2 is first fixed to the pump source housing 11 by inserting screws 421 through the third mounting hole 212, the fourth mounting hole 221, and the fifth mounting hole 113. Then, the pump source housing 11 is fixed to the cooling plate 3 by inserting screws 421 through the first mounting hole 411 and the second mounting hole 31. By first fixing the heat pipe cooling assembly 2 to the pump source housing 11 through the third mounting hole 212, the fourth mounting hole 221, and the fifth mounting hole 113, it is ensured that the heat pipe 23 and the heat-generating part of the pump source housing 11 are in close contact, achieving efficient heat conduction. Similarly, the pump source housing 11 and the cooling plate 3 are fixed through the first mounting hole 411 and the second mounting hole 31, ensuring a close fit between the heat pipe 23 and the cooling plate 3, thus achieving heat conduction.

[0046] Specific implementation steps

[0047] The chip 5 inside the pump source housing 11 generates heat, which is conducted through the aluminum alloy pump source housing 11 to the oxygen-free copper bottom shell 21, and then to the heat pipe 23. Utilizing the high thermal conductivity of the heat pipe 23, the heat generated by the chip 5 is distributed to the cover plate 22. The cover plate 22 is in contact with the cooling plate 3, and the heat of the cover plate 22 is quickly transferred to the cooling plate 3. The cooling plate 3 then dissipates the heat into the surrounding environment.

[0048] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A pump source heat dissipation structure, characterized in that, It includes a pump source (1), a heat pipe heat dissipation assembly (2), and a cooling plate (3), wherein, The pump source (1) includes a pump source housing (11), the interior of which is hollow to form a receiving space (111) for accommodating the chip (5), and the pump source housing (11) is made of aluminum alloy. The cooling plate (3) is disposed at one end of the pump source housing (11); The pump source housing (11) has a recessed first receiving groove (112) at one end near the cooling plate (3). The heat pipe heat dissipation assembly (2) is disposed in the first receiving groove (112). The heat pipe heat dissipation assembly (2) is in contact with the cooling plate (3). The heat pipe heat dissipation assembly (2) is used to conduct the heat generated by the chip (5) to the cooling plate (3).

2. The pump source heat dissipation structure according to claim 1, characterized in that, The heat pipe heat dissipation assembly (2) includes a bottom shell (21), a cover plate (22), and a heat pipe (23), wherein, The bottom shell (21) is disposed in the first receiving groove (112), and the bottom shell (21) is recessed to form a second receiving groove (211); The cover plate (22) is disposed at one end of the bottom shell (21), and the cover plate (22) is in contact with the cooling plate (3); The heat pipe (23) is disposed in the second receiving tank (211).

3. The pump source heat dissipation structure according to claim 2, characterized in that, The bottom shell (21) and the cover plate (22) are made of oxygen-free copper.

4. The pump source heat dissipation structure according to claim 2, characterized in that, The heat pipe (23) is welded and fixed to the bottom shell (21) and the cover plate (22).

5. The pump source heat dissipation structure according to claim 1, characterized in that, The heat pipe heat dissipation assembly (2) is detachably connected to the pump source housing (11).

6. The pump source heat dissipation structure according to claim 1, characterized in that, The area of ​​the cooling plate (3) is larger than the area of ​​the pump source housing (11).

7. A pump source heat dissipation structure according to claim 1 or 2, characterized in that, The first receiving groove (112) is coated with thermally conductive silicone grease.

8. The pump source heat dissipation structure according to claim 1, characterized in that, It also includes a fastening structure (4) for securing the pump source housing (11) to the cooling plate (3).

9. A pump source heat dissipation structure according to claim 8, characterized in that, The fastening structure (4) includes a connecting part (41) and a fastener (42), wherein, The connecting part (41) is disposed on the pump source housing (11), and a first mounting hole (411) is provided on the connecting part (41); The cooling plate (3) is provided with a second mounting hole (31) corresponding to the position of the first mounting hole (411); The fastener (42) passes through the first mounting hole (411) and the second mounting hole (31).

10. A pump source heat dissipation structure according to claim 9, characterized in that, The fastener (42) is a screw (421).

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